TW200720475A - Seal arrangement with corrosion barrier and method - Google Patents

Seal arrangement with corrosion barrier and method

Info

Publication number
TW200720475A
TW200720475A TW095124771A TW95124771A TW200720475A TW 200720475 A TW200720475 A TW 200720475A TW 095124771 A TW095124771 A TW 095124771A TW 95124771 A TW95124771 A TW 95124771A TW 200720475 A TW200720475 A TW 200720475A
Authority
TW
Taiwan
Prior art keywords
arrangement
ring
barrier
reactive species
seal arrangement
Prior art date
Application number
TW095124771A
Other languages
English (en)
Other versions
TWI322192B (en
Inventor
Martin Zucker
Daniel J Devine
Rene George
Josef T Hoog
Vincent C Lee
Original Assignee
Mattson Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mattson Tech Inc filed Critical Mattson Tech Inc
Publication of TW200720475A publication Critical patent/TW200720475A/zh
Application granted granted Critical
Publication of TWI322192B publication Critical patent/TWI322192B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4409—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber characterised by sealing means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Gasket Seals (AREA)
TW095124771A 2005-07-07 2006-07-07 Seal arrangement with corrosion barrier and method TWI322192B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69820505P 2005-07-07 2005-07-07

Publications (2)

Publication Number Publication Date
TW200720475A true TW200720475A (en) 2007-06-01
TWI322192B TWI322192B (en) 2010-03-21

Family

ID=37637715

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095124771A TWI322192B (en) 2005-07-07 2006-07-07 Seal arrangement with corrosion barrier and method

Country Status (6)

Country Link
US (1) US20070012251A1 (zh)
JP (1) JP2009500580A (zh)
KR (1) KR20080025742A (zh)
CN (1) CN101427062A (zh)
TW (1) TWI322192B (zh)
WO (1) WO2007008515A2 (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2560992A2 (en) 2010-04-21 2013-02-27 Glaxo Group Limited Binding domains
WO2012093125A1 (en) 2011-01-06 2012-07-12 Glaxo Group Limited Ligands that bind tgf-beta receptor ii
JP2014505698A (ja) 2011-02-02 2014-03-06 グラクソ グループ リミテッド 新規抗原結合タンパク質
JP2012207738A (ja) * 2011-03-30 2012-10-25 Arai Seisakusho Co Ltd 密封構造
WO2014164743A1 (en) * 2013-03-11 2014-10-09 Applied Materials, Inc. High temperature process chamber lid
TWI628689B (zh) 2013-05-09 2018-07-01 瑪森科技公司 用於保護電漿處理系統中之真空密封的系統與方法
KR102293092B1 (ko) * 2013-11-12 2021-08-23 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치
JP6170193B2 (ja) * 2016-01-22 2017-07-26 Ｎｅｃプラットフォームズ株式会社 シーリング材及び筐体
JP6734918B2 (ja) 2016-04-28 2020-08-05 ギガフォトン株式会社 タンク、ターゲット生成装置、及び、極端紫外光生成装置
JP6799306B2 (ja) * 2016-09-12 2020-12-16 株式会社ジェイテクト 嵌合構造及びこれを備えたステアリング装置
CN107326340B (zh) * 2017-08-29 2023-06-13 京东方科技集团股份有限公司 成膜设备
US11274377B2 (en) 2018-04-20 2022-03-15 Applied Materials, Inc. Seal apparatus for an electroplating system
JP7278685B2 (ja) * 2019-02-08 2023-05-22 ジヤトコ株式会社 動力伝達装置
CN110030382A (zh) * 2019-05-17 2019-07-19 永红保定铸造机械有限公司 一种发生相对转动的筒体与筒盖之间的密封结构
CN113969980A (zh) * 2020-07-23 2022-01-25 中国科学院微电子研究所 一种真空装置
CN213237949U (zh) * 2020-09-25 2021-05-18 东辉休闲运动用品(上海)有限公司 一种加热器及加热水池
JP7610389B2 (ja) 2020-10-19 2025-01-08 株式会社ジャパンエンジンコーポレーション 液冷式ピストンおよびクロスヘッド式内燃機関
CN113236777B (zh) * 2021-03-25 2022-10-25 西安近代化学研究所 一种机械连接装置
CN113464650B (zh) * 2021-07-30 2025-05-13 西安热工研究院有限公司 一种嵌入式石墨金属微小垫片结构
KR102684294B1 (ko) * 2022-05-30 2024-07-12 피에스케이 주식회사 기판 처리 장치
CN119876919B (zh) * 2025-01-15 2026-03-20 北京北方华创微电子装备有限公司 连接组件和半导体工艺设备

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US3097855A (en) * 1959-06-26 1963-07-16 George H Allen Sealing arrangement
US3282289A (en) * 1964-09-28 1966-11-01 Bendix Corp Hot gas relief valve
GB1297161A (zh) * 1969-01-10 1972-11-22
US3854735A (en) * 1972-10-24 1974-12-17 Exxon Production Research Co Static face seal
US4087120A (en) * 1976-06-16 1978-05-02 Michigan Pipe Fittings Company, Div. Of Michigan Hanger Co. Inc. Pipe coupling with a wedging contractile ring
JPS6177468U (zh) * 1984-10-26 1986-05-24
JPS6435175A (en) * 1987-07-31 1989-02-06 Tokyo Electron Ltd Semiconductor processing device
JP3106172B2 (ja) * 1991-02-26 2000-11-06 東京エレクトロン株式会社 熱処理装置の封止構造
US5722668A (en) * 1994-04-29 1998-03-03 Applied Materials, Inc. Protective collar for vacuum seal in a plasma etch reactor
US5507503A (en) * 1994-12-05 1996-04-16 Itt Corporation Static seal in combination with interengaged components having complementary diagonal surfaces
JPH112326A (ja) * 1997-06-11 1999-01-06 Seiko Epson Corp Ｏリング及びこれを具備する装置
US6135460A (en) * 1997-07-31 2000-10-24 Texas Instruments Incorporated Method of and apparatus for purifying reduced pressure process chambers
JPH11131052A (ja) * 1997-10-31 1999-05-18 Mitsubishi Cable Ind Ltd シール
KR100268432B1 (ko) * 1998-09-05 2000-11-01 윤종용 플라즈마 에칭을 위한 장치
TW455662B (en) * 1999-02-09 2001-09-21 Applied Materials Inc Valve seal
US6139026A (en) * 1999-03-25 2000-10-31 Pfaudler, Inc. Stabilized "O" ring gasket seal
US6165313A (en) * 1999-04-14 2000-12-26 Advanced Micro Devices, Inc. Downstream plasma reactor system with an improved plasma tube sealing configuration
US6245149B1 (en) * 1999-07-01 2001-06-12 Applied Materials, Inc. Inert barrier for high purity epitaxial deposition systems
GB9925469D0 (en) * 1999-10-27 1999-12-29 Boc Group Plc Seal assemblies
US6328847B1 (en) * 2000-01-19 2001-12-11 Advanced Micro Devices, Inc. Downstream plasma reactor system incorporating a plasma-resistant blocking member
US6736407B2 (en) * 2001-12-27 2004-05-18 Flow International Corporation Static fluid seals and seal assemblies for ultrahigh pressure fluid containment
DE10393981T5 (de) * 2002-12-27 2005-11-10 Nok Corp. Verbindervorrichtung

Also Published As

Publication number Publication date
WO2007008515A2 (en) 2007-01-18
KR20080025742A (ko) 2008-03-21
JP2009500580A (ja) 2009-01-08
US20070012251A1 (en) 2007-01-18
WO2007008515A3 (en) 2008-08-21
TWI322192B (en) 2010-03-21
CN101427062A (zh) 2009-05-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees