TW200720675A - Electronic component test device - Google Patents

Electronic component test device

Info

Publication number
TW200720675A
TW200720675A TW095125451A TW95125451A TW200720675A TW 200720675 A TW200720675 A TW 200720675A TW 095125451 A TW095125451 A TW 095125451A TW 95125451 A TW95125451 A TW 95125451A TW 200720675 A TW200720675 A TW 200720675A
Authority
TW
Taiwan
Prior art keywords
under test
held
electronic components
electronic component
components under
Prior art date
Application number
TW095125451A
Other languages
Chinese (zh)
Other versions
TWI303719B (en
Inventor
Katsuhiko Suzuki
Shigeki Kaneko
Hiroki Ikeda
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200720675A publication Critical patent/TW200720675A/en
Application granted granted Critical
Publication of TWI303719B publication Critical patent/TWI303719B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

When the number of electronic components under test placed on a loader buffer unit (114) to be held in the next text by contact arms (117, 118) is less than N, among the N electronic components under test held for execution of the current test, an electronic component under test at the position of the contact arms corresponding to the position lacking in the loader buffer unit is held as it is. While holding the electronic components under test, the electronic components under test placed on the loader buffer unit for execution of the next text are held. A test is executed in this state.
TW095125451A 2005-07-13 2006-07-12 Electronic component test device TW200720675A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/012947 WO2007007406A1 (en) 2005-07-13 2005-07-13 Test equipment of electronic component

Publications (2)

Publication Number Publication Date
TW200720675A true TW200720675A (en) 2007-06-01
TWI303719B TWI303719B (en) 2008-12-01

Family

ID=37636814

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125451A TW200720675A (en) 2005-07-13 2006-07-12 Electronic component test device

Country Status (5)

Country Link
US (1) US7859286B2 (en)
KR (1) KR100922145B1 (en)
CN (1) CN101176007A (en)
TW (1) TW200720675A (en)
WO (2) WO2007007406A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416652B (en) * 2010-08-20 2013-11-21 Chroma Ate Inc With a single through the shuttle shuttle of the semiconductor components test machine
TWI611195B (en) * 2016-03-18 2018-01-11 泰克元有限公司 Electronic component test sorting machine
TWI832311B (en) * 2022-06-30 2024-02-11 美商金士頓數位股份有限公司 Automatic test system and automatic test method for integrated-circuit devices

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100800312B1 (en) * 2006-01-25 2008-02-04 (주)테크윙 Test handler and loading method of test handler
JP2011197203A (en) * 2010-03-18 2011-10-06 Renesas Electronics Corp Driver and display device
JP4955792B2 (en) * 2010-04-28 2012-06-20 シャープ株式会社 Electronic component operation function measuring apparatus and electronic component operation function measuring method
TWI398654B (en) * 2011-11-22 2013-06-11 Chroma Ate Inc Semiconductor automation testing machine with temperature control system
KR101235285B1 (en) 2012-11-15 2013-02-21 유호전기공업주식회사 Test method of partial discharge detector using 3 dimensional pattern
JP6094733B2 (en) * 2012-11-26 2017-03-15 澁谷工業株式会社 Article classification device
TWI472778B (en) * 2013-08-30 2015-02-11 Chroma Ate Inc System - level IC test machine automatic retest method and the test machine
CN104670892B (en) * 2013-11-29 2017-02-08 鸿富锦精密工业（深圳）有限公司 Device for feeding and discharging
CN104880618B (en) * 2014-02-28 2019-06-07 惠州市德赛西威汽车电子股份有限公司 A kind of compound parallel test system and method
JP6245445B2 (en) * 2014-07-07 2017-12-13 Smc株式会社 Actuator tact measurement device and sensor signal detection device
CN106017727B (en) * 2016-05-16 2018-11-06 合肥市芯海电子科技有限公司 A kind of multi-chip temperature test and calibration system and method
KR102538843B1 (en) 2016-07-21 2023-05-31 세메스 주식회사 Method of testing semiconductor devices
KR102548782B1 (en) 2016-07-26 2023-06-27 세메스 주식회사 Apparatus for testing semiconductor devices
KR102538845B1 (en) 2016-07-28 2023-05-31 세메스 주식회사 Apparatus for testing semiconductor devices
KR102548788B1 (en) 2016-08-10 2023-06-27 세메스 주식회사 Apparatus for testing semiconductor devices
KR102270760B1 (en) * 2019-11-29 2021-06-30 에이엠티 주식회사 The test apparatus of the device having fine pitch
CN117368684A (en) * 2022-06-30 2024-01-09 金士顿数位股份有限公司 Automated testing system and automated testing method for integrated circuit devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001033514A (en) 1999-07-23 2001-02-09 Advantest Corp Heat plate for electronic component tester
JP2001230481A (en) * 2000-02-21 2001-08-24 Sharp Corp Semiconductor laser chip screening equipment
JP4553492B2 (en) * 2001-01-09 2010-09-29 株式会社アドバンテスト Method for obtaining correlation of electrical characteristics of socket in electronic component test apparatus, handler, control method for handler, and electronic component test apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416652B (en) * 2010-08-20 2013-11-21 Chroma Ate Inc With a single through the shuttle shuttle of the semiconductor components test machine
TWI611195B (en) * 2016-03-18 2018-01-11 泰克元有限公司 Electronic component test sorting machine
TWI832311B (en) * 2022-06-30 2024-02-11 美商金士頓數位股份有限公司 Automatic test system and automatic test method for integrated-circuit devices

Also Published As

Publication number Publication date
US20090058439A1 (en) 2009-03-05
KR100922145B1 (en) 2009-10-19
WO2007007406A1 (en) 2007-01-18
TWI303719B (en) 2008-12-01
US7859286B2 (en) 2010-12-28
WO2007007835A1 (en) 2007-01-18
CN101176007A (en) 2008-05-07
KR20080004579A (en) 2008-01-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees