TW200721331A - Molding apparatus for resin encapsulation of electronic part - Google Patents

Molding apparatus for resin encapsulation of electronic part

Info

Publication number
TW200721331A
TW200721331A TW095138729A TW95138729A TW200721331A TW 200721331 A TW200721331 A TW 200721331A TW 095138729 A TW095138729 A TW 095138729A TW 95138729 A TW95138729 A TW 95138729A TW 200721331 A TW200721331 A TW 200721331A
Authority
TW
Taiwan
Prior art keywords
resin
molding apparatus
electronic part
resin encapsulation
tray
Prior art date
Application number
TW095138729A
Other languages
English (en)
Chinese (zh)
Other versions
TWI323492B (2
Inventor
Mamoru Nakamura
Masanori Hanasaki
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200721331A publication Critical patent/TW200721331A/zh
Application granted granted Critical
Publication of TWI323492B publication Critical patent/TWI323492B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW095138729A 2005-11-04 2006-10-20 Molding apparatus for resin encapsulation of electronic part TW200721331A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005320280A JP4953619B2 (ja) 2005-11-04 2005-11-04 電子部品の樹脂封止成形装置

Publications (2)

Publication Number Publication Date
TW200721331A true TW200721331A (en) 2007-06-01
TWI323492B TWI323492B (2) 2010-04-11

Family

ID=38005620

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095138729A TW200721331A (en) 2005-11-04 2006-10-20 Molding apparatus for resin encapsulation of electronic part

Country Status (7)

Country Link
US (1) US20090068302A1 (2)
EP (1) EP1950023A1 (2)
JP (1) JP4953619B2 (2)
KR (1) KR100897654B1 (2)
CN (3) CN101180170B (2)
TW (1) TW200721331A (2)
WO (1) WO2007052467A1 (2)

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KR100889261B1 (ko) * 2007-08-20 2009-03-17 세크론 주식회사 분말 ｅｍｃ 트레이 및 이를 갖는 분말 ｅｍｃ 공급 장치
JP4990830B2 (ja) * 2008-03-27 2012-08-01 住友重機械工業株式会社 樹脂供給機構
KR100988629B1 (ko) 2008-07-28 2010-10-18 세크론 주식회사 에폭시 몰딩 혼합물 트레이
KR101042689B1 (ko) 2008-10-24 2011-06-20 세크론 주식회사 에폭시 몰딩 컴파운드를 공급하기 위한 트레이
JP5776092B2 (ja) * 2011-01-11 2015-09-09 アピックヤマダ株式会社 圧縮成形方法及び圧縮成形装置並びに樹脂供給ハンドラ
JP5682033B2 (ja) * 2011-03-14 2015-03-11 アピックヤマダ株式会社 樹脂封止装置
JP2013021199A (ja) * 2011-07-13 2013-01-31 Apic Yamada Corp 樹脂吸着搬送方法及び樹脂吸着搬送装置並びに樹脂封止方法
JP5953600B2 (ja) * 2011-08-12 2016-07-20 アピックヤマダ株式会社 樹脂供給装置、樹脂モールド装置および樹脂供給方法
KR101950894B1 (ko) * 2011-11-08 2019-04-22 아피쿠 야마다 가부시키가이샤 수지 밀봉 장치
JP6071869B2 (ja) * 2013-12-27 2017-02-01 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6017492B2 (ja) 2014-04-24 2016-11-02 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法、突起電極付き板状部材、及び樹脂封止電子部品
JP5944445B2 (ja) 2014-07-18 2016-07-05 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法、突起電極付き板状部材、樹脂封止電子部品、及び突起電極付き板状部材の製造方法
JP6282564B2 (ja) * 2014-09-16 2018-02-21 東芝メモリ株式会社 半導体装置の製造方法
JP6491508B2 (ja) * 2015-03-23 2019-03-27 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂成形品の製造方法
JP6333761B2 (ja) * 2015-03-31 2018-05-30 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給装置並びに圧縮成形方法及び圧縮成形装置
CN104875313A (zh) * 2015-04-23 2015-09-02 昆山群悦精密模具有限公司 脱气式电子封装模具
JP6017634B1 (ja) 2015-06-10 2016-11-02 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給装置及び方法、圧縮成形装置、並びに樹脂成形品製造方法
JP6039750B1 (ja) 2015-06-10 2016-12-07 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給装置及び圧縮成形装置
JP6080907B2 (ja) 2015-06-25 2017-02-15 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給装置及び方法、圧縮成形装置、並びに樹脂成形品製造方法
JP6440599B2 (ja) * 2015-08-28 2018-12-19 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6672103B2 (ja) 2016-08-01 2020-03-25 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
JP6212609B1 (ja) 2016-08-19 2017-10-11 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
JP6279047B1 (ja) 2016-10-11 2018-02-14 Ｔｏｗａ株式会社 樹脂材料供給装置、樹脂材料供給方法、樹脂成形装置、及び樹脂成形品製造方法
JP6654994B2 (ja) * 2016-10-31 2020-02-26 Ｔｏｗａ株式会社 回路部品の製造方法
JP6349376B2 (ja) * 2016-12-07 2018-06-27 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給装置及び方法、並びに圧縮成形装置及び樹脂成形品製造方法
JP6774865B2 (ja) * 2016-12-13 2020-10-28 アピックヤマダ株式会社 枠体治具、樹脂供給治具及びその計量方法、モールド樹脂の計量装置及び方法、樹脂供給装置、樹脂供給計量装置及び方法、並びに樹脂モールド装置及び方法
JP6723177B2 (ja) 2017-02-24 2020-07-15 Ｔｏｗａ株式会社 樹脂成形装置、樹脂成形方法、及び樹脂成形品の製造方法
JP7042813B2 (ja) 2017-05-16 2022-03-28 株式会社ブリヂストン 発泡成形型、および発泡成形体の製造方法
JP6416996B1 (ja) * 2017-07-24 2018-10-31 アサヒ・エンジニアリング株式会社 樹脂封止装置用の封止型
CN109935536A (zh) * 2017-12-19 2019-06-25 均华精密工业股份有限公司 布胶装置及其方法
JP6876637B2 (ja) * 2018-01-22 2021-05-26 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
KR102337659B1 (ko) * 2018-02-21 2021-12-09 삼성전자주식회사 금형 검사 장치 및 금형 검사 방법
CN109049461B (zh) * 2018-08-09 2023-09-01 深圳鼎晶科技有限公司 一种全自动精密模压封装线
CN110815686A (zh) * 2019-11-27 2020-02-21 苏州均华精密机械有限公司 载板热压模封设备及其方法
JP7470983B2 (ja) * 2020-11-17 2024-04-19 アピックヤマダ株式会社 樹脂供給装置、樹脂封止装置、及び樹脂封止品の製造方法
TWI790808B (zh) * 2021-11-04 2023-01-21 日月光半導體製造股份有限公司 模封治具
WO2026063009A1 (ja) * 2024-09-18 2026-03-26 株式会社村田製作所 電子部品の製造方法および製造装置

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JP3062192B1 (ja) * 1999-09-01 2000-07-10 松下電子工業株式会社 リ―ドフレ―ムとそれを用いた樹脂封止型半導体装置の製造方法
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Also Published As

Publication number Publication date
JP4953619B2 (ja) 2012-06-13
CN101180170A (zh) 2008-05-14
EP1950023A1 (en) 2008-07-30
CN103395158A (zh) 2013-11-20
CN103395157B (zh) 2015-09-02
KR20070121741A (ko) 2007-12-27
CN101180170B (zh) 2013-08-07
TWI323492B (2) 2010-04-11
JP2007125783A (ja) 2007-05-24
WO2007052467A1 (ja) 2007-05-10
US20090068302A1 (en) 2009-03-12
KR100897654B1 (ko) 2009-05-14
CN103395158B (zh) 2015-10-07
CN103395157A (zh) 2013-11-20

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