TW200724272A - Method for bonding between electrical devices using ultrasonic vibration - Google Patents

Method for bonding between electrical devices using ultrasonic vibration

Info

Publication number
TW200724272A
TW200724272A TW095143148A TW95143148A TW200724272A TW 200724272 A TW200724272 A TW 200724272A TW 095143148 A TW095143148 A TW 095143148A TW 95143148 A TW95143148 A TW 95143148A TW 200724272 A TW200724272 A TW 200724272A
Authority
TW
Taiwan
Prior art keywords
bonding
electrical devices
ultrasonic vibration
electrical device
adhesives
Prior art date
Application number
TW095143148A
Other languages
Chinese (zh)
Other versions
TWI306423B (en
Inventor
Kyung-Wook Paik
Myung-Jin Yim
Hyoung-Joon Kim
Ki-Won Lee
Original Assignee
Korea Advanced Inst Sci & Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Advanced Inst Sci & Tech filed Critical Korea Advanced Inst Sci & Tech
Publication of TW200724272A publication Critical patent/TW200724272A/en
Application granted granted Critical
Publication of TWI306423B publication Critical patent/TWI306423B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/253—Materials not comprising solid metals or solid metalloids, e.g. polymers or ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention is to provide a method for bonding between electrical devices, including the steps of: aligning electrodes on a bonded area of an upper electrical device and a lower electrical device to be bonded; and curing of adhesives by applying ultrasonic energy to the adhesives between the upper electrical device and the lower electrical device.
TW095143148A 2005-11-24 2006-11-22 Method for bonding between electrical devices using ultrasonic vibration TWI306423B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050113105A KR100746330B1 (en) 2005-11-24 2005-11-24 Connection method between electronic parts using ultrasonic wave

Publications (2)

Publication Number Publication Date
TW200724272A true TW200724272A (en) 2007-07-01
TWI306423B TWI306423B (en) 2009-02-21

Family

ID=38067402

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143148A TWI306423B (en) 2005-11-24 2006-11-22 Method for bonding between electrical devices using ultrasonic vibration

Country Status (6)

Country Link
JP (1) JP2009517861A (en)
KR (1) KR100746330B1 (en)
CN (1) CN101322233B (en)
DE (1) DE112006003181T5 (en)
TW (1) TWI306423B (en)
WO (1) WO2007061216A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492342B (en) * 2011-10-12 2015-07-11 聯詠科技股份有限公司 Integrated circuit chip package and application glass flip chip substrate structure
US9236360B2 (en) 2011-10-12 2016-01-12 Novatek Microelectronics Corp. IC chip package and chip-on-glass structure using the same

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JP4364928B2 (en) * 2007-04-13 2009-11-18 積水化学工業株式会社 Conductive fine particles, anisotropic conductive material, and conductive connection structure
KR100844430B1 (en) * 2007-08-24 2008-07-08 (주)에이앤아이 Connection method between electronic parts
DE102008050000A1 (en) * 2008-09-30 2010-04-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for the simultaneous mechanical and electrical connection of two parts
KR20100053016A (en) * 2008-11-12 2010-05-20 한국과학기술원 (method for bonding between electrical devices by adjusting the heating temperature of adhesive and apparatus for bonding between electrical devices by adjusting the heating temperature of adhesive
KR101046590B1 (en) 2009-02-16 2011-07-05 한국과학기술원 Electronic component joining method using vibration energy and vibration energy application device
KR101051045B1 (en) * 2009-06-02 2011-07-21 중앙대학교 산학협력단 Terminal connection method using conductive adhesive
KR101025620B1 (en) * 2009-07-13 2011-03-30 한국과학기술원 Anisotropic Conductive Adhesive for Ultrasonic Bonding and Connecting Method Between Electronic Components Using the Same
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
KR101582943B1 (en) * 2009-10-15 2016-01-08 삼성디스플레이 주식회사 Manufacturing method of flat panel display
DE102010039339A1 (en) 2010-08-16 2012-08-09 Steffen Möglich Adhesive system, useful for a workpiece, comprises microcapsules in which a coupling agent or a component of a coupling agent is encapsulated
CN102157406A (en) * 2011-01-20 2011-08-17 中南大学 Method for bonding chip with resin substrate through ultrasonic vibration
KR101908501B1 (en) 2011-12-07 2018-10-17 엘지디스플레이 주식회사 Integrated Touch Screen With Organic Emitting Display Device and Method for Manufacturing the Same
DE102013009234B4 (en) 2012-06-01 2019-10-02 Technische Universität Dresden Process for the preparation of electrically conductive compounds between joining partners as well as a use of a polymer or polymer mixture
KR101348127B1 (en) 2012-06-18 2014-01-07 손재설 Maunfacturing method for circuit pattern on heat sink
JP2014053597A (en) * 2012-08-09 2014-03-20 Hitachi Chemical Co Ltd Chip type electronic component and connection structure
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EP2884242B1 (en) * 2013-12-12 2021-12-08 ams International AG Sensor Package And Manufacturing Method
CN104051281B (en) * 2014-06-13 2016-08-31 武汉理工大学 Filling device and method under ultrasonic activation auxiliary flip-chip plastic packaging molding
CN104157617B (en) 2014-07-29 2017-11-17 华为技术有限公司 Chip integrated module, chip packaging structure and chip integration method
CA3036115A1 (en) * 2016-10-07 2018-04-12 Multimaterial-Welding Ag Method of activating adhesives
KR101740006B1 (en) * 2016-11-23 2017-06-09 지스마트 주식회사 Flexible circuit board for transparent display board improved durability and the assembling method thereof
KR101932337B1 (en) 2017-04-12 2018-12-26 한국과학기술원 Anisotropic conductive film including polymer layer for suppressing movement of conductive particles and manufacturing method thereof using vertical ultrasonic wave
WO2018207547A1 (en) * 2017-05-12 2018-11-15 コニカミノルタ株式会社 Light-emitting device
GB2584106B (en) 2019-05-21 2024-03-27 Pragmatic Printing Ltd Flexible electronic structure
KR102704007B1 (en) * 2019-09-30 2024-09-10 삼성디스플레이 주식회사 Ultrasonic bonding apparatus and ultrasonic bonding method using the same
JP7406955B2 (en) * 2019-10-29 2023-12-28 セイコーインスツル株式会社 2-layer single-sided flexible board and method for manufacturing a 2-layer single-sided flexible board
KR102860672B1 (en) 2020-07-30 2025-09-17 삼성디스플레이 주식회사 Electronic device
GB2601325B (en) 2020-11-25 2023-12-13 Pragmatic Semiconductor Ltd Support structures for flexible electronic circuits
TWI787685B (en) * 2020-12-11 2022-12-21 力成科技股份有限公司 Three-dimensional integrated circuit assembly and manufacturing method thereof
CN112867288B (en) * 2021-01-05 2021-08-17 江苏特丽亮镀膜科技有限公司 ACF conductive adhesive film structure, hot pressing method thereof and hot pressing assembly
KR102520768B1 (en) * 2021-04-21 2023-04-12 주식회사 경신전선 Method for ultrasonic bonding for circuit device using anisotropic conductive film
WO2026014567A1 (en) * 2024-07-10 2026-01-15 엘지전자 주식회사 Circuit device and display device comprising same
CN120018400A (en) * 2025-02-14 2025-05-16 江苏洲旭电路科技有限公司 A manufacturing process for ultra-thin printed circuit boards for MiniLED

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492342B (en) * 2011-10-12 2015-07-11 聯詠科技股份有限公司 Integrated circuit chip package and application glass flip chip substrate structure
US9236360B2 (en) 2011-10-12 2016-01-12 Novatek Microelectronics Corp. IC chip package and chip-on-glass structure using the same

Also Published As

Publication number Publication date
KR20070025889A (en) 2007-03-08
DE112006003181T5 (en) 2008-11-06
KR100746330B1 (en) 2007-08-03
CN101322233A (en) 2008-12-10
WO2007061216A1 (en) 2007-05-31
TWI306423B (en) 2009-02-21
CN101322233B (en) 2011-04-20
JP2009517861A (en) 2009-04-30

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