TW200725233A - Heat dissipation device - Google Patents

Heat dissipation device

Info

Publication number
TW200725233A
TW200725233A TW094144732A TW94144732A TW200725233A TW 200725233 A TW200725233 A TW 200725233A TW 094144732 A TW094144732 A TW 094144732A TW 94144732 A TW94144732 A TW 94144732A TW 200725233 A TW200725233 A TW 200725233A
Authority
TW
Taiwan
Prior art keywords
heat
dissipation device
heat dissipation
spreader
heat sink
Prior art date
Application number
TW094144732A
Other languages
Chinese (zh)
Other versions
TWI308682B (en
Inventor
Liang-Hui Zhao
Yi-Qiang Wu
Chun-Chi Chen
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94144732A priority Critical patent/TWI308682B/en
Publication of TW200725233A publication Critical patent/TW200725233A/en
Application granted granted Critical
Publication of TWI308682B publication Critical patent/TWI308682B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device includes a heat spreader for contacting an electronic component, a heat sink mounted on the heat spreader, a fan mounted on the heat sink, a heat-dissipating component, and a heat pipe thermally connecting the heat spreader, the heat sink and the electronic component together. The heat sink includes a core corresponding to the heat spreader and located under the fan, and a plurality of fins extending from the core.
TW94144732A 2005-12-16 2005-12-16 Heat dissipation device TWI308682B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94144732A TWI308682B (en) 2005-12-16 2005-12-16 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94144732A TWI308682B (en) 2005-12-16 2005-12-16 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW200725233A true TW200725233A (en) 2007-07-01
TWI308682B TWI308682B (en) 2009-04-11

Family

ID=45071877

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94144732A TWI308682B (en) 2005-12-16 2005-12-16 Heat dissipation device

Country Status (1)

Country Link
TW (1) TWI308682B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI815294B (en) * 2022-01-28 2023-09-11 奇鋐科技股份有限公司 Thermal module structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI815294B (en) * 2022-01-28 2023-09-11 奇鋐科技股份有限公司 Thermal module structure
US12215934B2 (en) 2022-01-28 2025-02-04 Asia Vital Components Co., Ltd. Thermal module structure

Also Published As

Publication number Publication date
TWI308682B (en) 2009-04-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees