TW200725821A - Package structure for gas sensor and package method thereof - Google Patents

Package structure for gas sensor and package method thereof

Info

Publication number
TW200725821A
TW200725821A TW094146810A TW94146810A TW200725821A TW 200725821 A TW200725821 A TW 200725821A TW 094146810 A TW094146810 A TW 094146810A TW 94146810 A TW94146810 A TW 94146810A TW 200725821 A TW200725821 A TW 200725821A
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
gas sensor
sensing component
package
Prior art date
Application number
TW094146810A
Other languages
Chinese (zh)
Other versions
TWI292943B (en
Inventor
Tzong-Sheng Lee
Original Assignee
Unimems Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimems Mfg Co Ltd filed Critical Unimems Mfg Co Ltd
Priority to TW094146810A priority Critical patent/TW200725821A/en
Priority to JP2006009026U priority patent/JP3128792U/en
Priority to US11/598,657 priority patent/US7827851B2/en
Publication of TW200725821A publication Critical patent/TW200725821A/en
Application granted granted Critical
Publication of TWI292943B publication Critical patent/TWI292943B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004—Gaseous mixtures, e.g. polluted air
    • G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

The invention provides a package structure for a gas sensor and the package method. The gas sensor comprises a printed circuit board, a sensing component and a covering body. The sensing component adheres and wires bonding to the printed circuit board. The covering body covers the sensing component on the printed circuit board. The printed circuit board disposes wiring circuit to connect with the wire bonding of the sensing component. It can carry out testing and controlling signal of the sensing component by the wiring circuit. It can use single printed circuit board to carry out packaging and testing of many sensing components by this invention. It doesn't need metal lead leg. The cost of gas sensor can be reduced largely.
TW094146810A 2005-12-27 2005-12-27 Package structure for gas sensor and package method thereof TW200725821A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094146810A TW200725821A (en) 2005-12-27 2005-12-27 Package structure for gas sensor and package method thereof
JP2006009026U JP3128792U (en) 2005-12-27 2006-11-06 Gas sensor package structure
US11/598,657 US7827851B2 (en) 2005-12-27 2006-11-14 Packaging structure of gas detector and method for making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094146810A TW200725821A (en) 2005-12-27 2005-12-27 Package structure for gas sensor and package method thereof

Publications (2)

Publication Number Publication Date
TW200725821A true TW200725821A (en) 2007-07-01
TWI292943B TWI292943B (en) 2008-01-21

Family

ID=38192331

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146810A TW200725821A (en) 2005-12-27 2005-12-27 Package structure for gas sensor and package method thereof

Country Status (3)

Country Link
US (1) US7827851B2 (en)
JP (1) JP3128792U (en)
TW (1) TW200725821A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI808541B (en) * 2021-11-22 2023-07-11 財團法人工業技術研究院 Breathable lid of chip package structure and manufacturing method thereof

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5279738B2 (en) * 2010-01-29 2013-09-04 フィガロ技研株式会社 Assembly method of gas sensor to printed circuit board
US8695402B2 (en) * 2010-06-03 2014-04-15 Honeywell International Inc. Integrated IR source and acoustic detector for photoacoustic gas sensor
US9285251B2 (en) * 2010-08-19 2016-03-15 Inficon Ab Gas sensor housing
CN106442865B (en) * 2015-08-12 2019-04-02 罕王微电子（辽宁）有限公司 A kind of gas sensor and its packaging method
TWI767241B (en) * 2020-05-28 2022-06-11 國立陽明交通大學 Gas sensing device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4345301A (en) * 1981-02-23 1982-08-17 Honeywell Inc. Capacitive humidity transducer
JPH04353753A (en) * 1991-05-31 1992-12-08 Matsushita Electric Ind Co Ltd Humidity sensor
US5247827A (en) * 1992-04-14 1993-09-28 Bell Communications Research, Inc. Resistive measurement of airborne contaminants
JPH0592706U (en) * 1992-05-19 1993-12-17 ティーディーケイ株式会社 Humidity detector
EP0760474B1 (en) * 1995-09-04 2004-05-12 Siemens Building Technologies AG Photo-acoustic gas sensor and its use
US5721430A (en) * 1995-04-13 1998-02-24 Engelhard Sensor Technologies Inc. Passive and active infrared analysis gas sensors and applicable multichannel detector assembles
JPH09180080A (en) * 1995-12-26 1997-07-11 Hochiki Corp HCl sensor
US6067840A (en) * 1997-08-04 2000-05-30 Texas Instruments Incorporated Method and apparatus for infrared sensing of gas
EP1178302B1 (en) * 2000-07-03 2005-10-26 Matsushita Electric Works, Ltd. Capacitance type moisture sensor and method of producing the same
US6418778B1 (en) * 2001-02-26 2002-07-16 Jong-Jiing Shiau Gas detector equipped with feedback function
US7043958B2 (en) * 2002-09-27 2006-05-16 Spx Corporation Gas analyzer automated purge/zero process
DE10322017B8 (en) * 2003-05-16 2005-02-24 Sitronic Gesellschaft für elektrotechnische Ausrüstung mbH. & Co. KG sensor unit
GB0327931D0 (en) * 2003-12-02 2004-01-07 City Tech Gas sensor
US7051577B2 (en) * 2003-12-12 2006-05-30 Radiaulics, Inc. Multi-functional leak detection instrument along with sensor mounting assembly and methodology utilizing the same
CN1938588B (en) * 2004-01-27 2011-11-09 H2Scan公司 Isolated gas sensor structure
US20060191318A1 (en) * 2005-02-25 2006-08-31 Mcbride Charles L Digitally accessible sensor
WO2006121321A1 (en) * 2005-05-10 2006-11-16 Sensata Technologies Holland B.V. Sensor module package
US20090151424A1 (en) * 2007-12-12 2009-06-18 Chin-Ying Huang Structure of a detecting and measuring device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI808541B (en) * 2021-11-22 2023-07-11 財團法人工業技術研究院 Breathable lid of chip package structure and manufacturing method thereof
US12191219B2 (en) 2021-11-22 2025-01-07 Industrial Technology Research Institute Gas-permeable package lid of chip package structure and manufacturing method thereof

Also Published As

Publication number Publication date
JP3128792U (en) 2007-01-25
US20070144903A1 (en) 2007-06-28
US7827851B2 (en) 2010-11-09
TWI292943B (en) 2008-01-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees