TW200725822A - Package structure of micro gas sensor and making method thereof - Google Patents

Package structure of micro gas sensor and making method thereof

Info

Publication number
TW200725822A
TW200725822A TW094146641A TW94146641A TW200725822A TW 200725822 A TW200725822 A TW 200725822A TW 094146641 A TW094146641 A TW 094146641A TW 94146641 A TW94146641 A TW 94146641A TW 200725822 A TW200725822 A TW 200725822A
Authority
TW
Taiwan
Prior art keywords
gas sensor
making method
package structure
load bearing
micro gas
Prior art date
Application number
TW094146641A
Other languages
Chinese (zh)
Other versions
TWI290358B (en
Inventor
Wen-Wang Ke
Nai-Hao Kuo
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW094146641A priority Critical patent/TWI290358B/en
Publication of TW200725822A publication Critical patent/TW200725822A/en
Application granted granted Critical
Publication of TWI290358B publication Critical patent/TWI290358B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)

Abstract

The invention provides a package structure of micro gas sensor and the making method. It is fixed at least a micro sensing chip on the containing space of a load bearing component. The micro sensing chip electrically connects with the load bearing component. A filter component is fixed at the top surface of the containing space of the load bearing component. The filter component comprises at least structure net and thin film located at the outside surface of the said structure net. The filter component can isolate the light, moisture, pollution substance in the environment. It can overcome the drawback of receiving pollution easily in prior art.
TW094146641A 2005-12-27 2005-12-27 Package structure of micro gas sensor and making method thereof TWI290358B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094146641A TWI290358B (en) 2005-12-27 2005-12-27 Package structure of micro gas sensor and making method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094146641A TWI290358B (en) 2005-12-27 2005-12-27 Package structure of micro gas sensor and making method thereof

Publications (2)

Publication Number Publication Date
TW200725822A true TW200725822A (en) 2007-07-01
TWI290358B TWI290358B (en) 2007-11-21

Family

ID=39301427

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146641A TWI290358B (en) 2005-12-27 2005-12-27 Package structure of micro gas sensor and making method thereof

Country Status (1)

Country Link
TW (1) TWI290358B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111517271A (en) * 2019-02-05 2020-08-11 英飞凌科技股份有限公司 Method including panel bonding operation and electronic device including cavity
TWI870834B (en) * 2023-04-25 2025-01-21 財團法人工業技術研究院 Breathable lid of chip package structure and manufacturing method and interface structure thereof
TWI878285B (en) * 2019-11-15 2025-04-01 日月光半導體製造股份有限公司 Semiconductor package structure and method for manufacturing the same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI423352B (en) * 2008-10-15 2014-01-11 頎邦科技股份有限公司 Gas sensor manufacturing method
EP2731129A1 (en) 2012-11-07 2014-05-14 ams AG Molded semiconductor sensor device and method of producing the same at a wafer-level
CN110579516A (en) * 2019-09-02 2019-12-17 青岛歌尔智能传感器有限公司 nitrogen dioxide gas detection device, manufacturing method thereof and electronic product
TWI808541B (en) 2021-11-22 2023-07-11 財團法人工業技術研究院 Breathable lid of chip package structure and manufacturing method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111517271A (en) * 2019-02-05 2020-08-11 英飞凌科技股份有限公司 Method including panel bonding operation and electronic device including cavity
US11921032B2 (en) 2019-02-05 2024-03-05 Infineon Technologies Ag Methods including panel bonding acts and electronic devices including cavities
TWI878285B (en) * 2019-11-15 2025-04-01 日月光半導體製造股份有限公司 Semiconductor package structure and method for manufacturing the same
TWI870834B (en) * 2023-04-25 2025-01-21 財團法人工業技術研究院 Breathable lid of chip package structure and manufacturing method and interface structure thereof

Also Published As

Publication number Publication date
TWI290358B (en) 2007-11-21

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