TW200725838A - Thermal conductive apparatus and manufacturing method thereof - Google Patents

Thermal conductive apparatus and manufacturing method thereof

Info

Publication number
TW200725838A
TW200725838A TW094144993A TW94144993A TW200725838A TW 200725838 A TW200725838 A TW 200725838A TW 094144993 A TW094144993 A TW 094144993A TW 94144993 A TW94144993 A TW 94144993A TW 200725838 A TW200725838 A TW 200725838A
Authority
TW
Taiwan
Prior art keywords
thermal conductive
dielectric layer
heat dissipation
conductive polymer
polymer dielectric
Prior art date
Application number
TW094144993A
Other languages
Chinese (zh)
Other versions
TWI270187B (en
Inventor
Shau-Chew Wang
Jyh-Ming Yu
Original Assignee
Polytronics Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polytronics Technology Corp filed Critical Polytronics Technology Corp
Priority to TW094144993A priority Critical patent/TWI270187B/en
Priority to US11/638,208 priority patent/US20070137835A1/en
Application granted granted Critical
Publication of TWI270187B publication Critical patent/TWI270187B/en
Publication of TW200725838A publication Critical patent/TW200725838A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The present invention discloses a thermal conductive apparatus, comprising a first electrode foil, a second electrode foil, a heat dissipation strip and a thermal conductive polymer dielectric layer. The thermal conductive polymer dielectric layer is stacked and disposed among the two electrode foils and the heat dissipation strip with a high thermal conductivity (greater than 1 W/mK). The interface among the thermal conductive polymer dielectric layer and the first and second electrode foils and the heat dissipation strip comprises at least a micro rough surface, which is formed by a plurality of nodules by means of electro-deposition. The first and second electrode foils are electrically spaced from each other and serve to connect to a heat radiating device and electrically connect to a power source.
TW094144993A 2005-12-19 2005-12-19 Thermal conductive apparatus and manufacturing method thereof TWI270187B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094144993A TWI270187B (en) 2005-12-19 2005-12-19 Thermal conductive apparatus and manufacturing method thereof
US11/638,208 US20070137835A1 (en) 2005-12-19 2006-12-13 Thermal conductive apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094144993A TWI270187B (en) 2005-12-19 2005-12-19 Thermal conductive apparatus and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TWI270187B TWI270187B (en) 2007-01-01
TW200725838A true TW200725838A (en) 2007-07-01

Family

ID=38172085

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094144993A TWI270187B (en) 2005-12-19 2005-12-19 Thermal conductive apparatus and manufacturing method thereof

Country Status (2)

Country Link
US (1) US20070137835A1 (en)
TW (1) TWI270187B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102150484A (en) * 2008-09-26 2011-08-10 派克汉尼芬公司 Thermal Gel Pack
US20160211431A1 (en) * 2015-01-21 2016-07-21 Korea Institute Of Science And Technology Heat radiation sheet, light emitting device, and heat radiation back sheet for photovoltaic module, each including boron nitride heat dissipation layer
JP6332108B2 (en) * 2015-03-30 2018-05-30 三菱マテリアル株式会社 Manufacturing method of power module substrate with heat sink
CN115979022A (en) * 2021-10-14 2023-04-18 杭州三花研究院有限公司 Heat exchanger, method of treating heat exchanger, and composite material
US20230168049A1 (en) * 2021-12-01 2023-06-01 Amulaire Thermal Technology, Inc. Heat-dissipation substrate structure with high adhesive strength

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1252704B (en) * 1991-12-20 1995-06-26 Sgs Thomson Microelectronics SEMICONDUCTOR DEVICE STRUCTURE WITH METALLIC DISSIPATOR AND PLASTIC BODY WITH CONTACT SURFACES WITH CONTROLLED ROUGHNESS AND PROCEDURE FOR ITS MANUFACTURE
US5517758A (en) * 1992-05-29 1996-05-21 Matsushita Electric Industrial Co., Ltd. Plating method and method for producing a multi-layered printed wiring board using the same
US6175084B1 (en) * 1995-04-12 2001-01-16 Denki Kagaku Kogyo Kabushiki Kaisha Metal-base multilayer circuit substrate having a heat conductive adhesive layer
US6286207B1 (en) * 1998-05-08 2001-09-11 Nec Corporation Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it
JP2003101204A (en) * 2001-09-25 2003-04-04 Nec Kansai Ltd Wiring board, method of manufacturing wiring board, and electronic component
EP1357773A3 (en) * 2002-04-25 2005-11-30 Matsushita Electric Industrial Co., Ltd. Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
JP5105168B2 (en) * 2005-11-02 2012-12-19 イビデン株式会社 Multilayer printed wiring board
JP4811015B2 (en) * 2005-12-21 2011-11-09 イビデン株式会社 Method for manufacturing printed wiring board

Also Published As

Publication number Publication date
TWI270187B (en) 2007-01-01
US20070137835A1 (en) 2007-06-21

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Legal Events

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MK4A Expiration of patent term of an invention patent