TW200726341A - Cover tape and method for manufacture - Google Patents

Cover tape and method for manufacture

Info

Publication number
TW200726341A
TW200726341A TW095134144A TW95134144A TW200726341A TW 200726341 A TW200726341 A TW 200726341A TW 095134144 A TW095134144 A TW 095134144A TW 95134144 A TW95134144 A TW 95134144A TW 200726341 A TW200726341 A TW 200726341A
Authority
TW
Taiwan
Prior art keywords
cover tape
film layer
base film
longitudinal edges
manufacture
Prior art date
Application number
TW095134144A
Other languages
Chinese (zh)
Other versions
TWI418270B (en
Inventor
Urey Ruben E Velasquez
Laura Clark Devaney
David J Vanoverbeke
Daniel H Henderson
Barbara L Birrell
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200726341A publication Critical patent/TW200726341A/en
Application granted granted Critical
Publication of TWI418270B publication Critical patent/TWI418270B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

An article includes a cover tape, which includes a base film layer, recessed areas, tear enabling features, and an adhesive. The base film layer has opposed longitudinal edges. The recessed areas extend along the longitudinal edges of the base film layer. The tear enabling features are substantially parallel to the longitudinal edges. The adhesive is disposed on the recessed areas.
TW095134144A 2005-09-16 2006-09-15 Cover tape and manufacturing method TWI418270B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/228,956 US20070062844A1 (en) 2005-09-16 2005-09-16 Cover tape and method for manufacture

Publications (2)

Publication Number Publication Date
TW200726341A true TW200726341A (en) 2007-07-01
TWI418270B TWI418270B (en) 2013-12-01

Family

ID=37622523

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134144A TWI418270B (en) 2005-09-16 2006-09-15 Cover tape and manufacturing method

Country Status (9)

Country Link
US (1) US20070062844A1 (en)
EP (1) EP1932408A1 (en)
JP (2) JP2009508773A (en)
KR (1) KR20080052592A (en)
CN (2) CN101273677B (en)
IL (1) IL190163A0 (en)
MY (1) MY154939A (en)
TW (1) TWI418270B (en)
WO (1) WO2007035374A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8247057B2 (en) * 2005-09-16 2012-08-21 3M Innovative Properties Company Cover tape and method for manufacture
US20070062844A1 (en) * 2005-09-16 2007-03-22 Velasquez Urey Ruben E Cover tape and method for manufacture
US20070208395A1 (en) * 2005-10-05 2007-09-06 Leclerc Norbert H Phototherapy Device and Method of Providing Phototherapy to a Body Surface
US20080038501A1 (en) * 2006-08-09 2008-02-14 3M Innovative Properties Company Carrier tapes having tear-initiated cover tapes and methods of making thereof
US9048272B2 (en) * 2008-09-25 2015-06-02 Illinois Tool Works Inc. Devices and method for handling microelectronics assemblies
US20110023548A1 (en) * 2009-07-29 2011-02-03 Garner Sean M Glass substrate comprising an edge web portion
CN101879962A (en) * 2010-06-25 2010-11-10 广东风华高新科技股份有限公司 Taping packaging of chip components and its preparation method and device
CN101955015A (en) * 2010-09-15 2011-01-26 吴江耀鑫光电有限公司 Surface mount component carrier tape upper cover tape and processing method thereof
CN103601029B (en) * 2013-11-19 2016-01-20 江西若邦科技股份有限公司 The manufacturing equipment of cover strip on a kind of SMD heat-sealing type
US20170072659A1 (en) * 2014-03-04 2017-03-16 3M Innovative Properties Company Cover tapes and assemblies and method for making
JP5983902B1 (en) * 2014-11-12 2016-09-06 住友ベークライト株式会社 Cover tape for electronic component packaging, packaging material for electronic component packaging, and electronic component package
TWI612858B (en) * 2017-02-17 2018-01-21 盟立自動化股份有限公司 Carrying substrate and method for removing adhesive layer from carrier substrate
TWI622532B (en) * 2017-09-28 2018-05-01 Jenimetal Chemical Factory Co Ltd Improved structure of the cover tape
USD896633S1 (en) 2019-01-29 2020-09-22 Golden State Foods Corp. Container
USD896634S1 (en) 2019-01-29 2020-09-22 Golden State Foods Corp. Container
CN111977174B (en) * 2020-09-16 2021-12-21 江西若邦科技股份有限公司 Easily-torn cover tape and preparation method thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3467250A (en) * 1968-01-25 1969-09-16 Anthony N D Elia Easy tear tape with lift tab
US4584220A (en) * 1982-01-15 1986-04-22 Kroy Inc. Laminated tape
MY103125A (en) * 1987-07-24 1993-04-30 Lintec Corp Cover tape for sealing chip-holding parts of carrier tape
US4944979A (en) * 1989-10-19 1990-07-31 At&T Bell Laboratories Tape conveyers for components
EP0466937B2 (en) * 1990-02-06 1998-03-18 Sumitomo Bakelite Company Limited Plastic carrier tape and cover tape for electronic component chip
TW203624B (en) * 1991-02-28 1993-04-11 Sumitomo Bakelite Co
US5390472A (en) * 1992-06-19 1995-02-21 Minnesota Mining And Manufacturing Company Carrier tape with cover strip
US5325654A (en) * 1992-06-19 1994-07-05 Minnesota Mining And Manufacturing Company Carrier tape with cover strip
TW310121U (en) * 1993-12-22 1997-07-01 Lintec Corp Cover tape
TW393405B (en) * 1997-09-13 2000-06-11 Four Pillars Entpr Co Ltd Compound membrane for packaging
US6027802A (en) * 1997-10-23 2000-02-22 Four Piliars Enterprise Co., Ltd. Cover tape for packaging
CN1077074C (en) * 1998-01-26 2002-01-02 四维企业股份有限公司 Composite film for packaging
US20070062844A1 (en) * 2005-09-16 2007-03-22 Velasquez Urey Ruben E Cover tape and method for manufacture

Also Published As

Publication number Publication date
EP1932408A1 (en) 2008-06-18
IL190163A0 (en) 2008-08-07
CN101273678A (en) 2008-09-24
JP2009508773A (en) 2009-03-05
MY154939A (en) 2015-08-28
WO2007035374A1 (en) 2007-03-29
JP2014015263A (en) 2014-01-30
KR20080052592A (en) 2008-06-11
US20070062844A1 (en) 2007-03-22
CN101273677A (en) 2008-09-24
TWI418270B (en) 2013-12-01
CN101273677B (en) 2013-03-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees