TW200728331A - Resin for compression molding - Google Patents

Resin for compression molding

Info

Publication number
TW200728331A
TW200728331A TW095145979A TW95145979A TW200728331A TW 200728331 A TW200728331 A TW 200728331A TW 095145979 A TW095145979 A TW 095145979A TW 95145979 A TW95145979 A TW 95145979A TW 200728331 A TW200728331 A TW 200728331A
Authority
TW
Taiwan
Prior art keywords
compression molding
resin
cyclic olefin
based thermoplastic
thermoplastic resin
Prior art date
Application number
TW095145979A
Other languages
English (en)
Other versions
TWI473826B (zh
Inventor
Toshifumi Takemori
Yoshiaki Takaya
Takahito Mita
Iizuka Tetsuya
Yuji Hashima
Takahisa Kusuura
Takuji Taguchi
Original Assignee
Maruzen Petrochem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maruzen Petrochem Co Ltd filed Critical Maruzen Petrochem Co Ltd
Publication of TW200728331A publication Critical patent/TW200728331A/zh
Application granted granted Critical
Publication of TWI473826B publication Critical patent/TWI473826B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/005—Surface shaping of articles, e.g. embossing; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F32/00—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F32/08—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having two condensed rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F232/08—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F10/00—Homopolymers and copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2045/00—Use of polymers of unsaturated cyclic compounds having no unsaturated aliphatic groups in a side-chain, e.g. coumarone-indene resins or derivatives thereof, as moulding material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW95145979A 2005-12-09 2006-12-08 Thermoform resin TWI473826B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005357014 2005-12-09

Publications (2)

Publication Number Publication Date
TW200728331A true TW200728331A (en) 2007-08-01
TWI473826B TWI473826B (zh) 2015-02-21

Family

ID=38122857

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95145979A TWI473826B (zh) 2005-12-09 2006-12-08 Thermoform resin

Country Status (6)

Country Link
US (2) US20100019410A1 (zh)
EP (1) EP1958970B1 (zh)
JP (1) JP5331341B2 (zh)
KR (1) KR101270114B1 (zh)
TW (1) TWI473826B (zh)
WO (1) WO2007066712A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408041B (zh) * 2008-09-03 2013-09-11 Univ Nat Sun Yat Sen 用於製造增亮膜之模具的製造方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007037085A1 (ja) * 2005-09-27 2007-04-05 Scivax Corporation 熱インプリント用樹脂
JP5394619B2 (ja) * 2007-07-04 2014-01-22 丸善石油化学株式会社 熱インプリント方法
JP5331315B2 (ja) * 2007-07-04 2013-10-30 丸善石油化学株式会社 熱インプリント方法
JP5470528B2 (ja) * 2007-11-14 2014-04-16 丸善石油化学株式会社 エッチングマスク、エッチングマスク付き基材、微細加工品および微細加工品の製造方法
JPWO2011090139A1 (ja) * 2010-01-21 2013-05-23 Jsr株式会社 樹脂成形体
JP2021037709A (ja) * 2019-09-04 2021-03-11 住友ベークライト株式会社 成形体の製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4233851A1 (de) * 1992-10-08 1994-04-14 Hoechst Ag Substrat aus zumindest einem Cycloolefin-Copolymer für Aufzeichnungsmedien und Verfahren zu seiner Herstellung
JP3389704B2 (ja) * 1994-09-22 2003-03-24 ジェイエスアール株式会社 導光板
JP3633672B2 (ja) * 1995-07-04 2005-03-30 三井化学株式会社 環状オレフィン系樹脂組成物成形体
EP0800914B1 (en) * 1996-04-11 2002-07-03 Mitsui Chemicals, Inc. Laminated film and packaging material
JPH09323354A (ja) * 1996-06-05 1997-12-16 Japan Synthetic Rubber Co Ltd 光学シート
JP3856875B2 (ja) * 1996-09-26 2006-12-13 三井化学株式会社 ノルボルネン系樹脂組成物およびその用途
JPH1158476A (ja) * 1997-08-14 1999-03-02 Jsr Corp 薄板状成形品及びその成形方法
JP2000143829A (ja) * 1998-11-18 2000-05-26 Nippon Zeon Co Ltd 熱収縮性シートまたはフィルム
DE10009295A1 (de) * 2000-02-28 2001-08-30 Mitsubishi Polyester Film Gmbh Weisse, biaxial orientierte, schwer entflammbare Polyesterfolie mit Cycloolefincopolymer, Verfahren zu ihrer Herstellung und ihre Verwendung
JP2001273675A (ja) * 2000-03-28 2001-10-05 Nippon Zeon Co Ltd 情報記録媒体用基板
DE10026163A1 (de) * 2000-05-26 2001-11-29 Mitsubishi Polyester Film Gmbh Weiße, hochglänzende, UV-stabilisierte, schwerentflammbare Polyesterfolie enthaltend Cycloolefincopolymer (COC), Verfahren zu ihrer Herstellung und ihre Verwendung
JP2002113767A (ja) * 2000-10-06 2002-04-16 Sekisui Chem Co Ltd ノルボルネン系樹脂フィルムの製造方法
JP2002372632A (ja) * 2001-06-15 2002-12-26 Jsr Corp 導光板およびその製造方法
JP3656991B2 (ja) 2001-09-12 2005-06-08 丸善石油化学株式会社 環状オレフィン系共重合体の製造方法
WO2003061949A1 (en) * 2002-01-18 2003-07-31 Avery Dennison Corporation Sheet having microsized architecture
JP2006124657A (ja) * 2004-09-30 2006-05-18 Nippon Zeon Co Ltd 射出成形体
KR20060084256A (ko) * 2005-01-19 2006-07-24 삼성전자주식회사 액정 표시 장치용 발광 다이오드 소자의 렌즈 조성물,이를 포함하는 발광 다이오드 소자, 백라이트 유닛 및액정 표시 장치
KR101366505B1 (ko) * 2005-06-10 2014-02-24 오브듀캇 아베 고리형 올레핀 공중합체를 포함하는 임프린트 스탬프
WO2007037085A1 (ja) * 2005-09-27 2007-04-05 Scivax Corporation 熱インプリント用樹脂

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408041B (zh) * 2008-09-03 2013-09-11 Univ Nat Sun Yat Sen 用於製造增亮膜之模具的製造方法

Also Published As

Publication number Publication date
US20100019410A1 (en) 2010-01-28
JP5331341B2 (ja) 2013-10-30
WO2007066712A1 (ja) 2007-06-14
KR20080089338A (ko) 2008-10-06
EP1958970A4 (en) 2009-07-01
EP1958970B1 (en) 2011-11-23
US9242407B2 (en) 2016-01-26
TWI473826B (zh) 2015-02-21
KR101270114B1 (ko) 2013-05-31
US20140339735A1 (en) 2014-11-20
EP1958970A1 (en) 2008-08-20
JPWO2007066712A1 (ja) 2009-05-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees