TW200728521A - GaN crystal sheet - Google Patents
GaN crystal sheetInfo
- Publication number
- TW200728521A TW200728521A TW095142797A TW95142797A TW200728521A TW 200728521 A TW200728521 A TW 200728521A TW 095142797 A TW095142797 A TW 095142797A TW 95142797 A TW95142797 A TW 95142797A TW 200728521 A TW200728521 A TW 200728521A
- Authority
- TW
- Taiwan
- Prior art keywords
- plasma
- crystal sheet
- working pressure
- gallium nitride
- until
- Prior art date
Links
- 239000013078 crystal Substances 0.000 title abstract 5
- 229910002601 GaN Inorganic materials 0.000 abstract 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 abstract 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 abstract 1
- 229910001873 dinitrogen Inorganic materials 0.000 abstract 1
- 229910052733 gallium Inorganic materials 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- 239000000155 melt Substances 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
- C30B23/08—Epitaxial-layer growth by condensing ionised vapours
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
A method for forming a gallium nitride crystal sheet. According to the method a metal melt, including gallium, is brought to a vacuum of 0.01 Pa or lower and is heated to a growth temperature of between approximately 860 DEG C and approximately 870 DEG C. A nitrogen plasma is applied to the surface of the melt at a sub-atmospheric working pressure, until a gallium nitride crystal sheet is formed on top. Preferably, the growth temperature is of 863 DEG C, and the working pressure is within the range of 0.05 Pa and 2.5 Pa. According to a preferred embodiment, application of the plasma includes introducing nitrogen gas to the metal melt at the working pressure, igniting the gas into plasma, directing the plasma to the surface of the metal melt, until gallium nitride crystals crystallize thereon, and maintaining the working pressure and the directed plasma until a gallium nitride crystal sheet is formed.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73778605P | 2005-11-17 | 2005-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200728521A true TW200728521A (en) | 2007-08-01 |
Family
ID=38049065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095142797A TW200728521A (en) | 2005-11-17 | 2006-11-17 | GaN crystal sheet |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20090081109A1 (en) |
| EP (1) | EP1960571A2 (en) |
| TW (1) | TW200728521A (en) |
| WO (1) | WO2007057892A2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2008218524B2 (en) * | 2007-02-22 | 2012-02-02 | Mosaic Crystals | Group-III metal nitride and preparation thereof |
| KR101691558B1 (en) * | 2009-02-13 | 2016-12-30 | 갈리움 엔터프라이지즈 피티와이 엘티디 | Plasma Deposition |
| WO2014064260A1 (en) * | 2012-10-25 | 2014-05-01 | Wmcs Technologies Limited | Improvement in crystallisation and crystal growth |
| US11441234B2 (en) * | 2019-10-11 | 2022-09-13 | University Of Louisville Research Foundation, Inc. | Liquid phase epitaxy of III-V materials and alloys |
| CN114232083B (en) * | 2021-12-22 | 2023-07-21 | 中国科学院苏州纳米技术与纳米仿生研究所 | Preparation method of two-dimensional gallium nitride crystal |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999023693A1 (en) * | 1997-10-30 | 1999-05-14 | Sumitomo Electric Industries, Ltd. | GaN SINGLE CRYSTALLINE SUBSTRATE AND METHOD OF PRODUCING THE SAME |
| US6562124B1 (en) * | 1999-06-02 | 2003-05-13 | Technologies And Devices International, Inc. | Method of manufacturing GaN ingots |
| JP2002284600A (en) * | 2001-03-26 | 2002-10-03 | Hitachi Cable Ltd | Gallium nitride crystal substrate manufacturing method and gallium nitride crystal substrate |
| US6949140B2 (en) * | 2001-12-05 | 2005-09-27 | Ricoh Company, Ltd. | Crystal growth method, crystal growth apparatus, group-III nitride crystal and group-III nitride semiconductor device |
| US7097707B2 (en) * | 2001-12-31 | 2006-08-29 | Cree, Inc. | GaN boule grown from liquid melt using GaN seed wafers |
| US7771689B2 (en) * | 2002-11-08 | 2010-08-10 | University Of Louisville Research Foundation, Inc | Bulk synthesis of metal and metal based dielectric nanowires |
| FR2860248B1 (en) * | 2003-09-26 | 2006-02-17 | Centre Nat Rech Scient | PROCESS FOR PRODUCING AUTOMATED SUBSTRATES OF ELEMENT III NITRIDES BY HETERO-EPITAXIA ON A SACRIFICIAL LAYER |
| JP4534631B2 (en) * | 2003-10-31 | 2010-09-01 | 住友電気工業株式会社 | Method for producing group III nitride crystal |
| JP2005194146A (en) * | 2004-01-08 | 2005-07-21 | Sumitomo Electric Ind Ltd | Method for producing group III nitride crystal |
-
2006
- 2006-11-15 US US12/092,935 patent/US20090081109A1/en not_active Abandoned
- 2006-11-15 WO PCT/IL2006/001319 patent/WO2007057892A2/en not_active Ceased
- 2006-11-15 EP EP06809874A patent/EP1960571A2/en not_active Withdrawn
- 2006-11-17 TW TW095142797A patent/TW200728521A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP1960571A2 (en) | 2008-08-27 |
| WO2007057892A3 (en) | 2009-04-09 |
| WO2007057892A2 (en) | 2007-05-24 |
| US20090081109A1 (en) | 2009-03-26 |
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