TW200729547A - Light-emitting device - Google Patents

Light-emitting device

Info

Publication number
TW200729547A
TW200729547A TW095133877A TW95133877A TW200729547A TW 200729547 A TW200729547 A TW 200729547A TW 095133877 A TW095133877 A TW 095133877A TW 95133877 A TW95133877 A TW 95133877A TW 200729547 A TW200729547 A TW 200729547A
Authority
TW
Taiwan
Prior art keywords
light
emitting device
emitting element
heightening
gold
Prior art date
Application number
TW095133877A
Other languages
Chinese (zh)
Inventor
Takaki Yasuda
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200729547A publication Critical patent/TW200729547A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)

Abstract

A light-emitting device is provided in a light-emitting element with a bonding wire that is a fine metallic wire formed mainly of gold or copper and coated at least partly with a substance capable of heightening a reflection coefficient of a wavelength of light emitted from the light-emitting element.
TW095133877A 2005-09-13 2006-09-13 Light-emitting device TW200729547A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005264754A JP4918238B2 (en) 2005-09-13 2005-09-13 Light emitting device

Publications (1)

Publication Number Publication Date
TW200729547A true TW200729547A (en) 2007-08-01

Family

ID=37940996

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095133877A TW200729547A (en) 2005-09-13 2006-09-13 Light-emitting device

Country Status (4)

Country Link
JP (1) JP4918238B2 (en)
KR (1) KR100978028B1 (en)
CN (1) CN101263612B (en)
TW (1) TW200729547A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475727B (en) * 2012-05-10 2015-03-01 榮創能源科技股份有限公司 Light-emitting diode package manufacturing method and package structure thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1857126B1 (en) 2005-02-28 2018-10-24 CellSeed Inc. Cultured cell sheet, production method thereof, and application method thereof
JP5245594B2 (en) * 2007-07-27 2013-07-24 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
KR101380387B1 (en) 2007-09-12 2014-04-02 서울반도체 주식회사 Light emitting diode package
US8049237B2 (en) 2007-12-28 2011-11-01 Nichia Corporation Light emitting device
US8378369B2 (en) 2008-09-09 2013-02-19 Showa Denko K.K. Light emitting unit, light emitting module, and display device
JP5220522B2 (en) * 2008-09-09 2013-06-26 昭和電工株式会社 Light emitting device, light emitting module
JP5220527B2 (en) * 2008-09-11 2013-06-26 昭和電工株式会社 Light emitting device, light emitting module
TWI409368B (en) * 2010-07-30 2013-09-21 Epistar Corp A method for making a light emitting diode
EP2617438B1 (en) 2010-09-15 2020-02-19 Tokyo Women's Medical University Middle ear mucous membrane-like cell sheet, production method therefor and utilization thereof
JP6189747B2 (en) 2011-02-28 2017-08-30 株式会社セルシード Cell sheet having hyaluronic acid producing ability and method for producing the same
CN103078040B (en) * 2011-08-22 2016-12-21 Lg伊诺特有限公司 Light emitting device package and light device
JP5775015B2 (en) * 2012-03-09 2015-09-09 タツタ電線株式会社 Ag bonding wire and manufacturing method thereof
KR101296265B1 (en) * 2012-06-12 2013-08-14 순천대학교 산학협력단 Semiconductor light emitting device, semiconductor light emitting device package and methods for manufacturing the same
JP5855554B2 (en) * 2012-10-25 2016-02-09 日亜化学工業株式会社 Light emitting device
JP6136701B2 (en) * 2013-07-24 2017-05-31 日亜化学工業株式会社 Light emitting device
JP6432280B2 (en) * 2014-10-24 2018-12-05 日亜化学工業株式会社 Method for manufacturing light emitting device
JP6743487B2 (en) * 2016-05-25 2020-08-19 日亜化学工業株式会社 Light emitting device
TW201742276A (en) * 2016-05-31 2017-12-01 隆達電子股份有限公司 Bonding wire and semiconductor package structure
US10622531B2 (en) 2017-09-28 2020-04-14 Nichia Corporation Light-emitting device
JP2019068053A (en) * 2017-09-28 2019-04-25 日亜化学工業株式会社 Light emitting device
US20220293824A1 (en) * 2020-04-17 2022-09-15 Ningbo Sunpu Led Co., Ltd. Ultraviolet led device
US20210376563A1 (en) * 2020-05-26 2021-12-02 Excelitas Canada, Inc. Semiconductor Side Emitting Laser Leadframe Package and Method of Producing Same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04354387A (en) * 1991-05-31 1992-12-08 Iwasaki Electric Co Ltd Light emitting diode
JPH0766235A (en) * 1993-08-27 1995-03-10 Tanaka Denshi Kogyo Kk Composite bonding wire for semiconductor element and semiconductor device
JP4432275B2 (en) * 2000-07-13 2010-03-17 パナソニック電工株式会社 Light source device
JP2004266124A (en) * 2003-03-03 2004-09-24 Matsushita Electric Ind Co Ltd Semiconductor light emitting device
JP4572604B2 (en) * 2003-06-30 2010-11-04 日亜化学工業株式会社 Semiconductor light emitting element and light emitting device using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475727B (en) * 2012-05-10 2015-03-01 榮創能源科技股份有限公司 Light-emitting diode package manufacturing method and package structure thereof

Also Published As

Publication number Publication date
JP4918238B2 (en) 2012-04-18
CN101263612A (en) 2008-09-10
CN101263612B (en) 2010-04-14
JP2007080990A (en) 2007-03-29
KR100978028B1 (en) 2010-08-25
KR20080042921A (en) 2008-05-15

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