TW200729565A - Light emitting diode for top view type and side view type - Google Patents

Light emitting diode for top view type and side view type

Info

Publication number
TW200729565A
TW200729565A TW095147887A TW95147887A TW200729565A TW 200729565 A TW200729565 A TW 200729565A TW 095147887 A TW095147887 A TW 095147887A TW 95147887 A TW95147887 A TW 95147887A TW 200729565 A TW200729565 A TW 200729565A
Authority
TW
Taiwan
Prior art keywords
view type
light emitting
emitting diode
top view
substrate
Prior art date
Application number
TW095147887A
Other languages
Chinese (zh)
Other versions
TWI388069B (en
Inventor
Seung-Ryeol Ryu
Jae-Ho Cho
Seok-Jin Kang
Original Assignee
Seoul Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seoul Semiconductor Co Ltd filed Critical Seoul Semiconductor Co Ltd
Publication of TW200729565A publication Critical patent/TW200729565A/en
Application granted granted Critical
Publication of TWI388069B publication Critical patent/TWI388069B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)

Abstract

The present invention provides a light emitting diode capable of being used as top view and side view types. There is provided a light emitting diode, comprising a substrate; first and second leads formed on the substrate to be spaced apart from each other at a predetermined interval; and a light emitting diode chip mounted on any one of the first and second leads, wherein the first and second leads are formed to extend on the same side and rear surfaces of the substrate.
TW095147887A 2005-12-20 2006-12-20 Top view type and side view type light emitting diode TWI388069B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050126473A KR100719282B1 (en) 2005-12-20 2005-12-20 Top and Side View Common Light Emitting Diodes

Publications (2)

Publication Number Publication Date
TW200729565A true TW200729565A (en) 2007-08-01
TWI388069B TWI388069B (en) 2013-03-01

Family

ID=38188789

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147887A TWI388069B (en) 2005-12-20 2006-12-20 Top view type and side view type light emitting diode

Country Status (4)

Country Link
KR (1) KR100719282B1 (en)
DE (1) DE112006003435B4 (en)
TW (1) TWI388069B (en)
WO (1) WO2007073062A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414096B (en) * 2010-01-15 2013-11-01 I Chiun Precision Ind Co Ltd High power light emitting diode bracket

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8258526B2 (en) * 2008-07-03 2012-09-04 Samsung Led Co., Ltd. Light emitting diode package including a lead frame with a cavity
US9022632B2 (en) 2008-07-03 2015-05-05 Samsung Electronics Co., Ltd. LED package and a backlight unit unit comprising said LED package
KR101107770B1 (en) * 2009-05-26 2012-01-20 일진반도체 주식회사 LED Package and Backlight Unit
DE102013110733A1 (en) * 2013-09-27 2015-04-02 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
KR20160045453A (en) * 2014-10-17 2016-04-27 서울반도체 주식회사 Back light unit and light emitting device package for side-view
KR101678790B1 (en) * 2015-08-26 2016-11-23 주식회사원광전자 package with LED and illumination sensor
EP3601186B1 (en) 2017-03-20 2022-01-12 Central Glass Company, Limited Infrared rays (ir) reflective laminated glass for a window
EP3544066A1 (en) * 2018-03-23 2019-09-25 Excellence Opto. Inc. High heat dissipation light emitting diode package structure having at least two light cups and lateral light emission

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940003109A (en) * 1992-07-31 1994-02-19 김광호 Light emitting diode and manufacturing method
DE59812835D1 (en) * 1997-07-29 2005-07-07 Osram Opto Semiconductors Gmbh OPTOELECTRONIC COMPONENT
EP1103759A3 (en) * 1999-11-11 2005-02-23 Toyoda Gosei Co., Ltd. Full-color light source unit
JP2001210871A (en) * 2000-01-25 2001-08-03 Sharp Corp Side emission type light emitting diode, method for manufacturing the same, and portable terminal device provided with this side emission type light emitting diode
KR100395306B1 (en) * 2000-04-27 2003-08-25 한국과학기술원 Light emitting diode and its fabrication method
KR100639186B1 (en) * 2004-04-27 2006-10-30 럭스피아 주식회사 LED Package for Backlight

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414096B (en) * 2010-01-15 2013-11-01 I Chiun Precision Ind Co Ltd High power light emitting diode bracket

Also Published As

Publication number Publication date
TWI388069B (en) 2013-03-01
DE112006003435T5 (en) 2008-10-09
KR100719282B1 (en) 2007-05-17
DE112006003435B4 (en) 2012-04-26
WO2007073062A1 (en) 2007-06-28

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