TW200730644A - Metal material for electronic component, electronic component, electronic device, metal Material processing method, and process for manufacturing electronic component and electronic optical component - Google Patents
Metal material for electronic component, electronic component, electronic device, metal Material processing method, and process for manufacturing electronic component and electronic optical componentInfo
- Publication number
- TW200730644A TW200730644A TW095104236A TW95104236A TW200730644A TW 200730644 A TW200730644 A TW 200730644A TW 095104236 A TW095104236 A TW 095104236A TW 95104236 A TW95104236 A TW 95104236A TW 200730644 A TW200730644 A TW 200730644A
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic
- component
- metal material
- electronic component
- components
- Prior art date
Links
- 239000007769 metal material Substances 0.000 title abstract 3
- 230000003287 optical effect Effects 0.000 title abstract 2
- 238000003672 processing method Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000956 alloy Substances 0.000 abstract 4
- 239000000463 material Substances 0.000 abstract 2
- 229910001092 metal group alloy Inorganic materials 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 239000012776 electronic material Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000004973 liquid crystal related substance Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
Landscapes
- Conductive Materials (AREA)
- Manufacturing Of Electric Cables (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
The present invention is related to a metal alloy material used in electronic components, electronic device and their products, processing method of electronic and metallic materials, and electronic optical component. It provides a stable metal alloy material for electronic components, which exhibits excellent processing ability and lower resistivity than the conventional material and can be applied to, e.g., a liquid crystal display device, various semiconductor products or components, printed circuit board, and other IC chip components, etc. as well as provides electric component using the material and electronic device. The alloy essentially comprises Cu as a major constitution and, in addition, contains 0.1 to 7.0 wt% W and 0.1 to 3.0 wt% in total of one or more elements chosen from the group of Al, Au, Ag, Ti, Ni, Co and Si. The alloy material improves the overall weathering resistance by adding W to Cu and evenly distributing Mo into the Cu grain boundary.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005006579A JP2006193783A (en) | 2005-01-13 | 2005-01-13 | Metal material for electronic component, electronic component, electronic device, process for processing metal material, process for manufacturing electronic component and electronic optical component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200730644A true TW200730644A (en) | 2007-08-16 |
Family
ID=36800091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095104236A TW200730644A (en) | 2005-01-13 | 2006-02-08 | Metal material for electronic component, electronic component, electronic device, metal Material processing method, and process for manufacturing electronic component and electronic optical component |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006193783A (en) |
| TW (1) | TW200730644A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101064144B1 (en) | 2006-08-10 | 2011-09-15 | 울박, 인크 | A method of forming a conductive film, a thin film transistor, a panel having a thin film transistor, and a manufacturing method of a thin film transistor |
| JP4355743B2 (en) | 2006-12-04 | 2009-11-04 | 株式会社神戸製鋼所 | Cu alloy wiring film, TFT element for flat panel display using the Cu alloy wiring film, and Cu alloy sputtering target for producing the Cu alloy wiring film |
| JP5228251B2 (en) * | 2007-05-07 | 2013-07-03 | 三菱マテリアル株式会社 | Sputtering target for forming wiring film and electrode film for flat panel display using TFT transistor having excellent adhesion |
| JP2012027159A (en) * | 2010-07-21 | 2012-02-09 | Kobe Steel Ltd | Display device |
| CN104480346A (en) * | 2014-12-25 | 2015-04-01 | 春焱电子科技（苏州）有限公司 | Tantalum contained copper alloy for electronic material |
| WO2018189965A1 (en) | 2017-04-13 | 2018-10-18 | 株式会社アルバック | Liquid crystal display device, organic el display device, semiconductor element, wiring film, wiring substrate, and target |
| EP3963230B1 (en) * | 2019-05-02 | 2024-11-27 | Automotive Components Floby AB | A method for forming a friction member and a friction member |
-
2005
- 2005-01-13 JP JP2005006579A patent/JP2006193783A/en active Pending
-
2006
- 2006-02-08 TW TW095104236A patent/TW200730644A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006193783A (en) | 2006-07-27 |
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