TW200730785A - Manufacture method for flat heat pipe - Google Patents

Manufacture method for flat heat pipe

Info

Publication number
TW200730785A
TW200730785A TW095105062A TW95105062A TW200730785A TW 200730785 A TW200730785 A TW 200730785A TW 095105062 A TW095105062 A TW 095105062A TW 95105062 A TW95105062 A TW 95105062A TW 200730785 A TW200730785 A TW 200730785A
Authority
TW
Taiwan
Prior art keywords
connection part
shell
connection
heat pipe
manufacture method
Prior art date
Application number
TW095105062A
Other languages
Chinese (zh)
Other versions
TWI294957B (en
Inventor
xiu-wei Yang
Pei-Pei Chen
Jau-Ching Lin
Wen-Hua Yu
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW095105062A priority Critical patent/TW200730785A/en
Publication of TW200730785A publication Critical patent/TW200730785A/en
Application granted granted Critical
Publication of TWI294957B publication Critical patent/TWI294957B/zh

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Rigid Pipes And Flexible Pipes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A manufacture method for the flat heat pipe is provided, including the following steps: (A) a hollow shell unit is provided. The shell unit has a first shell and a second shell with the shape corresponding to the first shell to form a containing space. A first connection part is formed on the periphery of the first shell and a second connection part corresponding to the first connection part (411) is formed on the periphery of the second shell; (B) At least one of the two connection parts is performed by the vapor deposition method to form a connection layer on the surface opposite to the other connection part; and (C)The first connection part (411) is positioned on the second connection part and the connection layer is heated to melt. By the vapor deposition method, the connection layer with uniform thickness is formed on the second connection part to ensure the airtight connection between the first connection part and the second connection part.
TW095105062A 2006-02-15 2006-02-15 Manufacture method for flat heat pipe TW200730785A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095105062A TW200730785A (en) 2006-02-15 2006-02-15 Manufacture method for flat heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095105062A TW200730785A (en) 2006-02-15 2006-02-15 Manufacture method for flat heat pipe

Publications (2)

Publication Number Publication Date
TW200730785A true TW200730785A (en) 2007-08-16
TWI294957B TWI294957B (en) 2008-03-21

Family

ID=45068294

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105062A TW200730785A (en) 2006-02-15 2006-02-15 Manufacture method for flat heat pipe

Country Status (1)

Country Link
TW (1) TW200730785A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411384B (en) * 2008-03-26 2013-10-01 Asia Vital Components Co Ltd Manufacturing method of heat dissipation module

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395918B (en) * 2009-09-18 2013-05-11 Pegatron Corp Vapor chamber and manufacturing method thereof
TWI673467B (en) * 2018-11-26 2019-10-01 奇鋐科技股份有限公司 Manufacturing method of heat dissipation unit
US10809010B2 (en) 2018-12-17 2020-10-20 Asia Vital Components Co., Ltd. Manufacturing method of heat dissipation unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411384B (en) * 2008-03-26 2013-10-01 Asia Vital Components Co Ltd Manufacturing method of heat dissipation module

Also Published As

Publication number Publication date
TWI294957B (en) 2008-03-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees