TW200730828A - Probe sheet adhesion holder, probe card, semiconductor inspection apparatus, and method for manufacturing semiconductor device - Google Patents

Probe sheet adhesion holder, probe card, semiconductor inspection apparatus, and method for manufacturing semiconductor device

Info

Publication number
TW200730828A
TW200730828A TW095135413A TW95135413A TW200730828A TW 200730828 A TW200730828 A TW 200730828A TW 095135413 A TW095135413 A TW 095135413A TW 95135413 A TW95135413 A TW 95135413A TW 200730828 A TW200730828 A TW 200730828A
Authority
TW
Taiwan
Prior art keywords
probe
electrode
inspection apparatus
adhesion holder
probe sheet
Prior art date
Application number
TW095135413A
Other languages
English (en)
Other versions
TWI313752B (zh
Inventor
Susumu Kasukabe
Teruo Shoji
Akio Hasebe
Yoshinori Deguchi
Yasunori Narizuka
Original Assignee
Renesas Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW200730828A publication Critical patent/TW200730828A/zh
Application granted granted Critical
Publication of TWI313752B publication Critical patent/TWI313752B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW095135413A 2005-10-05 2006-09-25 Probe sheet adhesion holder, probe card, semiconductor inspection apparatus, and method for manufacturing semiconductor device TW200730828A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005291886A JP2007101373A (ja) 2005-10-05 2005-10-05 プローブシート接着ホルダ、プローブカード、半導体検査装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW200730828A true TW200730828A (en) 2007-08-16
TWI313752B TWI313752B (zh) 2009-08-21

Family

ID=38003119

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095135413A TW200730828A (en) 2005-10-05 2006-09-25 Probe sheet adhesion holder, probe card, semiconductor inspection apparatus, and method for manufacturing semiconductor device

Country Status (5)

Country Link
US (1) US7423439B2 (zh)
JP (1) JP2007101373A (zh)
KR (1) KR100838434B1 (zh)
CN (1) CN1952667A (zh)
TW (1) TW200730828A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD203976S (zh) 2019-01-25 2020-04-11 日商Ｔｏｗａ股份有限公司 電子元件保持器
TWI905896B (zh) * 2024-01-22 2025-11-21 美商艾賽股份有限公司 用於積體電路測試的免工具快速更換彈性接觸介面之系統及方法

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JP2005136246A (ja) * 2003-10-31 2005-05-26 Renesas Technology Corp 半導体集積回路装置の製造方法
JP5005195B2 (ja) * 2005-07-13 2012-08-22 東京エレクトロン株式会社 プローブカード製造方法
JP2007101373A (ja) * 2005-10-05 2007-04-19 Renesas Technology Corp プローブシート接着ホルダ、プローブカード、半導体検査装置および半導体装置の製造方法
JP4800007B2 (ja) 2005-11-11 2011-10-26 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法およびプローブカード
TWI276806B (en) * 2005-11-15 2007-03-21 Wintek Corp Thin-film probe card
US8248091B2 (en) * 2006-10-20 2012-08-21 Taiwan Semiconductor Manufacturing Co., Ltd. Universal array type probe card design for semiconductor device testing
JP2008151573A (ja) * 2006-12-15 2008-07-03 Micronics Japan Co Ltd 電気的接続装置およびその製造方法
JP5065674B2 (ja) * 2006-12-28 2012-11-07 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP2009204393A (ja) * 2008-02-27 2009-09-10 Renesas Technology Corp プローブカード、プローブカードの製造方法、半導体検査装置および半導体装置の製造方法
KR101232691B1 (ko) * 2008-02-29 2013-02-13 니혼 하츠쵸 가부시키가이샤 배선기판 및 프로브 카드
JP5503189B2 (ja) * 2009-05-14 2014-05-28 東京エレクトロン株式会社 プローブカード
DE202009007039U1 (de) 2009-05-15 2010-10-14 Stabilo International Gmbh Verschlusskappe
JP5381609B2 (ja) * 2009-10-20 2014-01-08 日本電産リード株式会社 検査用治具及び接触子
DE202010006061U1 (de) * 2010-04-23 2010-07-22 Helmut Fischer GmbH Institut für Elektronik und Messtechnik Messsonde zur zerstörungsfreien Messung der Dicke dünner Schichten
TWI435083B (zh) * 2010-07-27 2014-04-21 Mpi Corp Combination probe head for vertical probe card and its assembly alignment method
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
JP6040530B2 (ja) * 2012-01-17 2016-12-07 セイコーエプソン株式会社 ハンドラーおよび検査装置
US9685717B2 (en) * 2012-03-14 2017-06-20 R+D Sockets, Inc. Apparatus and method for a conductive elastomer on a coaxial cable or a microcable to improve signal integrity probing
TWI510788B (zh) * 2014-01-13 2015-12-01 Taiwan Elite Nano Technology Corp 探針結構及其製造方法
WO2015109208A2 (en) 2014-01-17 2015-07-23 Nuvotronics, Llc Wafer scale test interface unit: low loss and high isolation devices and methods for high speed and high density mixed signal interconnects and contactors
CN103901240B (zh) * 2014-03-24 2017-05-24 上海华力微电子有限公司 探针卡识别芯片安装方法
US10003149B2 (en) 2014-10-25 2018-06-19 ComponentZee, LLC Fluid pressure activated electrical contact devices and methods
US9577358B2 (en) * 2014-10-25 2017-02-21 ComponentZee, LLC Fluid pressure activated electrical contact devices and methods
JP6626254B2 (ja) * 2015-02-03 2019-12-25 株式会社テセック 半導体デバイス測定方法
KR101726399B1 (ko) * 2016-03-17 2017-04-13 주식회사 오킨스전자 바텀 메탈 플레이트 범프를 포함하는 테스트 소켓 및 그 제조 방법
DE102017209443A1 (de) * 2017-06-02 2018-12-06 Feinmetall Gmbh Kontaktmodul zur elektrischen Berührungskontaktierung eines Bauteils und Kontaktsystem
EP3651561B1 (en) * 2017-07-04 2022-02-09 Fuji Corporation Component mounting device
NL2021552B1 (en) * 2018-09-03 2020-04-30 Besi Netherlands Bv Method and device for selective separating electronic components from a frame with electronic components
KR102062471B1 (ko) * 2018-12-26 2020-01-03 고기돈 Ｒｆ 칩 테스트를 위한 버티컬 프루브를 구비한 필름 타입 프루브 카드
WO2020191295A1 (en) * 2019-03-20 2020-09-24 Celadon Systems, Inc. Portable probe card assembly
CN112649711B (zh) * 2019-10-12 2022-04-15 成都辰显光电有限公司 微发光二极管的检测装置及方法
WO2023032036A1 (ja) * 2021-08-31 2023-03-09 信越エンジニアリング株式会社 通電検査装置及び通電検査方法
US12052830B2 (en) 2021-12-06 2024-07-30 Advantest America, Inc. Method and process for creating high-performance coax sockets

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US4696849A (en) * 1985-09-16 1987-09-29 The Dow Chemical Company Process for preparing polyurethane-backed textiles
JP2539453B2 (ja) 1987-09-11 1996-10-02 株式会社日立製作所 半導体素子検査装置
US5012187A (en) * 1989-11-03 1991-04-30 Motorola, Inc. Method for parallel testing of semiconductor devices
JP2966671B2 (ja) 1991-11-18 1999-10-25 東京エレクトロン株式会社 プローブカード
JP3502874B2 (ja) 1994-06-03 2004-03-02 株式会社ルネサステクノロジ 接続装置およびその製造方法
EP0707214A3 (en) * 1994-10-14 1997-04-16 Hughes Aircraft Co Multiport membrane probe to test complete semiconductor plates
TW300954B (en) * 1995-07-14 1997-03-21 Tokyo Electron Co Ltd The probe card used in prober
US5642054A (en) * 1995-08-08 1997-06-24 Hughes Aircraft Company Active circuit multi-port membrane probe for full wafer testing
US5818246A (en) * 1996-05-07 1998-10-06 Zhong; George Guozhen Automatic multi-probe PWB tester
JPH1038924A (ja) 1996-07-25 1998-02-13 Advantest Corp プローブカード
JP3315339B2 (ja) 1997-05-09 2002-08-19 株式会社日立製作所 半導体素子の製造方法並びに半導体素子へのプロービング方法およびその装置
JPH11160356A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Ind Co Ltd ウェハ一括型測定検査用プローブカードおよびセラミック多層配線基板ならびにそれらの製造方法
JP2000150594A (ja) * 1998-11-05 2000-05-30 Hitachi Ltd 接続装置および押さえ部材付配線フィルムの製造方法並びに検査システムおよび半導体素子の製造方法
US6586955B2 (en) * 2000-03-13 2003-07-01 Tessera, Inc. Methods and structures for electronic probing arrays
DE10039336C2 (de) * 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
US6690184B1 (en) * 2000-08-31 2004-02-10 Micron Technology, Inc. Air socket for testing integrated circuits
TWI236723B (en) * 2002-10-02 2005-07-21 Renesas Tech Corp Probe sheet, probe card, semiconductor inspection device, and manufacturing method for semiconductor device
JP4465995B2 (ja) 2003-07-02 2010-05-26 株式会社日立製作所 プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法
JP2007101373A (ja) * 2005-10-05 2007-04-19 Renesas Technology Corp プローブシート接着ホルダ、プローブカード、半導体検査装置および半導体装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD203976S (zh) 2019-01-25 2020-04-11 日商Ｔｏｗａ股份有限公司 電子元件保持器
TWD204853S (zh) 2019-01-25 2020-05-21 日商Ｔｏｗａ股份有限公司 電子元件保持器
TWI905896B (zh) * 2024-01-22 2025-11-21 美商艾賽股份有限公司 用於積體電路測試的免工具快速更換彈性接觸介面之系統及方法

Also Published As

Publication number Publication date
CN1952667A (zh) 2007-04-25
TWI313752B (zh) 2009-08-21
JP2007101373A (ja) 2007-04-19
KR100838434B1 (ko) 2008-06-16
US20070103178A1 (en) 2007-05-10
KR20070038410A (ko) 2007-04-10
US7423439B2 (en) 2008-09-09

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees