TW200733211A - Wet cleaning apparatus comprising cleaning bath for robot chuck and rinse bath for substrate and, and method thereof - Google Patents

Wet cleaning apparatus comprising cleaning bath for robot chuck and rinse bath for substrate and, and method thereof

Info

Publication number
TW200733211A
TW200733211A TW095149285A TW95149285A TW200733211A TW 200733211 A TW200733211 A TW 200733211A TW 095149285 A TW095149285 A TW 095149285A TW 95149285 A TW95149285 A TW 95149285A TW 200733211 A TW200733211 A TW 200733211A
Authority
TW
Taiwan
Prior art keywords
bath
substrate
cleaning
robot chuck
rinse bath
Prior art date
Application number
TW095149285A
Other languages
English (en)
Chinese (zh)
Other versions
TWI362065B (de
Inventor
Hyun-Woo Cho
Original Assignee
K C Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K C Tech Co Ltd filed Critical K C Tech Co Ltd
Publication of TW200733211A publication Critical patent/TW200733211A/zh
Application granted granted Critical
Publication of TWI362065B publication Critical patent/TWI362065B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning In General (AREA)
TW095149285A 2005-12-28 2006-12-27 Wet cleaning apparatus comprising cleaning bath for robot chuck and rinse bath for substrate and, and method thereof TW200733211A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050131898A KR100637401B1 (ko) 2005-12-28 2005-12-28 로봇 척 세정조 겸용 기판 린스조, 이를 포함하는 습식세정 장치 및 기판 세정 방법

Publications (2)

Publication Number Publication Date
TW200733211A true TW200733211A (en) 2007-09-01
TWI362065B TWI362065B (de) 2012-04-11

Family

ID=37621689

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149285A TW200733211A (en) 2005-12-28 2006-12-27 Wet cleaning apparatus comprising cleaning bath for robot chuck and rinse bath for substrate and, and method thereof

Country Status (3)

Country Link
KR (1) KR100637401B1 (de)
CN (1) CN100487859C (de)
TW (1) TW200733211A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100895963B1 (ko) 2007-09-07 2009-05-07 주식회사 케이씨텍 웨이퍼 습식처리장치
US11682567B2 (en) 2020-06-30 2023-06-20 Applied Materials, Inc. Cleaning system with in-line SPM processing
CN113659044B (zh) * 2021-08-17 2023-07-25 通威太阳能(金堂)有限公司 一种清洗器和提高异质结太阳电池转换效率的方法

Also Published As

Publication number Publication date
TWI362065B (de) 2012-04-11
CN100487859C (zh) 2009-05-13
CN1992160A (zh) 2007-07-04
KR100637401B1 (ko) 2006-10-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees