TW200734403A - Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element - Google Patents

Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element

Info

Publication number
TW200734403A
TW200734403A TW095136629A TW95136629A TW200734403A TW 200734403 A TW200734403 A TW 200734403A TW 095136629 A TW095136629 A TW 095136629A TW 95136629 A TW95136629 A TW 95136629A TW 200734403 A TW200734403 A TW 200734403A
Authority
TW
Taiwan
Prior art keywords
composition
sealing
semiconductor element
group
cured product
Prior art date
Application number
TW095136629A
Other languages
Chinese (zh)
Other versions
TWI383024B (en
Inventor
Hisashi Shimizu
Toshio Shiobara
Tsutomu Kashiwagi
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200734403A publication Critical patent/TW200734403A/en
Application granted granted Critical
Publication of TWI383024B publication Critical patent/TWI383024B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention provides a composition for sealing optical devices that can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and also provides a cured product of the composition, and a sealing method that uses the composition. A resin composition for sealing an optical device, comprising: (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5 x 10<SP>4</SP> or greater, represented by an average composition formula: R1a(OX)bSiO(4-a-b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula -SiR2R3R4 (wherein R2 to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represent a number within a range from 1.00 to 1.5; b represents a nu,ber that satisfies 0<b<2, and a+b satisfies 1.00 <a+b <2), and (ii) a condensation catalyst, as well as a transparent cured product obtained by curing that composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element.
TW95136629A 2005-10-27 2006-10-03 Sealing optical device resin composition, hardened product thereof, and method of sealing a semiconductor device TWI383024B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005312504A JP4781780B2 (en) 2005-10-27 2005-10-27 Resin composition for sealing light-related device, cured product thereof and method for sealing semiconductor element

Publications (2)

Publication Number Publication Date
TW200734403A true TW200734403A (en) 2007-09-16
TWI383024B TWI383024B (en) 2013-01-21

Family

ID=37736149

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95136629A TWI383024B (en) 2005-10-27 2006-10-03 Sealing optical device resin composition, hardened product thereof, and method of sealing a semiconductor device

Country Status (6)

Country Link
US (1) US7550204B2 (en)
EP (1) EP1780242B1 (en)
JP (1) JP4781780B2 (en)
KR (1) KR101289960B1 (en)
CN (1) CN1970675B (en)
TW (1) TWI383024B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI683861B (en) * 2014-12-08 2020-02-01 日商信越化學工業股份有限公司 Condensation hardening silicone resin composition

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JP4781779B2 (en) * 2005-10-27 2011-09-28 信越化学工業株式会社 Method for producing high molecular weight organopolysiloxane, composition containing high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof
KR20070079867A (en) * 2006-02-04 2007-08-08 삼성전자주식회사 Organic-inorganic hybrid polymers and organic insulator compositions comprising the same
DE102006014247B4 (en) * 2006-03-28 2019-10-24 Robert Bosch Gmbh Image recording system and method for its production
JP4813265B2 (en) * 2006-06-14 2011-11-09 信越化学工業株式会社 Curable organopolysiloxane composition for solar cell
JP2008013623A (en) * 2006-07-04 2008-01-24 Shin Etsu Chem Co Ltd Optical composition sealing resin composition and cured product thereof
JP4520437B2 (en) * 2006-07-26 2010-08-04 信越化学工業株式会社 A curable silicone composition containing a fluorescent material for LED and an LED light emitting device using the composition.
KR101380062B1 (en) 2007-04-10 2014-04-01 신에쓰 가가꾸 고교 가부시끼가이샤 Phosphor-containing Adhesive Silicone Composition, Composition Sheet formed of the Composition, and Method of Producing Light Emitting Device using the Sheet
JP4623322B2 (en) * 2007-12-26 2011-02-02 信越化学工業株式会社 White thermosetting silicone resin composition for forming optical semiconductor case, optical semiconductor case and molding method thereof
WO2009099211A1 (en) 2008-02-07 2009-08-13 Mitsubishi Chemical Corporation Semiconductor light emitting device, backlighting device, color image display device and phosphor used for those devices
JP2010021533A (en) * 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd White heat-curable silicone resin composition for forming optical semiconductor case, and optical semiconductor case
JP2010018786A (en) * 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd White heat-curable silicone resin composition for forming optical semiconductor case, and optical semiconductor case
JP5353629B2 (en) * 2008-11-14 2013-11-27 信越化学工業株式会社 Thermosetting resin composition
JP5310699B2 (en) * 2010-10-27 2013-10-09 パナソニック株式会社 Resin coating apparatus and resin coating method
US20130200425A1 (en) * 2012-02-03 2013-08-08 Shin-Etsu Chemical Co., Ltd Phosphor-containing adhesive silicone composition sheet, and method of producing light-emitting device using same
CN104955905B (en) 2013-02-27 2017-11-28 株式会社朝日橡胶 White reflection film ink, powder coating, white reflection film and its manufacture method, light source bracket and ligthing paraphernalia light shield
JP5915599B2 (en) * 2013-07-08 2016-05-11 信越化学工業株式会社 Room temperature curable resin composition
WO2015013464A1 (en) * 2013-07-23 2015-01-29 Lotus Leaf Coatings, Inc. Process for preparing an optically clear superhydrophobic coating solution
DE102013222003A1 (en) 2013-10-29 2015-04-30 Evonik Industries Ag Means for the sealing of light-emitting diodes
TWI700313B (en) * 2014-05-07 2020-08-01 日商琳得科股份有限公司 Curable polysilsesquioxane compound, its manufacturing method, curable composition, curing object and use method of curable composition
JP6194853B2 (en) * 2014-06-06 2017-09-13 信越化学工業株式会社 White thermosetting silicone resin composition for optical semiconductor device and case for mounting optical semiconductor element
JP6672991B2 (en) 2016-04-25 2020-03-25 信越化学工業株式会社 Condensation curable resin composition and semiconductor device
JP6574147B2 (en) 2016-07-08 2019-09-11 信越化学工業株式会社 Curable organosilicon resin composition
JP6683573B2 (en) 2016-08-19 2020-04-22 信越化学工業株式会社 Condensation curable silicone resin composition
US10451814B2 (en) * 2016-08-29 2019-10-22 Corning Optical Communications LLC Fiber optic connector sub-assemblies including a bonding agent, along with related methods
US10800920B2 (en) 2017-12-18 2020-10-13 Shin-Etsu Chemical Co., Ltd. Curable organopolysiloxane composition
TW202003701A (en) * 2018-03-30 2020-01-16 日商住友化學股份有限公司 Silicone resin composition production method and silicone resin composition

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TWI683861B (en) * 2014-12-08 2020-02-01 日商信越化學工業股份有限公司 Condensation hardening silicone resin composition

Also Published As

Publication number Publication date
JP4781780B2 (en) 2011-09-28
EP1780242A3 (en) 2008-05-21
US7550204B2 (en) 2009-06-23
KR20070045947A (en) 2007-05-02
JP2007119569A (en) 2007-05-17
CN1970675A (en) 2007-05-30
EP1780242A2 (en) 2007-05-02
CN1970675B (en) 2011-06-15
TWI383024B (en) 2013-01-21
US20070099009A1 (en) 2007-05-03
EP1780242B1 (en) 2013-10-09
KR101289960B1 (en) 2013-07-26

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