TW200734650A - Probe card - Google Patents

Probe card

Info

Publication number
TW200734650A
TW200734650A TW095149164A TW95149164A TW200734650A TW 200734650 A TW200734650 A TW 200734650A TW 095149164 A TW095149164 A TW 095149164A TW 95149164 A TW95149164 A TW 95149164A TW 200734650 A TW200734650 A TW 200734650A
Authority
TW
Taiwan
Prior art keywords
inspected
probes
electrically connected
end electrically
parts
Prior art date
Application number
TW095149164A
Other languages
Chinese (zh)
Other versions
TWI324256B (en
Inventor
Shigeki Ishikawa
Takashi Nidaira
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of TW200734650A publication Critical patent/TW200734650A/en
Application granted granted Critical
Publication of TWI324256B publication Critical patent/TWI324256B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

This invention is addressed a probe card which suppresses the effect of cross talk between neighboring parts to be inspected. For the above purposes the probe card of this invention has: a plurality of probes for contacting the parts to be inspected to perform at least either one of inputting or outputting electric signals, a substrate having a wiring pattern corresponding with the circuit construction for producing signals for inspection, a plurality of input lead wires each having one end electrically connected with any one of the plurality of probes for transmitting input signals to the parts to be inspected, a plurality of coaxial cables each having one end electrically connected to the substrate and another end electrically connected to any one of the plurality of the input lead wires, or to any one of the plurality of the probes, a plurality of output lead wire each having one end electrically connected to any one of the plurality of probes for transmitting the output signals from the part to be inspected, and a shield provided in the vicinity of the region where the output lead wire connected to one of the two neighboring parts to be inspected and the input lead wire connected to the another part of the neighboring parts are crossed.
TW095149164A 2005-12-28 2006-12-27 Probe card TW200734650A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005380381A JP4757630B2 (en) 2005-12-28 2005-12-28 Probe card
PCT/JP2006/325756 WO2007074765A1 (en) 2005-12-28 2006-12-25 Probe card

Publications (2)

Publication Number Publication Date
TW200734650A true TW200734650A (en) 2007-09-16
TWI324256B TWI324256B (en) 2010-05-01

Family

ID=38217985

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149164A TW200734650A (en) 2005-12-28 2006-12-27 Probe card

Country Status (5)

Country Link
JP (1) JP4757630B2 (en)
KR (1) KR101021253B1 (en)
CN (1) CN101346632B (en)
TW (1) TW200734650A (en)
WO (1) WO2007074765A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI620940B (en) * 2016-11-14 2018-04-11 旺矽科技股份有限公司 Probe card and multi-signal transmission board

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5260163B2 (en) * 2008-07-02 2013-08-14 日置電機株式会社 Measuring apparatus and measuring method
JP5260164B2 (en) * 2008-07-04 2013-08-14 日置電機株式会社 Measuring apparatus and measuring method
KR101115958B1 (en) * 2009-12-11 2012-02-22 (주)기가레인 Probe card
KR101455540B1 (en) * 2013-10-07 2014-11-04 주식회사 세디콘 Probe card
CN103926433B (en) * 2014-03-20 2016-06-08 上海华力微电子有限公司 Probe
KR101962529B1 (en) * 2017-01-03 2019-03-26 주식회사 텝스 Vertical ultra-low leakage current probe card for dc parameter test
KR102689406B1 (en) * 2018-11-16 2024-07-29 주식회사 기가레인 The space transformer for the probe card
US10914757B2 (en) 2019-02-07 2021-02-09 Teradyne, Inc. Connection module
JPWO2023243250A1 (en) * 2022-06-14 2023-12-21

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0138618B1 (en) * 1993-08-04 1998-06-15 이노우에 아끼라 Probe card, coaxial probe beam for probe card and manufacturing method thereof
KR950021486A (en) * 1993-12-14 1995-07-26 문정환 Noise shield of integrated device
KR100227283B1 (en) * 1997-08-22 1999-11-01 김충환 Probe card for high frequency
JP2002257898A (en) * 2001-03-06 2002-09-11 Nec Corp Probe structure for semiconductor device inspection and method of manufacturing the same
JP2003344494A (en) * 2002-05-24 2003-12-03 Nec Micro Systems Ltd Emulator probe
JP2004117247A (en) * 2002-09-27 2004-04-15 Advantest Corp Prober interface device for semiconductor testing device and device interface system for semiconductor testing device
KR100702003B1 (en) * 2003-01-18 2007-03-30 삼성전자주식회사 Probe card
JP2005183863A (en) * 2003-12-24 2005-07-07 Renesas Technology Corp Method for manufacturing semiconductor integrated circuit device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI620940B (en) * 2016-11-14 2018-04-11 旺矽科技股份有限公司 Probe card and multi-signal transmission board

Also Published As

Publication number Publication date
KR101021253B1 (en) 2011-03-11
WO2007074765A1 (en) 2007-07-05
JP2007178406A (en) 2007-07-12
CN101346632A (en) 2009-01-14
KR20080083020A (en) 2008-09-12
CN101346632B (en) 2011-03-30
TWI324256B (en) 2010-05-01
JP4757630B2 (en) 2011-08-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees