TW200738422A - Mold apparatus - Google Patents

Mold apparatus

Info

Publication number
TW200738422A
TW200738422A TW095113422A TW95113422A TW200738422A TW 200738422 A TW200738422 A TW 200738422A TW 095113422 A TW095113422 A TW 095113422A TW 95113422 A TW95113422 A TW 95113422A TW 200738422 A TW200738422 A TW 200738422A
Authority
TW
Taiwan
Prior art keywords
mold
adjust
adjust element
slide
threadedly engaged
Prior art date
Application number
TW095113422A
Other languages
Chinese (zh)
Other versions
TWI331957B (en
Inventor
Ming-Chiang Tsai
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW95113422A priority Critical patent/TWI331957B/en
Publication of TW200738422A publication Critical patent/TW200738422A/en
Application granted granted Critical
Publication of TWI331957B publication Critical patent/TWI331957B/en

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The present invention relates to a mold apparatus. The mold apparatus includes two mold plates disposed opposite to each other, and two mold cores configured in the two mold plates respectively. The two mold cores each include a molding surface. At least one mold core is cooperated with an adjust apparatus. The adjust apparatus includes aslide, a first adjust element and a second adjust element. The slide holds the mold core. The first adjust element passes through the slide and is threadedly engaged with the mold core. The second adjust element passes through the mold plate and is threadedly engaged with the slide. The two adjust element are disposed perpendicularly.
TW95113422A 2006-04-14 2006-04-14 Mold apparatus TWI331957B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95113422A TWI331957B (en) 2006-04-14 2006-04-14 Mold apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95113422A TWI331957B (en) 2006-04-14 2006-04-14 Mold apparatus

Publications (2)

Publication Number Publication Date
TW200738422A true TW200738422A (en) 2007-10-16
TWI331957B TWI331957B (en) 2010-10-21

Family

ID=45074673

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95113422A TWI331957B (en) 2006-04-14 2006-04-14 Mold apparatus

Country Status (1)

Country Link
TW (1) TWI331957B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385067B (en) * 2008-02-15 2013-02-11 Hon Hai Prec Ind Co Ltd Mold and method for using same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI686283B (en) * 2017-07-13 2020-03-01 城翊科技有限公司 Thick plastic injection mould

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385067B (en) * 2008-02-15 2013-02-11 Hon Hai Prec Ind Co Ltd Mold and method for using same

Also Published As

Publication number Publication date
TWI331957B (en) 2010-10-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees