TW200738771A - Alkali developable curable composition and cured product thereof - Google Patents

Alkali developable curable composition and cured product thereof

Info

Publication number
TW200738771A
TW200738771A TW095148998A TW95148998A TW200738771A TW 200738771 A TW200738771 A TW 200738771A TW 095148998 A TW095148998 A TW 095148998A TW 95148998 A TW95148998 A TW 95148998A TW 200738771 A TW200738771 A TW 200738771A
Authority
TW
Taiwan
Prior art keywords
curable composition
photosensitive
component
compound
cured product
Prior art date
Application number
TW095148998A
Other languages
Chinese (zh)
Other versions
TWI332960B (en
Inventor
Hiromitu Morino
Noboru Kohiyama
Kwang-Ho Song
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005374188A external-priority patent/JP4933093B2/en
Priority claimed from JP2006016171A external-priority patent/JP4855083B2/en
Priority claimed from JP2006016195A external-priority patent/JP2007199249A/en
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200738771A publication Critical patent/TW200738771A/en
Application granted granted Critical
Publication of TWI332960B publication Critical patent/TWI332960B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)

Abstract

Disclosed is a curable composition containing (A) an epoxy resin having 1,3-dioxolane ring, which is obtained by partially adding a ketone to an epoxy resin having two or more epoxy groups in a molecule, (B) a carboxyl group-containing compound, (C) a photosensitive (meth)acrylate compound, and (D) a photopolymerization initiator. When a carboxyl group-containing photosensitive compound is used as the component (B), the photosensitive (meth)acrylate compound as the component (C) can be omitted. Since this curable composition is photocurable and thermosetting while being excellent in storage stability, it can be constituted as a single-component curable composition. In addition, the curable composition enables to form a photosensitive dry film which is excellent in room temperature storage stability. A coating film of this curable composition can be developed by an aqueous alkali solution, and it is useful as various resists such as a solder resist for printed wiring boards.
TW095148998A 2005-12-27 2006-12-26 Alkali developable curable composition and cured product thereof TW200738771A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005374188A JP4933093B2 (en) 2005-12-27 2005-12-27 Curable composition capable of alkali development and cured product thereof
JP2006016171A JP4855083B2 (en) 2006-01-25 2006-01-25 Curable composition and cured product thereof
JP2006016195A JP2007199249A (en) 2006-01-25 2006-01-25 Curable composition and cured product thereof

Publications (2)

Publication Number Publication Date
TW200738771A true TW200738771A (en) 2007-10-16
TWI332960B TWI332960B (en) 2010-11-11

Family

ID=38228190

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148998A TW200738771A (en) 2005-12-27 2006-12-26 Alkali developable curable composition and cured product thereof

Country Status (2)

Country Link
TW (1) TW200738771A (en)
WO (1) WO2007077837A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510855B (en) * 2009-07-02 2015-12-01 Taiyo Holdings Co Ltd A photohardenable thermosetting resin composition, a dry film and a cured product using the composition, and a printed wiring board using the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4916908B2 (en) * 2007-02-16 2012-04-18 太陽ホールディングス株式会社 Epoxy resin and method for producing the same
JP2009120737A (en) * 2007-11-15 2009-06-04 Nippon Kayaku Co Ltd Reactive carboxylate compound, active energy ray-curable resin composition using the same, and application of the resin composition
TWI532756B (en) * 2009-03-31 2016-05-11 Taiyo Holdings Co Ltd Hardened resin composition and printed circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08134138A (en) * 1994-11-08 1996-05-28 Dainippon Ink & Chem Inc Polymerizable 2-oxo-1,3-dioxo-4-yl derivative, polymer obtained from the derivative, and curable composition using the polymer
JPH10139777A (en) * 1996-11-05 1998-05-26 Yokohama Rubber Co Ltd:The New latent curing agent and its production
JPH11271972A (en) * 1998-03-25 1999-10-08 Nippon Paint Co Ltd Photocurable resin composition
JP2000053746A (en) * 1998-08-06 2000-02-22 Nippon Shokubai Co Ltd Production of photosensitive resin and photosensitive resin composition containing resin produced by the method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510855B (en) * 2009-07-02 2015-12-01 Taiyo Holdings Co Ltd A photohardenable thermosetting resin composition, a dry film and a cured product using the composition, and a printed wiring board using the same

Also Published As

Publication number Publication date
TWI332960B (en) 2010-11-11
WO2007077837A1 (en) 2007-07-12

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