TW200739760A - Memory card structure and method of manufacturing the same - Google Patents

Memory card structure and method of manufacturing the same

Info

Publication number
TW200739760A
TW200739760A TW095113058A TW95113058A TW200739760A TW 200739760 A TW200739760 A TW 200739760A TW 095113058 A TW095113058 A TW 095113058A TW 95113058 A TW95113058 A TW 95113058A TW 200739760 A TW200739760 A TW 200739760A
Authority
TW
Taiwan
Prior art keywords
substrate
electrodes
manufacturing
memory card
same
Prior art date
Application number
TW095113058A
Other languages
Chinese (zh)
Other versions
TWI307928B (en
Inventor
zhi-xiang Lin
Sheng-Hui Chien
Original Assignee
Kingpak Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kingpak Tech Inc filed Critical Kingpak Tech Inc
Priority to TW095113058A priority Critical patent/TW200739760A/en
Publication of TW200739760A publication Critical patent/TW200739760A/en
Application granted granted Critical
Publication of TWI307928B publication Critical patent/TWI307928B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Credit Cards Or The Like (AREA)

Abstract

This invention provides a memory card structure and a method of manufacturing the same, which comprises a substrate formed thereon with an upper surface and a lower surface, the upper surface having a plurality of first electrodes thereon and the substrate having a plurality of gold fingers electrically connected to the first electrodes; at least one secondary board adhered to the lower surface of the substrate, each secondary board having second electrodes for electrically connecting the first electrodes of the substrate; an adhesive coated onto the upper surface of the substrate; a chip having a plurality of solder pads thereon and the chip adhered to the upper surface of the substrate so that the solder pads are electrically connected to the first electrodes of the substrate; and a packaging material for covering the chip.
TW095113058A 2006-04-12 2006-04-12 Memory card structure and method of manufacturing the same TW200739760A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095113058A TW200739760A (en) 2006-04-12 2006-04-12 Memory card structure and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095113058A TW200739760A (en) 2006-04-12 2006-04-12 Memory card structure and method of manufacturing the same

Publications (2)

Publication Number Publication Date
TW200739760A true TW200739760A (en) 2007-10-16
TWI307928B TWI307928B (en) 2009-03-21

Family

ID=45071706

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113058A TW200739760A (en) 2006-04-12 2006-04-12 Memory card structure and method of manufacturing the same

Country Status (1)

Country Link
TW (1) TW200739760A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10622314B2 (en) 2017-12-07 2020-04-14 Mediatek Inc. Chip package structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10622314B2 (en) 2017-12-07 2020-04-14 Mediatek Inc. Chip package structure

Also Published As

Publication number Publication date
TWI307928B (en) 2009-03-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees