TW200740331A - Hybrid multilayer circuit board and method of manufacturing the same - Google Patents

Hybrid multilayer circuit board and method of manufacturing the same

Info

Publication number
TW200740331A
TW200740331A TW095134345A TW95134345A TW200740331A TW 200740331 A TW200740331 A TW 200740331A TW 095134345 A TW095134345 A TW 095134345A TW 95134345 A TW95134345 A TW 95134345A TW 200740331 A TW200740331 A TW 200740331A
Authority
TW
Taiwan
Prior art keywords
layer
circuit board
cable
multilayer circuit
hybrid multilayer
Prior art date
Application number
TW095134345A
Other languages
English (en)
Other versions
TWI377890B (zh
Inventor
Hiroaki Inose
Tsutomu Igarashi
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200740331A publication Critical patent/TW200740331A/zh
Application granted granted Critical
Publication of TWI377890B publication Critical patent/TWI377890B/zh

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW095134345A 2005-11-04 2006-09-15 Hybrid multilayer circuit board and method of manufacturing the same TW200740331A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005320936A JP4808468B2 (ja) 2005-11-04 2005-11-04 混成多層回路基板およびその製造方法

Publications (2)

Publication Number Publication Date
TW200740331A true TW200740331A (en) 2007-10-16
TWI377890B TWI377890B (zh) 2012-11-21

Family

ID=38072028

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134345A TW200740331A (en) 2005-11-04 2006-09-15 Hybrid multilayer circuit board and method of manufacturing the same

Country Status (3)

Country Link
JP (1) JP4808468B2 (zh)
CN (1) CN1960597B (zh)
TW (1) TW200740331A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8569630B2 (en) 2010-01-22 2013-10-29 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
TWI422291B (zh) * 2011-04-20 2014-01-01 Adv Flexible Circuits Co Ltd Multi-layer stacked circuit cable with local separation section

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4898564B2 (ja) * 2007-06-06 2012-03-14 ソニーケミカル＆インフォメーションデバイス株式会社 プリント配線板の製造方法及びプリント配線板の製造装置
KR101385094B1 (ko) * 2007-09-11 2014-04-14 삼성디스플레이 주식회사 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법
JP5075568B2 (ja) * 2007-10-17 2012-11-21 株式会社フジクラ シールド付回路配線基板及びその製造方法
KR20100127253A (ko) * 2008-03-25 2010-12-03 스미토모 베이클리트 컴퍼니 리미티드 리지드 플렉스 회로판의 제조 방법 및 리지드 플렉스 회로판
JP2009267081A (ja) * 2008-04-25 2009-11-12 Sony Chemical & Information Device Corp フレックスリジッド配線基板とその製造方法
JP2012209383A (ja) * 2011-03-29 2012-10-25 Murata Mfg Co Ltd 多層基板およびその製造方法
CN105682354A (zh) * 2016-02-25 2016-06-15 广东欧珀移动通信有限公司 软硬结合板及终端
TWI660901B (zh) * 2018-09-04 2019-06-01 Chipbond Technology Corporation 撓性電路板捲帶
CN112449477B (zh) * 2019-08-27 2022-04-15 宏启胜精密电子(秦皇岛)有限公司 电路板的制造方法及电路板
KR102897206B1 (ko) 2021-01-06 2025-12-10 삼성전자 주식회사 회로 기판 및 이를 포함하는 전자 장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0184472U (zh) * 1987-11-26 1989-06-05
JPH04313300A (ja) * 1991-04-10 1992-11-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板
JP3176858B2 (ja) * 1996-12-11 2001-06-18 日本メクトロン株式会社 両面銅張プリント配線板
JP2001060746A (ja) * 1999-08-23 2001-03-06 Fuji Electric Co Ltd フレキシブルプリント配線板
JP2001167642A (ja) * 1999-12-13 2001-06-22 Daichu Denshi Co Ltd フレキシブルプリント配線板およびフレキシブルフラットケーブル

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8569630B2 (en) 2010-01-22 2013-10-29 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
TWI422291B (zh) * 2011-04-20 2014-01-01 Adv Flexible Circuits Co Ltd Multi-layer stacked circuit cable with local separation section

Also Published As

Publication number Publication date
JP4808468B2 (ja) 2011-11-02
TWI377890B (zh) 2012-11-21
CN1960597A (zh) 2007-05-09
CN1960597B (zh) 2010-10-06
JP2007129087A (ja) 2007-05-24

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