TW200740530A - Coating device and coating method - Google Patents

Coating device and coating method

Info

Publication number
TW200740530A
TW200740530A TW096104999A TW96104999A TW200740530A TW 200740530 A TW200740530 A TW 200740530A TW 096104999 A TW096104999 A TW 096104999A TW 96104999 A TW96104999 A TW 96104999A TW 200740530 A TW200740530 A TW 200740530A
Authority
TW
Taiwan
Prior art keywords
nozzle
stage
movement mechanism
coating
box
Prior art date
Application number
TW096104999A
Other languages
Chinese (zh)
Other versions
TWI350213B (en
Inventor
Junichi Yoshida
Mikio Masuichi
Yukihiro Takamura
Hiroyuki Ueno
Masafumi Kawagoe
Matsuka Tsuyoshi
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006050727A external-priority patent/JP5116978B2/en
Priority claimed from JP2006050726A external-priority patent/JP4789652B2/en
Priority claimed from JP2006091060A external-priority patent/JP4780656B2/en
Priority claimed from JP2006091061A external-priority patent/JP4656578B2/en
Priority claimed from JP2006094263A external-priority patent/JP4656580B2/en
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200740530A publication Critical patent/TW200740530A/en
Application granted granted Critical
Publication of TWI350213B publication Critical patent/TWI350213B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

To provide a coating apparatus that prevents a foreign matter from falling onto a substrate to be coated. A nozzle is used for discharging a coating liquid from its tip. A stage is formed by placing a substrate on its top surface. A nozzle movement mechanism shuttles the nozzle across the stage face within the space above the stage. A box is provided by enclosing the nozzle movement mechanism and has an opening formed along which the nozzle is shuttled with at least a portion of the nozzle protruding from the nozzle movement mechanism side to the stage side. A vapor film generation means is used for generating strips of vapor film shielding the opening of the box by injecting a predetermined gas from the injection tip.
TW096104999A 2006-02-27 2007-02-12 Coating device and coating method TW200740530A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006050727A JP5116978B2 (en) 2006-02-27 2006-02-27 Coating method and coating apparatus
JP2006050726A JP4789652B2 (en) 2006-02-27 2006-02-27 Coating device
JP2006091060A JP4780656B2 (en) 2006-03-29 2006-03-29 Coating device
JP2006091061A JP4656578B2 (en) 2006-03-29 2006-03-29 Coating apparatus and coating method
JP2006094263A JP4656580B2 (en) 2006-03-30 2006-03-30 Coating device

Publications (2)

Publication Number Publication Date
TW200740530A true TW200740530A (en) 2007-11-01
TWI350213B TWI350213B (en) 2011-10-11

Family

ID=38614252

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096104999A TW200740530A (en) 2006-02-27 2007-02-12 Coating device and coating method

Country Status (3)

Country Link
KR (1) KR100840482B1 (en)
CN (1) CN101912833B (en)
TW (1) TW200740530A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI446973B (en) * 2008-02-27 2014-08-01 東麗工程股份有限公司 Coating machine
TWI458564B (en) * 2007-11-21 2014-11-01 東麗工程股份有限公司 Coating device and substrate holding method thereof
TWI770027B (en) * 2016-05-30 2022-07-11 日商武藏工業股份有限公司 Liquid material discharge device, coating device and coating method therefor

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5750385B2 (en) * 2012-02-27 2015-07-22 株式会社Ｓｃｒｅｅｎホールディングス Coating device
CN105964488B (en) * 2016-05-30 2019-12-03 中国科学院半导体研究所 Coater with substrate heating and atmosphere treatment
CN110523558A (en) * 2019-08-28 2019-12-03 昆山工研院新型平板显示技术中心有限公司 A kind of coating mechanism

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6514344B2 (en) * 1999-12-16 2003-02-04 Tokyo Electron Limited Film forming unit
JP3849921B2 (en) * 2001-09-26 2006-11-22 大日本スクリーン製造株式会社 Substrate processing equipment
MY133543A (en) * 2002-01-24 2007-11-30 Three Bond Co Ltd Material application apparatus
JP4313026B2 (en) * 2002-11-08 2009-08-12 株式会社ヒラノテクシード Manufacturing apparatus and manufacturing method of organic EL panel using coating nozzle by capillary action
JP2005013787A (en) * 2003-06-23 2005-01-20 Tokyo Electron Ltd Coating film forming apparatus and coating film forming method
JP4805555B2 (en) * 2004-07-12 2011-11-02 株式会社東芝 Coating apparatus and coating method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458564B (en) * 2007-11-21 2014-11-01 東麗工程股份有限公司 Coating device and substrate holding method thereof
TWI446973B (en) * 2008-02-27 2014-08-01 東麗工程股份有限公司 Coating machine
TWI770027B (en) * 2016-05-30 2022-07-11 日商武藏工業股份有限公司 Liquid material discharge device, coating device and coating method therefor

Also Published As

Publication number Publication date
TWI350213B (en) 2011-10-11
CN101912833B (en) 2012-10-10
CN101912833A (en) 2010-12-15
KR100840482B1 (en) 2008-06-20
KR20070089039A (en) 2007-08-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees