TW200740873A - Photo-curable resin composition having high thermal conductivity - Google Patents

Photo-curable resin composition having high thermal conductivity

Info

Publication number
TW200740873A
TW200740873A TW096113240A TW96113240A TW200740873A TW 200740873 A TW200740873 A TW 200740873A TW 096113240 A TW096113240 A TW 096113240A TW 96113240 A TW96113240 A TW 96113240A TW 200740873 A TW200740873 A TW 200740873A
Authority
TW
Taiwan
Prior art keywords
photo
resin composition
curable resin
weight
parts
Prior art date
Application number
TW096113240A
Other languages
Chinese (zh)
Inventor
Jung-Hyun Son
Jong-Dai Park
In-Seok Ahn
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200740873A publication Critical patent/TW200740873A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A photo-curable resin composition is disclosed. The photo-curable resin composition includes: (A) 100 parts by weight of epoxy resin; (B) 0.01 to 20 parts by weight of photo-polymerization initiator; (C) 0.01 to 10 parts by weight of coupling agent; and (D) 0.01 to 120 parts by weight of inorganic filler. The photo-curable resin composition can further include (E) 0.05 to 10 parts by weight of photo-acid generator. The photo-curable resin composition has an improved thermal conductivity and barrier function against moisture, and thus, is useful for producing display such as Organic Light Emitting Diode(OLED), Liquid Crystal Display(LCD) and Flexible Display.
TW096113240A 2006-04-18 2007-04-14 Photo-curable resin composition having high thermal conductivity TW200740873A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060035021A KR20070103204A (en) 2006-04-18 2006-04-18 Photocurable resin composition having excellent thermal conductivity

Publications (1)

Publication Number Publication Date
TW200740873A true TW200740873A (en) 2007-11-01

Family

ID=38756755

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096113240A TW200740873A (en) 2006-04-18 2007-04-14 Photo-curable resin composition having high thermal conductivity

Country Status (4)

Country Link
JP (1) JP2007284680A (en)
KR (1) KR20070103204A (en)
CN (1) CN101059652A (en)
TW (1) TW200740873A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469381B (en) * 2008-03-20 2015-01-11 東進世美肯有限公司 Method for preparing dye-sensitized solar cell

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101491991B1 (en) * 2008-03-13 2015-02-23 주식회사 동진쎄미켐 Sealing method of electric device with transparent part and electric device with transparent part
CN102197101B (en) * 2008-10-24 2015-10-21 第一毛织株式会社 Adhesive composition and optical element
KR101827551B1 (en) 2010-10-15 2018-03-23 삼성디스플레이 주식회사 Organic light emitting diode display and method for fabricating of the same
JP5664855B2 (en) * 2010-12-22 2015-02-04 スリーボンドファインケミカル株式会社 Epoxy resin composition
US8829556B2 (en) 2011-09-01 2014-09-09 General Electric Company Thermal management in large area flexible OLED assembly
WO2014084686A1 (en) * 2012-11-29 2014-06-05 주식회사 엘지화학 Gas barrier film having protective coating layer stacked thereon including inorganic particles
TWI541278B (en) * 2012-12-18 2016-07-11 夸茲沃克公司 Thermally conductive plastic material
WO2018163338A1 (en) 2017-03-08 2018-09-13 堺ディスプレイプロダクト株式会社 Method for manufacturing organic el device and apparatus for forming film
CN107177167B (en) * 2017-06-22 2018-05-04 深圳市玖润光电科技有限公司 Heat-dissipating resin composition for LED substrate and preparation method thereof
CN113201203A (en) * 2021-03-15 2021-08-03 苏州市汇涌进光电有限公司 Light-cured transparent epoxy material and application thereof
CN116144243B (en) * 2022-12-13 2024-07-02 国网安徽省电力有限公司超高压分公司 Photo-curing heat-resistant epoxy resin coating for current transformer and preparation method and application thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469381B (en) * 2008-03-20 2015-01-11 東進世美肯有限公司 Method for preparing dye-sensitized solar cell

Also Published As

Publication number Publication date
KR20070103204A (en) 2007-10-23
CN101059652A (en) 2007-10-24
JP2007284680A (en) 2007-11-01

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