TW200740949A - Masking tape for substrate - Google Patents

Masking tape for substrate

Info

Publication number
TW200740949A
TW200740949A TW096105885A TW96105885A TW200740949A TW 200740949 A TW200740949 A TW 200740949A TW 096105885 A TW096105885 A TW 096105885A TW 96105885 A TW96105885 A TW 96105885A TW 200740949 A TW200740949 A TW 200740949A
Authority
TW
Taiwan
Prior art keywords
base member
film
masking tape
tape
adhesive layer
Prior art date
Application number
TW096105885A
Other languages
Chinese (zh)
Other versions
TWI437069B (en
Inventor
Mitsushi Yamamoto
Kazuhito Okumura
Mikio Masuichi
Masafumi Kawagoe
Tsuyoshi Matsuka
Original Assignee
Nitto Denko Corp
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp, Dainippon Screen Mfg filed Critical Nitto Denko Corp
Publication of TW200740949A publication Critical patent/TW200740949A/en
Application granted granted Critical
Publication of TWI437069B publication Critical patent/TWI437069B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
    • B05B12/24—Masking elements, i.e. elements defining uncoated areas on an object to be coated made at least partly of flexible material, e.g. sheets of paper or fabric
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
  • Coating Apparatus (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

This invention provides a masking tape for use in applying a coating liquid made of a fluid material to a substrate for forming a film, the masking tape being capable of avoiding an undesirable enlarging of the film thickness caused by an undesirable spreading of the coating material around the tape. The masking tape 10 of this invention consists of a base member 1 and an adhesive layer 3 formed on one surface of the base member 1, wherein the base member has another surface A having an angle of contact with water of less than 65 DEG, and the adhesive layer 3 has a side edge surface B having an angle of contact with water of less than 100 DEG. This tape 10 is capable of suppressing the formation of a meniscus of the adhesive along the edge of the adhesive layer 3 when a film of a fluid substance such as water dispersion conductive material is formed, or a separation of the fluid substance from the another surface A of the base member 1, and thus a film having a uniform thickness can be formed.
TW096105885A 2006-02-28 2007-02-16 Substrate mask TWI437069B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006053533 2006-02-28
JP2007024150A JP4884249B2 (en) 2006-02-28 2007-02-02 Masking tape for substrates

Publications (2)

Publication Number Publication Date
TW200740949A true TW200740949A (en) 2007-11-01
TWI437069B TWI437069B (en) 2014-05-11

Family

ID=38614562

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105885A TWI437069B (en) 2006-02-28 2007-02-16 Substrate mask

Country Status (4)

Country Link
JP (1) JP4884249B2 (en)
KR (1) KR100816694B1 (en)
CN (1) CN101104780B (en)
TW (1) TWI437069B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101324756B (en) * 2008-07-10 2011-04-06 电子科技大学 Method for improving prepared thin film thickness in rotary coating method
CN102785496B (en) * 2012-08-17 2014-12-24 湖北联合天诚防伪技术股份有限公司 Method for treating silver layer of frame of silver-sprayed plate
CN104607342A (en) * 2013-11-05 2015-05-13 沈阳芯源微电子设备有限公司 Rotary outer ring adhesion protecting device
JP6610247B2 (en) * 2015-12-25 2019-11-27 三菱ケミカル株式会社 Adhesive composition, cross-linked adhesive, masking film adhesive, heat-resistant adhesive film adhesive, masking heat-resistant adhesive film
JP6815740B2 (en) * 2016-03-29 2021-01-20 日東電工株式会社 Masking sheet
CN107645012A (en) * 2016-07-21 2018-01-30 新丰杰力电工材料有限公司 It is a kind of for the surface treatment method of anode of lithium ion battery heat sensitive adhesive tape and the application process of heat sensitive adhesive tape
JP2023048932A (en) * 2021-09-28 2023-04-07 トヨタ自動車株式会社 Forming method of parting line
CN113941473A (en) * 2021-10-30 2022-01-18 芜湖徽氏新材料科技有限公司 Slice tearing adhesive tape for semiconductor wafer cutting
KR102703141B1 (en) * 2022-06-03 2024-09-04 연세대학교 산학협력단 Manufacturing method of solar cell to prevent short circuit
CN114958082A (en) * 2022-06-23 2022-08-30 惠州市浩明科技股份有限公司 Ink composition, preparation method thereof and adhesive tape

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227198A (en) * 1989-04-20 1993-07-13 A-Line Products Corporation Aqueous coating composition and method of use
JP3622931B2 (en) * 1996-04-04 2005-02-23 ソニーケミカル株式会社 Paint masking tape substrate and paint masking tape
CN1439028A (en) * 2000-06-28 2003-08-27 住友化学工业株式会社 Resin composition for insulating material, resin composition for adhesive, and bonded sheet
SG115510A1 (en) * 2001-12-20 2005-10-28 Nitto Denko Corp Cover tape for the electronic part conveyance, process for its production and electronic part conveying member
US6699347B2 (en) * 2002-05-20 2004-03-02 The Procter & Gamble Company High speed embossing and adhesive printing process
KR20050007953A (en) * 2003-07-12 2005-01-21 두산중공업 주식회사 Titanium nitrite coating method

Also Published As

Publication number Publication date
KR100816694B1 (en) 2008-03-27
KR20070089624A (en) 2007-08-31
JP4884249B2 (en) 2012-02-29
TWI437069B (en) 2014-05-11
CN101104780A (en) 2008-01-16
JP2007260665A (en) 2007-10-11
CN101104780B (en) 2011-01-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees