TW200742111A - LED chip encapsulation structure and method - Google Patents

LED chip encapsulation structure and method

Info

Publication number
TW200742111A
TW200742111A TW095113848A TW95113848A TW200742111A TW 200742111 A TW200742111 A TW 200742111A TW 095113848 A TW095113848 A TW 095113848A TW 95113848 A TW95113848 A TW 95113848A TW 200742111 A TW200742111 A TW 200742111A
Authority
TW
Taiwan
Prior art keywords
unit
emitted
mainboard
negative pole
positive pole
Prior art date
Application number
TW095113848A
Other languages
Chinese (zh)
Other versions
TWI298529B (en
Inventor
Bily Wang
Jonnie Juang
Wen-Kui Wu
Original Assignee
Harvatek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harvatek Corp filed Critical Harvatek Corp
Priority to TW095113848A priority Critical patent/TW200742111A/en
Priority to JP2007109138A priority patent/JP2007288200A/en
Priority to KR1020070037879A priority patent/KR100868158B1/en
Publication of TW200742111A publication Critical patent/TW200742111A/en
Application granted granted Critical
Publication of TWI298529B publication Critical patent/TWI298529B/zh

Links

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  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

A LED (light emitted diode) chip encapsulation structure and method, including : a mainboard unit , a emitted unit , a colloid unit. The mainboard unit has a mainboard body and form the conductive orbit (electron trace ) of a positive pole and a negative pole in the mainboard body respectively; the emitted unit has plurality LED chip which set upon the mainboard body, wherein each LED chip has a positive pole terminal and a negative pole terminal , the positive pole terminal and the negative pole terminal electrical connect with the conductive orbit of the positive pole and the negative pole respectively , the colloid unit covers on the mainboard unit and the emitted unit ; By this way, the emitted unit produces the light by conduct to the conductive orbit of the positive pole and the negative pole, the light form a continuous emitted area in the colloid unit through the guide of the colloid unit.
TW095113848A 2006-04-18 2006-04-18 LED chip encapsulation structure and method TW200742111A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW095113848A TW200742111A (en) 2006-04-18 2006-04-18 LED chip encapsulation structure and method
JP2007109138A JP2007288200A (en) 2006-04-18 2007-04-18 Light emitting diode chip sealing structure and light emitting diode chip structure packaging method
KR1020070037879A KR100868158B1 (en) 2006-04-18 2007-04-18 Structure for sealing light-emitting diode chip and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095113848A TW200742111A (en) 2006-04-18 2006-04-18 LED chip encapsulation structure and method

Publications (2)

Publication Number Publication Date
TW200742111A true TW200742111A (en) 2007-11-01
TWI298529B TWI298529B (en) 2008-07-01

Family

ID=38759611

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113848A TW200742111A (en) 2006-04-18 2006-04-18 LED chip encapsulation structure and method

Country Status (3)

Country Link
JP (1) JP2007288200A (en)
KR (1) KR100868158B1 (en)
TW (1) TW200742111A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI554811B (en) * 2011-04-20 2016-10-21 松下知識產權經營股份有限公司 A light-emitting device, a backlight unit, a liquid crystal display device, a lighting device, and a light-emitting device manufacturing method

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009141982A1 (en) * 2008-05-19 2009-11-26 株式会社 東芝 Linear white light source, and backlight and liquid crystal display device using linear white light source
TWI422059B (en) * 2008-05-23 2014-01-01 Pegatron Corp Package structure for light emitting diode chips
TWI411143B (en) 2009-06-26 2013-10-01 Led package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
JP5351365B1 (en) * 2012-04-11 2013-11-27 パナソニック株式会社 Light emitting device and lamp
JP5991065B2 (en) 2012-07-31 2016-09-14 日亜化学工業株式会社 Light emitting device
KR102428681B1 (en) * 2015-08-13 2022-08-04 주성엔지니어링(주) Lighting apparatus
JP2016189488A (en) * 2016-07-07 2016-11-04 日亜化学工業株式会社 Light emitting device
CN114857511B (en) * 2022-04-11 2024-02-20 厦门普为光电科技有限公司 led

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6062168A (en) 1983-09-14 1985-04-10 Toshiba Corp Solid light emitting indicator
JP2000261039A (en) * 1999-03-12 2000-09-22 Mitsubishi Electric Corp Light source device
KR100419611B1 (en) * 2001-05-24 2004-02-25 삼성전기주식회사 A Light Emitting Diode, a Lighting Emitting Device Using the Same and a Fabrication Process therefor
JP2002358035A (en) * 2001-06-04 2002-12-13 Nichia Chem Ind Ltd LED lighting device
ATE417364T1 (en) * 2002-06-21 2008-12-15 Kyosemi Corp LIGHT RECEIVING OR LIGHT EMITTING DEVICE AND METHOD FOR PRODUCING THE SAME
JP5138145B2 (en) * 2002-11-12 2013-02-06 日亜化学工業株式会社 Phosphor laminate structure and light source using the same
KR100576865B1 (en) * 2004-05-03 2006-05-10 삼성전기주식회사 LED array module for backlight and backlight unit having same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI554811B (en) * 2011-04-20 2016-10-21 松下知識產權經營股份有限公司 A light-emitting device, a backlight unit, a liquid crystal display device, a lighting device, and a light-emitting device manufacturing method

Also Published As

Publication number Publication date
TWI298529B (en) 2008-07-01
KR20070103319A (en) 2007-10-23
KR100868158B1 (en) 2008-11-12
JP2007288200A (en) 2007-11-01

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