TW200742122A - Surface mountable light emitting diode assemblies packaged for high temperature operation - Google Patents

Surface mountable light emitting diode assemblies packaged for high temperature operation

Info

Publication number
TW200742122A
TW200742122A TW095125507A TW95125507A TW200742122A TW 200742122 A TW200742122 A TW 200742122A TW 095125507 A TW095125507 A TW 095125507A TW 95125507 A TW95125507 A TW 95125507A TW 200742122 A TW200742122 A TW 200742122A
Authority
TW
Taiwan
Prior art keywords
high temperature
light emitting
emitting diode
temperature operation
led
Prior art date
Application number
TW095125507A
Other languages
English (en)
Inventor
Joseph B Mazzochette
Original Assignee
Lamina Ceramics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=37637479&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW200742122(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lamina Ceramics Inc filed Critical Lamina Ceramics Inc
Publication of TW200742122A publication Critical patent/TW200742122A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

Landscapes

  • Led Device Packages (AREA)
TW095125507A 2005-07-12 2006-07-12 Surface mountable light emitting diode assemblies packaged for high temperature operation TW200742122A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/179,863 US7528421B2 (en) 2003-05-05 2005-07-12 Surface mountable light emitting diode assemblies packaged for high temperature operation

Publications (1)

Publication Number Publication Date
TW200742122A true TW200742122A (en) 2007-11-01

Family

ID=37637479

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125507A TW200742122A (en) 2005-07-12 2006-07-12 Surface mountable light emitting diode assemblies packaged for high temperature operation

Country Status (3)

Country Link
US (1) US7528421B2 (zh)
TW (1) TW200742122A (zh)
WO (1) WO2007008717A1 (zh)

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CN101442040B (zh) * 2007-11-20 2011-03-16 奇力光电科技股份有限公司 发光二极管封装结构及其制造方法
US8598463B2 (en) 2010-08-05 2013-12-03 Unimicron Technology Corp. Circuit board and manufacturing method thereof
TWI565021B (zh) * 2010-09-15 2017-01-01 半導體組件工業公司 連接器總成及其製造方法

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US20060006405A1 (en) 2006-01-12
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