TW200745308A - Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method - Google Patents

Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method

Info

Publication number
TW200745308A
TW200745308A TW096112733A TW96112733A TW200745308A TW 200745308 A TW200745308 A TW 200745308A TW 096112733 A TW096112733 A TW 096112733A TW 96112733 A TW96112733 A TW 96112733A TW 200745308 A TW200745308 A TW 200745308A
Authority
TW
Taiwan
Prior art keywords
circuit
circuit member
member connecting
adhesive layer
adhesive film
Prior art date
Application number
TW096112733A
Other languages
Chinese (zh)
Other versions
TWI367930B (en
Inventor
Yukihisa Hirosawa
Tadamitsu Iimura
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200745308A publication Critical patent/TW200745308A/en
Application granted granted Critical
Publication of TWI367930B publication Critical patent/TWI367930B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

A circuit connecting adhesive film is provided for connecting a first circuit member, in which a first circuit electrode is formed on the main plane of a first substrate, with a second circuit member, in which a second circuit electrode is formed on the main plane of a second substrate, in a status where the first and the second circuit electrodes are arranged to face each other. The film is provided with at least a conductive adhesive layer (3) containing conductive particles (1) and an adhesive (2); a first insulating adhesive layer (4) formed on one plane of the conductive adhesive layer (3); and a second insulating adhesive layer (5) formed on the conductive adhesive layer (3) on the plane opposite to the plane whereupon the first insulating adhesive layer (4) is formed. The thickness of at least one layer of the first and the second insulating adhesive layers (4, 5) is 0.1-5.0 μm.
TW096112733A 2006-04-12 2007-04-11 Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method TW200745308A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006109690 2006-04-12
JP2006213444 2006-08-04

Publications (2)

Publication Number Publication Date
TW200745308A true TW200745308A (en) 2007-12-16
TWI367930B TWI367930B (en) 2012-07-11

Family

ID=38624909

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096112733A TW200745308A (en) 2006-04-12 2007-04-11 Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method

Country Status (5)

Country Link
JP (1) JP4775377B2 (en)
KR (2) KR101150116B1 (en)
CN (3) CN101421886B (en)
TW (1) TW200745308A (en)
WO (1) WO2007123003A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464228B (en) * 2010-12-23 2014-12-11 Cheil Ind Inc Anisotropic conductive film and device comprising the same
TWI491663B (en) * 2009-07-01 2015-07-11 Nippon Kayaku Kk A liquid crystal sealant for liquid crystal dropping, and a liquid crystal display unit using the sealant
TWI557208B (en) * 2012-09-18 2016-11-11 迪睿合股份有限公司 An anisotropic conductive film, an anisotropic conductive film manufacturing method, a method for manufacturing a connecting body, and a connecting method
TWI666657B (en) * 2015-05-28 2019-07-21 日商拓自達電線股份有限公司 Mounting conductive paste
TWI741973B (en) * 2015-12-22 2021-10-11 美商英特爾股份有限公司 Manufacturing method of laminated body, laminated body and multilayer circuit board

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5186157B2 (en) * 2007-08-24 2013-04-17 デクセリアルズ株式会社 Anisotropic conductive film and manufacturing method of connection structure using the same
JP2009194359A (en) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd Adhesive film for circuit connection, circuit member connection structure using the same, and circuit member connection method
JP2010241993A (en) * 2009-04-08 2010-10-28 Canon Chemicals Inc Electroconductive adhesive
KR20120076187A (en) * 2010-12-29 2012-07-09 제일모직주식회사 Anisotropic conductive film
CN103596379A (en) * 2013-10-26 2014-02-19 溧阳市东大技术转移中心有限公司 Method for manufacturing double-layer flexible printed circuit board
JP6408759B2 (en) * 2013-11-08 2018-10-17 デクセリアルズ株式会社 Adhesive composition and film winding body
CN108603078A (en) * 2016-01-29 2018-09-28 日立化成株式会社 Adhesive film, method for producing same, adhesive tape, and reel for adhesive film
CN108040425B (en) * 2017-12-14 2019-09-20 广东长盈精密技术有限公司 Electronic equipment and its circuit board
JP7510039B2 (en) * 2018-06-06 2024-07-03 デクセリアルズ株式会社 Filler-containing film
KR102254467B1 (en) * 2018-07-12 2021-05-21 에이치엔에스하이텍(주) Manufacturing method for anisotropic conductive adhesive film
KR102254470B1 (en) * 2018-07-12 2021-05-21 에이치엔에스하이텍(주) Manufacturing method for anisotropic conductive adhesive film
CN110875101A (en) * 2018-08-31 2020-03-10 玮锋科技股份有限公司 Anisotropic conductive film structure and manufacturing method thereof
JP2023165280A (en) * 2022-05-02 2023-11-15 株式会社レゾナック Film adhesive and method for producing circuit connection structure

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JPS61195179A (en) * 1985-02-25 1986-08-29 Matsushita Electric Ind Co Ltd Anisotropically conductive adhesive sheet
JPH01236588A (en) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd Anisotropic conductive adhesive
JPH0636327B2 (en) * 1988-07-06 1994-05-11 日東電工株式会社 Conductive adhesive tape
JP2833111B2 (en) * 1989-03-09 1998-12-09 日立化成工業株式会社 Circuit connection method and adhesive film used therefor
JPH03107888A (en) * 1989-09-21 1991-05-08 Sharp Corp Connecting structure for circuit board
JPH04366630A (en) * 1991-06-13 1992-12-18 Sharp Corp Anisotropic conductive adhesive tape
US5401913A (en) * 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
JPH07230840A (en) * 1994-02-17 1995-08-29 Hitachi Chem Co Ltd Connecting member and electrode connecting structure using the same
JP3656768B2 (en) * 1995-02-07 2005-06-08 日立化成工業株式会社 Connection member, electrode connection structure using the connection member, and connection method
US5718789A (en) * 1995-06-07 1998-02-17 The Dexter Corporation Method for making a debossed conductive film composite
JP3914606B2 (en) * 1997-04-25 2007-05-16 松下電器産業株式会社 Adhesive layer manufacturing device, double-sided substrate manufacturing device and multilayer substrate manufacturing device
JPH11135567A (en) 1997-10-30 1999-05-21 Toshiba Corp Method for manufacturing anisotropic conductive film and semiconductor device
US6429382B1 (en) * 1999-04-13 2002-08-06 Matsushita Electric Industrial Co., Ltd. Electrical mounting structure having an elution preventive film
JP2002076607A (en) * 2000-08-25 2002-03-15 Sekisui Chem Co Ltd Fine particle transfer / placement method, fine particle placement film, conductive connection film, and conductive connection structure
KR100559937B1 (en) * 2003-01-08 2006-03-13 엘에스전선 주식회사 Connection method of microcircuit and connection structure by it

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI491663B (en) * 2009-07-01 2015-07-11 Nippon Kayaku Kk A liquid crystal sealant for liquid crystal dropping, and a liquid crystal display unit using the sealant
TWI464228B (en) * 2010-12-23 2014-12-11 Cheil Ind Inc Anisotropic conductive film and device comprising the same
TWI557208B (en) * 2012-09-18 2016-11-11 迪睿合股份有限公司 An anisotropic conductive film, an anisotropic conductive film manufacturing method, a method for manufacturing a connecting body, and a connecting method
TWI666657B (en) * 2015-05-28 2019-07-21 日商拓自達電線股份有限公司 Mounting conductive paste
TWI741973B (en) * 2015-12-22 2021-10-11 美商英特爾股份有限公司 Manufacturing method of laminated body, laminated body and multilayer circuit board

Also Published As

Publication number Publication date
JP4775377B2 (en) 2011-09-21
WO2007123003A1 (en) 2007-11-01
CN101421886A (en) 2009-04-29
TWI367930B (en) 2012-07-11
CN101901972B (en) 2012-07-04
KR101090561B1 (en) 2011-12-08
CN101421886B (en) 2010-12-15
JPWO2007123003A1 (en) 2009-09-03
KR101150116B1 (en) 2012-06-08
CN101901972A (en) 2010-12-01
CN101901971B (en) 2012-07-04
CN101901971A (en) 2010-12-01
KR20110063586A (en) 2011-06-10
KR20080108615A (en) 2008-12-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees