TW200745574A - Semiconductor package sorting method - Google Patents

Semiconductor package sorting method

Info

Publication number
TW200745574A
TW200745574A TW095137752A TW95137752A TW200745574A TW 200745574 A TW200745574 A TW 200745574A TW 095137752 A TW095137752 A TW 095137752A TW 95137752 A TW95137752 A TW 95137752A TW 200745574 A TW200745574 A TW 200745574A
Authority
TW
Taiwan
Prior art keywords
tray
unloading
defective
products
defective product
Prior art date
Application number
TW095137752A
Other languages
Chinese (zh)
Other versions
TWI317815B (en
Inventor
Min-Gu Kang
Hyun-Min Lee
Kyung-Soo Song
Sang-Yoon Lee
Ssang-Gun Lim
Original Assignee
Intekplus Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intekplus Co Ltd filed Critical Intekplus Co Ltd
Publication of TW200745574A publication Critical patent/TW200745574A/en
Application granted granted Critical
Publication of TWI317815B publication Critical patent/TWI317815B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Disclosed is a semiconductor package sorting method for improving sorting speed and yield of semiconductor packages. The method comprises performing a vision inspection on a tray from a loading unit, transferring the tray to a buffer unit, shifting defective products, received in the tray as a buffer tray, to a defective product tray, performing a vision inspection on a tray from the loading unit, transferring the tray to an unloading unit, determining whether defective products are found among semiconductor packages received in the tray as an unloading tray, if it is determined that the unloading tray receives defective products, shifting the defective products of the unloading tray to the defective product tray and shifting normal products of the buffer tray to fill the unloading tray, if a vision inspection for a last tray of a lot is completed after repeatedly performing all the foregoing steps and the last tray is transferred to the unloading unit, shifting the defective products received in the unloading tray to the defective product tray, discharging the defective product tray into a defective product storage unit and determining whether a re-inspection for the defective products is performed, and if the re-inspection is determined, performing a defective product re-inspection simultaneously with arrangement of the normal products.
TW095137752A 2005-10-19 2006-10-13 Semiconductor package sorting method TWI317815B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050098855A KR100705655B1 (en) 2005-10-19 2005-10-19 Classification method of semiconductor package

Publications (2)

Publication Number Publication Date
TW200745574A true TW200745574A (en) 2007-12-16
TWI317815B TWI317815B (en) 2009-12-01

Family

ID=37962691

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137752A TWI317815B (en) 2005-10-19 2006-10-13 Semiconductor package sorting method

Country Status (4)

Country Link
KR (1) KR100705655B1 (en)
CN (1) CN101292338A (en)
TW (1) TWI317815B (en)
WO (1) WO2007046629A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG154364A1 (en) * 2008-01-30 2009-08-28 Rokko Mechatronics Pte Ltd System and method for the sorting of ic units
KR101134985B1 (en) * 2009-03-05 2012-04-09 (주)제이티 Vision inspection apparatus
KR101275862B1 (en) 2011-10-12 2013-06-17 한미반도체 주식회사 semiconductor manufacturing system and a controlling method of the same
CN103021899B (en) * 2012-12-21 2015-07-15 日月光半导体（昆山）有限公司 Semiconductor product detection machine and detection method thereof
CN104900555A (en) * 2015-04-29 2015-09-09 海太半导体（无锡）有限公司 Semiconductor encapsulation testing device
KR102391516B1 (en) * 2015-10-08 2022-04-27 삼성전자주식회사 Semiconductor test apparatus
CN106841989A (en) * 2017-02-13 2017-06-13 张家港市欧微自动化研发有限公司 A kind of cmos sensor method of testing
CN111620118A (en) * 2020-05-29 2020-09-04 苏州天准科技股份有限公司 Blanking equipment and camera protection module detection system
CN117465986B (en) * 2023-01-30 2026-06-23 惠州华星光电显示有限公司 Intelligent film-sending integrated machine and operation flow thereof
CN118115038B (en) * 2024-03-12 2024-11-05 深圳市鹏乐智能系统有限公司 LED chip defect detection method, device, equipment and storage medium

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08262102A (en) * 1995-03-23 1996-10-11 Advantest Corp Device re-inspection method in IC tester handler
KR100481297B1 (en) * 1997-10-27 2005-07-07 삼성전자주식회사 Semiconductor packaging system and packaging method
JP2000258496A (en) 1999-03-05 2000-09-22 Nec Corp Inspection method and apparatus for semiconductor device
KR100338194B1 (en) * 1999-10-16 2002-05-27 김주환 Inspection system of Semiconductor device package with 3 dimension type and the inspection method thereof
KR100819796B1 (en) * 2002-05-02 2008-04-07 삼성테크윈 주식회사 Classification method of semiconductor package
KR100498496B1 (en) * 2003-05-07 2005-07-01 삼성전자주식회사 Testing method of remnant semiconductor device
KR200339601Y1 (en) * 2003-10-13 2004-01-24 한미반도체 주식회사 apparatus for vision inspection of semiconductor devices

Also Published As

Publication number Publication date
CN101292338A (en) 2008-10-22
KR100705655B1 (en) 2007-04-09
WO2007046629A1 (en) 2007-04-26
TWI317815B (en) 2009-12-01

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