TW200746344A - Thin plate container - Google Patents

Thin plate container

Info

Publication number
TW200746344A
TW200746344A TW096111660A TW96111660A TW200746344A TW 200746344 A TW200746344 A TW 200746344A TW 096111660 A TW096111660 A TW 096111660A TW 96111660 A TW96111660 A TW 96111660A TW 200746344 A TW200746344 A TW 200746344A
Authority
TW
Taiwan
Prior art keywords
suction
wafer
container
vacuum
pressure reduction
Prior art date
Application number
TW096111660A
Other languages
Chinese (zh)
Inventor
Yukihiro Hyobu
Original Assignee
Miraial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006102759A external-priority patent/JP2007281053A/en
Priority claimed from JP2006102756A external-priority patent/JP2007281050A/en
Application filed by Miraial Co Ltd filed Critical Miraial Co Ltd
Publication of TW200746344A publication Critical patent/TW200746344A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

An extremely thin wafer (wafer thickness is 10-200 μm) obtained by grinding the back of a semiconductor wafer is easy to break because it has low strength. It is also deformed easily and automation of subsequent process becomes difficult. As a means for solving that problem, a thin plate container which can secure the extremely thin wafer by vacuum suction is employed. The vacuum suction section of the container has a wafer suction surface for mounting a wafer, a plurality of suction holes for vacuum sucking the wafer opening onto the suction surface, a pressure reduction chamber connected with the suction holes, a suction opening connected with an external vacuum line, and a suction hole connecting the suction opening connected with an external vacuum line with the pressure reduction chamber and the suction opening. A supporting partition wall is provided in the pressure reduction chamber in order to support the suction plate. The suction plate has a structure separable from the container. A two-layer structure where the suction surface is composed of an elastic material and the other surface is composed of a polymer material having a fixed strength is employed. The wafer suction surface of the container is suitably concave for the peripheral portion. Since the wafer is secured by vacuum suction, conveyance of the thin plate container and the process can be automated. The container can be used repeatedly with reduced environmental load.
TW096111660A 2006-04-04 2007-04-02 Thin plate container TW200746344A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006102759A JP2007281053A (en) 2006-04-04 2006-04-04 Thin plate storage container
JP2006102756A JP2007281050A (en) 2006-04-04 2006-04-04 Wafer tray for semiconductor wafers

Publications (1)

Publication Number Publication Date
TW200746344A true TW200746344A (en) 2007-12-16

Family

ID=38563598

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096111660A TW200746344A (en) 2006-04-04 2007-04-02 Thin plate container

Country Status (2)

Country Link
TW (1) TW200746344A (en)
WO (1) WO2007114331A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104144570A (en) * 2013-05-07 2014-11-12 景硕科技股份有限公司 Plate carrier for improving heat convection effect of oven
CN104798191A (en) * 2012-11-20 2015-07-22 艾克斯特朗欧洲公司 Apparatus for aligning wafers on wafer holders
TWI684223B (en) * 2017-09-28 2020-02-01 日商新川股份有限公司 Adsorption platform
CN111473039A (en) * 2020-03-04 2020-07-31 上海精测半导体技术有限公司 Flexible panel leveling apparatus and method
CN115241114A (en) * 2022-08-17 2022-10-25 常熟市兆恒众力精密机械有限公司 Crystal disc clamp

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US9159595B2 (en) * 2010-02-09 2015-10-13 Suss Microtec Lithography Gmbh Thin wafer carrier
JP5913162B2 (en) 2012-04-04 2016-04-27 東京エレクトロン株式会社 Substrate holding device and substrate holding method
GB2502303A (en) * 2012-05-22 2013-11-27 Applied Microengineering Ltd Method of handling a substrate using a pressure variance
CN112086394A (en) * 2020-07-30 2020-12-15 北京烁科精微电子装备有限公司 Wafer transfer transmission device and wafer transfer transmission method
CN115497863B (en) * 2021-06-18 2026-02-27 广东聚华印刷显示技术有限公司 Method for transferring fixture platform and flexible display components, and peeling and transfer system
JP7810618B2 (en) * 2022-08-23 2026-02-03 ユナイテッド・セミコンダクター・ジャパン株式会社 Wafer support plate and semiconductor manufacturing device equipped with same
CN119731776A (en) * 2022-09-02 2025-03-28 Ev 集团 E·索尔纳有限责任公司 Vacuum substrate support with optimized vacuum seal
CN118737823B (en) * 2024-08-30 2024-12-06 苏州长光华芯光电技术股份有限公司 Thinning method of semiconductor structure

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JPH04167541A (en) * 1990-10-31 1992-06-15 Fujitsu Ltd Positioning method for substrate and device thereof
US5445559A (en) * 1993-06-24 1995-08-29 Texas Instruments Incorporated Wafer-like processing after sawing DMDs
JPH09225768A (en) * 1996-02-23 1997-09-02 Nippon Telegr & Teleph Corp <Ntt> Substrate holding device
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JP2000082737A (en) * 1998-09-04 2000-03-21 Canon Inc Substrate chuck, exposure apparatus, device manufacturing method, substrate transfer system and substrate transfer method
JP4700819B2 (en) * 2000-03-10 2011-06-15 キヤノン株式会社 Substrate holding apparatus, semiconductor manufacturing apparatus, and semiconductor device manufacturing method
JP4057229B2 (en) * 2000-10-02 2008-03-05 富士フィルター工業株式会社 Suction chuck plate
JP4288694B2 (en) * 2001-12-20 2009-07-01 株式会社ニコン Substrate holding apparatus, exposure apparatus, and device manufacturing method
JP2004083182A (en) * 2002-08-26 2004-03-18 Sharp Corp Substrate transfer device and liquid crystal display device manufacturing method
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104798191A (en) * 2012-11-20 2015-07-22 艾克斯特朗欧洲公司 Apparatus for aligning wafers on wafer holders
CN104144570A (en) * 2013-05-07 2014-11-12 景硕科技股份有限公司 Plate carrier for improving heat convection effect of oven
TWI684223B (en) * 2017-09-28 2020-02-01 日商新川股份有限公司 Adsorption platform
CN111473039A (en) * 2020-03-04 2020-07-31 上海精测半导体技术有限公司 Flexible panel leveling apparatus and method
CN115241114A (en) * 2022-08-17 2022-10-25 常熟市兆恒众力精密机械有限公司 Crystal disc clamp
CN115241114B (en) * 2022-08-17 2023-10-10 常熟市兆恒众力精密机械有限公司 A wafer disc fixture

Also Published As

Publication number Publication date
WO2007114331A1 (en) 2007-10-11

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