200804992 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種聯機式塗敷裝置，尤其涉及一種適用 於對基板塗敷照相平版印刷用光阻劑的塗敷作業，且可防 止形成光阻劑的不良塗層，並能實現整個平版印刷技術聯 機化的聯機式塗敷裝置（inline pr〇cess type c〇ating apparatus) 〇 【先前技術】 通常’在各種平板顯示器基板的製造技術中，會使用 照相平板印刷（photolithography)方式作爲在基板表面形 成預定圖案的方法。 這種方式的步驟如下，首先在基板表面塗敷感光物質 (sensitive material)，之後對塗有感光物質的塗敷表面進行 曝光、顯影、蝕刻等一系列作業。 在所述塗敷作業中，通常使用光阻劑作爲感光物質， 並將其以一定厚度均勻塗敷在基板表面上。 例如，如果基板表面上的光阻劑塗層厚於預定厚度， 則可能在進行蝕刻作業時無法形成完整的圖案；相反，若 薄於預定厚度’則可能在基板表面出現過度姓刻圖案的現 象。 爲了在基板表面塗敷光阻劑，主要使用旋轉式塗敷裝 置來進行塗敷··即從驅動源接受動力，並以中心部爲基準 在可旋轉的旋轉板上裝載基板，在此狀態下，將光阻劑滴 落在基板表面並利用離心力使其均勻分散及塗敷在基板表 5 200804992 面上。 但是，使用所述旋塗裝置，不僅在旋轉基板的中心部 和外圍部出現轉速偏差，而且在光阻劑的擴散時溶劑會不 均勻地療發，因此在塗敷面形成波紋狀層理。 在對大面積基板進行塗敷時，上述波紋狀層理的産生 更爲嚴重，因此在進行塗敷作業時，不能得到令人滿意的 效果。 另外，由於滴落到基板表面上的光阻劑因離心力的作 用而滴落到基板外側，因而將浪費過多的原料。 爲瞭解決所述問題，本發明提出了一種非旋轉塗敷方 式，即在具有+面裝載面的定盤上水平放置基板，並通過 在基板上面移動具有狹縫式噴出口的塗敷裝置（s出 coater)來塗敷光阻劑。 但是，這種塗敷方式，由於在定盤上放置基板的狀態 下，直接移動狹縫式塗敷裝置來進行塗敷作業，很難連續 進行對多個基板的塗敷作業。 、 尤其是，這種非連續式塗敷作業，很難實現整個昭相 平板印刷工序及其設備的聯機化’因此其操作複雜，需要 過多時間，從而降低生産效率。 【發明内容】 本發明鐾於所述問題而作成，其目的在於提供一種在 輸送基板的同時可連續進行光阻劑塗敷作業，且易於實現 整個照相平板印刷技術聯機化的聯機式塗敷裝置。 爲實現所述目的’本發明提供一種聯機式塗敷裝置， 6 200804992 其包括： 作業平臺，其提供的作業面長度足以在基板輸送過程 中完成塗敷作業； …/于口，其藉由氣體噴射壓力使基板水平懸浮在所述 作業面上； 輸k衣置，其用於吸附及固定懸浮狀基板，同時藉由 從驅動源接受的翁τ七 .JL _ t 的動力^所述作業面輸送基板； 狹縫式塗敷裝置，其具有細長的開口，即喷出口’並 通過所述❹口對沿著所述作業面移動的基板塗敷光阻 喷出调整裝置，其具有可分離地接觸在所述噴出口端 部的平滑面，並以與平滑面面接觸的狀態壓住枯接在所述 贺出口端部上的綠劑’使光阻劑沿所述喷出Π的開口方 向均勻分佈。200804992 IX. Description of the Invention: The present invention relates to an in-line coating apparatus, and more particularly to a coating operation suitable for coating a substrate with a photoresist for photolithography, and preventing formation of a photoresist A poor coating of the agent, and an inline pr〇cess type c〇ating apparatus that can realize the entire lithographic technique. [Prior Art] Generally, in the manufacturing technology of various flat panel display substrates, A photolithography method is used as a method of forming a predetermined pattern on the surface of the substrate. The procedure in this manner is as follows. First, a photosensitive material is applied to the surface of the substrate, and then a series of operations such as exposure, development, and etching of the coated surface coated with the photosensitive material are performed. In the coating operation, a photoresist is usually used as a photosensitive material, and it is uniformly coated on the surface of the substrate with a certain thickness. For example, if the photoresist coating on the surface of the substrate is thicker than a predetermined thickness, a complete pattern may not be formed during the etching operation; on the contrary, if it is thinner than the predetermined thickness, an excessive pattern may be formed on the surface of the substrate. . In order to apply a photoresist to the surface of the substrate, the coating is mainly applied by a spin coating apparatus, that is, the power is received from the driving source, and the substrate is loaded on the rotatable rotating plate with respect to the center portion. The photoresist was dropped on the surface of the substrate and uniformly dispersed by a centrifugal force and applied to the surface of the substrate 5 200804992. However, with the spin coating device, not only the rotational speed deviation occurs in the central portion and the peripheral portion of the rotating substrate, but also the solvent is unevenly treated during the diffusion of the photoresist, so that a corrugated bedding is formed on the coated surface. . When the large-area substrate is coated, the above-mentioned corrugated layering is more severely produced, so that a satisfactory effect cannot be obtained when the coating operation is performed. In addition, since the photoresist dropped onto the surface of the substrate drops to the outside of the substrate due to the centrifugal force, excessive raw materials are wasted. In order to solve the problem, the present invention proposes a non-rotation coating method in which a substrate is horizontally placed on a fixed plate having a +-face loading surface, and a coating device having a slit type discharge port is moved over the substrate ( s coater) to apply the photoresist. However, in this coating method, since the slit coating apparatus is directly moved to perform the coating operation while the substrate is placed on the fixed plate, it is difficult to continuously perform the coating operation on the plurality of substrates. In particular, in such a discontinuous coating operation, it is difficult to realize the online connection of the entire stencil printing process and its equipment. Therefore, the operation is complicated and it takes too much time to reduce the production efficiency. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide an in-line coating apparatus which can continuously perform a photoresist coating operation while transporting a substrate, and which is easy to realize the entire photolithography technology. . To achieve the object, the present invention provides an in-line coating apparatus, 6 200804992, which comprises: a work platform that provides a working surface length sufficient to complete a coating operation during substrate transport; The ejection pressure causes the substrate to be horizontally suspended on the working surface; and is used for adsorbing and fixing the suspended substrate, and at the same time, by the power of the Weng τ7.JL_t received from the driving source a substrate coating device having an elongated opening, that is, a discharge port ', and applying a photoresist discharge adjusting device to the substrate moving along the working surface through the port, which is detachably Contacting a smooth surface at the end of the discharge port, and pressing the green agent that is attached to the end of the outlet port in a state of being in contact with the smooth surface to cause the photoresist to follow the opening direction of the discharge port Evenly distributed.
採用本發明，藉由聯機方式移動基板的同時，可簡單 地進行光阻劑的塗敷作業。 方式 地實 尤其’這種在㈣基板㈣料進行錄作業的聯機 ’可與照相平板印刷中各種程序相結合，能夠很容易 現整個程序及設備的聯機化。 ’可利用面接觸力，使光 口’從而防止出現光阻劑 另外，在進行塗敷作業之前 阻劑均勻分散在塗敷裝置的噴出 的不良塗層，進而提高塗敷質量。 【實施方式】 下面 參照附圖說明本發明的較佳 實施例，並在所屬 7 200804992 領域技術人員能夠實施本發明實施例的範圍内進行說明。 另外’由於本發明的實施例能夠以多種形式實施，所 以本發明的申請專利範圍並不限於下述實施例的範圍。 圖一是用於說明本發明實施例所涉及的聯機式塗敷裝 置整體結構的主要視圖，圖中符號2指作業平臺。 所述作業平台2具有作業面4，所述作業面4的大小 適於在基板G的輸送過程中，藉由聯機方式進行光阻劑w 的塗敷作業。 所述作業平台2可使用經由焊接或用螺絲等連接用的 金屬型鋼而形成的金屬支架，或者類似的金屬結構體。 在所述作業面4上安裝有可藉由氣體喷射壓力使基板 G懸浮的懸浮台6。 所述懸浮台6採用一般的懸浮台結構，並被沿基板G 的輸迗區域配置在所述作業面4上，且藉由從多個孔（未 圖不）喷射出的氣體之壓力均勻地支撐基板G的下端，以 使基板G水平懸浮。 如此利用氣體喷射壓力在作業面4上以非接觸狀態支 接基板G的方式’與利用輸送輥支撐基板〇的接觸式支撐 方式相比’可有效防止因各種衝擊和接觸力等而損壞基板 G的現象。而且，藉由均勻的氣體喷射壓力能夠以水平狀 悲支撐基板G的整個表面。 在所述作業平台2上安裝有用於沿所述作業面4輸送 基板G的輸送裝置8。 所述輸送裝置8以真空壓力吸附基板G的至少一處， 8 200804992 並沿所述作業面4以聯機方式輸送基板G。 爲此，如圖一所示，本實施例中，在所述作業面4上 設有至少一個真空吸盤c。當所述真空吸盤C接受驅動源 Μ1的動力而沿所述作業面4移動時，基板g在被吸附及 固定於真空吸盤C的狀態下移動。 如圖一及圖二所示’設置在基板G兩側的移動體1 〇 上分別固定有至少一個所述真空吸盤C。 此外’所述驅動源]VI1可使用普通的線性電動機，其 可沿著所述作業面4直線輸送所述兩個移動體1 〇。 在所述各真空吸盤C上形成有的孔（未圖示）與產生 真空壓的一般真空壓發生裝置相連接且產生真空壓作用， 藉由這些孔吸附及固定基板G的對應兩邊，以使其大致呈 水平狀態。 如圖二所示，所述各真空吸盤c被固定在所述移動體 10上，其可隨著移送用的氣壓缸L1的動作而改變其位置。 這種結構可讓所述真空吸盤c在基板G的兩侧縮小或 擴大其間隔’從而改變吸附位置。 所述作業面4的一侧還可進一步設有位置調整裝置 12 藉由物理接觸力在塗敷光阻劑W之前調整從外部進 入的基板G的位置。 如圖三所示，所述位置調整裝置12由位於所述作業面 4 一侧的兩個導鎖？1和推壓板p2(pushpiate)組成、。 、喜二Ϊ導銷P1位於可卡住基板G的四個邊中兩個相鄰 9 200804992 所述推壓板P2位於可推壓基板G上與所述兩個導銷 P1接觸的相鄰兩邊之對角方向上的另兩個側邊的位置上。 如圖四所示，所述導銷P1和推壓板P2，分別與缸 的活塞杆相連接’所述導銷P1可卡住所述基板G的邊緣 而上下移動，所述推壓板P2則向水平方向推壓。 所述位置調整裝置12在基板G由所述作業面4 一側 進入並懸浮在作業面4上的狀態下工作。According to the present invention, the application of the photoresist can be easily performed while moving the substrate in an on-line manner. In this way, the online connection of the (four) substrate (four) material can be combined with various programs in photolithography, and the entire program and equipment can be easily connected. The surface contact force can be used to prevent the optical port from occurring, thereby preventing the occurrence of a photoresist. Further, the resist is uniformly dispersed in the poor coating of the coating device before the coating operation, thereby improving the coating quality. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, and will be described within the scope of the embodiments of the present invention. Further, since the embodiments of the present invention can be implemented in various forms, the scope of the present invention is not limited to the scope of the following embodiments. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a principal view for explaining the overall structure of an in-line coating apparatus according to an embodiment of the present invention, and reference numeral 2 denotes a work platform. The work platform 2 has a working surface 4 which is sized to perform a coating operation of the photoresist w by means of an in-line process during the conveyance of the substrate G. The work platform 2 can use a metal bracket formed by welding or a metal profile for joining by screws or the like, or a similar metal structure. A floating stage 6 capable of suspending the substrate G by gas injection pressure is mounted on the working surface 4. The floating stage 6 adopts a general floating stage structure and is disposed on the working surface 4 along the conveying area of the substrate G, and is uniformly distributed by the pressure of the gas ejected from the plurality of holes (not shown). The lower end of the substrate G is supported to horizontally suspend the substrate G. Thus, the manner in which the substrate G is supported in the non-contact state by the gas ejection pressure in the non-contact state is compared with the contact-supporting method in which the substrate is supported by the transport roller, which can effectively prevent damage to the substrate G due to various impacts, contact forces, and the like. The phenomenon. Moreover, the entire surface of the substrate G can be supported in a horizontal manner by uniform gas ejection pressure. A transport device 8 for transporting the substrate G along the work surface 4 is mounted on the work platform 2. The conveying device 8 adsorbs at least one place of the substrate G by vacuum pressure, 8 200804992, and transports the substrate G in an on-line manner along the working surface 4. To this end, as shown in Fig. 1, in the present embodiment, at least one vacuum chuck c is provided on the work surface 4. When the vacuum chuck C receives the power of the driving source 而1 and moves along the working surface 4, the substrate g moves in a state of being adsorbed and fixed to the vacuum chuck C. As shown in Figs. 1 and 2, at least one of the vacuum chucks C is fixed to each of the moving bodies 1 设置 disposed on both sides of the substrate G. Further, the "drive source" VI1 can use a conventional linear motor which can linearly transport the two moving bodies 1 沿着 along the work surface 4. Holes (not shown) formed in the respective vacuum chucks C are connected to a general vacuum pressure generating device that generates a vacuum pressure, and a vacuum pressure is generated, and the corresponding sides of the substrate G are adsorbed and fixed by the holes, so that It is roughly horizontal. As shown in Fig. 2, each of the vacuum chucks c is fixed to the movable body 10, and its position can be changed in accordance with the movement of the pneumatic cylinder L1 for transfer. This structure allows the vacuum chuck c to be narrowed or enlarged at both sides of the substrate G to change the adsorption position. One side of the working surface 4 may further be provided with a position adjusting device 12 to adjust the position of the substrate G entering from the outside before applying the photoresist W by physical contact force. As shown in Fig. 3, the position adjusting device 12 has two guide locks on one side of the work surface 4? 1 and the push plate p2 (pushpiate) composition. The two guiding pins P1 are located on two adjacent sides of the four sides of the slidable substrate G. The urging plate P2 is located on the adjacent substrate of the pushable substrate G that is in contact with the two guiding pins P1. The position of the other two sides in the diagonal direction. As shown in FIG. 4, the guide pin P1 and the pressing plate P2 are respectively connected to the piston rod of the cylinder. The guide pin P1 can be moved up and down by the edge of the substrate G, and the pressing plate P2 is directed to Push in the horizontal direction. The position adjusting device 12 operates in a state where the substrate G enters from the working surface 4 side and is suspended on the work surface 4.
即如圖四所示，在利用所述各真空吸盤c進行吸附之 前，使所述導銷P1和推壓板P2開始工作，並在所述兩個 導銷P1卡住基板G邊緣的狀態下，如圖示方向推壓所述 推壓板P2，從而調整基板g的位置。 另外，所述作業面4上安裝有在基板G輸送過程中用 於塗敷光阻劑W的塗敷裝置14。 如圖五所示，所述塗敷裝置14呈長方形箱體狀。而且， 所述塗敷裝置14的下方形成有用於塗敷光阻劑w的狹縫 狀細長噴出口 N。 的動作沿上下方向移動。 述塗敷裝置14被固定在位於所述作業面4上的機 “（Gantry)上，且其之裝配方向與基板g前進方向相 直，而且在所述機架16±，其能夠隨著移送用氣壓缸 所述塗敷裝置14與儲存光阻劑|的儲存槽τ相連接， :由該儲存槽T獲得光阻劑W。爲了能夠進行一般的照相 序：所述光阻…用由固態粉末狀感光物質 軍I〖生/合劑混合而成的感光性組成物。 10 200804992 在基板G以被所述真空吸盤c固定的狀態水平移動， 且在將要通過所述喷出口 N下方位置時’所述塗敷裝置14 向下移動’使喷出口 N接近基板Q表面。 、，此外，如圖六所示’從所述噴出口 N喷出光阻劑w， 並在基板G輸送過程中，將光阻劑w塗敷在其表面上， 從而形成一定厚度的塗層。That is, as shown in FIG. 4, before the adsorption by the vacuum chucks c is performed, the guide pin P1 and the pressing plate P2 are started to operate, and in a state where the two guide pins P1 are caught by the edge of the substrate G, The pressing plate P2 is pushed in the direction shown to adjust the position of the substrate g. Further, a coating device 14 for applying the photoresist W during the conveyance of the substrate G is mounted on the work surface 4. As shown in FIG. 5, the coating device 14 has a rectangular box shape. Further, a slit-like elongated discharge port N for applying the photoresist w is formed under the coating device 14. The movement moves up and down. The coating device 14 is fixed on a machine "Gantry" located on the work surface 4, and its assembly direction is straight with the advancement direction of the substrate g, and at the frame 16±, it can be transferred along with The coating device 14 is connected to the storage tank τ storing the photoresist| by a pneumatic cylinder, and the photoresist W is obtained from the storage tank T. In order to enable a general photo sequence: the photoresist is used by a solid state A photosensitive composition in which a powdery photosensitive material is mixed with a mixture of ingredients. 10 200804992 The substrate G is horizontally moved in a state of being fixed by the vacuum chuck c, and is to be passed through a position below the discharge port N. The coating device 14 is moved downward to make the ejection port N close to the surface of the substrate Q. Further, as shown in FIG. 6, 'the photoresist w is ejected from the ejection port N, and during the substrate G transport, A photoresist w is applied on the surface thereof to form a coating of a certain thickness.
如上所述，在基板G輸送過程中進行光阻劑w的塗 敷作業時’在所述塗敷裝置14的塗敷位置，所述各真空 吸盤C的真空壓力被解除’由所述懸浮台6支撐基板使其 懸浮，以進行塗敷作業。 例如，如圖七所示，在基板〇兩侧真空吸盤c中的配 置可暫時解除通過所述❹σ 塗敷位置的真空吸盤c 的真空壓。 由此，所述基板G的整個面積中通過所述喷出口 Μ 方的部分可藉由所述懸浮台6的氣壓，以非接觸狀態獲得 支持。 這種結構在進行塗敷作章時，益 斤 W茶-糟由氣體噴射壓力以非 接觸狀態支撐所述基板〇的全部面積中與所述_出口 ^ 近的部分，因此在基板G移動過程中，可使基板保持一定 的水平狀態。 如果所述基板在經過塗敷位置的基板G的部分面積直 ，被所述真空吸盤c固定的狀態下移動，就會因所述各真 空吸盤C在動作過程中所形成的姿勢和位置偏差等， 均勻地固定基板G，從而降低塗敷質量。 . 11 200804992 如圖一所示，在所述作豐 業面2上，女裝有與所述塗 裝置1 4相鄰的噴出調整裝置丨8。 在使用所述塗敷裝置14進行塗㈣業之_ '出調整裝置18使㈣在所述喷出…部上的光阻劑 W均勻分布。 dAs described above, when the coating operation of the photoresist w is performed during the conveyance of the substrate G, 'the vacuum pressure of each vacuum chuck C is released at the application position of the coating device 14' by the floating table 6 Support the substrate to suspend it for coating operation. For example, as shown in Fig. 7, the arrangement in the vacuum chuck c on both sides of the substrate 可 temporarily releases the vacuum pressure of the vacuum chuck c passing through the ❹σ application position. Thereby, the portion of the entire area of the substrate G that passes through the discharge port can be supported in a non-contact state by the air pressure of the floating table 6. When the coating is applied, the portion of the entire area of the substrate which is adjacent to the outlet is supported by the gas ejection pressure in a non-contact state, and thus the substrate G is moved. The substrate can be maintained at a certain level. If the substrate is moved in a state where the portion of the substrate G passing through the application position is straight and is fixed by the vacuum chuck c, the posture and positional deviation formed by the vacuum chuck C during the operation may be caused. , the substrate G is uniformly fixed, thereby reducing the coating quality. 11 200804992 As shown in Fig. 1, on the augmented surface 2, the women's wear has a discharge adjusting device 8 adjacent to the coating device 14. The coating device 14 is used for coating (4) to uniformly distribute the photoresist W on the ejection portion. d
爲此，如圖八所示，在本實施例中，通過將具 接觸面F的移動滑塊20沿著所述作業面4移動，使所述 接觸面F以面接觸力壓住粘著在所述塗敷裝置"之噴出 口 N端部上的光阻齊】W，從而使光阻齊】w在所述噴出口 N端部的開口方向上均勻分布（如圖九所示）。 如圖八所示，所述移動滑塊2〇呈長方體狀，且爲了防 止其與沿所述作業® 4移動的基板G及真空吸盤c相接 觸，將其固定在底部呈凹形的支撐用托架22上。 所述托架22在移送用氣壓缸L3的作用下，沿所述作 業面4進行往復移動，使所述移動滑塊2〇通過所述噴出 口 N的下方。 、 在所述移動滑塊20通過所述塗覆裝置ι4的下方時， 將所述噴出口 N的端部與所述接觸面F之間的間距Q設定 在50至100微米範圍。 若所述間距Q小於所述範圍，則難以保障有足夠的空 間可使點著在所述喷出口 N端部上的光阻劑w與接觸面F 相接觸而均勻分散。 相反’若所述間距Q大於所述範圍，則很難得到有六文 的面接觸力。 > 12 200804992 對所述接觸面F可進行_ 磨，以使其具有一定的平滑度 開口方向維持均等間距Q。To this end, as shown in FIG. 8, in the present embodiment, by moving the moving slider 20 having the contact surface F along the working surface 4, the contact surface F is pressed against the surface contact force by the surface contact force. The photoresist on the end portion of the ejection port of the coating device is flushed so that the photoresist is uniformly distributed in the opening direction of the end portion of the ejection port N (as shown in FIG. 9). As shown in FIG. 8, the moving slider 2 is formed in a rectangular parallelepiped shape, and is fixed to a concave support at the bottom in order to prevent it from coming into contact with the substrate G and the vacuum chuck c moving along the operation® 4. On the bracket 22. The carriage 22 reciprocates along the work surface 4 by the transfer pneumatic cylinder L3 to pass the moving slider 2 below the discharge port N. When the moving slider 20 passes under the coating device ι4, the pitch Q between the end of the ejection port N and the contact surface F is set in the range of 50 to 100 μm. If the pitch Q is smaller than the above range, it is difficult to ensure that there is sufficient space for the photoresist w placed on the end portion of the discharge port N to be in contact with the contact surface F to be uniformly dispersed. On the contrary, if the pitch Q is larger than the range, it is difficult to obtain a surface contact force of six documents. > 12 200804992 The contact surface F can be _ milled to have a certain degree of smoothness. The opening direction maintains an even pitch Q.
般的表面處理工序，例如研 ’從而能夠沿所述喷出口 N 如上所述，在進行塗敷作 的面接觸力，使粘著在所述喷 均勻分布，從而能夠將光阻劑 整個表面上。 業之前，藉由所述接觸面F 出口 N端部上的光阻劑w W均勻地塗敷在基板〇的In the general surface treatment process, for example, the surface contact force of the coating can be applied along the discharge port N as described above, so that the adhesion can be uniformly distributed in the spray, so that the entire surface of the photoresist can be applied. . Before, the photoresist W w on the end of the contact surface of the contact surface F is uniformly coated on the substrate
例如，如果在所述噴出口 N的端部上不均句地 阻劑W的狀態下進行塗敷作举For example, if the coating is performed at the end of the discharge port N in a state where the resist W is unevenly applied,
j 土双作菜，如圖十所不，所述基板G 表面中’進行起始塗敷作業的前方料，由於其不能均勾 地塗敷光阻劑W，會導致不良塗層。 而且，與利用旋轉輥輪，在輥輪旋轉時利用親輪外柱 面的線接觸力碾壓的方式相比，上述利用移動滑塊2〇的 面接觸方式能夠更爲容易地壓住所述塗覆裝置14喷出口 n 上的光阻劑W，以使光阻劑w沿所述噴出口 N的開 向均勻分布。 、另外，在所述作業φ 4 i，還可進_步安裝用於清洗 所述塗覆裝置14或移動滑塊2〇的清洗裝置24。 壯所述清洗裝置24可藉由物理接觸力清洗粘著在所述塗 敷衣置14之噴出α N端部或移動滑塊2〇㈤接觸面f上的 異物和殘餘的光阻劑W。 6 =此，在本實施例中，如圖一所示，在所述作業面* 2女裝有清洗輥輪R，所述輥輪R接受驅動源M3的動力， 攸長方形塗覆裝置14或移動滑塊2〇的任何一側向另一側 13 200804992j. Double-layered vegetables, as shown in Fig. 10, the front material of the substrate G on which the initial coating operation is performed may cause a poor coating because it cannot apply the photoresist W uniformly. Further, compared with the manner in which the rotating roller is used to roll the roller by the line contact force of the outer cylinder surface when the roller is rotated, the above-described surface contact method using the moving slider 2 can more easily press the said surface contact method. The coating device 14 discharges the photoresist W on the exit n to uniformly distribute the photoresist w in the opening direction of the ejection port N. Further, in the operation φ 4 i, the cleaning device 24 for cleaning the coating device 14 or moving the slider 2〇 may be further installed. The cleaning device 24 can clean the foreign matter and the residual photoresist W adhering to the sprayed α N end portion of the coating garment 14 or the moving slider 2 (f) contact surface f by physical contact force. 6 = In this embodiment, as shown in FIG. 1, on the working surface * 2 women have a cleaning roller R, the roller R receives the power of the driving source M3, the rectangular coating device 14 or Move any side of the slider 2〇 to the other side 13 200804992
移動，並藉由親輪R 光阻劑w。 、卜桎面的接觸力除去異物或殘餘的 所u輥輪R在所述彳 的喷出口 N的端邱 一 可與所述塗覆裝置14 且位於如圖十所述移動滑塊2G的接觸面F相接觸， 所不的固定滑塊26上部。 送用氣壓缸U的^動精而^安裝在所述作業平台2上的移 清洗所《覆從岐"R處於可 衣置W或移動滑塊2〇的位置上。 而且’在所述固定普 勳嬙μ m 鬼26上，所述清洗輥輪H盥電 動機M3的軸相連接， ，、电 ..^ 接並猎由所述電動機M3的驅動，以 軸心爲中心進行旋轉。 ’勒以 b ffi H _十三所示’當所述清洗輥 定滑塊26移動時，名张、+、、主* ' 丨思所迹固 F ^ ^ 斤述，月洗輥輪R的外柱面與所述塗 覆衣置…出口 _部或移動滑塊2〇的接 的狀態下’錢轉方式進行清洗。 _ 〃這種結構在被由清洗輥輪R進行清洗作業時，可 釦轉力擦洗被清洗面，從而增加清洗效率。 曰 上述利用清洗輥輪R來清洗所述塗敷裝置14或移 滑塊20的結構僅作爲本發明的一個實施例而被表示在 兔明的说明書及附圖中，但本發明並不限於此。 、 例如，如圖十四及圖十五所示，可使用具有其大小η 容納所述塗敷裝置14的喷出口 Ν或所述移動滑塊2〇接= 面F的清洗面28，且在所述清洗面28上設置形成有〜 噴孔30的清洗頭Η。 右干 14 200804992 斤述右輪輪噴孔3〇與可藉由喷射清洗液或幹燥空 /月洗所述噴出口]^或接觸面的傳統裝置相連接。/、 如上所述，當利用聯機方式移動基板G來 W的塗敷作業時，若 在作業面4上安裝有由所述清洗輥輪 R 3 頭成的清洗裝置24與所述塗敷作業相配合， 月匕夠fi便進仃所述塗敷裝置14和移動滑& μ的清洗作 業0 【圖式簡單說明】 。係為本务明實施例所涉及的聯機式塗敷裝置整體 結構示意圖。 圖二係為圖一中輸送裝置的結構示意圖。 圖二係為本發明實施例所涉及的聯機式塗敷裝置中基 板定位裝置的結構示意圖。 t " 圖四係為用於說明圖三中具體結構及作用的示意圖。 圖五係為圖一所示塗敷裝置的結構放大圖。 圖/、表不圖五所示塗敷裝置的作用。 圖七表示光阻劑塗敷作業較佳實施例。 圖八係為圖一所示噴出調整裝置的結構放大圖。 圖九表示圖八所示噴出調整裝置的作用。 圖十表示在基板上形成光阻劑的不良塗層。 圖十一係為本發明實施例所涉及的聯機式塗敷襄置中 清洗裝置的結構示意圖。 圖十二及圖十三表示圖十一所示清洗裝置的作用。 圖十四及圖十五表示圖十一所示裝置的另一實施例。 15 200804992Move and pass the parent-wheel R photoresist w. Contact force of the dice face to remove foreign matter or residual rubbing roller R at the end of the discharge port N of the crucible can be in contact with the coating device 14 and at the moving slider 2G as shown in FIG. The surface F is in contact with each other, and the upper portion of the slider 26 is fixed. The pneumatic cylinder U is supplied with a moving cleaning device mounted on the work platform 2, and the cover is placed at the position where the garment is placed or the slider 2 is moved. Moreover, on the fixed Phonson μm ghost 26, the shaft of the cleaning roller H盥 motor M3 is connected, and the electric motor is connected and driven by the motor M3, with the axis being The center rotates. 'Lee b ffi H _13' when the cleaning roller fixed slider 26 moves, the name Zhang, +,, the main * ' 丨 所 所 F F F , , , , , 月 月 月 月 月 月The outer cylinder surface is cleaned by the money transfer mode in a state in which the outer surface of the coating garment is connected to the outlet portion or the movable slider 2 is attached. _ 〃 This structure can be used to scrub the surface to be cleaned when it is being cleaned by the cleaning roller R, thereby increasing the cleaning efficiency. The above-described structure for cleaning the coating device 14 or the slide slider 20 by the cleaning roller R is only shown as an embodiment of the present invention in the specification and drawings of the present invention, but the present invention is not limited thereto. this. For example, as shown in FIG. 14 and FIG. 15, a cleaning surface 28 having a size η for accommodating the discharge port of the coating device 14 or the moving slider 2 = = face F may be used, and The cleaning surface 28 is provided with a cleaning head 形成 having a through-hole 30 formed therein. Right trunk 14 200804992 The right wheel nozzle orifice 3 is connected to a conventional device which can be sprayed with a cleaning solution or a dry air/month wash nozzle. / As described above, when the substrate G is moved by the on-line method, the cleaning device 24 formed by the cleaning roller R 3 is attached to the working surface 4 and the coating operation is performed. Cooperate, the moon is enough to enter the coating device 14 and the moving slide & μ cleaning operation 0 [simple description]. The overall structure of the in-line coating apparatus according to the present embodiment is shown. Figure 2 is a schematic view showing the structure of the conveying device of Figure 1. Fig. 2 is a schematic view showing the structure of a substrate positioning device in an in-line coating apparatus according to an embodiment of the present invention. t " Figure 4 is a schematic diagram for explaining the specific structure and function of Figure 3. Figure 5 is an enlarged view of the structure of the coating apparatus shown in Figure 1. Figure /, the role of the coating device shown in Figure 5. Figure 7 shows a preferred embodiment of the photoresist application operation. Fig. 8 is an enlarged view showing the structure of the discharge adjusting device shown in Fig. 1. Fig. 9 shows the action of the discharge adjusting device shown in Fig. 8. Figure 10 shows a poor coating of a photoresist formed on a substrate. Figure 11 is a schematic view showing the structure of a cleaning device in an in-line coating device according to an embodiment of the present invention. Figures 12 and 13 show the function of the cleaning device shown in Figure 11. Figures 14 and 15 show another embodiment of the apparatus shown in Figure 11. 15 200804992
【主要元件符號說明】 2 ： 作業平台 C ·· 真空吸盤 4 ·· 作業面 G ： 基板 6 ： 懸浮台 N ： 喷出口 8 ： 輸送裝置 R ： 輥輪 10 ： 移動體 T ·· 儲存槽 12 ： 位置調整裝置 F : 接觸面 14 ： 塗敷裝置 W ： 光阻劑 16 ： 機架 Q · 間距 18 ： 喷出調整裝置 Η ： 清洗頭 20 ： 移動滑塊 L1 :移送用氣 壓 缸 22 ： 支撐用托架 L2 :移送用氣 壓 缸 24 ： 清洗裝置 L3 :移送用氣 壓 缸 26 ： 固定滑塊 L4 :移送用氣 壓 缸 28 ·· 清洗面 Ml :驅動源 30 ·· 噴孔 M2 :驅動源 P1 ： 導銷 M3 :驅動源 P2 ： 推壓板 16[Description of main component symbols] 2 : Work platform C ·· Vacuum chuck 4 ··Working surface G : Substrate 6 : Floating table N : Outlet port 8 : Conveying device R : Roller 10 : Moving body T ·· Storage tank 12 : Position adjustment device F : Contact surface 14 : Coating device W : Photoresist 16 : Rack Q · Pitch 18 : Discharge adjustment device Η : Cleaning head 20 : Moving slider L1 : Transfer pneumatic cylinder 22 : Supporting support R2: Transfer pneumatic cylinder 24: Cleaning device L3: Transfer pneumatic cylinder 26: Fixed slider L4: Transfer pneumatic cylinder 28 ·· Cleaning surface M1: Drive source 30 ·· Injection hole M2: Drive source P1 : Guide pin M3: drive source P2: push plate 16