TW200819700A - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
TW200819700A
TW200819700A TW095138816A TW95138816A TW200819700A TW 200819700 A TW200819700 A TW 200819700A TW 095138816 A TW095138816 A TW 095138816A TW 95138816 A TW95138816 A TW 95138816A TW 200819700 A TW200819700 A TW 200819700A
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TW
Taiwan
Prior art keywords
heat
fin
heat dissipation
fins
dissipating device
Prior art date
Application number
TW095138816A
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Chinese (zh)
Other versions
TWI308954B (en
Inventor
Cheng-Tien Lai
Wei-Le Wu
Cui-Jun Lu
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Foxconn Tech Co Ltd
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Priority to TW095138816A priority Critical patent/TWI308954B/en
Publication of TW200819700A publication Critical patent/TW200819700A/en
Application granted granted Critical
Publication of TWI308954B publication Critical patent/TWI308954B/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device is used for dissipating heat generated by an electronic device. The heat dissipation device includes a heat conducting column and a plurality of fins surrounding the column. The fins include a plurality of first fins and a plurality of second fins respectively radially extending from a circumferential face of the column. The first and second fins are curved along two counter-directions. Therefore, airflow passing through the first and second fins gives strong turbulence between the fins, and fully exchanges heat with the first and second fins. Thus, heat dissipation capacity of the heat dissipation device is improved.

Description

200819700 九、發明說明： •【發明所屬之技術領域】 ‘本發明涉及一種散熱裝置，尤其涉及 件之散熱裝置。 卞70 【先前技術】 電子元件如中央處理器等在運行過程中產生大量 …，為確保電子元件之正常運行，其產生之熱需及時地 發出去。通常’該電子元件上加裝—散熱襄置。 而出!=::5包括一金屬底板及從該底板向上延伸 該緒片提供強:二1該專韓片之頂端還加裝一風扇以向 -片如供強對。使用時，該底板貼置於 元件而吸收其產生之熱量，進而將熱量 散發到周圍空間。隨著電子產業之發展，電子元二二: 提升’其發熱量亦隨之增加。上述散熱裝 :要較大之政熱面積以滿足電子元件之散熱需求。铁而 在電子糸統日益集成化和小型化之趨勢下，上述散埶裝置 之，積增加有限。因此’另外一種散熱裝置應用電子^件 之散熱’請參閱圖1，該散熱裝置包括一中心柱體卜 該柱體1結合之散熱體3。該散熱體3之外周面H射延伸出= 2片4’相鄰韓片4間形成複數氣流通道。—風以通過一 風扇固定件7固定至該料片4之頂端。其中，該等複數鮮 片4沿順時針方向彎曲，該風扇6可沿逆時針方 曰 作時’該散熱襄置通過-扣件5將柱體以底部貼合至電: 200819700 元件上，電子元件產生之熱通過柱體i吸收進而到達該等鰭 .片4,該風扇6向該等鰭片4提供強對流氣流而加速該等鰭片 _ 4上之熱量散發至周圍空間。然而，在該散熱裝置散熱體3 之下部，由於氣流流速降低，加之，氣流之紊流度降低， 則其與該等鰭片4之熱交換率下降，其散熱性能有待進一步 提升。 【發明内容】 > 本發明旨在提供一種散熱性能好之散熱裝置。 一種散熱裝置用於電子元件散熱，其包括一導熱柱及 圍繞該導熱柱設置冬複數散熱鰭片，所述該等鰭片包括分 別圍繞該導熱柱周圍呈放射狀延伸之複數第一散熱鰭片及 複數第二散熱鰭片，該等第一散熱鰭片和該等第二散熱鰭 片之彎曲方向相反。 與習知技術相比，上述第一、二鰭片對應彎曲設置， 從而使工作中通過該第一、二散熱鰭片之氣流在其間產生 1強紊流而與該第一、二散熱鰭片進行充分熱交換，從而第 一、二鰭片上之熱量充分之散發出去，該散熱裝置之散熱 性能得以提升。 【實施方式】 請參閱圖2,本發明散熱裝置包括一散熱器（未標示）、 一與該散熱器結合以將該散熱裝置固定至發熱電子元件之 扣具30、一風扇60通過一固定架70固定至散熱器之頂部。 上述散熱器包括一導熱導熱柱11及圍繞該導熱柱11之 7 200819700 第一、二鰭片組13、15。 * 上述導熱柱11由銅等導熱性能良好之金屬製成，其包 .括一直徑較大之吸熱部111及從該吸熱部111一體向上延伸 之直徑較小之傳熱部113。 上述第一鰭片組13通過鋁擠一體成型，其包括一圓柱 形第一套筒131及從該第一套筒131外周面向外呈放射狀延 伸之複數第一鰭片133。該第一套筒131圍繞一第一穿孔 _ 1311，以收容上述導熱柱11之傳熱部113。該複數第一鰭片 131沿該第一套筒131之周向逆時針彎曲。每一第一鰭片133 包括一從該第一套筒131延伸出之主體部1331及從該柱體 1331末端向外分叉延伸之二分叉部1333。該二分叉部1333 大致形成於每一第一鰭片133整體長度之一半處。該複數第 一鰭片133之分叉部1333之末端位於同一圓周面上。每一第 一鰭片133具有一弧形凹面及與該凹面相對之弧形凸面。相 鄰第一鰭片133及相鄰分叉部1333之間形成供氣流流通之 第一通道（未標示）。 上述第二鰭片組15具有與上述第一鰭片組13相似之結 構，其包括複數設有第二穿孔1511之第二套筒151及從該第 二套筒151外周面向外呈放射狀延伸之複數第二鰭片153。 該複數第二鰭片153沿該第二套筒151之周向順時針彎曲。 每一第二鰭片153包括從第二套筒151外周面延伸之主體部 1531及從該主體部1531末端進一步向外分叉延伸之二分叉 部1533。該複數第二鰭片153之分叉部1533之末端位於同一 圓周面上。相鄰主體部1531及相鄰分叉部1533之間形成供 8 200819700 氣流流通之第二通道（未標示）。該第二鰭片153和第一鰭 、片133之彎曲弧度相同。 , 上述扣具30包括一大致呈四邊形之扣板31及從該扣板 31四角向外延伸之四扣腳33。該扣板31之中心設有一開口 311，以收容上述導熱柱11之傳熱部113。該開口 311之直徑 小於上述導熱柱11吸熱部111之直徑，但略大於或相當於該 傳熱部113之直徑。每一扣腳33之近末端處設有一螺孔331 φ以容置一固定件如螺釘（圖未示）等，而將該散熱裝置固 定至電子元件所在之電路板（圖未示）上。該固定腳33之 底部對應該螺孔331向下延伸一襯套333以導引固定件之鎖 固。 請參閱圖3和圖4，上述導熱柱11之傳熱部113依次穿過 扣具30之開口311、第一、二套筒131、151之第一、第二穿 孔1311、1511，從而該傳熱部113通過過盈配合與該第一、 二套筒131、151結合。該導熱柱11之吸熱部111從該扣板31 _開口 311凸出，該扣板31夾置於該第一鰭片組13和導熱柱11 之吸熱部111之間。該第二鰭片組15位於該第一鰭片組13 上，其中該第一鰭片組13之第一鰭片133沿逆時針方向延 伸，第二鰭片組15之第二鰭片153沿順時針方向延伸。該第 一、二鰭片組13、15之第一、二通道相通。該扣具30之四 扣腳33伸出於第一、二鰭片組13、15端緣之外。 請參閱圖2-5，上述風扇60呈圓形，其通過上述固定架 70固定至上述第二鰭片組15上。該固定架70包括一環形部 710及從該環形部710外周面之上周緣向外延伸之複數固定 200819700 部730。該複數固定部730均勻分佈於該環形部710之上周 i緣。該環形部710環繞固定至該第二鰭片組15之上部外周 _緣，該風扇60固定至該複數固定部730上，從而該風扇60對 應於該第一、二鰭片組13、15之第一、二通道而固定至該 第二鰭片組15之上部。 使用時，上述該散熱裝置通過扣具30固定至電路板 上，散熱器導熱柱11之吸熱部111貼合至該電子元件而吸收 _電子元件產生之熱量，該熱量通過該導熱柱11之傳熱部113 傳遞至第一、二鰭片組13、15。風扇60向該第一、二鰭片 組13、15提供強對流氣流，該氣流通過第一、二鰭片組13、 15之第一、二通道而將第一、二鰭片133、153上之熱量散 發至周圍空間。該實施例中，風扇60沿逆時針方向運轉， 其與第二鰭片組15之第二鰭片153之順時針彎曲方向相反。 與習知技術相比，上述散熱裝置之第一、二鰭片組13、 15之第一、二鰭片133、153反向彎曲，從而其間形成大致 ®呈“S”之氣流通道。上述風扇60提供之強對流氣流在該 “ S”之氣流通道内產生強紊流，而與該第一、二鰭片組 13、15之鰭片133、153進行充分熱交換，從而及時帶走第 一、二鰭片133、153上之熱量，該散熱裝置之散熱性能得 以提升。請參閱表1，其為本發明散熱裝置與習知技術圖1 中散熱裝置之對比實驗資料，其中Ta表該測試時之環境溫 度，Tc表被測試電子元件在加裝散熱裝置時之測試溫度，P 表被測試電子元件功率，字母A表圖1中習知技術之散熱裝 置，字母B表本發明散熱裝置，字母Μ、N分別表本發明散 10 200819700 熱裝置中第一鳍片細 P且，並^曰…、弟二鰭片組15。Θ表散熱裝置之埶 阻其為衡置散熱裝置散熱性能之指標，射c_Ta: θ-M7P，由此可知，當p、Ta均恒定時，θ值越小，ΔΤ值小， 說明電子元件運行時之Te值料，電子元件產生之熱被散 熱裝置及時地散發出去，則可知電子元件所用散熱裝置之 散熱性能較好，反之，電子元件所用散熱裝置之散熱性能 欠佳。 μ _200819700 IX. Description of the invention: • [Technical field to which the invention pertains] ‘ The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for a piece.卞70 [Prior Art] Electronic components such as a central processing unit generate a large amount of ... during operation. To ensure the normal operation of electronic components, the heat generated is required to be issued in a timely manner. Usually, the electronic component is mounted with a heat sink. And out!=::5 includes a metal bottom plate and extends upward from the bottom plate. The piece provides strong: 2: The top of the special Korean piece is also equipped with a fan to provide a strong pair of the film. In use, the bottom plate is placed on the component to absorb the heat generated by it, thereby dissipating heat to the surrounding space. With the development of the electronics industry, the electronic element 22: boosted its heat generation. The above heat dissipating device: a larger political area is required to meet the heat dissipation requirements of electronic components. Iron In the trend of increasing integration and miniaturization of electronic systems, the increase in the volume of the above-mentioned dilation devices is limited. Therefore, the heat dissipation device of the other heat dissipating device is referred to as Fig. 1. The heat dissipating device includes a central cylinder and a heat dissipating body 3 combined with the cylinder 1. The outer peripheral surface of the heat radiating body 3 is extended by a projection of two sheets of 4' adjacent Korean sheets 4 to form a plurality of airflow passages. The wind is fixed to the top end of the web 4 by a fan fixing member 7. Wherein, the plurality of fresh chips 4 are bent in a clockwise direction, and the fan 6 can be attached to the bottom of the cylinder through the counter-clockwise device as the heat-dissipating device: 200819700 The heat generated by the element is absorbed by the cylinder i to reach the fins 4. The fan 6 provides a strong convective flow to the fins 4 to accelerate the dissipation of heat from the fins 4 to the surrounding space. However, in the lower portion of the heat dissipating body heat sink 3, since the air flow rate is lowered, and the turbulence of the air flow is lowered, the heat exchange rate with the fins 4 is lowered, and the heat dissipation performance needs to be further improved. SUMMARY OF THE INVENTION The present invention is directed to a heat sink having good heat dissipation performance. A heat dissipating device is used for dissipating heat of an electronic component, comprising a heat conducting column and a plurality of winter heat dissipating fins disposed around the heat conducting column, wherein the fins comprise a plurality of first heat dissipating fins extending radially around the heat conducting column And a plurality of second heat dissipation fins, wherein the first heat dissipation fins and the second heat dissipation fins have opposite bending directions. Compared with the prior art, the first and second fins are correspondingly curved, so that the airflow passing through the first and second heat dissipation fins during operation generates a strong turbulence therebetween and the first and second heat dissipation fins. The heat exchange is performed sufficiently, so that the heat on the first and second fins is sufficiently radiated, and the heat dissipation performance of the heat sink is improved. [Embodiment] Referring to Figure 2, the heat sink of the present invention includes a heat sink (not shown), a clip 30 coupled to the heat sink to fix the heat sink to the heat-generating electronic component, and a fan 60 through a holder 70 is fixed to the top of the radiator. The heat sink comprises a heat conducting and heat conducting column 11 and a first and second fin set 13 and 15 surrounding the heat conducting column 11 . * The heat transfer column 11 is made of a metal having good thermal conductivity such as copper, and includes a heat absorbing portion 111 having a large diameter and a heat transfer portion 113 having a small diameter extending integrally from the heat absorbing portion 111. The first fin group 13 is integrally molded by aluminum extrusion, and includes a cylindrical first sleeve 131 and a plurality of first fins 133 extending radially outward from the outer circumference of the first sleeve 131. The first sleeve 131 surrounds a first through hole _ 1311 to receive the heat transfer portion 113 of the heat conducting column 11 . The plurality of first fins 131 are bent counterclockwise along the circumference of the first sleeve 131. Each of the first fins 133 includes a main body portion 1331 extending from the first sleeve 131 and a bifurcation portion 1333 extending outwardly from the end of the cylindrical body 1331. The bifurcation portion 1333 is formed substantially at one half of the entire length of each of the first fins 133. The ends of the bifurcations 1333 of the plurality of first fins 133 are located on the same circumferential surface. Each of the first fins 133 has an arcuate concave surface and an arcuate convex surface opposite the concave surface. A first passage (not labeled) for airflow is formed between the adjacent first fin 133 and the adjacent branching portion 1333. The second fin set 15 has a structure similar to that of the first fin set 13 , and includes a second sleeve 151 provided with a plurality of second through holes 1511 and radially extending from the outer circumferential surface of the second sleeve 151 . The plurality of second fins 153. The plurality of second fins 153 are bent clockwise along the circumference of the second sleeve 151. Each of the second fins 153 includes a main body portion 1531 extending from the outer peripheral surface of the second sleeve 151 and a bifurcated portion 1533 extending further outward from the end of the main body portion 1531. The ends of the bifurcations 1533 of the plurality of second fins 153 are located on the same circumferential surface. A second passage (not labeled) for circulating airflow of 8 200819700 is formed between the adjacent main body portion 1531 and the adjacent branch portion 1533. The second fin 153 and the first fin and the sheet 133 have the same curvature. The buckle 30 includes a substantially quadrangular gusset 31 and four fastening legs 33 extending outward from the four corners of the gusset 31. An opening 311 is defined in the center of the gusset 31 to receive the heat transfer portion 113 of the heat conducting column 11. The diameter of the opening 311 is smaller than the diameter of the heat absorbing portion 111 of the heat conducting column 11, but slightly larger than or equal to the diameter of the heat transfer portion 113. A screw hole 331 φ is disposed at a proximal end of each of the fastening pins 33 to receive a fixing member such as a screw (not shown), and the heat sink is fixed to a circuit board (not shown) on which the electronic component is located. The bottom of the fixing leg 33 has a bushing 333 extending downwardly corresponding to the screw hole 331 to guide the fixing of the fixing member. Referring to FIG. 3 and FIG. 4, the heat transfer portion 113 of the heat conducting column 11 sequentially passes through the opening 311 of the clip 30, the first and second through holes 1311, 1511 of the first and second sleeves 131, 151, so that the heat transfer portion 113 The hot portion 113 is coupled to the first and second sleeves 131, 151 by an interference fit. The heat absorbing portion 111 of the heat conducting column 11 protrudes from the gusset 31_opening 311, and the gusset 31 is interposed between the first fin group 13 and the heat absorbing portion 111 of the heat conducting column 11. The second fin set 15 is located on the first fin set 13 , wherein the first fin 133 of the first fin set 13 extends in a counterclockwise direction, and the second fin 153 of the second fin set 15 along the second fin set 153 Extend clockwise. The first and second channels of the first and second fin sets 13, 15 are in communication. The four buckles 33 of the clip 30 extend beyond the end edges of the first and second fin sets 13, 15. Referring to Figures 2-5, the fan 60 has a circular shape and is fixed to the second fin set 15 by the fixing bracket 70. The mounting bracket 70 includes an annular portion 710 and a plurality of fixed 200819700 portions 730 extending outwardly from a peripheral edge of the outer peripheral surface of the annular portion 710. The plurality of fixing portions 730 are evenly distributed on the upper edge of the annular portion 710. The annular portion 710 is circumferentially fixed to the outer periphery of the second fin set 15 , and the fan 60 is fixed to the plurality of fixing portions 730 , so that the fan 60 corresponds to the first and second fin sets 13 and 15 . The first and second channels are fixed to the upper portion of the second fin set 15. In use, the heat dissipating device is fixed to the circuit board by the clip 30, and the heat absorbing portion 111 of the heat conducting column 11 of the heat sink is attached to the electronic component to absorb heat generated by the electronic component, and the heat is transmitted through the heat conducting column 11 The hot portion 113 is transferred to the first and second fin groups 13, 15. The fan 60 provides a strong convective airflow to the first and second fin sets 13 and 15, and the airflow passes through the first and second channels of the first and second fin sets 13, 15 to the first and second fins 133 and 153. The heat is dissipated to the surrounding space. In this embodiment, the fan 60 operates in a counterclockwise direction that is opposite to the clockwise direction of the second fin 153 of the second fin set 15. Compared with the prior art, the first and second fins 133 and 153 of the first and second fin sets 13 and 15 of the heat dissipating device are reversely bent to form a gas flow passage of substantially "S" therebetween. The strong convection current provided by the fan 60 generates strong turbulence in the air passage of the "S", and is fully exchanged with the fins 133, 153 of the first and second fin sets 13, 15 to take away in time. The heat dissipation of the first and second fins 133 and 153 improves the heat dissipation performance of the heat sink. Please refer to Table 1, which is a comparative experimental data of the heat dissipating device of the present invention and the heat dissipating device of the prior art in FIG. 1, wherein the Ta table is the ambient temperature during the test, and the Tc is the test temperature of the tested electronic component when the heat dissipating device is installed. , P table is tested electronic component power, letter A is shown in Fig. 1 of the heat sink of the prior art, letter B is the heat sink of the present invention, the letter Μ, N respectively, the present invention is scattered 10 200819700 The first fin of the thermal device is fine P And, ^ 曰 ..., the second fin set 15 . Θ 散热 散热 散热 散热 散热 散热 散热 散热 c c c c c c c c c c c θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ θ At the time of the Te value, the heat generated by the electronic component is dissipated by the heat dissipating device in time, and it is known that the heat dissipating device used in the electronic component has better heat dissipation performance, and conversely, the heat dissipating device used in the electronic component has poor heat dissipation performance. μ _

試樣 所用風扇 Ρ 1¾度 (mm) Ta(°C) Θ ( °C /watt) 轉速 _(rpm) (watt) Μ N TcfC) ΔΤ(°〇 34.3 61.6 273 0.2707 A 40 32.5 60.2 27.7 0.2746 34.8 62.6 27.8 0.2756 32.3 60.1 27.8 0.2756 32.8 58.9 26.1 0.2588 20 20 32.7 59.0 26.3 0.2608 33.4 59.9 26.5 0.2627 Λ Γ\Γ\ί\ 1 ΠΠ 9.f\ 32.1 58.1 26.0 0.2578 4U〇u ΐυυ.οο 32.8 59.4 26.6 0.2637 B 15 25 32.4 58.2 25.8 0.2558 33.3 59.4 26.1 0.2588 32.7 58.7 26.0 0.2578 32.1 58.9 26.8 0.2657 25 15 32.1 58.2 26.1 0.2588 30.3 57 26.7 0.2647 32.4 59.2 26.8 0.2657 由上述實驗資料可知，本發明散熱裴置之熱阻Θ明顯小 11 200819700 於習知技術中散熱裝置之熱阻，故本發明散熱裝置 、性能優於習知技術中散熱裝置。 …、 綜上所述，本發明符合發明專利要件，麦依法提 以上該者僅為本發明之較佳實施例，舉凡孰 …士 ’在爰依本發明精神所作之等效修飾或 【圖式簡單說明】 變匕，皆應涵蓋於以下之申請專利範圍内。 一 mFan used for the sample Ρ 13⁄4 degrees (mm) Ta (°C) Θ ( °C / watt) Speed _ (rpm) (watt) Μ N TcfC) ΔΤ (°〇34.3 61.6 273 0.2707 A 40 32.5 60.2 27.7 0.2746 34.8 62.6 27.8 0.2756 32.3 60.1 27.8 0.2756 32.8 58.9 26.1 0.2588 20 20 32.7 59.0 26.3 0.2608 33.4 59.9 26.5 0.2627 Λ Γ\Γ\ί\ 1 ΠΠ 9.f\ 32.1 58.1 26.0 0.2578 4U〇u ΐυυ.οο 32.8 59.4 26.6 0.2637 B 15 25 32.4 58.2 25.8 0.2558 33.3 59.4 26.1 0.2588 32.7 58.7 26.0 0.2578 32.1 58.9 26.8 0.2657 25 15 32.1 58.2 26.1 0.2588 30.3 57 26.7 0.2647 32.4 59.2 26.8 0.2657 It can be seen from the above experimental data that the thermal resistance of the heat dissipating device of the present invention is significantly small 11 200819700 The heat dissipation device of the present invention is superior to the heat dissipation device of the prior art in the prior art. The preferred embodiment of the present invention is equivalent to the equivalent modification of the spirit of the present invention. Single explanation] All changes should be covered in the following patent application.

圖1係習知技術中一散熱裝置之立體圖。 圖2係本發明散熱裝置之立體分解圖。 圖3係本發明散熱裝置部分元件之組裝圖。 圖4係圖3之俯視圖。 圖5係本發明散熱裝置之組裝圖 【主要元件符號說明】 導熱柱 11 吸熱部 傳熱部 113 第一鰭片組 第一套筒 131 第一穿孔 第一鰭片 133 主體部 分又部 1333 、 1533 第二鰭片組 第二穿孔 1511 第二鰭片 扣具 30 扣板 開 311 扣腳 螺孔 331 襯套 風扇 60 固定架 111 13 1311 1331、1531 15 153 31 33 333 12 70 200819700 730 環形部 710 固定部1 is a perspective view of a heat sink in the prior art. 2 is an exploded perspective view of the heat sink of the present invention. Figure 3 is an assembled view of some of the components of the heat sink of the present invention. Figure 4 is a plan view of Figure 3. Figure 5 is an assembly diagram of the heat sink of the present invention. [Main component symbol description] Heat transfer column 11 Heat sink heat transfer portion 113 First fin set First sleeve 131 First through hole First fin 133 Main body portion Further 1333, 1533 Second fin set second perforation 1511 second fin clip 30 gusset opening 311 fastening screw hole 331 bushing fan 60 fixing frame 111 13 1311 1331, 1531 15 153 31 33 333 12 70 200819700 730 ring portion 710 fixed unit

1313

Claims (1)

200819700 十、申請專利範圍： L :種散熱裝置’包括-導熱柱及圍繞該導熱柱設置之複 數散熱w，其改良在t該散減#包括分別圍繞該 =熱柱周圍呈放射狀延伸之複數第一散熱鰭片及複數 第一散熱鰭片’該第一散熱鰭片和第二散熱鰭片之彎曲 方向相反。 m % 2. 如申料難圍第1項所狀散熱裝置，其巾該第一散 "’、-、、曰片第一散熱鰭片沿該導熱柱之長度方向排佈。 3. 如申請專利範圍第2項所述之散熱裝置，其中該第一散 熱鰭片沿該導熱柱周向呈逆時針方向彎曲，該第二散熱 鰭片沿該導熱柱周向呈順時針方向彎曲。 …、 如申明專利範圍第3項所述之散熱裝置，其中該第一及 第一政熱韓片之彎曲弧度相同。 5·如申請專·圍第3項所述之散熱裝置，其中該散熱褒 f包=套設在該導熱柱外周面之第一及第二套筒，該第 及第一散熱鰭片分別自該第一及第二套筒之外 向外延伸而出。 6·=請專利範圍第5項所述之散熱裝置，其中該導熱柱 二^有圍徑增大且凸伸出該第一或第二散熱鰭片之 如申β專利範圍第5項所述之散熱裝置，其中該第一散 = 片包括從該第一套筒外周面延伸之主體部及從該 體°卩末端進一步向外延伸之二分叉部。 14 200819700 δ.如申請專利範圍第7項所述之散熱裝置，其中該分又部 之末端位於同一圓周面上。 9·如申請專利範圍第5項所述之散熱裝置，其中該第二散 熱.鳍片包括從該第二套筒外周面延伸之主體部及從該 主體部末端進一步向外延伸之二分叉部。 10·如申請專利範圍第9項所述之散熱裝置，其中該分叉部 之末端位於同一圓周面上。 霸u·如申請專利範圍第1-10項中任-項所述之散熱農置，其 中該弟及弟一散熱鰭片間分別形成複數第一及第二 氣流通道，該散熱裝置還包括一以向該第一及第二氣Z 通道提供對流氣流之風扇，該風扇位於該第一、二埶 鰭片之一端。 ” 12♦如申請專利範圍第n項所述之散熱裝置，其中該風扇通 過—固定架固定至該第二散熱鰭片上。 • 13.如申請專利範圍g 12項所述之散熱裝置，其中該固定架 包括一環繞該第二散熱鰭片週邊之環形部及從該環形 部延伸之複數固定該風扇之支撐部。 ’ 15200819700 X. Patent application scope: L: The kind of heat dissipating device 'includes-heat-conducting column and a plurality of heat-dissipating heat w disposed around the heat-conducting column, and the improvement thereof is in the above-mentioned heat-reducing The first heat dissipation fin and the plurality of first heat dissipation fins 'the first heat dissipation fin and the second heat dissipation fin have opposite bending directions. m % 2. If the heat sink of the first item is not covered, the first heat sink fin of the first strip is arranged along the length of the heat conducting column. 3. The heat dissipation device of claim 2, wherein the first heat dissipation fin is curved in a counterclockwise direction along a circumferential direction of the heat conduction column, and the second heat dissipation fin is clockwise along a circumferential direction of the heat conduction column. bending. The heat dissipating device of claim 3, wherein the first and first political hot Korean films have the same curvature. 5. The heat dissipation device according to Item 3, wherein the heat dissipation package includes the first and second sleeves disposed on the outer circumferential surface of the heat conduction column, and the first and first heat dissipation fins are respectively The first and second sleeves extend outwardly from the outside. The heat dissipating device of the fifth aspect of the invention, wherein the heat-conducting column has a larger diameter and protrudes from the first or second heat-dissipating fin, as described in item 5 of the patent application scope of claim β. The heat dissipating device, wherein the first diffuser comprises a main body portion extending from an outer peripheral surface of the first sleeve and a bifurcated portion extending further outward from the end of the body. The heat dissipating device of claim 7, wherein the ends of the sub-parts are on the same circumferential surface. The heat dissipating device of claim 5, wherein the second heat dissipating fin comprises a main body portion extending from an outer peripheral surface of the second sleeve and a bifurcation extending further outward from an end of the main body portion. unit. 10. The heat sink according to claim 9, wherein the ends of the branch portions are on the same circumferential surface. The heat-dissipating agricultural device according to any one of the items 1-10 of the patent application, wherein the first and second air flow passages are respectively formed between the cooling fin and the heat sink fin, and the heat dissipating device further comprises a A fan for providing convective airflow to the first and second gas Z passages, the fan being located at one end of the first and second fins. The heat dissipating device of claim n, wherein the fan is fixed to the second heat dissipating fin by a fixing bracket. The fixing frame includes an annular portion surrounding the periphery of the second heat dissipating fin and a plurality of supporting portions extending from the annular portion to fix the fan.
TW095138816A 2006-10-20 2006-10-20 Heat dissipation device TWI308954B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106659059A (en) * 2016-09-11 2017-05-10 奇鋐科技股份有限公司 Fin structure of heat sink
EP2567174A4 (en) * 2010-05-04 2017-09-27 Alexander Poltorak Fractal heat transfer device
CN107634038A (en) * 2017-10-25 2018-01-26 东莞永腾电子制品有限公司 One kind intersects high wind-guiding fin set radiator

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2567174A4 (en) * 2010-05-04 2017-09-27 Alexander Poltorak Fractal heat transfer device
CN106659059A (en) * 2016-09-11 2017-05-10 奇鋐科技股份有限公司 Fin structure of heat sink
CN106659059B (en) * 2016-09-11 2023-04-07 奇鋐科技股份有限公司 Fin structure of heat sink
CN107634038A (en) * 2017-10-25 2018-01-26 东莞永腾电子制品有限公司 One kind intersects high wind-guiding fin set radiator
CN107634038B (en) * 2017-10-25 2024-05-24 东莞永腾电子制品有限公司 Cross high wind-guiding fin group radiator

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