200819921 •九、發明說明： •【發明所屬之技術領域】 本發明係關於印刷配線基板用的曝光裝置。 【先前技術】 印刷配線基板於近年來係使用曝光裝置進行製造，係 採用：於塗佈有光阻劑等感光材料的基板表面以該曝光裝 置感光曝印預定之圖案，孓後藉由蝕刻步驟而於基板上形 成圖案的所謂光微影法。 _ 於該曝光裝置中，主要係採用描繪有圖案原圖的樹脂 膜遮罩作為原版，該膜遮罩一般係被保持於玻璃製的遮罩 2持具而進行使用。此外為了提高該膜遮罩與基板間的密 著性，多採用將兩者間抽為真空而使其密著的所謂真空密 著方法。 該真空密著方式雖於當基板表面平坦時有效，但若基 板表面存有凹凸或扭曲時，則有遮罩無法追隨基板而形成 馨裝著不良的情形。 因此，係提案有於真空密著後將膜遮罩與遮罩保持具 之間進行大氣開放’以使膜遮罩追隨於基板的嘗試（專利文 獻1 )，以及於真空密著前預先於膜遮罩之背面側導入空氣 而予以加壓的方法（專利文獻2)等。 ’ (專利文獻1)日本國特開平5_333555號公報 (專利文獻2)日本國特開平8_5〇357號公報 【發明内容】 (發明所欲解決之绿題） 319515 5 200819921 ，/但是，在專利文獻ϊ之將膜遮罩與遮罩保持件之間進 •行大氣開放之方法的情形中，因壓力不足而存有無法獲得 充分的膜遮罩之密著的問題。此外，因僅能使用稱為= 塵的-定麼力，故存有難以藉由改變壓力而因應種種 獲得最佳密著性的問題。 另一方面，專利文獻2之於進行真空密著前事先在膜 遮罩之背面侧進行加壓而構成的情形中，則存有因加屋耗 費時間而導致使膜密著化的步驟變得長時間化的問題。此 ►外，也存有產生膜遮罩之拉伸等變形之可能性的問題。 本發明之目的即為解決前述習知技術之問題。 (解決課題的手段） 為了達成前述目的’本發明之曝光裝置係具有：曝 光台m置欲曝㈣基板；朗罩，描㈣應曝光於 欲曝光之基板的圖案；遮罩保持具，係於前述曝光台側之 面將該膜遮罩支持成，使膜逆置 嗓 优膜遮罩之周圍密著，且可將流體 導入該遮罩保持具與膜遮罩之間·無 y k ^ ^ 早疋間，動力裝置，使前述曝光 σ與遮罩保持具接近；密封|罟 对衷置，猎由前述接近而將前述 曝光台與遮罩保持具之間资钮，工^丄、 ⑴封而形成將前述基板與膜遮 罩予以收納的密閉空間；一次宓 丄β 人在者手段，將前述密閉空間 減壓，使前賴遮罩與基板—次性地密著；以及二次密著 手段’在由前料壓手朗進行的—切錢，以預定之 壓力將流體導入前述膜遮罩蛊前 、 早兴則述遮罩保持具之間，而使 前述膜遮罩與基板更加密著。 於前述構成中，由於係在 予在Μ —次密著手段使膜遮罩與 319515 6 200819921 、基板密著的狀態下以二次密著手段進行流體的導入，故流 ,體之導入量較少，而可大幅縮短導入時間。而且，由於係 在密著後的狀態下將膜遮罩進行加壓，故不易產生膜遮罩 之拉伸或變形等。 · 此外，藉由改變所導入的流體之預定壓力，可對應於 種種條件而獲得最佳的密著性。〜、 作為前述預定之壓力，將其設定為lkpa以上、2〇k卯 以下。此乃因若設為lkpa#下則無法得到充分的密著效 果，而若設為20kpa以上則有導致玻璃破損等危險。 此外，更佳為在2kpa以上、l〇kpa以下的範圍内進行 選擇。雖流體壓力可如前所述地因應種種條件而進行選 擇，但此乃因在2kpa以上、i〇kpa以下的範圍内得 良好的密著性。 又 20kpa以下之壓力保持為 此外，復具有將Ikpa以上 一定的調壓裝置為佳。 •(發明效果） 依據本發明之曝光裝置，由於可藉由改變所導入的流 體之廢力而因應條件將膜遮罩與基板之密著性最佳化，故 可進行高精度的曝光。此外，由於藉由流體之導入而進行 的密著也能以短時間進行故也可縮短曝光時間，並有不易 產生膜遮罩之拉伸或變形等的效果。 【實施方式】 以下係根據圖式對本發明 光衣置之貫施形態進行說明。 之製造印刷配線基板用的曝 319515 7 200819921 * 於第1圖中，已施有光阻劑的印刷配線用基板90係被 ’載置於曝光台1上。曝光台工係可於χγ*向移動，且也可 於上下方向升降。另外也可水平方向旋動。關於該等移動、 升降及旋動機構係省略其說明。 描繪有電路圖案的膜遮罩（film mask)2係與基板 相對向而設’並使該膜料2與基板9()密著，且藉由從光 源9的曝光而使電路圖案曝印在基板9〇。 於第1圖中雖將曝光台1與基板90配設於上下方向， 但並不限定於此，為相反亦可，又或著也可採用將曝光台 1與基板90垂直立起而進行配設的構造。 此外，不使基板90移動而使曝光台丨移動也可，更且， 構成為使兩者移動亦可。 膜遮罩2純保持於料保持具3之基板9()侧。遮罩 保持具3係構成為於中央部具有玻璃3()，而使來自光㈣ 的光穿透玻璃3G而將料在膜遮罩2的圖案曝印在基板 90上。 膜遮罩2係於其周圍的密著部20密著於遮罩保持件 3,且形成為可於膜遮罩2與遮罩保持件3(玻璃 入流體。 膜，罩2與遮罩保持件3係形成為可藉由加壓裝置5 ¥入預定壓力之空氣。且於前述密著部2()之内側開口有導 入孔5 2，該導入孔5 2係經由調壓震置5!而與氣體源5 〇 連接。藉由調壓裳置51，預定壓力之空氣即從導入孔52 導入至玻璃3〇與膜遮罩2之間。膜遮罩2係構成為：於密 319515 8 200819921 •著部20中密著於遮罩保持件3，其中心部侧成為密閉空 ,間’且藉由該被導入之空氣而朝基板90方向膨出，而形成 加壓空間25 〇 j 加壓裝置5係由控制裝置8所控制，其係構成為將預 定壓力之空氣導入至玻璃3〇與膜遮罩2之間，且維持該壓 力預定時間。 所導入的空氣之壓力，係如前所述地為j kpa以上 20kpa以下，較佳為在2kpa以上l〇kpa以下的範圍内進行 ⑩選擇。 其係構成為該壓力會被加壓裝置5維持至曝光終了為 止。 、、' ^於曝光台1之周圍係設有密封構件4，而構成為將曝 光台1與遮罩保持件3之間的空間設成密閉空間4〇。亦 P若使曝光σ 1於遮罩保持件3方向上升，則密封構件 4將與遮罩保持件3接觸，而將曝光台丨與遮罩保持件3 ⑩之間密封而形成密閉空間4〇。 ^於曝光台1係連接有減壓裝置6,減壓孔61係開口於 密閉^間40内。減壓孔61係連接至減壓泵6〇，且係構成 為可藉由減壓泵6〇之驅動而使密閉空間40減壓。減壓裝 置6也是由控制裝置8進行控制。 、 於以上構成中，將基板9〇載置於曝光台1上時，即將 曝光台1朝ΧΥ及0方向移動而進行基板9〇 位置對合。接著使曝光台1上升，且使密封構件= 保持具3接觸而形成密閉空間40,同時使膜遮罩2與基板 319515 9 200819921 • 90接觸，且控制減壓裝置6以驅動減壓泵6〇，雨將密閉空 ,間40減壓。藉由該減壓而進行膜遮罩2與基板9〇的j次 密著。 第3圖為示意性的表示丨次密著之狀態者。若於基板 90存有凹部91等，則僅藉由密閉空間4〇之減壓無法於凹 部91的部份中使膜遮罩2密著。 其次，使加壓裝置5運作，如第2圖所示，從導入孔 _ 52導入預定壓的空氣，於膜遮罩2與玻璃3〇之間形成加 疋二間2 5，且使膜遮罩2與基板9 〇更加密著。此即為2 次密著。第4圖係示意性的表示2次密著之狀態，即使於 凹部91，膜遮罩2也追隨之而密著。 口猎由1 -人岔著，膜遮罩2與基板9 〇已為經密著之狀 悲的緣故，故從導入孔52之空氣導入量為極少量即可，而 可以藉由短時間結束其導入。此外，因膜遮罩2為已密著 之狀L故由加壓所致的膨出量微小，且加壓空間2 $之容 _積也微小。因此不會有因膜遮罩2之膨脹所致之變形等弊 害。 控制裝置8係控制調壓裝置51而維持加壓空間託之 壓力’且維持膜遮罩2之密著狀態。 又，因應基板90之表面狀態等種種條件而控制調壓裝 ，51即可调整所導入的空氣之壓力，而可實現因應條件之 最佳的2次密著。 於第2圖之狀態下’藉由從光源9而來的光進行曝光， 使加壓|置5與減壓裝置6之驅動停止，且使曝光台工下 319515 10 200819921 •降且取出基板90，送入次一製程，並結束曝光。 ， 於第5圖示有其他實施形態。於該實施形態中，係使 用了加壓膜7 ’將加壓膜7在密著部2〇予以貼著於遮罩保 持件3，而形成將膜遮罩2裝著於加壓膜7上的構成。 於該構成時，因沒有使膜遮罩2之周圍密著於遮罩保 持件3的需要，故膜遮罩25之安裝及拆下變得容易，而有 成為易於交換的優點。 【圖式簡單說明】 • 弟1圖係表示本發明之一實施形態的概略圖。 弟2圖係表示本發明之一實施形態之動作的說明圖。 第3圖係表示本發明之一實施形態之動作的說明圖。 第4圖係表示本發明之一實施形態之動作的說明圖。 第5圖係表示本發明之其他實施形態之楙略圖。 【主要元件符號說明】 1 曝光台 2 膜遮罩 3 遮罩保持具 4 密封構件 5 加壓裝置 6 減壓裝置 7 加壓膜 8 控制裝置 9 光源 20 密著部 25 加壓空間 30 玻璃 40 密閉空間 50 氣體源 51 調壓裝置 52 導入孔 60 減壓泵 61 減壓孔 90 基板 91 凹部 11 319515200819921 • Ninth, invention: • Technical field to which the invention pertains The present invention relates to an exposure apparatus for a printed wiring board. [Prior Art] In recent years, a printed wiring board has been manufactured by using an exposure apparatus in which a predetermined pattern is photosensitively exposed on a surface of a substrate coated with a photosensitive material such as a photoresist, and then an etching step is performed. A so-called photolithography method of forming a pattern on a substrate. In the exposure apparatus, a resin film mask in which a pattern original image is drawn is mainly used as a master, and the film mask is generally used by being held in a glass mask 2 holder. Further, in order to improve the adhesion between the film mask and the substrate, a so-called vacuum adhesion method in which the two are evacuated and vacuumed is often used. This vacuum adhesion method is effective when the surface of the substrate is flat. However, if the surface of the substrate is uneven or distorted, the mask may not follow the substrate to form a defective package. Therefore, it is proposed to open the atmosphere between the film mask and the mask holder after vacuum adhesion, so that the film mask follows the substrate (Patent Document 1), and before the vacuum adhesion, the film is advanced. A method of introducing air into the back side of the mask and pressurizing it (Patent Document 2). [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. In the case where the method of opening the atmosphere between the film mask and the mask holder is carried out, there is a problem that sufficient film masking is not obtained due to insufficient pressure. Further, since only a constant force called = dust can be used, there is a problem that it is difficult to obtain optimum adhesion by various kinds of pressures by changing the pressure. On the other hand, in the case where the pressure is applied to the back side of the film mask before vacuum sealing, the step of making the film adhered due to the time required for the addition of the room becomes The problem of long-termization. In addition to this, there is also a problem that the possibility of deformation such as stretching of the film mask occurs. It is an object of the present invention to solve the problems of the prior art described above. (Means for Solving the Problem) In order to achieve the above object, the exposure apparatus of the present invention has an exposure stage m to expose a substrate (4), a mask, and a pattern to be exposed to the substrate to be exposed; the mask holder is attached to The surface of the exposure stage side supports the film mask so that the film is placed against the periphery of the film mask, and the fluid can be introduced between the mask holder and the film mask. No yk ^ ^ early In the daytime, the power device is such that the exposure σ is close to the mask holder; the seal|罟 is in the opposite direction, and the hunting is carried out by the proximity of the exposure table and the mask holder, and the (1) seal Forming a sealed space for accommodating the substrate and the film mask; and the first 宓丄β person is used to decompress the sealed space to make the front cover and the substrate sub-contact; and the secondary adhesion means 'In the process of pressing the front hand-cutting money, the fluid is introduced into the front of the film mask at a predetermined pressure, and the mask holder is placed between the mask holders, so that the film mask and the substrate are more encrypted. . In the above-mentioned configuration, the introduction of the fluid by the secondary adhesion means in the state in which the film mask is adhered to the substrate in the state in which the film is covered with the 319515 6 200819921, so that the introduction amount of the flow and the body is relatively small. Less, and can significantly reduce the import time. Further, since the film mask is pressurized in a state of being adhered, stretching or deformation of the film mask or the like is less likely to occur. Further, by changing the predetermined pressure of the introduced fluid, optimum adhesion can be obtained in accordance with various conditions. ~ As the predetermined pressure, set it to lkpa or more and 2〇k卯 or less. This is because if it is set to lkpa#, sufficient adhesion effect cannot be obtained, and if it is set to 20 kPa or more, there is a risk of damage to the glass. Further, it is more preferable to select in the range of 2 kpa or more and l〇kpa or less. Although the fluid pressure can be selected in accordance with various conditions as described above, this is because the adhesion is good in the range of 2 kPa or more and i 〇 kpa or less. In addition, the pressure below 20kpa is maintained. In addition, it is better to have a pressure regulating device with a certain Ikpa or more. (Effect of the Invention) According to the exposure apparatus of the present invention, since the adhesion between the film mask and the substrate can be optimized by changing the waste force of the introduced fluid, high-precision exposure can be performed. Further, since the adhesion by the introduction of the fluid can be performed in a short time, the exposure time can be shortened, and the effect of stretching or deformation of the film mask is less likely to occur. [Embodiment] Hereinafter, a mode in which the vestibule of the present invention is placed will be described based on the drawings. Exposure for Manufacturing Printed Wiring Substrate 319515 7 200819921 * In Fig. 1, a printed wiring board 90 to which a photoresist has been applied is placed on the exposure table 1. The exposure stage system can move in the χγ* direction and can also be moved up and down. In addition, it can also be rotated horizontally. The description of these movement, lifting and turning mechanisms will be omitted. A film mask 2 in which a circuit pattern is drawn is disposed opposite to the substrate, and the film 2 is adhered to the substrate 9 (), and the circuit pattern is exposed by exposure from the light source 9. The substrate 9 is. In the first embodiment, the exposure stage 1 and the substrate 90 are disposed in the vertical direction. However, the present invention is not limited thereto. Alternatively, the exposure stage 1 and the substrate 90 may be vertically erected. The structure of the setting. Further, the exposure stage may be moved without moving the substrate 90, and the two may be moved. The film mask 2 is purely held on the substrate 9 () side of the material holder 3. The mask holder 3 is configured to have glass 3() at the center portion, and light from the light (4) is passed through the glass 3G to expose the pattern of the film mask 2 on the substrate 90. The film cover 2 is adhered to the periphery of the cover portion 3 to be adhered to the mask holder 3, and is formed to be permeable to the film cover 2 and the mask holder 3 (glass into the fluid. The film, the cover 2 and the mask are held The member 3 is formed so that the air of a predetermined pressure can be supplied by the pressurizing device 5, and the introduction hole 52 is opened inside the adhesion portion 2 (), and the introduction hole 52 is vibrated by the pressure adjustment 5! And connected to the gas source 5 。. By the pressure swinging skirt 51, the air of the predetermined pressure is introduced from the introduction hole 52 between the glass 3〇 and the film mask 2. The film mask 2 is configured as: 密密319515 8 200819921 • The cover portion 20 is adhered to the mask holder 3, and the center portion side thereof is sealed, and is swelled toward the substrate 90 by the introduced air to form a pressurized space 25 加j The pressing device 5 is controlled by the control device 8, and is configured to introduce air of a predetermined pressure between the glass 3 and the membrane mask 2, and maintain the pressure for a predetermined time. The pressure of the introduced air is as before The ground is j kpa or more and 20 kPa or less, and preferably 10 is selected within a range of 2 kPa or more and l 〇 kpa or less. The force is maintained by the pressurizing device 5 until the end of the exposure. . . . , the sealing member 4 is provided around the exposure table 1, and the space between the exposure table 1 and the mask holder 3 is sealed. If the exposure σ 1 is raised in the direction of the mask holder 3, the sealing member 4 will come into contact with the mask holder 3, and the exposure stage 丨 and the mask holder 3 10 will be sealed to form a gap. The closed space is 4〇. The decompression device 6 is connected to the exposure stage 1 , and the decompression hole 61 is opened in the sealing chamber 40. The decompression hole 61 is connected to the decompression pump 6〇, and is configured to be borrowable. The sealed space 40 is decompressed by the driving of the decompression pump 6A. The decompressing device 6 is also controlled by the control device 8. In the above configuration, when the substrate 9 is placed on the exposure table 1, the exposure table is about to be 1, the substrate 9〇 is moved in the direction of the ΧΥ and 0, and then the exposure stage 1 is raised, and the sealing member = the holder 3 is brought into contact to form the sealed space 40, while the film mask 2 and the substrate 319515 9 200819921 are 90 contact, and control the decompression device 6 to drive the decompression pump 6 〇, the rain will be sealed, and the 40 decompression By this decompression, the film mask 2 and the substrate 9 are adhered j times. Fig. 3 is a view schematically showing the state of the next time. If the substrate 90 has the concave portion 91 or the like, only the borrowing is performed. The pressure reduction in the closed space 4 is such that the film mask 2 cannot be adhered to the portion of the concave portion 91. Next, the pressurizing device 5 is operated, and as shown in Fig. 2, the predetermined pressure is introduced from the introduction hole _52. Between the film mask 2 and the glass 3, a twisted space 25 is formed, and the film mask 2 and the substrate 9 are more encrypted. This is a second adhesion. The fourth figure is a schematic representation. In the state of adhesion twice, even in the concave portion 91, the film mask 2 is closely followed. The mouth hunting is carried out by a person, and the film mask 2 and the substrate 9 are already in a tight state, so the amount of air introduced from the introduction hole 52 can be extremely small, and can be ended by a short time. Its import. Further, since the film mask 2 is in a closed state L, the amount of bulging due to pressurization is small, and the volume of the pressurized space 2 $ is also small. Therefore, there is no disadvantage such as deformation due to expansion of the film mask 2. The control device 8 controls the pressure regulating device 51 to maintain the pressure of the pressurized space holder and maintains the sealed state of the film mask 2. Further, by controlling the pressure regulating device in accordance with various conditions such as the surface state of the substrate 90, the pressure of the introduced air can be adjusted by 51, and the optimum adhesion can be achieved in accordance with the conditions. In the state of Fig. 2, 'the light from the light source 9 is exposed, the pressurization|setting 5 and the driving of the decompression device 6 are stopped, and the exposure stage is lowered 319515 10 200819921. , send to the next process, and end the exposure. There are other embodiments in the fifth drawing. In this embodiment, the pressurizing film 7' is used to adhere the pressurizing film 7 to the mask holder 3 at the adhesion portion 2, and the film mask 2 is attached to the pressure film 7. Composition. In this configuration, since the periphery of the film mask 2 is not adhered to the mask holder 3, the attachment and detachment of the film mask 25 are facilitated, and there is an advantage that it is easy to exchange. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an embodiment of the present invention. Fig. 2 is an explanatory view showing the operation of an embodiment of the present invention. Fig. 3 is an explanatory view showing the operation of an embodiment of the present invention. Fig. 4 is an explanatory view showing the operation of an embodiment of the present invention. Fig. 5 is a schematic view showing another embodiment of the present invention. [Explanation of main components] 1 Exposure table 2 Membrane mask 3 Mask holder 4 Sealing member 5 Pressing device 6 Pressure reducing device 7 Pressurizing film 8 Control device 9 Light source 20 Adhering portion 25 Pressurizing space 30 Glass 40 Sealing Space 50 gas source 51 pressure regulating device 52 introduction hole 60 pressure reducing pump 61 pressure reducing hole 90 substrate 91 recess 11 319515