TW200833187A - Method for producing structured electrically conductive surfaces - Google Patents

Method for producing structured electrically conductive surfaces Download PDF

Info

Publication number
TW200833187A
TW200833187A TW96137901A TW96137901A TW200833187A TW 200833187 A TW200833187 A TW 200833187A TW 96137901 A TW96137901 A TW 96137901A TW 96137901 A TW96137901 A TW 96137901A TW 200833187 A TW200833187 A TW 200833187A
Authority
TW
Taiwan
Prior art keywords
electroless
layer
particles
electrolytically coatable
adhesive layer
Prior art date
Application number
TW96137901A
Other languages
English (en)
Chinese (zh)
Inventor
Rene Lochtman
Juergen Kaczun
Norbert Schneider
Juergen Pfister
Norbert Wagner
Original Assignee
Basf Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Ag filed Critical Basf Ag
Publication of TW200833187A publication Critical patent/TW200833187A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW96137901A 2006-11-06 2007-10-09 Method for producing structured electrically conductive surfaces TW200833187A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06123508 2006-11-06

Publications (1)

Publication Number Publication Date
TW200833187A true TW200833187A (en) 2008-08-01

Family

ID=39081672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96137901A TW200833187A (en) 2006-11-06 2007-10-09 Method for producing structured electrically conductive surfaces

Country Status (2)

Country Link
TW (1) TW200833187A (de)
WO (1) WO2008055867A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102484946A (zh) * 2009-09-04 2012-05-30 巴斯夫欧洲公司 生产导电表面的方法
US9974215B1 (en) 2016-11-09 2018-05-15 Ntrium Inc. Electronic component package for electromagnetic interference shielding and method for manufacturing the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10770508B2 (en) 2014-12-01 2020-09-08 Pi Ceramic Gmbh Actuator device
DE102014017746B4 (de) * 2014-12-01 2021-10-21 Pi Ceramic Gmbh Aktuatorvorrichtung
US11240916B2 (en) 2017-05-31 2022-02-01 Cryovac, Llc Electronic device, method and apparatus for producing an electronic device, and composition therefor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2014649A1 (en) * 1989-08-22 1991-02-22 Frank L. Cloutier Method for forming conductive traces on a substrate
JP2005203396A (ja) * 2004-01-13 2005-07-28 Toshiba Corp 電子部品の製造装置、電子部品の製造方法および電子部品
DE102004019412A1 (de) * 2004-04-19 2005-11-03 Man Roland Druckmaschinen Ag Verfahren zum Drucken elektrischer und/oder elektronischer Strukturen und Folie zur Verwendung in einem solchen Verfahren
DE102005019983A1 (de) * 2005-04-27 2006-11-02 Basf Ag Verfahren zur Herstellung metallisierter, extrudierter Kunststoff-Gegenstände

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102484946A (zh) * 2009-09-04 2012-05-30 巴斯夫欧洲公司 生产导电表面的方法
CN102484946B (zh) * 2009-09-04 2015-09-02 巴斯夫欧洲公司 生产导电表面的方法
US9974215B1 (en) 2016-11-09 2018-05-15 Ntrium Inc. Electronic component package for electromagnetic interference shielding and method for manufacturing the same
TWI631686B (zh) * 2016-11-09 2018-08-01 安特麗屋股份有限公司 用於電磁干擾屏蔽的電子部件封裝及其製造方法
US10849258B2 (en) 2016-11-09 2020-11-24 Ntrium Inc. Electronic component package for electromagnetic interference shielding and method for manufacturing the same

Also Published As

Publication number Publication date
WO2008055867A1 (de) 2008-05-15

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