TW200838412A - Thermal load locator - Google Patents

Thermal load locator Download PDF

Info

Publication number
TW200838412A
TW200838412A TW096139716A TW96139716A TW200838412A TW 200838412 A TW200838412 A TW 200838412A TW 096139716 A TW096139716 A TW 096139716A TW 96139716 A TW96139716 A TW 96139716A TW 200838412 A TW200838412 A TW 200838412A
Authority
TW
Taiwan
Prior art keywords
cooling
electrical
coupled
electrical load
load
Prior art date
Application number
TW096139716A
Other languages
English (en)
Chinese (zh)
Inventor
James K Martin
Original Assignee
Liebert Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liebert Corp filed Critical Liebert Corp
Publication of TW200838412A publication Critical patent/TW200838412A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW096139716A 2006-10-23 2007-10-23 Thermal load locator TW200838412A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86253806P 2006-10-23 2006-10-23
US11/670,208 US20080092577A1 (en) 2006-10-23 2007-02-01 Thermal load locator

Publications (1)

Publication Number Publication Date
TW200838412A true TW200838412A (en) 2008-09-16

Family

ID=39296072

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096139716A TW200838412A (en) 2006-10-23 2007-10-23 Thermal load locator

Country Status (6)

Country Link
US (1) US20080092577A1 (de)
EP (1) EP2087780A2 (de)
BR (1) BRPI0717345A2 (de)
MX (1) MX2009004284A (de)
TW (1) TW200838412A (de)
WO (1) WO2008051809A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI466628B (zh) * 2011-07-07 2014-12-21 Hon Hai Prec Ind Co Ltd 貨櫃型資料中心散熱系統

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SE533820C2 (sv) * 2009-05-05 2011-01-25 Sitetel Sweden Ab Skåp för kylning av elektronikutrustning placerad i skåpet
GB0922271D0 (en) * 2009-12-21 2010-02-03 Sir Robert Mcalpine Ltd Direct air cooling
DE102010005192B4 (de) * 2010-01-21 2014-12-04 Rittal Gmbh & Co. Kg Regelungsverfahren einer Kühlanlage
US20130098593A1 (en) * 2011-10-19 2013-04-25 International Business Machines Corporation Independent computer system zone cooling responsive to zone power consumption
CN103429022B (zh) * 2012-05-23 2016-09-07 华为技术有限公司 一种集装箱数据中心
CN103729328A (zh) * 2012-10-15 2014-04-16 深圳市腾讯计算机系统有限公司 数据中心模块及由微模块组成的数据中心
US9148982B2 (en) 2012-11-08 2015-09-29 International Business Machines Corporation Separate control of coolant flow through coolant circuits
GB2514799A (en) * 2013-06-04 2014-12-10 Ibm Scalable panel cooling system
EP3005018B1 (de) * 2013-06-04 2019-09-04 Schneider Electric IT Corporation Verfahren zur identifizierung von an einer kältemittelverteilungseinheit in einem kühlsystem angeschlossenen kühlmodulen
WO2016069010A1 (en) * 2014-10-31 2016-05-06 Hewlett Packard Enterprise Development Lp Adaptive cooling assembly
WO2018076056A1 (en) * 2016-10-25 2018-05-03 NEXTDC Limited Data centre cooling regulation system and method

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JP2513040B2 (ja) * 1989-10-03 1996-07-03 日本電気株式会社 液冷電子機器への冷媒供給装置
US6330516B1 (en) * 2000-03-27 2001-12-11 Power Distribution, Inc. Branch circuit monitor
US6415619B1 (en) * 2001-03-09 2002-07-09 Hewlett-Packard Company Multi-load refrigeration system with multiple parallel evaporators
US7024573B2 (en) * 2002-02-05 2006-04-04 Hewlett-Packard Development Company, L.P. Method and apparatus for cooling heat generating components
US20040020225A1 (en) * 2002-08-02 2004-02-05 Patel Chandrakant D. Cooling system
US6775997B2 (en) * 2002-10-03 2004-08-17 Hewlett-Packard Development Company, L.P. Cooling of data centers
US6829142B2 (en) * 2002-10-25 2004-12-07 Hewlett-Packard Development Company, L.P. Cell thermal connector
US6862179B2 (en) * 2002-11-26 2005-03-01 Hewlett-Packard Development Company, L.P. Partition for varying the supply of cooling fluid
US6868682B2 (en) * 2003-01-16 2005-03-22 Hewlett-Packard Development Company, L.P. Agent based control method and system for energy management
JP4199018B2 (ja) * 2003-02-14 2008-12-17 株式会社日立製作所 ラックマウントサーバシステム
US6747872B1 (en) * 2003-02-28 2004-06-08 Hewlett-Packard Development Company, L.P. Pressure control of cooling fluid within a plenum
US6987370B2 (en) * 2003-06-23 2006-01-17 Hewlett-Packard Development Company, L.P. Method and system for cooling electronic components
US7184267B2 (en) * 2003-12-12 2007-02-27 Hewlett-Packard Development Company, Lp. Longitudinally cooled electronic assembly
US7214131B2 (en) * 2004-01-15 2007-05-08 Hewlett-Packard Development Company, L.P. Airflow distribution control system for usage in a raised-floor data center
US7057506B2 (en) * 2004-01-16 2006-06-06 Hewlett-Packard Development Company, L.P. Cooling fluid provisioning with location aware sensors
US7203063B2 (en) * 2004-05-21 2007-04-10 Hewlett-Packard Development Company, L.P. Small form factor liquid loop cooling system
US8019477B2 (en) * 2004-05-26 2011-09-13 Hewlett-Packard Development Company, L.P. Energy efficient CRAC unit operation
US7010392B2 (en) * 2004-05-26 2006-03-07 Hewlett-Packard Development Company, L.P. Energy efficient CRAC unit operation using heat transfer levels
US7031870B2 (en) * 2004-05-28 2006-04-18 Hewlett-Packard Development Company, L.P. Data center evaluation using an air re-circulation index
DE102005013567A1 (de) * 2005-03-23 2006-09-28 Siemens Ag Anordnung zur Kühlung von Komponenten in einem Fahrzeug
US7596476B2 (en) * 2005-05-02 2009-09-29 American Power Conversion Corporation Methods and systems for managing facility power and cooling

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI466628B (zh) * 2011-07-07 2014-12-21 Hon Hai Prec Ind Co Ltd 貨櫃型資料中心散熱系統

Also Published As

Publication number Publication date
BRPI0717345A2 (pt) 2013-10-15
WO2008051809A2 (en) 2008-05-02
MX2009004284A (es) 2009-05-05
US20080092577A1 (en) 2008-04-24
EP2087780A2 (de) 2009-08-12
WO2008051809A3 (en) 2008-07-03

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