TW200908043A - Multi-layered ceramic electronic component - Google Patents

Abstract

The invention provides a laminated ceramic electronic component which has high reliability to wet resistance even in a miniaturization condition. In a sintered ceramic body (10) including side gap portions arranged between sides of a first internal electrode (1) and a second internal electrode (2) and first and second side surfaces (21),(22) of the sintered ceramic body and between sides of the effective layer portion (3a) and the first and second side surfaces of the sintered ceramic body, regions of the side gap portions at least adjacent to the first and second internal electrodes are Mg-rich regions MR each having a Mg concentration greater than that of the effective layer portion. In addition, the side gap portions are integrally taken as Mg-rich regions.; In a side gap portion GE between the end portion of the effective layer portion and the first or second side surfaces (11), (12), the region at least adjacent to the first and second internal electrodes is taken as an Mg-rich region. Mg in the Mg-rich region is 0.5-1.0 mol% more than that in the effective layer portion.

Description

200908043 IX. Description of the Invention [Technical Field] The present invention relates to a laminated ceramic electronic component, and more specifically to a laminated ceramic electronic component in which a ceramic layer and an internal electrode for capacitor formation are laminated. [Prior Art] In recent years, miniaturization of electronic components mounted by electronic devices such as mobile phones and portable music players has also rapidly progressed. For example, in a wafer-type laminated ceramic device represented by a wafer type multilayer ceramic capacitor, in order to secure a predetermined characteristic and reduce the size of the wafer, the thinning of the ceramic layer is progressing. Therefore, in response to the Tao: the thin layer of the layer, the number of layers of the ceramic layer has also increased. Usually, the laminated ceramics have no electronic parts, although the ceramic layer and the internal electrodes are alternately laminated. The structure &ren; because the internal electrodes do not cover all the ceramic layers, but only formed by the pottery > The inner side of the peripheral portion is slightly retracted so that the internal electrode is exposed from the side surface of the wafer, and the +I + path thus causes a step difference between the internal electrode and the ceramic layer. Therefore, if the number of sheets of the layer is increased, it is easy to cause structural defects such as peeling due to the step. To solve this problem, the Y f L 1 feed is confronted. For example, there has been proposed a method of printing the internal electrode pattern on the ceramic unprocessed sheet after the internal electrode pattern is printed on the ceramic unprocessed sheet. Part of the pattern is printed by Tao Yufen, and the poor stalk is absorbed by the Shai ceramic paste (see Patent Document 1). However, in the δ Hai method, 嘻, month conditions, even if the difference between the absorbable ceramic layer and the internal electrode is small, but the internal electrode and the ceramic layer are sintered during the 煻w 疋 疋 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 The difference in the shrinkage behavior caused by the fineness of the moisture-resistant defect causes a gap between the ends of the internal electrodes, and moisture such as moisture penetrates into the gap. The technique related to the patent document also proposes a method. S1〇2 is added to the ceramic paste for phase difference absorption to reduce the difference in sintering shrinkage behavior of the internal electrodes of the ceramics (refer to Patent Document 2). However, even the patent document 2 is ancient, i*#. p. In order to make the sintering shrinkage behavior of both the ceramic and the internal electrode completely consistent, the gap caused by the gap is not obtained, and the upper part of the absorption is closest to the wafer:: In the firing step, heat is easily conducted under sintering, and the addition of the sintering temperature portion is further reduced, and the rich side surface portion is excessively burned* into a problem of structural defects or strength reduction of the capacitor body. Mp; In addition, there is also a proposal - a method to solve the step difference problem, which is to increase the internal electrode and the step absorption layer by Cu (9) in the step-by-step absorption of the internal electrode material. In the case of the method of Patent Document 3, in the case of the method of Patent Document 3, the gold is likely to generate an oxidation-reduction reaction due to the firing atmosphere, etc., due to the volume expansion in the oxidation reaction. After that, the volume of the reduction reaction is reduced, and the smear is generated in the step portion. Therefore, it is difficult to sufficiently ensure the reliability of the wetness. Patent Document 1 Japanese Patent Laid-Open No. Hei 56-94719 Patent Literature 2曰 特 〇〇 〇〇 〇〇 _ _ _ 2009 2009 2009 080 2009 2009 080 080 080 080 080 080 080 080 080 080 080 080 2009 080 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 【 【 【 【 【 Provided is a laminated ceramic component having high reliability against moisture resistance even in the case of miniaturization. In order to solve the above problem, the laminated body of the present invention (the i-th item of the patent range) burn The body is made up of a plurality of layers of ceramics, and has a mutual _ a 攸 a first side and a second side opposite to each other, and a first end and a second end opposite to each other. The part electrode is formed in the pottery: the inside of the sintered body and is led out to the first end surface and contains Ni: the second internal electrode is formed in the pottery: the inside of the sintered body is formed to transmit through: the layer and the inside of the crucible The electrode is opposed to the second end surface and has a N1; the first external terminal electrode is formed on the (four) 1 end surface of the ceramic sintered body and electrically connected to the (iv) i (four) electrode; and the first terminal electrode is formed in the electrode The second internal electrode of the (4) 2 end of the ceramic sintered body is electrically connected, and is connected to a potential different from the first (a) terminal portion ^=, wherein the ceramic sintered body comprises: the ceramic layer is held in the layer The second internal electrode and the second internal electricity are effective layer portions for forming a capacitance; and the side portions of the second and second inner portions and the ceramic sintered body are present! Between the side faces of the crucible 2 and the second side of the ceramic sintered body, the side gap portion is such that at least the first side is formed in the side gap portion. The region adjacent to the surface electrode has a high Mg concentration, a ^, and a second inner region. The door is rich in Mg 200908043 in the effective layer portion of the 4th layer and is preferably located in the lateral side gap portion. The region of the same height of the internal electrode is the Mg-rich region containing the μ: in the invention, it is preferable that the side-side gap portion as a whole is rich; and the second and second inner portions are preferably the ceramic sintered body. The end portion of the second electrode and the end portion of the first and second effective portions of the ceramic sintered body and the end surface of the i-th or the second surface of the ceramic sintered body: a gap portion; At least the region adjacent to the vertical electrode of the vertical side of the end face side gap portion has a concentration of vtg higher than that of the :: Mg-rich region of the layer 4. In the present invention, the vertical shadow region of the side gap portion of the ceramic layer on the outer side of the inner electrode of the first and second inner electrodes may be made At least the concentration is higher than the Mg-rich region of the active layer. In the present month, it is preferable to increase the proportion of the main component (10) constituting the Mg-rich region, and to add more proportion to the main component of the ceramic material constituting the present layer. 0.5~1.0 m〇i〇/. . Further, in the present invention, it is also possible to adopt a configuration in which the Mg-rich region-containing towel Mg-rich has a concentration gradient which decreases from the outer side to the inner side of the ceramic sintered body. The first layer of the first and the second internal electrodes formed in the interior of the ceramic body, and the first part of the ceramics, such as the above-mentioned i. The first terminal electrode of the internal electrode electrical connection is the external terminal electrode and the second external terminal electrode which is connected to the second internal electric path, and is present in the inner internal electrode and the second inner electrode of the ceramic sintered body. The side between the side portion and the second side surface of the ceramic sintered body, and the side between the side portion of the layer portion and the first and second side faces of the bismuth body, the area adjacent to the second internal electrode is Mg concentration Since the surface of the active layer is rich in the (10) domain, the oxidized compound of Mg which is a metal element constituting the internal electrode and the metal element of the Tauman is formed at the boundary portion between the internal electrode and the side surface gap portion; The milk is formed to fill the boundary between the internal electrode and the side-side gap portion, and the internal electrode and the side surface gap are combined by the emulsified compound, so that the moisture resistance can be improved. Further, since the filling effect of the gap between the internal electrode and the side surface is increased by the volume expansion due to the oxidized compound, it is expected that the (four) property is greatly improved. In the case where the Mg concentration in the Mg-rich region is higher than the effective layer 2 and the Mg is contained in the effective layer portion, the Mg-rich region = the ratio of the Mg content in the effective layer portion contains %, and In the case where the layer does not contain Mg, it means that Mg is contained to a significant extent: the generation of the metal constituting the internal electrode and the compound of Mg. In addition, the use of Mg0 is added to In the case of a ceramic material, it is contained in the content of Mg which is rich in the area of the Mg region and the Mg layer of the active layer is derived from MgO. In the region of the same height as the second inner electrode of the second inner electrode, 200908043, that is, the side portion of the inner electrode is a region of the peripheral portion of the rich eight and the side gap portion 3, whereby the Ni of the internal electrode metal and the ceramic are derived from In the boundary portion of the gold, the internal electrode is formed to improve the moisture resistance. The oxidized compound belonging to 7L of Mg, that is, the side electrode side gap can prevent the internal electrode from being rich. Deterioration of moisture resistance in the case of a Mg-containing region, Further, the part caused by the gap of the surface side gap portion. The laminated ceramic electrons which are excellent in moisture resistance, and the end surface side gap which exists between the second end faces of the effective layer a: The adjacent region is rich in ^ and 苐, and the second inner moisture is infiltrated from the end surface to enter the g: domain', thereby suppressing and preventing the moisture resistance from being improved. Further, since the external terminal electrode is formed at the end surface Obtaining the effect of suppressing the infiltration of water by the 'human effect', so there is no need to special *^ 6 6 Mg area on the end side of the special sigh

There are also many obstacles, but by adding the Μσ F domain to the end face side, the moisture resistance reliability can be further improved. Κ In the present invention, it is also possible to make 第a among the second internal electrodes of the first and second brothers; and between the side faces of the ceramic layer on the outer side of the inner electrode of the outer layer: a straight projection region and an end surface side gap portion. The vertical projection area of the small j

The Mg concentration is higher than the Mg-rich region of the active layer portion, and in this case, it is sure to obtain a laminated ceramic electronic component excellent in moisture resistance. / , and further, the proportion of Mg added to the main lOOmol% of the ceramic material rich in the Mg region is compared with that of the constituent knives, the ceramic of the β double TM ;; the main component of the M material is l 〇〇 m 〇1% Mg addition ratio!·〇m〇i〇/〇, 10 200908043 Thereby, the moisture resistance reliability can be more improved, and the present invention is more effective. Further, in the present invention, in the case where the Mg concentration has a concentration gradient which decreases from the outer side to the inner side of the sintered body in the Mg-rich region, a laminated ceramic electronic component excellent in moisture resistance can be obtained. In addition, a method in which the Mg concentration has a composition from the outer side to the inner side of the ceramic sintered body = concentration gradient is exemplified by the original wafer before firing, and the adhesive of 'Bebe, 3 and Mg, after impregnating Mg A method of firing an original wafer or the like. [Embodiment] The following describes the embodiments of the present invention and further details the features of the present invention. [Embodiment 1] Fig. 1 is a perspective view showing a configuration of a laminated ceramic electronic component according to an embodiment of the present invention (a laminated ceramic capacitor in the present embodiment), and Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1. Fig. 3 is a sectional view taken along line 8-6 of Fig. 1, and Fig. 4 is a view for explaining the configuration of a multilayer ceramic capacitor according to an embodiment of the present invention. As shown in FIGS. 1 to 4, the multilayer ceramic capacitor of the first embodiment is a ceramic sintered body having a plurality of layers of ceramic layers 3, and is first and secondly disposed so as to be alternately drawn to the opposite side. 2, the internal electrodes 〖, 2, and the first and second internal electrodes 丨, 2 lead portions are connected to the ceramic sintered body ίο the first end face 丨丨 and the second end face 12 of the first And second external terminal electrodes 31, 32. Further, the ceramic sintered body 丨〇 has a first side surface 21 and a second side surface 22 opposite to each other (the first end surface U and the second end surface 12) (Fig. 3, which are opposite to each other) The configuration has a bow to the front end of the face, as shown in Figure 2, the electrode 1, and through the established pottery layer (helping to open the second: the first inner layer is in the ceramics sintered body (four) set #7; ^ The dielectric body is led to the second end face 12, the electrode 1 is opposite to the U U and contains the second N1, and the first end face of the ceramics sintered body 10, as shown in the figure, no, the first and the first The second electrode 12 of the ceramic electrode 1 is electrically connected to the second electrode 12 of the ceramic sintered body 1 , and the terminal electrical electrode 2 is electrically connected to the external terminal electrode and the second internal potential. The second external terminal electrode 32. The sub-electrode 3i is different and the laminated ceramic thunder is crying, the ceramic sintered body is 1 〇, and the door is shown in Fig. 4, and the internal electrode of Fig. 3 and 2 is contained in the ceramic layer 3 2, and contribute to the formation of an effective layer of capacitance; 1 and the first internal electric ... the side of the second internal electrode 2:: in the first], the second side 21, 22 The i-th and the second side-side side of the sintered body 1 of the body 10 are present in the i-th internal electrode i and the first side-side gap portion Gs and the junction i. Between the second end face ", 12, and;;:: the ceramic burning end and the ceramic sintered body 1. The i- or second end face U, the layer... the face-side gap portion ge. In addition, the 'ceramic sintered body J 〇, the internal electrode i (2) and the outer layer 1 (2) of the uppermost layer and the outer electrode 1 (2) of the lower layer are not related to the external capacitance of the ceramic layer. Outside, and with 12 200908043 Next, the side-side gap and the surname... ^ f 1 h and the side-side gap ge, the brother 1, the second internal electrode, 2 adjacent 〇 / E , . , 4 Gs! (Fig. 3, Fig. 4), E (Fig. 4), set to Mg concentration more effective 敁Λ / Γ 1 ja 冋 animal containing Mg area A MR ' and Mg system expansion and clearance In the present embodiment, although only the average Y is made to enlarge the gap between the Mg and the gap portion, the Mg is more than pB p, eight right..., Bellow The expansion and the gap are generally uniform As long as Mg exists in the vicinity of the internal electrode of the gap portion.

As in the present embodiment, Mg may be distributed so as to be distributed over the entire gap portion or to the portion near the electrode of the gap portion so as to reach the ceramic sintered body. Further, in the first embodiment, the material which does not contain Mg is used for the ceramic material which is used in an effective manner, and the material which is rich in the Mg region MR is used as the material for the effective layer portion. 3a ceramic 10〇m〇1〇/ ^ Λ j 趸 枓 its main component is. Add Mg (four) material in the range of O.H.Omom. In the multilayer ceramic pot container of the 2 (four) state 1, as described above, the side surface side gap portion G and the end surface side gap 9th coffee pot 1?, α| are the same as the first and inner 4 electrodes 1 2 Adjacent area GS1, G, π # has a layer of Qiu 1 one, does not become a Mg concentration compared to the part of the electricity: the 畐 contains the Mg area MR, so in the second 2: U2 and the area adjacent to the Tao And &: genus: the formation of the internal electricity ... the metal of the oxidized compound derived from the genus of the genus of the genus of the genus, by the 兮 & filling the meat μ $ straw from the bismuth compound The edges of the electrodes 1, 2 and the regions GS1 and 〇Ε1 are shown in the gap C (reference) of the boundary of the n-丄E1, and the oxidized compound is combined with the internal GS1 «p gate. Since the electrodes 1 and 2 and the region 1 4 GE1 are used, it is possible to obtain a multilayer ceramic capacitor having high moisture resistance and high reliability against moisture resistance in the case of miniaturization in 200908043. Next, a description will be given of a method of manufacturing the laminated ceramic capacitor. (1) In advance, the unprocessed sheet 3 containing the dielectric ceramics as the main component has Nl & a conductive paste for internal electrodes as a conductive material and a conductive paste for external terminal electrodes. The unprocessed sheet or various conductive pastes of the ceramics contain a binder and a solvent, but a known organic binder or an organic solvent can be used. (2) Next, as shown in Fig. 6(a), the conductive f 42 is printed on an island shape by, for example, screen printing on the ceramic green sheet 4 to form an inner crucible electrode pattern 42p ^ (3). Then, as shown in FIG. 6(b), the portion on which the internal electrode pattern 42p is not formed on the ceramic green sheet 4, the side surface side gap portion Gs and the end surface side gap portion GE are printed. The ceramic material constituting the ceramic paste is a ceramic material having a higher Mg content than a ceramic material constituting the ceramic green sheet 41 as a base. Further, in the case where Mg is obliquely distributed in the gap portion, for example, a plurality of ceramic pastes having different Mg contents may be prepared, and a method of sequentially printing them may be used. (4) Next, as shown in Fig. 6(b), the ceramic green sheets 41 are laminated while being shifted by a predetermined distance in the longitudinal direction to form a mother block. Further, an unprocessed sheet is used for the outer layer of the outermost layer without forming an internal electrode pattern. In addition, the mother block may need to be scrapped along the lamination direction by means of the equalization method, etc. 14 200908043. (5) Next, the mother block is cut to a predetermined size along the predetermined cutting line L to cut. μ piece (see, Figure 6 (c)). Further, in Fig. 6(c), a single ceramic unprocessed sheet is shown for convenience to indicate the cutting line L. In addition, the original wafer is ground by a method such as σ, roller polishing, etc., so that the ridge line and the corner of the original wafer are rounded. (6) Next, the original wafer (original pottery layered body) is fired. The degree of burning is preferably from 9 〇 0 to 13, and C is preferred. The ambient atmosphere of the firing may be appropriately used in an ambient atmosphere such as a large oxygen or N2. ()', a human conductive paste is applied to two or two of the fired ceramic laminates to be baked to form an external terminal electrode. The baking temperature is preferably 7 〇〇 to _ C. Baking atmosphere atmosphere. , the field knife does not use large milk, N2 and other environmental gases" m see also need to be on the external terminal electrode surface, forming a money coating to enhance the dream of 9 dreams or enhance the purity of solder. It has a container as shown in Fig. 丨~4. 'The laminated ceramic material is composed of the laminated ceramic capacitor in this embodiment, and the ceramic unprocessed sheet is used to form a ceramic unprocessed sheet. °, the material is used as the material, and the Mg content is used as the material. The height < ting ten is used as the side-side gap portion rn ^ ^ paste, so that the ceramic gap portion GE of the front end side gap is located on the end face side of the gap portion of the 'no' side surface The area of the position is included in the = and the first: the internal electrode ... the concentration of the same height g is 咼 并 他 他 邱 邱 邱 邱 邱 , , , , , , , 邱 乂 他 他 他 他 他 他 他 他 他 他 他 他 他 他 他 他 他 他 他 他 他By constituting the internal electrode 丨, 2 of 15 200908043 and the Mg oxidizing compound to fill the internal electrode 2 (four) domain ^ MEI boundary portion (four) gap c (column 5), and by chemical compounding:, combined with the internal electrode i, 2 and the region Gsj ^, so that a multilayer ceramic electric device with south moisture resistance can be obtained In addition, since a number of expansions of the constituent components can be generated between the ceramic layers, the side-side gap portion Gs, the region of the end-face side gap portion = the distance between each other and the region Gei, the wave duration may be It is slightly higher. s Also, although the Mg in the pottery can exist in the form of Mg〇, it can also exist in the state of a compound such as an oxide. However, the glass composition ◦ § is not good. When the amount of breakage of the side-side gap portion Gs and the end-face side gap portion E is increased, the side-side gap portion A and the end surface-side gap have a lower sintering temperature, and the original heat is easily transmitted to the vicinity of the surface of the sundial. The side side gap mail r _ "side gap portion Gs, end face = and cause electricity...: E will become excessively sintered, resulting in a structural defect or strength reduction of the body 4 of the electric body. And the engraving is rich in the MKMg content of the Mg region, As described above, the addition ratio of the second component to the main component of the ceramics is preferably 以0.5 to L〇m〇1% of the effective layer portion. Although it is also considered to constitute the formation of the capacitor body The concentration of Mg 2 generally increases, but if the degree of the effective layer is changed, the characteristics of the capacitor (the dielectric constant, the temperature G, and the Shanghai factor) cannot be obtained. Therefore, the side side is improved as in the present invention. The gap portion Gs & face-side gap portion Ge contains more Mg. 16 200908043 In the laminated ceramic electronic component of the present invention, the ceramic layer can be made of BaTiO, butyl; 八1(^>3, SrTi〇3, And a component such as CaZr03 or the like as a main component may be added to the main component such as a quinone compound, an Fe compound, a Cr compound, a Co compound, a ruthenium, a τ. In the laminated ceramic electronic component of the present invention, the thickness of the ceramic layer is preferably 1 to 10 #m. In this month, the internal electrode contains Ni as a requirement. Specifically, it is a Ni compound containing a metal such as Ni or Ni, or a Sichuan alloy. The thickness of the internal electrode is preferably 1 to 1 Å. Further, in the present invention, it is preferable that the external terminal electrode has a plurality of layers including a base electrode = a plating layer formed thereon. The external terminal electrode is usually formed so as to be wound around the main surface and the side surface from the end surface, but may be formed at least at the end surface. Metals such as &, state, and Ag-Pd can be used as the base electrode constituting the external terminal electrode. The base electrode is preferably glass-containing. The plating layer of the terminal electrode is preferably a two-layer structure of a (four) Ni plating layer and a Sn plating layer in the case where the laminated ceramic electronic component is soldered. It is preferable to use a two-layer structure in which a Ni plating layer or an Au plating layer is used in the case of a laminated electronic component which is made of a conductive adhesive or a wire bonding. Further, in the case where the capacitor is embedded in the wax substrate, it is preferable to form the outer layer by a layer of mineral. The plating layer does not have to be defined as 2 layers, 1 layer or more. Also, «the thickness of each layer of the layer! m is preferred. Further, a resin layer for relieving stress may be formed between the base electrode and the forged layer. In addition, the present invention is directed to the invention of the reaction between Ni contained in the internal electrode and Mg contained in the ceramic, and is not limited to the laminated ceramic capacitor as long as it can be made to have a specific structure of the present invention and can be expected to have an effect. It can also be applied to laminated thermistors and laminated inductors. [Embodiment 2] FIG. 7 is a cross-sectional view showing a configuration of a main part of a laminated ceramic electronic component (a laminated ceramic capacitor in the present embodiment) according to another embodiment (Embodiment 2) of the present invention, which corresponds to Embodiment B. Fig. 8 is a view for explaining the configuration of a multilayer ceramic capacitor according to a second embodiment of the present invention. As shown in Fig. 7 and Fig. 8, the multilayer ceramic capacitor of the second embodiment has the side surface side gap portion Gs as the Mg-rich region Mr, and also the ceramic layer outside the inner electrode of the outermost layer among the internal electrodes. The vertical projection region 13b of the side-side gap portion Gs of the (outer layer) 3b is set to be rich in the Mg region Mr. In addition, the case of the multilayer ceramic capacitor of the form 2 is rich.

In the Mg region MR, the Mg concentration has a concentration gradient which decreases from the outer side to the inner side of the ceramic sintered body. In other words, the laminated ceramic capacitor of the second embodiment differs from the first embodiment in that the ceramic layer (outer layer) 3b outside the internal electrode of the outermost layer among the internal electrodes is used. The vertical projection region 13b of the side-side gap portion Gs also forms the Mg-rich region Mr, the Mg-rich region MR is not formed in the end face-side gap portion ge, and the Mg-rich region MR has a Mg concentration from the outside of the ceramic sintered body. Concentration gradient that decreases toward the inside. 18 200908043 In addition, the other configuration is the same as that of the embodiment i. In the case of the configuration of the second embodiment, the side-side gap portion Gs and the vertical projection region m of the side-side gap portion are the regions where the side portion of the inner electrode and the ceramic layer are separated by Ni and The oxidized compound is filled and the side portion of the internal electrode and the ceramic layer are more reliably bonded by the oxidized compound of Ni and Mg. Therefore, in the same manner as in the embodiment, it is possible to obtain a high moisture resistance even in In the case of miniaturization, a multilayer ceramic capacitor with high reliability against moisture resistance is also available. Next, a description will be given of a method of manufacturing the laminated ceramic capacitor. When the multilayer ceramic capacitor of the second embodiment is manufactured, in the step (3) of the method for producing a multilayer ceramic capacitor according to the first embodiment, the peripheral region of the internal electrode pattern on the unprocessed sheet is used (the internal electrode pattern is not formed). In part, the ceramic paste is applied, and the ceramic paste is the same ceramic material as the ceramic material constituting the unprocessed sheet (as a substrate). Then, in the same manner as in the case of the first embodiment, the ceramic unprocessed sheets are alternately shifted by a predetermined distance in the longitudinal direction to form a mother block. Further, a layer other than the inner electrode pattern is not formed with an unprocessed sheet on the outermost layer. Then, it may be necessary to crimp the mother block in the lamination direction by a method such as uniformity. Thereafter, as in the case of the first embodiment, the mother block is cut into a predetermined size along a predetermined cutting line to cut the original wafer. Further, the original wafer may be ground by a method such as barrel polishing as needed, so that the ridge line portion and the corner portion of the original wafer are rounded. 200908043 Next, the two sides of the obtained original wafer were immersed in an organic binder solution containing MgO in a ratio of i, and the original wafer was impregnated and dried. Thereafter, in the same manner as in the first embodiment, by firing and forming an external terminal electrode, the Mg-rich region Mr in the ceramic sintered body 10 as shown in Figs. 7 and 8 is obtained. The Mg concentration has a multilayer ceramic capacitor having a concentration gradient which decreases from the outer side to the inner side of the ceramic body 1G <曰~55曰日 is a pair of sides, immersed in an organic binder solution containing MgO, but the original wafer may be entirely immersed in an organic binder solution containing M ^ ^ ^ ^ ^ ^ as the case may be. Composition.

[Embodiment 3J] The cross section of the laminated ceramics according to another embodiment (Embodiment 3) of the present invention is a schematic diagram of the main part of the laminated ceramic capacitor in the present embodiment, and corresponds to the graph of the first embodiment. Sectional view, the resulting diagram. ~3 of the layered ceramic capacitors. The laminated ceramics of this embodiment 3 is crying and smashing... The essays, as shown in Figure 9 and Figure 10,

It is formed in the side-side gap portion Gs to form the 轺Is g匚 domain mr in the M-rich electrode, and also in the inner < ten outermost outer electrode of the inner electrode, the outer side of the inner side of the gap is the layer (outer layer) 3b The vertical projection area of the side J 丨 soap 4 Gs is another ancient; ^ outside $ into the ^ area 1 ^. For the aspect, as shown in Figure 1〇, Yu Cheng is a rich Mg-rich area. Ή Ή 部 ge is not shaped 20 200908043 That is, the layer of the third embodiment. The configuration is struggling with the embodiment, and the inner electrode (four) of the outermost layer in the following points is the same as that of the inner surface of the inner electrode gap portion Gs. In the end face side gap, the 未 £ is not formed to be rich in two

The other configuration is the same as the embodiment 丨 R in the third embodiment, although Mg is substantially enlarged. In addition, the present embodiment does not need to be evenly distributed and spread over the gap portion; the cloth = the entire gap portion, but the vicinity of the internal electrode of the portion may be used. X and 吣 are present in the gap to reach the side of the 峨 体 : g : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : In the case of the configuration of the third embodiment, in the case of the configuration of the third embodiment, it is possible to obtain a high-rise ceramic capacitor having high reliability in the case of miniaturization and reliability against moisture. Next, a description will be given of a method of manufacturing the laminated ceramic capacitor. On the M u_μ plus 41, the conductive paste 42 is printed in a strip shape by, for example, screen printing to form the internal electrode pattern 42ρ °. Next, the ceramic unprocessed month 41 is alternately shifted by a predetermined distance in the width direction. Laminated to make the mother block. Further, the outer layer in which the inner electrode pattern was not formed was laminated on the outermost layer with the unprocessed sheet. In addition, the mother block may need to be pressed in the direction of the laminate by means of a pressure equalization method or the like.

Pick up. S 21 200908043 Next, the mother block is cut to a predetermined size along the predetermined cutting line L to cut the original crystal as shown in Fig. 11(b)). Further, in Fig. 10, in order to facilitate the removal of one piece of ceramic unprocessed piece, the cutting line L is indicated. Further, the original wafer has a structure in which the internal electrode pattern is not only exposed on one side but also on the side surface of the Xiashan w囟岣 road, and the structure is different from the original wafer in the first and second embodiments. Secondly, it is applied at a predetermined thickness on both sides of the original wafer: the ratio is higher than that of the ceramics that constitute the ceramics of the unprocessed film, and dried. Further, in the case where Mg is obliquely distributed in the gap portion, a plurality of kinds of ceramic pastes having different contents of 备.I may be used, and coating, drying and repeated coating may be sequentially performed. In this case, on the two sides of the original wafer, the surface is formed to correspond to the side side gap. P contains a Mg region (see Fig. 9). Moreover, in the case of this method, the side of the ceramic layer on the outer side of the innermost electrode of the outermost electrode is also the gap of the human-w w·· gap. The vertical projection area of P forms a 畐-containing Mg region. After that, the original wafer can be ground by the method of barrel grinding, and the ridge line and the corner of the original wafer can be rounded. However, when the Tao Jing cream is applied, when the side of the original wafer is immersed and used, the portion and the corner portion of the impregnation method according to the Taoman cream may be rounded, so sometimes : Two-shaped, the original wafer ridgeline h shell roller grinding. The other steps are the same as in the embodiment i. Example 22 200908043 [Example 1] A ceramic slurry mainly composed of a barium titanate-based ceramic powder which is resistant to reduction was used to form a rectangular ceramic green sheet having a thickness of 20 " m. Name f reduction) · Raw barium titanate ceramic powder, that is, ceramic material for effective layer. In this example, you use BaTi〇3 in a ratio of 99mol0/〇, and the ratio of 1 mol% contains right v. There are 2〇3' but no MgO materials (Mg0 added:

Omol%). At. On the unprocessed sheet of Hetao, a conductive powder of 100 parts by weight of nickel powder having an average particle diameter of 0.3 and 3.0 parts by weight of an organic binder is used as a conductive paste for forming an internal electrode, and the screen is printed as a short side. The width is 800 // m and the internal electrode pattern is formed. Next, the ceramic material is blended (the ceramic material constituting the gap portion, the Mg 〇 addition ratio vehicle, the ceramic material for the turf effective layer of the ceramic layer of the turf (9)), and the weight of the organic binder is 1 3 〇 Tao: It is a paste, printed in the screen

Brush inside.周% pole pattern of the eyepiece 'to eliminate the difference between the internal electrode pattern and its surroundings, wherein BaTi〇3 is contained in a ratio of 99m〇l%, lm〇1% ratio 3 has a main component of Y2 03〇〇 M〇1%, the ceramic material was blended with Mg〇 as an additive in a ratio of 0-5 mol%. Next, 240 pieces of ceramic green sheets on which the conductive paste and the ceramic paste are printed are laminated, and each of the 7-inch sheets is further formed in the above-described manner and the ceramic unprocessed sheets in which the internal electrode patterns are not formed (the ceramics for the outer layer are not processed). The laminate was laminated on the upper and lower sides thereof, and pressed and cut in the thickness direction to obtain an original wafer (unfired ceramic sintered body) having a length of 2.0 mm x a width of l_〇mmx and a thickness of 丨〇 mm. 23 200908043 The original wafer was immersed at a temperature of 1300t. .6 surface X width 0,8mmx thickness 0.8mm ceramics, and the length of the inner electrode surface of the prepared ceramic sintered body was prepared, and the conductive paste was applied. And laminating it to form the laminated ceramic capacitor A (sample A) ^ by forming both ends of the mountain surface. The terminal electrode and the ceramic material constituting the gap portion partially contain BaTi〇3, and the ratio of 1 mol% contains the ratio of γ and "m〇i%. . — : 'The ratio of using "·75_ is 乂2:::: The ceramic material of the material (Mg〇 is added in proportion to the ", 'mouth.n7, 10/, (1) A ceramic capacitor B (sample B) was produced under the same conditions as in the case of the multilayer ceramic capacitor a, except that the ceramic material was used. ° Further, the ceramic material constituting the gap portion contains BaTi〇3 in proportion to ^99m〇i%, and the ratio of lln〇1% contains γ2〇3, and the main component is (10)(10)% 'system, used lm〇1% a ceramic material in which Mg 〇 is blended as an additive (a ceramic material more than 1% by mass of the ceramic material for the active layer portion). Others, a laminated ceramic is produced under the same conditions as in the case of the laminated ceramic capacitor A. Capacitor C (sample C). Further, the pottery material constituting the gap portion has a main component containing γ2 〇3 in a ratio of BaTi〇3, lm〇1% in a case of 99 mol% of t, and is 1 00 mol / 〇. a ratio of Mg 〇 as an additive to the ceramic material* (a ceramic material 1.5 mol% more than the ceramic material for the effective layer portion). Others, a multilayer ceramic capacitor is produced under the same conditions as in the case of the multilayer ceramic capacitor A. D (sample D). In addition, for comparison, the ceramic paste is made of ceramic unprocessed sheet which is printed on the inner electrode pattern by screen printing without using Mg 〇 and using 24 200908043 /, Tao Wen unprocessed piece of the same pottery ^ ^ ceramic paste ^ Comparative Example 1 ϋ a Force sheet, in the same manner as the laminated ceramic capacitor E (sample E). C, two t for the laminated Taman capacitors of the first embodiment (samples) A, B, straight,, voltage 11 of the multilayer ceramic i capacitor (test _, apply 0.5V = test, and the resistance value in one Π The following layered pottery is a defective product. Others are good for sorting. Connect: 'The moisture resistance test is performed on the selected products to confirm the moisture resistance. The test conditions are based on temperature 1

Straight 50 humidity is 95% RH, 5V is applied and W voltage, hold time 144

After the test, the application of 10V was performed at room temperature.隹1_0χ10Ε6Ώ or less was judged to be moisture-resistant. Table 1 shows that the laminated layer of the core layer of the first embodiment is a capacitor (sample), c, Ε), and the laminated ceramic capacitor of the comparative example 1 (§枓) 500 500, each of the surveyed non-destructive testing results, such as the results of the humidity test, the dryness and the quality of the poor after the screening of 500 samples. [Table 1] ---—— MgO blending ratio (mol%) ~~~~-------- Wetness test on the eve of the test, agriculture 4 materials A -------_, Bu Min. Flat moisture resistance test failure rate ϊ^example) 0.5 0-40% 5% Sample Β -------- ^ Example) 0.75 0.60% 0% Completion, material 1 1 0.60% 0% u (Example) 1.5 0.40% 15% 、,料_b 0 _- 0.40% 72% 25 200908043 As shown in Table 1, the multilayer ceramic capacitors (samples) BC, D and Comparative Example i of the examples were confirmed. The multilayer ceramic capacitor (the sample had the same defect rate before the wet test, but the sample A, B, C, and D of Example 1 was significantly lower than the sample of Comparative Example 1) for the moisture resistance test. In particular, in the samples B and C, the moisture resistance test failure rate was 0%. Further, in the sample E of Comparative Example 1, it was observed that many of the resistance values after the test were judged to be good after the moisture resistance test, and the resistance value after the test was lower than that before the test. Further, in the samples B and C of the first embodiment, the gap was not detected at the end portion of the internal electrode, and the samples A and D were also observed only in the center of the lamination direction. . Therefore, in the multilayer ceramic capacitor of the first embodiment, it is possible to suppress the penetration of moisture into the gap between the portion of the internal electrode and the surrounding portion, thereby suppressing the occurrence of defects in the moisture resistance test. [Example 2] First, a ceramic slurry mainly composed of a barium titanate-based ceramic powder having a reducing property was used to form a rectangular ceramic green sheet having a thickness of 2.0 / m. The reduction-resistant barium titanate-based ceramic powder is specifically a material containing BaTi〇3 in a ratio of 99 m〇l%, and a ratio of 1% of lm Mg, but not δ MgO (Mg〇 addition amount) :〇mol%). Next, on the ceramic green sheet, nickel powder having an average particle diameter of 〇. 3 # m is blended! The conductive paste of 00 parts by weight and 3 parts by weight of the organic binder was used as a conductive paste for forming an internal electrode, and an internal electrode pattern was formed by screen printing to have a short side width of 800 m'. Then, 'the blend of the pottery powder contained in the ceramics used to shape the ceramic unprocessed sheet is the same as the pottery powder (without adding Mg〇) 1 〇〇重26 200908043 Parts and organic binder parts The circumference of the electrode pattern is poor. 3. The weight of the ceramic paste is printed in the screen to eliminate the internal electrode pattern and the surrounding segments. Then 240 pieces of the ceramic paste printed with the conductive paste and the ceramic paste are laminated. _Steps each of the 〇################################################################################################# An original wafer (unfired ceramic sintered body) having a length of 2.0 mm x a width of 10 faces x a thickness of 1.0 mm was obtained. Next, one side of the obtained original wafer was immersed in an organic binder solution containing MgO in a ratio of ruthenium and dried, and the other side was also impregnated so that both sides were impregnated with Mg. After the original wafer was dried, it was again 13 (10). The temperature of c was fired to obtain a ceramic sintered body having a length Μηπηχwidth 〇8 mmx thickness 〇8 mm. Then, the external terminal electrode ' was formed by the 'fourth conductive' & paste of the exposed surface of the internal electrode of the obtained ceramic-filled body to form an external terminal electrode ' (sample F). In addition, the laminated ceramic capacitor F (sample F) is equivalent to the laminated ceramics of the structure described in the second embodiment, and the laminated ceramic electric grid of the 虿谷谷盗, and the two ceramics of the ceramics. The side of the side is & people, J is rich in Mg, rich in

The Mg concentration in the Mg region has a multilayer ceramic capacitor having a concentration gradient which decreases from the outside to the inside of the ceramic sintered body (see Figs. 7 and 8). One

Further, in the same manner, 27 200908043 organic binder solution containing MgO in a ratio of 3.〇m〇1/L was used, and a multilayer ceramic capacitor G (salt G) was prepared by the step of R. ). Also, for comparison, with this embodiment! In the same manner as in the comparative example described above, a multilayered Tauman capacitor Η (sample Η) as Comparative Example 2 was produced. Further, the sample of Comparative Example 2 was produced in the same manner as the comparative example, but the manufacturing lot number was different from the comparative example. Next, the multilayer ceramic capacitors F and G of the second embodiment and the laminated ceramic capacitors of the second comparative example 2 were subjected to the same method as in the case of the example i before the moisture resistance test and after the sorting. Good moisture resistance test. The results are shown in Table 2. [Table 2] Non-destructive rate before moisture resistance test, such as manufacturing conditions, moisture resistance test failure rate, sample F, impregnation in a ratio of 1.0 mol/L _ (Example) MgO organic binder solution 0.20% 6% Sample G immersion The organic binder solution (Example) MgO is contained in a ratio of 3.0 mol/L. 0.60% 0% Sample Η Not impregnated with MgO (Comparative Example 2) Organic binder solution 0.60% 69% As shown in Table 2 As shown in Table 2, the multilayer ceramic capacitors f and g of the second embodiment and the multilayer ceramic capacitor η' of the parent example 2 can obtain substantially the same evaluation results as those of the first embodiment and the comparative example. That is, as shown in Table 2, it has been confirmed that the laminated ceramic capacitors of Example 2, 200908043, F, G, and the laminated ceramic capacitors of Comparative Example 2 have the same defect rate before the moisture resistance test, but the moisture resistance test is In terms of the defect rate, the second embodiment

The multilayer ceramic capacitor F and ΓA G of the sample were significantly lower than the laminated ceramic capacitor H of Comparative Example 2. In particular, the defect rate of the moisture resistance test in the sample G was state. Further, in the multilayer ceramic capacitor H t of Comparative Example 2, it was observed that even if it was judged to be from 0 to J Θ艮 σ after the moisture resistance test, the resistance value after measuring the s type was lower than that before the test. Further, from the laminated ceramic capacitor G of the second embodiment, the gap was not detected at the end portion of the internal electrode, and the laminated ceramic capacitor of Comparative Example 2 was only in the central portion of the laminated direction, and the internal electrode of the scorpio Some micro-gap was observed at the end. [Embodiment 3] First, a ceramic slurry mainly composed of titanium/amp; L 钡 ceramic powder which is resistant to yttrium, earth + #放 < a > is used, so that the thickness is 2 〇 Coffee a | Formed with a rectangular ceramic unprocessed piece of m. The ten-reduced titanate locks are blessed! Signature, 士. „ . 糸 奋 奋 , , , , 糸 糸 糸 糸 糸 糸 ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’

BaTiOs, the proportion of 1 mol% will be ancient v ^ , , 3 〗 3 Υ 2 〇 3 of the main component is 100 m 〇 l%, is to use a ratio of lmol% blended with Mg 〇 material. Next, on the ceramic unprocessed w ^ 士 τ & on-chip 'will be replaced with an average granules for 〇. 3 # m of nickel powder 100 weight price Pangu drag u ^ -, organic binder 3.0 parts by weight of conductivity t As a conductive paste for internal electrode formation, the conductive paste for Rayker X was screen-printed to have a short side width of 800 // m to form an internal electrode pattern. Next, the ceramic material is blended (the ceramic material constituting the gap portion, (4) is added in proportion to the effective layer, and the pottery is used: the material is nostalgic. 5 〇 〇i % of the Taman material) 29 200908043 100 parts by weight and organic knot Agent 3 Q parts by weight of the ceramics f, screen printed around the internal electrode pattern to eliminate the difference between the internal electrode pattern and its surroundings, wherein BaTi03, lm〇 (8) is contained in a ratio of 99% to 99%. The main component of 丨έ2丨έ3〇 is 〇〇m〇]0/. The ceramic material was blended with Mg 〇 as an additive at a ratio of 0.5 mol%. Then, 240 pieces of the Tauman unprocessed sheet on which the conductive paste and the ceramic paste were printed were laminated, and each of the 7-inch sheets was formed in the above-described manner and the ceramic electrode was not formed into the inner electrode pattern (outer layer ceramics) Unprocessed film) Laminated on the upper and lower sides, by adding I in the thickness direction and giving (4), the length is 2.0mmx width! .〇_thickness] The raw wafer mouth of the bribe is fired into the ceramic sintered body). The original wafer was fired at a temperature of 1300 C to obtain a ceramic sintered body having a length of l_6 mmx and a width of 88 mmx and a thickness of 8 mm. Further, a conductive paste was formed on both ends of the exposed surface of the internal electrode of the obtained ceramic composition, and baked to form an external terminal electrode, thereby producing a laminated ceramic capacitor 1 (Sample I). The ceramic material constituting the gap portion is composed of a ratio of Wo (4) 〇 3, lm 〇 1%, and a main component of I% (10) is blended with a ratio of _ as an additive. The addition ratio of Mg〇 is one more than that of the ceramic material in the effective layer portion. 1% of the material is used, and the other layer is made of the laminated ceramic capacitor j (sample). In the month y, the material of the ceramic material constituting the gap portion contains BaTi03 in a ratio of 99% to 1%, and the ratio of lm 2 〇 3 in the ratio of lm 2 〇 3 is 100 30 200908043 moiy. It is used to blend Mg 〇 as a competition material in a ratio of 2 m 〇m (the ratio of MgO added to the lining of the effective layer is: 夕 物 : : : : : :) The lm〇1/° piece is used to make a laminated ceramic capacitor K (sample K). The β-open/same strip, the ceramic material constituting the gap portion, contains BaTi〇3 in a ratio of 99% to 1%, and the ratio of lm〇l% contains z soil composition of 1 〇〇 mol%, which is used. M. ^ ί ί ί ί ί ί ί ί ί ί ί 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶 陶With the laminated ceramic capacitor] 2

In the same manner, a multilayer ceramic capacitor L (sample L) was produced. D. In order to compare, the ceramic material constituting the gap portion contains BaTi〇3 in a ratio of 99% to 1%, and the ratio of lm〇1% is contained. ! The main component is loo mol%, which is a pottery material that is used as an additive in the ratio of lm〇1% (the material used in the active layer: the same material) 'others' with the laminate Tao Capacitor! In the same condition, a laminated ceramic capacitor crucible (sample M) was produced. Next, the multilayer ceramic capacitors of the third embodiment (sample port, ), K, L, and the laminated ceramic capacitor of Comparative Example 3 were subjected to a test of applying a 0-5 V straight peach voltage to a laminate having a resistance value of ι or less. The ceramic capacitor is a defective product, and the others are selected for good quality. Then, the moisture resistance test is performed on the selected product to confirm the moisture property. The temperature measurement is 125. (3, humidity is 95% RH, and 5V DC is applied. Voltage, hold time @ 144 hours '(4)】 Apply the DC voltage after the test. 'The resistance value is determined to be poor in moisture resistance after the service is printed. 31 200908043 Table ^^„The layer (4) capacitance L and ratio of Example 3 Example 3 laminated ceramic capacitors), the poorly selected before the moisture resistance test =:)... Each of the (10) investigated moisture resistance test failure rate ^ quantity; ^ after the good ----- MgO blend Proportion (mol%) L clothes>3′′ ----, T 1 Poorness rate before moisture resistance test Poorness test rate Test sample I — (Example) — 1.5 0.20% 0% Sample J J implementation Example) 1.75 0% 0% sample K a case) 2 ___ 0.40% 0% sample L a case) 2.5 0.4 0% 8% of the following materials: 3) 1 0.40% 19% As shown in Table 3, the multilayer ceramic capacitors (samples) I, K, L of Comparative Example 3 and the multilayer ceramic capacitor of Comparative Example 3 were confirmed ( Sample No.) The moisture failure rate before the test was substantially the same, but the samples I, K, and L of Example 3 were significantly lower than the sample of Comparative Example 3 in terms of the moisture resistance test failure rate. In the case of the sample j of the example of the sample of 75 m〇i%, the defect rate before the test of the wetness and moisture test. The defect rate after the test of the wetness test was also 0%. Further, the amount of addition of MgO was 15 m〇i%. The sample of the example I of the case 32 200908043 The odds ratio before the / fool test is 0.20%, but the bad side after the moisture resistance test

The sample of the example in which the amount of addition was 2 mol% was 0.40% before the moisture resistance test, but the defect rate after the moisture resistance test was also 0%. In the case of the case where the amount of addition of MgO was 2.5 mol%, the case of L @ '@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@@ When the sample Μ ' of Comparative Example 3 and the other vehicle, κ, which meets the requirements of the present invention, the moisture resistance test failure rate is high. - y In addition, in the sample of Comparative Example 3, it was observed that even if it was judged to be a good product after moisture resistance/test, the resistance value after the test was lower than before the test. In each of the above-described embodiments and examples, the case where the effective layer portion does not contain Mg is described as an example, and in the comparative example 3, the case where the effective layer portion is added to the Taman is described as an example. However, regardless of whether or not the ceramic constituting the layer portion contains Mg, the present invention can be obtained by making the Mg 3-rich rate of the Mg-rich layer higher than the effective layer portion < Basic effect. Further, in the above-described embodiment and the embodiment, although the laminated ceramic capacitor is used as an example, the present invention is not limited to the laminated container, and can be widely applied to an internal laser/Ni electrode having Ni. Various laminated ceramic electronic parts such as laminated thermistors or laminated inductors. Further, the present invention is not limited to the above embodiment, and the laminated form of the ceramic layer and the internal electrode or the number of the 01 accumulated layers, the effective layer portion or the side surface side, and the end surface side gap portion ^ The type of eucalyptus and the group containing Ni 33 200908043 internal electrode (4) can be used in various applications or modified within the scope of the present invention. As described above, according to the present invention, it is possible to provide moisture resistance reliability of a laminated ceramic electronic component having a structure in which an internal electrode is transmitted through a ceramic layer in a ceramic sintered body, and is resistant to moisture even in the case of miniaturization. The high-quality multilayer ceramic electronic parts. Therefore, the present invention is suitable for use in various laminated ceramic electronic parts such as multilayer ceramic capacitors, laminated thermistors, and laminated inductors used in various applications. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a laminated ceramic electronic component (layered ceramic capacitor) according to a first embodiment of the present invention. Figure 2 is a cross-sectional view taken along line A-a of Figure 1. Figure 3 is a cross-sectional view taken along line b-b of Figure 1. Fig. 4 is a view for explaining the configuration of a multilayer ceramic capacitor according to Embodiment 1 of the present invention. Fig. 5 is a cross-sectional view of an essential part for explaining the action of the multilayer ceramic capacitor according to the first embodiment of the present invention. 6(a) and 6(b) are diagrams showing a method of manufacturing a multilayer ceramic capacitor according to a second embodiment of the present invention. Fig. 7 is a side cross-sectional view showing a configuration of a multilayer ceramic capacitor according to a second embodiment of the present invention. Fig. 8 is a side view showing a configuration of a multilayer ceramic capacitor according to a second embodiment of the present invention. Fig. 9 is a side cross-sectional view showing a configuration of a multilayer ceramic capacitor according to a third embodiment of the present invention. Fig. 11 (a) and (b) are views showing a method of manufacturing a multilayer ceramic capacitor according to a third embodiment of the present invention. [Description of main component symbols] 1: First internal Electrode 2: second internal electrode 3: ceramic layer 3a: effective layer portion 3b: outer layer I0: ceramic sintered body II: first end face 12 of ceramic sintered body: second end face 13b of ceramic sintered body: vertical projection region, 21: the first side surface 22 of the ceramic sintered body: the second side surface 3 1 of the ceramic sintered body: the first external terminal electrode 32: the second external terminal electrode 41: the ceramic unprocessed sheet 42: the conductive paste 42p: the internal electrode pattern 43: Ceramic paste 35 2 00908043 GE : End face side gap part GE1 : End face side gap part and 1st

Gs : side side gap portion GS1 : side side gap portion and first, L: cutting line

Mr : rich in Mg area 2 area where the internal electrodes are adjacent 2 area adjacent to the internal electrodes 36

Claims (1)

200908043 X. Patent application scope: 1. A laminated ceramic electronic component, comprising: a ceramic sintered body, wherein the plurality of ceramic layers are opposite to each other, and the first side and the 坌9 have the opposite sides of each other and opposite to each other. The first inner electrode of the first end face of the brother 1 is formed on the ith end face, and contains the inside of the #Ni Hai ceramic sintered body and is led out to the second inner Deng electrode, which is attached to the ceramic body. The ceramic layer 疋 in the inner portion of the sintered body is transmitted through the first inner electrode of the "fhai", and is led to the second surface of the crucible, and contains Ni; the external terminal electrode of the mountain brother 2, the end face The first part of the Shou ceramics sintered body, the internal electrode of the younger brother 1 is electrically connected, and the second external terminal electrode is formed on the end face 'and the second internal electric body, the body 2 The external terminal electrode is different from the potential of the ith ^ J, and the ceramic sintered body comprises: the ceramic layer is held at the pole and contributes to the formation of a capacitance =: The second internal electricity exists in the first and the ninth B n* tm 1 - the side of the inner 4 electrode and the side of the ceramic layer amp&#1, the second side, and the side of the effective layer of the first and second sides of the corpus callosum a side-side gap portion between the ceramics; a region in which the side-side gap portion is adjacent is a Mg concentration higher than that of the branch layer, the inner electrode 2, and the inner electrode 2, as in the patent application range; Mg area. The laminated ceramic electronic component of the member, wherein, 37 200908043, the region of the surface-side gap portion is located in the region equal to the i-th and the south, and is the Mg-rich region. The electrode layer 3, the multilayer ceramic electronic component of the first aspect of the patent application, the side side gap portion as a whole is the Mg-rich region electronic component, wherein, as in any one of claims 1 to 3 a part of the ceramic sintered body comprising: the end portion of the first electric effective electrode portion between the end portion of the first electric electrode and the second end surface of the ceramic sintered body; and the ceramic sintered body The end face side gap portion; # & between the first faces, at least the region of the i-th and second inner electrodes of the end face-side gap portion is a Mg-rich region having a concentration higher than the effective layer portion. 5. The laminated ceramic electrical component according to any one of the first to third aspect, wherein the side surface side gap of the ceramic layer outside the innermost electrode of the outermost outer layer of the first and second inner electrodes is obtained. At least one of the vertical projection region of the portion and the vertical projection region of the end surface side gap portion is a Mg-rich region having a concentration still existing in the effective layer portion. 6. The laminated ceramic electronic component of claim 4, wherein the vertical projection area of the side gap portion of the outer layer of the inner electrode of the innermost electrode of the first and second inner electrodes is made. And at least one of the vertical projection regions of the end face side gap 为 is a Mg-rich region having a Mg concentration higher than the effective layer portion. 7. The laminated ceramic electronic component according to any one of claims 1 to 3, wherein 'the ratio of Mg added to the main component constituting the Mg-rich ceramic material is 100% by mol, which is effective compared to the composition. 38 of the layer 200908043 The main component of the pottery material is 100mo_ Mg added in a proportion of more than 5 1 .Omol%. 8. The laminated ceramic electronic component according to item 4 of the patent application, wherein the main component of the ceramic material rich in the Mg region is (10) (9), and the Mg addition ratio is compared with the effective layer portion. The main component of the ceramic material is lOOmol% of Mg added in a proportion of more than 〇"〇} 〇m〇i%. 9. The laminated ceramic electronic component of claim 5, wherein the main component of the ceramic material rich in the Mg region is 嶋. Then, the Mg addition ratio ' is more than the main component of the ceramic material constituting the effective layer portion, and the Mg addition ratio is more than 5%. 1. In the case of the laminated ceramics electronic component of the sixth item of the patent scope, the main component of the ceramic material constituting the Mg-rich zone is 100 丨 eu 丨 丨 匕 匕 匕 匕 匕 匕 匕 100 100 100 100 % % % g~, plus ratio; j: the main component of the ceramic material constituting the effective layer portion is 1〇〇1"〇丨% of the cerium addition ratio is more than O.Si.Omol%. For example, in the laminated ceramics 任 of any of the patent scopes, the concentration of the rich scented area towel has a concentration gradient that decreases from the lateral side to the inner side of the terracotta k-body. J2 is a laminated ceramic electronic component according to item 4 of the patent application scope, wherein the Mg concentration of the Mg zone towel at 2 °H has a concentration gradient which decreases from the side to the inner side of the ceramic body. 13. In the scope of the patent application, the concentration gradient in which Mg is reduced to the inside in the Mg-rich region. 14. The laminated ceramic electronic component of claim 5, wherein the concentration has a laminated ceramic electronic component from the outer side of the ceramic sintered body, and in 39 200908043, the Mg concentration in the Mg-rich region has a ceramic sintered body. The concentration gradient of the outer side decreases to the inner side. XI. Schema: as the next page 40