200912182 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種發光二極體燈具，特別係指一種具有 散熱模組的發光二極體燈具。 【先前技術】 隨著科學技術的進步，從一般鎢絲燈發展到現在的冷 陰極熒；光燈管（Cold Cathode Fluorescent Lamp, CCFL)及 發光二極體（Light Emitting Diode，LED)，皆係朝向體積 縮小及扁平化的方向發展。 而目前CCFL因為體積幾乎係不能再縮小，而且CCFL 升壓到600伏特電壓時會發生干擾，另外CCFL會造成汞污 染的問題，使得部分國家也將予以禁用。而LED具有環保、 亮度高、省電、壽命長等諸多特點，所以LED將漸漸取代 CCFL·。然而，現今的高亮度LED所產生的局部熱量較大， 若要取代CCFL作為.照明產品，則必須要有合適的散熱設 計；否則會造成LED發光效率降低及壽命縮短等問題。 另外，LED所需要的電源為直流、低電壓，故用於驅 動鎢絲燈、冷陰極熒光燈管等的交流電源不適合直接驅動 LED燈具。為此，LED燈具中通常採用交直流轉換裝置將交 流電源轉換成直流電源以便驅動LED燈具。然而，交直流 轉換裝置在工作過程中會產生大量的熱量，若不能將其產 生的熱量及時散發，造成交直流轉換裝置的溫度升高，將 導致交直流轉換裝置的能源轉換效率降低，並會導致交直 200912182 流轉換裝置輸出的電流、電壓不穩定，從而造成LED發光 效率降低等問題。 因此有關LED及交直流轉換裝置的散熱係目前業界亟 需克服的難題。 【發明内容】 有鑒於此，實有必要提供一種散熱良好、工作穩定的 發光二極體燈具。 一種發光二極體燈具，包括一發光二極體模組和與該 發光二極體模組電性連接的一交直流轉換裝置。其中，該 發光二極體燈具還包括一散熱裝置，該散熱裝置包括一基 板，該發光二極體模組和該交直流轉換裝置並列地設於該 基板上。 與習知技術相比，本發明將發光二極體模組和交直流 轉換裝置並列地設於該基板上，可通過該基板同時對發光 二極體模組和該交直流轉換裝置進行散熱，以確保整個燈 具工作於正常的溫度範圍内，從而可確發光二極體燈具正 常、穩定地工作。 【實施方式】 圖1所示為本發明一實施例中的發光二極體燈具。該發 光二極體燈具包括一散熱裝置100、一發光二極體模組200 和兩個交直流轉換裝置300，該交直流轉換裝置300與該發 光二極體模組200電性連接。其中，該發光二極體模組200 和兩個交直流轉換裝置300並列地放置於散熱裝置100的上 7 200912182 .表面，該發光二極體模組200和兩個交直流轉換裝置300產 生的熱量可通過該散熱裝置100散發到外部環境中去。 請一併參考圖2及圖3,該散熱裝置100包括一散熱器 110和嵌入該散熱器110上表面的複數熱管120。該散熱器 110包括一大致呈矩形的基板112，和自基板112下表面延伸 而出的複數散熱片114。在基板112的上表面設有複數相互 平行的溝槽1120，該等溝槽1120自基板112的一端向基板 112的另一端延伸。如圖2中散熱器110所處的位置，該等溝 槽1120沿著基板112的長度方向從散熱器110的後端區域延 伸至散熱器110的前端區域。 上述熱管120——對應地放入該等溝槽1120内，如此， 該等熱管120即被嵌入基板112内並從基板112的一端延伸 至基板112的另一端。該等熱管120呈扁平狀，且該等熱管 120的上表面與基板112的上表面處於同一平面内以便散熱 器110和熱管120與發光二極體模組200接觸，並降低散熱裝 置100與發光二極體模組200之間的熱阻。此外，在基板112 上的溝槽1120的兩侧分別設有複數的螺紋孔1122，利用螺 絲（圖中未示）等固定元件穿過發光二極體模組200並旋合 於相應的螺紋孔1122内即可將發光二極體模組200固定在 散熱器110的上表面並令熱管120與發光二極體模組200直 接接觸。 該發光二極體模組200包括複數長條形的電路板210和 設於每一個電路板210上的複數發光二極體220。該等電路 板210沿著熱管120的延伸方向平行地放置於基板112的後 8 200912182 .端區域，並令每一個電路 120，該支熱管120在謗相 對應地没置有一支熱管 路板職伸至基板^t的^板加下方延伸並超出電 穿過電路板2職旋合^^域。制螺料固定元件 板则定在散議^目孔1122㈣可將電路 的上表面，並令熱管120盥雷敗妃 210接觸。此外，該等電 ”书路板 路极210與父直流轉換梦晉％ 連接，當交直流轉換裴置3〇 ' 電性 罝3〇〇將父、"IL電源轉換 過電路板210驅動發光二極 取直1¾源通 吝斗从舳旦^r v .dr與也體2204先守，發光二極體220所 熱器110和熱管12〇吸收並散發到外部 環境中去。與此同時，哕六古士絲说壯 狀知判外邛 曰 Λ又直/爪軺換裝置3〇〇也會產生埶 罝’且其產生的熱量也可以姑兮坪勒。 ”、、 l」以被該政熱态11〇和埶管 收、散發到外部環境中去。以下4+斟吁上士 …㈢丄川及 ^ ^ 1ΠΠ . ρ. „ ，十士 Μ又直流轉換裝置300 與散熱裝置100之間的具體位置關係等進行說明。 每一個交直ΐ轉換與—定數量的電路板210電 性連接。該父直概轉換袭置耀包括—驅動電路板則、設 於該驅動電路板3紙的複數電容32〇，和設於該驅動電路 板310上並會產生权夕熱量的發熱電子元 效應電晶™Ε”等。其中’該驅動 有驅動電豸（圖中未不）用以實現交直流轉換，該等電容 320位於驅動電路板3U)的上方，而發熱電子元件％◦位於驅 動電路板310的下方。 略板310相互平 ’並令驅動電路 營120延伸至電 兩個父直、"ι(·轉換裝置3〇〇的兩個驅動電 行、並列地設置於基板112的前端的上表面 板310上的發熱電子元件33〇與基板112和熱 9 200912182 .路板210外部的部分同時直接接觸。這樣一來，交直流轉換 裝置300的發熱電子元件330所產生的熱量，可以被基板112 — 和熱管120同時吸收，從而可確保交直流轉換裝置300工作 於正常的溫度範圍内，以確保發光二極體220的正常發光。 如上所述，驅動電路板310和電路板210均設於基板112 的上表面，且熱管120從電路板210的下方延伸至驅動電路 板310的下方。換言之，每一個熱管120可以劃分為兩段， , 即位於電路板210和基板112之間的第一段和位於驅動電路 板310和基板112之間的第二段。發光二極體220和交直流轉 換裝置300產生的熱量可同時被基板112和熱管120吸收，並 傳導給散熱片114進而散發到外部環境中去，從而可以確保 發光二極體燈具工作於正常的溫度範圍内。 圖4至圖6所示為本發明另一實施例中的發光二極體燈 具的散熱裝置l〇〇a與交直流轉換裝置300a。該交直流轉換 裝置300a與上一實施例中的交直流轉換裝置300之間的主 〔 要不同之處在於：該交直流轉換裝置300a的發熱電子元件 330a和電容320a設於驅動電路板310a的上方。該散熱裝置 100a與上一實施例中的散熱裝置100之間的主要不同之處 在於：該散熱裝置l〇〇a還包括設於基板112a前端的複數熱 傳導元件130a，如導熱膠、金屬塊等。該散熱裝置100a和 該交直流轉換裝置300a以與上一實施例中相同的排列方式 組裝在一起，並令該等熱傳導元件130a位於驅動電路板 310a和基板112a之間。這樣一來，交直流轉換裝置300a產生 的熱量通過該熱傳導元件130a傳遞給基板112a和熱管 10 200912182 120a，進而散發到外部環境中去。 在上述實施例中’發光二極體燈具包括兩個交直流轉 換裝置；根據實際使用狀況可以改變交直流轉換裝置的數 量’如-個、三個等，以及每-個交直流轉換裝置驅動的 電路板的數量等。 綜上所述，本發明確已符合發明專利之要件，遂依法200912182 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode lamp, and more particularly to a light-emitting diode lamp having a heat-dissipating module. [Prior Art] With the advancement of science and technology, from the development of general tungsten filament lamps to the current cold cathode fluorescent lamps; Cold Cathode Fluorescent Lamps (CCFLs) and Light Emitting Diodes (LEDs), It is moving in the direction of shrinking and flattening. At present, the CCFL can hardly shrink because of the volume, and the CCFL will increase to 600 volts, and the CCFL will cause mercury pollution, which will be banned in some countries. LED has environmental protection, high brightness, power saving, long life and many other characteristics, so LED will gradually replace CCFL. However, today's high-brightness LEDs generate a large amount of local heat. To replace CCFL as a lighting product, it is necessary to have a proper heat dissipation design; otherwise, LED lighting efficiency will be reduced and life will be shortened. In addition, the power supply required for the LED is DC and low voltage, so the AC power source for driving the tungsten filament lamp, the cold cathode fluorescent lamp, etc. is not suitable for directly driving the LED lamp. To this end, LED lamps typically use an AC-DC converter to convert the AC power to a DC power source to drive the LEDs. However, the AC/DC converter will generate a large amount of heat during the working process. If the heat generated by the AC/DC converter cannot be dissipated in time, the temperature of the AC/DC converter will increase, which will cause the energy conversion efficiency of the AC/DC converter to decrease. The current and voltage output of the current conversion device of 200912182 are unstable, which causes problems such as reduced LED luminous efficiency. Therefore, the heat dissipation of LEDs and AC/DC converters is currently a problem that the industry needs to overcome. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a light-emitting diode lamp with good heat dissipation and stable operation. An illuminating diode lamp includes a illuminating diode module and an AC/DC converting device electrically connected to the illuminating diode module. The illuminating diode lamp further includes a heat dissipating device, and the heat dissipating device includes a substrate, and the illuminating diode module and the AC/DC converting device are juxtaposed on the substrate. Compared with the prior art, the light emitting diode module and the AC/DC converter are arranged side by side on the substrate, and the light emitting diode module and the AC/DC converter device can be simultaneously dissipated through the substrate. In order to ensure that the entire luminaire works within the normal temperature range, the illuminating diode lamp can work normally and stably. Embodiments FIG. 1 shows a light-emitting diode lamp according to an embodiment of the present invention. The illuminating diode device includes a heat dissipating device 100, a illuminating diode module 200, and two AC/DC converting devices 300. The AC/DC converting device 300 is electrically connected to the illuminating diode module 200. The LED module 200 and the two AC/DC converters 300 are placed side by side on the surface of the heat sink 100, and the LED module 200 and the two AC/DC converters 300 are generated. Heat can be dissipated to the external environment through the heat sink 100. Referring to FIG. 2 and FIG. 3 together, the heat sink 100 includes a heat sink 110 and a plurality of heat pipes 120 embedded in the upper surface of the heat sink 110. The heat sink 110 includes a substantially rectangular substrate 112 and a plurality of fins 114 extending from a lower surface of the substrate 112. A plurality of mutually parallel grooves 1120 are provided on the upper surface of the substrate 112, and the grooves 1120 extend from one end of the substrate 112 toward the other end of the substrate 112. The trenches 1120 extend from the rear end region of the heat sink 110 to the front end region of the heat sink 110 along the length direction of the substrate 112, as in the position where the heat sink 110 is located. The heat pipes 120 are correspondingly placed in the grooves 1120 such that the heat pipes 120 are embedded in the substrate 112 and extend from one end of the substrate 112 to the other end of the substrate 112. The heat pipes 120 are flat, and the upper surfaces of the heat pipes 120 are in the same plane as the upper surface of the substrate 112 so that the heat sink 110 and the heat pipe 120 are in contact with the light emitting diode module 200, and the heat sink 100 and the light emitting device are lowered. Thermal resistance between the diode modules 200. In addition, a plurality of threaded holes 1122 are respectively disposed on the two sides of the groove 1120 of the substrate 112, and the fixing elements are passed through the LED module 200 by screws (not shown) and screwed into the corresponding threaded holes. The light-emitting diode module 200 can be fixed on the upper surface of the heat sink 110 in 1122 and the heat pipe 120 is directly in contact with the light-emitting diode module 200. The LED module 200 includes a plurality of strip-shaped circuit boards 210 and a plurality of LEDs 220 disposed on each of the circuit boards 210. The circuit boards 210 are placed in parallel along the extending direction of the heat pipe 120 in the rear end region of the substrate 112, and each of the circuits 120, the heat pipe 120 is not provided with a heat pipe plate. The plate extending to the substrate ^t is extended below and beyond the electrical circuit through the circuit board 2 job. The screw fixing member plate is set in the upper hole 1122 (four) to connect the upper surface of the circuit, and the heat pipe 120 is defeated by 210. In addition, the electric circuit board circuit pole 210 is connected with the parent DC conversion dream, and when the AC/DC conversion device is set to 3〇', the electric power is converted to the circuit board 210 to drive the light. The two poles take the straight 13⁄4 source through the bucket from the ^旦^rv.dr and the body 2204 first, the light-emitting diode 220 heatstor 110 and the heat pipe 12〇 are absorbed and distributed to the external environment. At the same time, Six Gussi said that the Zhuangzi knows that the outer scorpion is straight and the claws are changed. The 〇〇 〇〇 〇〇 〇〇 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且The hot state 11〇 and the manifold are collected and distributed to the external environment. The following 4+ 斟 上 ... ... ( ( ( ( ( ( ( ( ( ( ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十 十The plurality of circuit boards 210 are electrically connected. The parent straight circuit includes a driving circuit board, a plurality of capacitors 32 设 disposed on the driving circuit board 3, and is disposed on the driving circuit board 310 and generates The heating electron element effect of the power of the eve of the electric crystal TM Ε" and so on. Wherein the drive has a drive power (not shown) for AC/DC conversion, the capacitor 320 is located above the drive circuit board 3U), and the heat generating electronic component % is located below the drive circuit board 310. The slabs 310 are flush with each other and the driving circuit battalion 120 is extended to the two upper electrodes, and the two driving electric lines of the switching device 3 are arranged side by side on the upper surface plate 310 of the front end of the substrate 112. The upper heat generating electronic component 33 is directly in direct contact with the substrate 112 and the heat external portion of the circuit board 210. Thus, the heat generated by the heat generating electronic component 330 of the AC/DC converting device 300 can be generated by the substrate 112 - and The heat pipe 120 is simultaneously absorbed, thereby ensuring that the AC/DC converter 300 operates within a normal temperature range to ensure normal illumination of the LED 220. As described above, the driving circuit board 310 and the circuit board 210 are both disposed on the substrate 112. The upper surface, and the heat pipe 120 extends from below the circuit board 210 to below the drive circuit board 310. In other words, each heat pipe 120 can be divided into two segments, that is, a first segment located between the circuit board 210 and the substrate 112 and located The second section between the driving circuit board 310 and the substrate 112. The heat generated by the light emitting diode 220 and the AC/DC converting device 300 can be simultaneously absorbed by the substrate 112 and the heat pipe 120 and transmitted to the heat sink. 114 is further distributed to the external environment, so that the illuminating diode lamp can be operated in a normal temperature range. FIG. 4 to FIG. 6 show a heat dissipating device of the illuminating diode lamp according to another embodiment of the present invention. 〇〇a and AC/DC converter 300a. The main difference between the AC/DC converter 300a and the AC/DC converter 300 of the previous embodiment is: the heat-generating electronic component 330a of the AC-DC converter 300a The capacitor 320a is disposed above the driving circuit board 310a. The main difference between the heat sink 100a and the heat sink 100 of the previous embodiment is that the heat sink 10a further includes a front end of the substrate 112a. a plurality of heat conducting elements 130a, such as a thermal conductive paste, a metal block, etc. The heat sink 100a and the AC/DC converting device 300a are assembled in the same arrangement as in the previous embodiment, and the heat conducting elements 130a are located on the driving circuit board. Between the 310a and the substrate 112a, heat generated by the AC/DC converting device 300a is transmitted to the substrate 112a and the heat pipe 10 through the heat conducting element 130a. And in the above embodiment, the 'light-emitting diode lamp includes two AC-DC converters; the number of AC-DC converters can be changed according to actual use conditions, such as -, three, etc., and The number of circuit boards driven by each AC-DC converter device, etc. In summary, the present invention has indeed met the requirements of the invention patent,
提出專射請。惟，以上所述者僅為本發明之較佳實施Z 自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝 =人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 〜叫 【圖式簡單說明】 圖。圖1係本發明—實施例中發光二極體燈具的部分分解 圖 圖2係圖交直流轉㈣置與散㈣置的立體分解 上 圖3係圖2中的交直流轉換裳 時的立體分解圖。 1，、政熱衣置的底部朝 圖4係本發明另一實施例 轉換#晋盥# # & 知九一極體燈具的交直流 将換装置與放熱裝置的立體圖。 圖5係圖4的分解圖。 圖6係圖5中的交直流轉換 時的立體分解圖。㈣裝置與散㈣置的底部朝上 11 200912182 【主要元件符號說明】 散熱裝置 100 、 100a 散熱器 110 基板 112 、 112a 溝槽 1120 螺紋孔 1122 散熱片 114 教管 120 > 120a 發光二極體模組 200 電路板 210 發光二極體 220 交直流轉換裝置 300 > 300a 驅動電路板 310、 310a 電容 320 、 320a 發熱電子元件 330、 330a 熱傳導元件 130a 12Make a special shot please. However, the above description is only a preferred embodiment of the present invention. Z is not intended to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons in accordance with the spirit of the present invention are intended to be within the scope of the following claims. ~ Call [Simple diagram description] Figure. 1 is a partial exploded view of a light-emitting diode lamp according to the present invention - FIG. 2 is a three-dimensional exploded view of AC-DC (four) and scattered (four). Figure 3 is a three-dimensional decomposition of the AC-DC converter in FIG. Figure. 1, the bottom of the political hot clothes is shown in Fig. 4 is another embodiment of the present invention. Conversion #晋盥# # & The AC and DC of the nine-pole body lamp will be a perspective view of the device and the heat release device. Figure 5 is an exploded view of Figure 4. Fig. 6 is an exploded perspective view showing the AC-DC conversion in Fig. 5. (4) Device and dispersion (4) placed bottom up 11 200912182 [Main component symbol description] Heat sink 100, 100a Heat sink 110 Substrate 112, 112a Groove 1120 Threaded hole 1122 Heat sink 114 Teaching 120 > 120a Light-emitting diode Group 200 Circuit Board 210 Light Emitting Diode 220 AC/DC Converter 300 > 300a Drive Circuit Board 310, 310a Capacitance 320, 320a Heated Electronic Components 330, 330a Thermal Conduction Element 130a 12