TW200920799A - Coating composition and article using the same - Google Patents

Coating composition and article using the same Download PDF

Info

Publication number
TW200920799A
TW200920799A TW097132252A TW97132252A TW200920799A TW 200920799 A TW200920799 A TW 200920799A TW 097132252 A TW097132252 A TW 097132252A TW 97132252 A TW97132252 A TW 97132252A TW 200920799 A TW200920799 A TW 200920799A
Authority
TW
Taiwan
Prior art keywords
fluoropolymer
coating
coating composition
solvent
article
Prior art date
Application number
TW097132252A
Other languages
English (en)
Chinese (zh)
Inventor
Fumio Karasawa
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200920799A publication Critical patent/TW200920799A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
TW097132252A 2007-08-23 2008-08-22 Coating composition and article using the same TW200920799A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007217386A JP2009051876A (ja) 2007-08-23 2007-08-23 コーティング組成物及びそれを使用した物品

Publications (1)

Publication Number Publication Date
TW200920799A true TW200920799A (en) 2009-05-16

Family

ID=40378954

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097132252A TW200920799A (en) 2007-08-23 2008-08-22 Coating composition and article using the same

Country Status (6)

Country Link
EP (1) EP2183329A4 (de)
JP (1) JP2009051876A (de)
KR (1) KR20100063083A (de)
CN (1) CN101784622A (de)
TW (1) TW200920799A (de)
WO (1) WO2009026284A2 (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
GB2462824A (en) * 2008-08-18 2010-02-24 Crombie 123 Ltd Printed circuit board encapsulation
KR101574374B1 (ko) 2008-08-18 2015-12-03 셈블란트 리미티드 할로-하이드로카본 폴리머 코팅
WO2010106472A1 (en) * 2009-03-17 2010-09-23 Koninklijke Philips Electronics N.V. Led strip for small channel letters
US8697458B2 (en) 2009-04-22 2014-04-15 Shat-R-Shield, Inc. Silicone coated light-emitting diode
DE102009032424A1 (de) * 2009-07-09 2011-01-13 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung mit einer flexiblen Leiterplatte
WO2011064861A1 (ja) * 2009-11-26 2011-06-03 Cheng Chiang-Ming 多機能照明装置
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
TWI509838B (zh) * 2010-04-14 2015-11-21 黃邦明 具氟化聚合物之表面塗層的發光二極體外殼及其發光二極體結構
EP2563858B1 (de) 2010-04-30 2013-12-11 Solvay Specialty Polymers Italy S.p.A. VDF-Polymerzusammensetzung
US20120036750A1 (en) * 2010-08-12 2012-02-16 Sun Inno Tech Internally Illuminated Panel and Method of Making the Same
EP2428537A1 (de) * 2010-09-13 2012-03-14 Sika Technology AG Abdichtungsmembran mit verbesserter Haftung
RU2505572C2 (ru) * 2012-04-26 2014-01-27 Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" Лаковая композиция
CN102977700B (zh) * 2012-12-28 2016-05-04 上海电缆研究所 一种全面改善架空导线性能的涂料
ITMI20130350A1 (it) * 2013-03-07 2014-09-08 Davide Zanesi Processo di stampaggio di circuiti elettronici su supporti tessili tramite tecnologia serigrafica, con l¿ utilizzo di materiale elettricamente conduttivo, termoelettrico o elettro-luminescente.
US10103037B2 (en) * 2014-05-09 2018-10-16 Intel Corporation Flexible microelectronic systems and methods of fabricating the same
KR102237112B1 (ko) 2014-07-30 2021-04-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 광원 모듈
US9540536B2 (en) 2014-09-02 2017-01-10 E I Du Pont De Nemours And Company Heat-curable polymer paste
EP3196550B1 (de) * 2016-01-20 2018-10-24 OSRAM GmbH Verfahren zur herstellung von beleuchtungsvorrichtungen sowie entsprechende beleuchtungsvorrichtung
DE102016105407A1 (de) * 2016-03-23 2017-09-28 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer elektronischen Vorrichtung und elektronische Vorrichtung
EP3453054A4 (de) * 2016-05-03 2020-01-01 Honeywell International Inc. Lichtemittervorrichtungen und komponenten mit verbesserter chemischer beständigkeit und zugehörige verfahren
JP6632725B2 (ja) * 2016-06-29 2020-01-22 三菱電機株式会社 表示装置
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
JP7123973B2 (ja) * 2017-05-20 2022-08-23 ハネウェル・インターナショナル・インコーポレーテッド Ｍｉｌｋとｌｕｍｉｌｕｘの分散液
KR102186090B1 (ko) 2017-06-15 2020-12-03 주식회사 엘지화학 부분 몰딩 처리된 기판과 부분 몰딩 장치 및 방법
JP2020528097A (ja) * 2017-07-21 2020-09-17 ザ ケマーズ カンパニー エフシー リミテッド ライアビリティ カンパニー 光架橋性フルオロポリマーコーティング組成物及びそれから形成されるコーティング層
KR102445179B1 (ko) * 2017-10-26 2022-09-21 시예드 타이무르 아흐마드 소수성, 올레포빅 및 올레필릭 코팅용 비-뉴턴 유체를 포함하는 조성물, 및 그의 사용 방법
US20210087381A1 (en) 2018-03-15 2021-03-25 Solvay Specialty Polymers Italy S.P.A. Fluoropolymer composition for components of light emitting apparatus
JP6899412B2 (ja) * 2018-07-27 2021-07-07 住友化学株式会社 Ｌｅｄデバイスの製造方法
DE102019205064A1 (de) * 2019-04-09 2020-10-15 Conti Temic Microelectronic Gmbh Verwendung des Stoffs [P(VdF-HFP)HP] als Kühleinrichtung zur Kühlung einer Sensorvorrichtung eines Kraftfahrzeugs
CN113853690A (zh) 2019-05-16 2021-12-28 住友化学株式会社 电子部件和其制造方法
CN113811429A (zh) 2019-05-16 2021-12-17 住友化学株式会社 电子部件的制造方法和电子部件
JP6998362B2 (ja) * 2019-05-16 2022-01-18 住友化学株式会社 電子部品及びその製造方法
JP6856787B1 (ja) * 2020-01-29 2021-04-14 住友化学株式会社 電子部品の製造方法
JP6870128B1 (ja) * 2020-01-30 2021-05-12 住友化学株式会社 フッ素樹脂封止剤及びその製造方法
JP6830168B1 (ja) * 2020-01-30 2021-02-17 住友化学株式会社 電子部品の製造方法
JP6816317B1 (ja) * 2020-01-30 2021-01-20 住友化学株式会社 フッ素樹脂シート及びその製造方法
CN115435299A (zh) * 2022-08-31 2022-12-06 深圳雷曼光电科技股份有限公司 一种led模组的边缘保护方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177150A (en) * 1990-05-10 1993-01-05 Elf Atochem North America, Inc. Powder coatings of vinylidene fluoride/hexafluoropylene copolymers
US5922453A (en) * 1997-02-06 1999-07-13 Rogers Corporation Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates
JP2000017197A (ja) * 1998-04-30 2000-01-18 Daikin Ind Ltd 熱硬化性粉体塗料組成物
DE60117994T2 (de) * 2000-06-30 2006-09-21 3M Innovative Properties Co., Saint Paul Für hohe frequenzen ausgelegtes elektronisches teil, das ein isoliermaterial umfasst, und verfahren zu dessen herstellung
KR100601775B1 (ko) * 2001-04-09 2006-07-19 후지 샤신 필름 가부시기가이샤 화상 형성용 착색 조성물 및 칼라 화상의 내오존성 개선방법
US6878196B2 (en) * 2002-01-15 2005-04-12 Fuji Photo Film Co., Ltd. Ink, ink jet recording method and azo compound
EP1612226B1 (de) * 2003-04-09 2009-12-09 Kuraray Co., Ltd. (meth)acrylharzemulsion und herstellungsverfahren dafür
US20070053179A1 (en) * 2005-09-08 2007-03-08 Pang Slew I Low profile light source utilizing a flexible circuit carrier

Also Published As

Publication number Publication date
JP2009051876A (ja) 2009-03-12
EP2183329A4 (de) 2011-05-11
CN101784622A (zh) 2010-07-21
WO2009026284A2 (en) 2009-02-26
WO2009026284A3 (en) 2009-04-09
EP2183329A2 (de) 2010-05-12
KR20100063083A (ko) 2010-06-10

Similar Documents

Publication Publication Date Title
TW200920799A (en) Coating composition and article using the same
US20110260945A1 (en) Coating Composition and Article Using the Same
TWI786086B (zh) 光學堆疊
Mendez-Rossal et al. Printability and properties of conductive inks on primer‐coated surfaces
TWI650382B (zh) 塗佈裝置的方法以及經塗佈的產品
TW201011073A (en) Curable resin material composition, optical material, light-emitting device, method for producing light-emitting device, and electronic device
JP6954292B2 (ja) 含フッ素重合体、その製造方法、および含フッ素重合体の硬化物を備える物品
CN1610954A (zh) 透明导电膜和该透明导电膜形成用涂敷液及透明导电性叠层结构体和显示装置
Liu et al. A Stable, Self‐Healable, and Stretchable Dielectric Polymer for Electroluminescent Device Working Underwater
US20090035565A1 (en) Bonding layer on fluoropolymers
CN104813499B (zh) 导电透明电极以及相关制造工艺
TWI620359B (zh) 透明電極及相關製造方法
CN108603054A (zh) 使用交联的聚(乙烯醇缩丁醛)底漆层增强银纳米粒子墨水在塑料衬底上的粘附力的方法
JP2015150813A (ja) 配線板用保護フィルム、カバーレイ及びプリント配線板
JP2007231072A (ja) コーティング組成物及びそれを使用した物品
Hwang et al. Embedded silver‐nanowire electrode in an acrylic polymer–silicate nanoparticle composite for highly robust flexible devices
JPWO2013105626A1 (ja) 発光素子および発光素子形成用樹脂組成物
JP5371175B2 (ja) 電子・電気部品用防湿コーティング組成物および防湿コーティング膜の形成方法
TW201623511A (zh) 用光學清透黏著劑直接接合以保護基於奈米大小金屬的新電導體
JP2006282942A (ja) 透明導電性コーティング用組成物、これを塗布してなる透明導電性フィルムおよびその製造方法
JP7211175B2 (ja) 樹脂組成物
WO2020037768A1 (zh) 一种可挠性导电膜及其制备方法
WO2018013889A1 (en) Coated articles that demonstrate push-through electrical connectivity
TWI850767B (zh) 透明導電膜
TWI651345B (zh) 可撓式透明導電膜之製造方法及使用此方法所製造之可撓式透明導電膜、透明電極及有機發光二極體