TW200922776A - Oxidation-resistant composite board assembly - Google Patents

Oxidation-resistant composite board assembly Download PDF

Info

Publication number: TW200922776A
Authority: TW; Taiwan
Prior art keywords: section; metal layer; metal; composite sheet; composite
Prior art date: 2007-11-20

Application number

TW96143920A

Other languages

English (en)

Chinese (zh)

Other versions

TWI329062B (2

Inventor

Xian-De Zheng

Xian-Song Zheng

Original Assignee

Xxentria Technology Materials Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-11-20

Filing date

2007-11-20

Publication date

2009-06-01

2007-11-20 Application filed by Xxentria Technology Materials Co Ltd filed Critical Xxentria Technology Materials Co Ltd

2007-11-20 Priority to TW96143920A priority Critical patent/TW200922776A/zh

2009-06-01 Publication of TW200922776A publication Critical patent/TW200922776A/zh

2010-08-21 Application granted granted Critical

2010-08-21 Publication of TWI329062B publication Critical patent/TWI329062B/zh

Links

239000002131 composite material Substances 0.000 title claims abstract description 54
230000003647 oxidation Effects 0.000 title abstract description 7
238000007254 oxidation reaction Methods 0.000 title abstract description 7
239000010410 layer Substances 0.000 claims abstract description 45
229910052751 metal Inorganic materials 0.000 claims abstract description 39
239000002184 metal Substances 0.000 claims abstract description 39
239000012792 core layer Substances 0.000 claims abstract description 20
229910052755 nonmetal Inorganic materials 0.000 claims abstract description 14
229910000831 Steel Inorganic materials 0.000 claims description 6
230000003064 anti-oxidating effect Effects 0.000 claims description 6
239000010959 steel Substances 0.000 claims description 6
239000000463 material Substances 0.000 claims description 5
229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 5
229910001335 Galvanized steel Inorganic materials 0.000 claims description 4
239000004698 Polyethylene Substances 0.000 claims description 4
239000005038 ethylene vinyl acetate Substances 0.000 claims description 4
239000008397 galvanized steel Substances 0.000 claims description 4
229910000680 Aluminized steel Inorganic materials 0.000 claims description 2
239000004743 Polypropylene Substances 0.000 claims description 2
239000003963 antioxidant agent Substances 0.000 claims description 2
230000003078 antioxidant effect Effects 0.000 claims description 2
230000013011 mating Effects 0.000 claims description 2
PGTXKIZLOWULDJ-UHFFFAOYSA-N [Mg].[Zn] Chemical compound [Mg].[Zn] PGTXKIZLOWULDJ-UHFFFAOYSA-N 0.000 claims 1
229910045601 alloy Inorganic materials 0.000 claims 1
239000000956 alloy Substances 0.000 claims 1
229910052782 aluminium Inorganic materials 0.000 claims 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
229920005606 polypropylene copolymer Polymers 0.000 claims 1
238000005096 rolling process Methods 0.000 claims 1
210000001503 joint Anatomy 0.000 abstract 1
238000005520 cutting process Methods 0.000 description 8
230000000694 effects Effects 0.000 description 4
238000004519 manufacturing process Methods 0.000 description 4
239000011248 coating agent Substances 0.000 description 2
238000000576 coating method Methods 0.000 description 2
238000005260 corrosion Methods 0.000 description 2
230000007797 corrosion Effects 0.000 description 2
238000007747 plating Methods 0.000 description 2
229910000838 Al alloy Inorganic materials 0.000 description 1
VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
-1 Polyethylene Polymers 0.000 description 1
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
238000004026 adhesive bonding Methods 0.000 description 1
229920001577 copolymer Polymers 0.000 description 1
RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
238000001125 extrusion Methods 0.000 description 1
JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
239000000203 mixture Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
230000001590 oxidative effect Effects 0.000 description 1
239000004033 plastic Substances 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
229920000573 polyethylene Polymers 0.000 description 1
230000001629 suppression Effects 0.000 description 1
230000000007 visual effect Effects 0.000 description 1
229910052725 zinc Inorganic materials 0.000 description 1
239000011701 zinc Substances 0.000 description 1

Landscapes

Laminated Bodies (AREA)

TW96143920A 2007-11-20 2007-11-20 Oxidation-resistant composite board assembly TW200922776A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW96143920A TW200922776A (en)	2007-11-20	2007-11-20	Oxidation-resistant composite board assembly

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW96143920A TW200922776A (en)	2007-11-20	2007-11-20	Oxidation-resistant composite board assembly

Publications (2)

Publication Number	Publication Date
TW200922776A true TW200922776A (en)	2009-06-01
TWI329062B TWI329062B (2)	2010-08-21

Family

ID=44728320

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW96143920A TW200922776A (en)	2007-11-20	2007-11-20	Oxidation-resistant composite board assembly

Country Status (1)

Country	Link
TW (1)	TW200922776A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI588023B (zh) *	2015-07-31	2017-06-21		Composite plate combination method and composite plate combination

2007
- 2007-11-20 TW TW96143920A patent/TW200922776A/zh not_active IP Right Cessation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI588023B (zh) *	2015-07-31	2017-06-21		Composite plate combination method and composite plate combination

Also Published As

Publication number	Publication date
TWI329062B (2)	2010-08-21

Similar Documents

Publication	Publication Date	Title
WO2009084848A3 (en)	2009-09-17	Zinc alloy coated steel sheet having good sealer adhesion and corrosion resistance and process of manufacturing the same
WO2008027205A3 (en)	2008-04-24	Self assembled monolayer for improving adhesion between copper and barrier layer
JPH02225200A (ja)	1990-09-07	物品の継手構造とパネルの継手構造と複合パネルの継手構造と継手
WO2009111140A3 (en)	2009-11-05	Corrosion resistant laminated steel
JP2009081356A5 (2)	2010-05-13
JP2010049967A5 (2)	2011-10-13
JP6085202B2 (ja)	2017-02-22	金属化フィルムコンデンサ
MY155827A (en)	2015-12-15	Surface-treated metal plate
WO2001041167A3 (en)	2002-01-17	A contact element and a contact arrangement
TW200628522A (en)	2006-08-16	The polyimide film with increased surface activity
TWI329062B (2)	2010-08-21
WO2005002845A3 (en)	2005-03-17	Laminate with local reinforcement
CN207099547U (zh)	2018-03-13	一种金属镀层聚酰亚胺复合薄膜
JPH04282239A (ja)	1992-10-07	端面耐食性および溶接性に優れた積層鋼板
JP5741934B2 (ja)	2015-07-01	Ｍｇ合金部材、および電気機器の筐体
CN201301529Y (zh)	2009-09-02	一种铝波纹板
CN210316063U (zh)	2020-04-14	一种整体卫浴墙板阳角结构
CN211921413U (zh)	2020-11-13	一种新型pet膜
HK1244754A1 (zh)	2018-08-17	超高阻隔金属化膜
CN2775102Y (zh)	2006-04-26	铝箔牛皮纸多层复合纸
MY182210A (en)	2021-01-18	Aqueous two layer-coated metal plate
CN105033441A (zh)	2015-11-11	爆炸焊接夹层复合板的制造方法
CN212949570U (zh)	2021-04-13	一种多层超厚安全型玻璃
CN219618679U (zh)	2023-09-01	一种镀铝基膜
CN206799508U (zh)	2017-12-26	一种防静电绝缘胶带

Legal Events

Date	Code	Title	Description
2014-05-21	MM4A	Annulment or lapse of patent due to non-payment of fees