200923461 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種成像模組，尤其涉及一種便於組裝、拆 卸之成像模組。 【先前技術】 影像感測器可用於空間中檢測光訊號並將其轉換為電 訊號，其已被廣泛應用於各種光電產品中，且成為關鍵元件 之一。目前，行動電話向著多功能趨勢發展，具有照相功能 之行動電話一經推出即倍受歡迎。應用於行動電話之相機模 組不僅要滿足輕薄短小之要求，其亦須具有較好之晝面品 質，而灰塵污染係影響晝面品質重要因素之一。因此如何對 成像模組進行拆卸清理灰塵，成為業者所努力去克服研發之 問題。 如圖1所示，為先前之成像模組100之示意圖，其包括 一基板30、一影像感測晶片20、熱固膠18、多條導線19、 一鏡頭模組10及一濾光片15。所述基板包括一承載面31， 所述影像感測晶片20藉由熱固膠18固設於基板30之承載面 31上。所述承載面31上設有複數個基板焊墊301，所述影像 感測晶片20上設有複數個晶片焊墊201，所述複數個基板焊 墊301與所述複數個晶片焊墊201藉由所述多條導線19對應 電性連接。所述鏡頭模組10包括一透鏡組16、一鏡筒12及 一鏡座14。所述透鏡組16收容於鏡筒12内，所述鏡筒12 螺合於鏡座14内。所述濾光片15藉由熱固膠18粘接於鏡筒 12之下端面121。所述鏡座14藉由熱固膠18固設於基板30 6 200923461 之承載面31上。 鏡座14與基板30及濾光片15與鏡筒12之間都係以熱 固膠18之方式粘合，然後進行烘烤，使熱固膠18熱固。惟， 於鏡座14點膠前，仍無法避免鏡筒12與鏡座14對焦而摩擦 產生之粉塵或外來灰塵掉落到影像感測晶片20上，而影響影 像感測晶片20之晝素提升，降低該成像模組100之成像品 質。同時，鏡座14與基板30藉由熱固膠18粘合，熱固膠 18熱固後，鏡座14與基板30之間不易拆除。當有粉塵或灰 塵落到影像感測晶片20導致晝面品質降低時，需更換整個成 像模組100。 【發明内容】 有鑒於此，有必要提供一種便於組裝、拆卸、便於清理 灰塵之成像模組。 一種成像模組，其包括：一鏡頭模組、一影像感測晶片、 一基板。所述鏡頭模組與影像感測晶片對正設置。所述基板 有一承載面用於承載所述影像感測晶片及鏡頭模組。所述鏡 頭模組包括一透鏡組、鏡筒及鏡座。所述透鏡組設置於鏡筒 内。所述鏡筒收容於鏡座内。所述成像模組還進一步包括一 連接件，所述連接件固設於基板承載面上並環繞所述影像感 測晶片。所述鏡頭模組之鏡座可拆卸地固定於連接件上。 相對於先前技術，所述鏡頭模組之鏡座與基板之間設有 一連接件，所述連接件固設於基板上，所述鏡頭模組之鏡座 可拆卸地固定於連接件上。如此，當有灰塵落入影像感測晶 片上時，可方便拆卸進行清理。 7 200923461 【實施方式】200923461 IX. Description of the Invention: [Technical Field] The present invention relates to an imaging module, and more particularly to an imaging module that is easy to assemble and disassemble. [Prior Art] Image sensors can be used to detect optical signals in space and convert them into electrical signals. They have been widely used in various optoelectronic products and become one of the key components. At present, mobile phones are moving toward multi-functional trends, and mobile phones with camera functions are popular as soon as they are launched. The camera module used in mobile phones not only needs to meet the requirements of lightness and thinness, but also has good quality of the face, and dust pollution is one of the important factors affecting the quality of the face. Therefore, how to disassemble and clean the imaging module has become an effort for the industry to overcome the problem of research and development. As shown in FIG. 1 , it is a schematic diagram of a prior imaging module 100 including a substrate 30 , an image sensing chip 20 , a thermosetting adhesive 18 , a plurality of wires 19 , a lens module 10 , and a filter 15 . . The substrate includes a bearing surface 31. The image sensing wafer 20 is fixed on the bearing surface 31 of the substrate 30 by a thermosetting adhesive 18. A plurality of substrate pads 301 are disposed on the bearing surface 31. The image sensing wafers 20 are provided with a plurality of wafer pads 201. The plurality of substrate pads 301 and the plurality of wafer pads 201 are borrowed. The plurality of wires 19 are electrically connected. The lens module 10 includes a lens group 16, a lens barrel 12, and a lens holder 14. The lens group 16 is housed in the lens barrel 12, and the lens barrel 12 is screwed into the lens holder 14. The filter 15 is bonded to the lower end surface 121 of the lens barrel 12 by a thermosetting glue 18. The lens holder 14 is fixed on the bearing surface 31 of the substrate 30 6 200923461 by a thermosetting glue 18 . The mirror base 14 and the substrate 30 and between the filter 15 and the lens barrel 12 are bonded by means of a thermosetting glue 18, and then baked to thermoset the thermosetting glue 18. However, before the lens holder 14 is dispensed, the lens 12 and the lens holder 14 are prevented from being in focus, and the dust generated by the friction or the foreign dust is dropped onto the image sensing wafer 20, thereby affecting the pixel enhancement of the image sensing chip 20. The imaging quality of the imaging module 100 is reduced. At the same time, the lens holder 14 and the substrate 30 are bonded by the thermosetting glue 18, and after the thermosetting glue 18 is thermosetting, the lens holder 14 and the substrate 30 are not easily removed. When dust or dust falls on the image sensing wafer 20, the quality of the kneading surface is lowered, and the entire imaging module 100 needs to be replaced. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an imaging module that is easy to assemble, disassemble, and easy to clean. An imaging module includes: a lens module, an image sensing chip, and a substrate. The lens module and the image sensing wafer are aligned. The substrate has a carrying surface for carrying the image sensing chip and the lens module. The lens module includes a lens group, a lens barrel and a lens holder. The lens group is disposed in the lens barrel. The lens barrel is housed in the lens holder. The imaging module further includes a connector fixed to the substrate carrying surface and surrounding the image sensing wafer. The lens holder of the lens module is detachably fixed to the connecting member. In contrast to the prior art, a connecting member is disposed between the lens holder of the lens module and the substrate, and the connecting member is fixed on the substrate, and the lens holder of the lens module is detachably fixed to the connecting member. In this way, when dust falls on the image sensing wafer, it can be easily disassembled for cleaning. 7 200923461 [Embodiment]
所Place
、強化塑膠或陶瓷等材質, reinforced plastic or ceramic materials
Metal Semiconductor，互補性金屬氧化物感測器）。所述影像感測晶 電荷麵合組件感測器）或cm〇s(c〇_麵_ 片50既可以點接至所述基板6〇承載面6丄上並藉由打線方式 與基板60電性連接，亦可以使用覆晶形式、内引腳貼合、自 動載帶貼合'倒貼封裝或熱壓合連接方式使影像感測晶片結 構性及電性連接於基板60。所述影像感測晶片5〇具有一感 測區51。 本實施方式中，所述透光元件9〇為一紅外濾光片，用 於對光線進行過滤。 所述膠體層80為雙面膠、軟膠中之一種。 所述連接件4〇為一中空方形邊框結構，包括四相互鄰 接之邊框42。該連接件4〇固設於所述基板60之承載面61 上亚壞繞所述影像感測晶片50。本實施方式中，所述連接件 40之邊框内設有一隔板43，因此，所述連接件40之邊框42 内被間隔形成二凹槽，即第一凹槽41及與第一凹槽41相對 之第一凹槽46。所述第一凹槽41之深度與所述透光元件9〇 200923461 之厚度相當，優選地，所述第一凹槽41之深度與所述透光元 件90之厚度相同。所述第二凹槽46之深度大於或等於所述 影像感測晶片50之厚度，優選地，所述第二凹槽46之深度 與所述影像感測晶片50之厚度相同。所述第二凹槽46收容 所述影像感測晶片50且環繞該影像感測晶片50。所述隔板 43包括一與鏡頭模組70相對之頂面47,該頂面47上開設有 一圓形之貫穿開口 44，所述貫穿開口 44之尺寸大於或等於 所述影像感測晶片50之感測區51之尺寸。所述透光元件90 藉由所述膠體層80固設於所述隔板43之頂面47上。所述邊 框42上設有第一卡制部，所述第一卡制部為複數個等高之凸 塊45，本實施方式中，所述第一卡制部為四個等高之凸塊 45，其分別設置於不同之邊框42上。該四個凸塊45與邊框 42採用相同材料做成，並為一體結構。所述四個凸塊45與 所述邊框42亦可為二獨立之元件，該四個凸塊45藉由粘接 方式粘著於所述邊框42上。 實際應用中，所述連接件40亦可與所述基板60為一體 結構。所述四個凸塊45亦可分別設置於之邊框42之拐角位 置上，並不限於本實施方式。 所述鏡頭模組70包括透鏡組（圖未示）、一鏡筒72及 一鏡座74。所述透鏡組包括至少一光學鏡片，該透鏡組收容 於所述鏡筒74内。所述鏡筒72外側設有外螺紋71，所述鏡 座74内側設有内螺紋73，所述鏡筒72藉由外螺紋71與内 螺紋73旋入至鏡座74内固定或調焦。本實施方式中，所述 鏡座74包括一與影像感測晶片50正對之底面741，該底面 200923461 741對應所述邊框42上之第一卡制部設有第二卡制部，所述 第二卡制部為為複數個收容孔742。本實施方式中，所述第 二卡制部對應連接件40上之四個凸塊45對應為四個收容孔 742。所述凸塊45與所述收容孔742藉由過盈配合，使鏡座 74固定於連接件40之邊框42上。 實際應用中，所述連接件40之邊框42之第一卡制部亦 可為複數個收容孔，所述鏡座74之第二卡制部為複數個凸 塊。所述連接件40亦可不設有隔板43，所述透光元件90設 於鏡筒72内，並不限於本實施方式。 請參閱圖6，為本發明第二實施方式之成像模組300。 所述成像模組300之結構與所述第一實施方式成像模組200 之結構大體相同，該成像裝置300之結構與成像裝置200之 結構主要差異在於：所述連接件40上之第一卡制部為各邊框 42上分別延伸出之四個凸條48，所述鏡頭模組70之鏡座74 包括相互鄰接之四侧邊78,所述第二卡制部為所述鏡座74 之各側邊78對應所述凸條48開設之四個卡制槽75，所述凸 條48卡制於所述卡制槽75内，使鏡座74固定於連接件40 之邊框42上。 所述鏡頭模組之鏡座與基板之間設有一連接件，所述連 接件固設於基板上，所述鏡頭模組之鏡座可拆卸地固定於連 接件上。如此，當有灰塵落入影像感測晶片上時，可方便拆 卸進行清理。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施方式，本 10 200923461 發明之靶圍並不以上述實施方式 之人士援依本發明之精神所作 舉凡減本案技藝 蓋於以下中請專利範圍Γ $修#或變化，皆應涵 【圖式簡單說明】 圖1係先前之一種成像模組剖視圖； ;明第—實施方式之成像模組之立體分解圖； 圖3係本圖2中之連接件之另—角度之立體圖，· β ;圖4係本發實财式之成像模組之鏡座之立體 圖係本發明第-實施方式之成像模組之立體剖視圖； 囷係本么明第一實施方式之成像模組之立體分解圖。 【主要元件符號說明】 100, 200, 300 鏡頭模組 10, 70 71 鏡筒 12, 72 73 鏡座 14, 74 16 熱固膠 18 18 透光元件 15, 90 19 下端面 121 40 第一凹槽 41 42 隔板 43 44 凸塊 45 47 影像感測晶片 20, 50 51 基板 30, 60 31, 61 晶片焊墊 201 成像模組 外螺紋 内螺紋 透鏡組 膠體層 導線 連接件 邊框 貫穿開口 頂面 感測區 承載面 11 200923461 基板焊墊 301 第二凹槽 46 底面 741 收容孔 742 凸條 48 卡制槽 75 側邊 78 12Metal Semiconductor, Complementary Metal Oxide Sensor). The image sensing crystal charge surface mount component sensor or cm〇s (c〇_face_sheet 50 can be connected to the substrate 6 〇 bearing surface 6 并 and electrically connected to the substrate 60 by wire bonding For the connection, the image sensing chip can be structurally and electrically connected to the substrate 60 by using a flip chip form, an internal pin bonding, an automatic tape attaching 'paste-mounting package or a thermocompression bonding connection. The wafer 5 has a sensing region 51. In the embodiment, the transparent component 9 is an infrared filter for filtering light. The colloid layer 80 is a double-sided adhesive or a soft rubber. The connecting member 4 is a hollow square frame structure, and includes four adjacent frames 42. The connecting member 4 is fixed on the bearing surface 61 of the substrate 60 to break the image sensing wafer 50. In this embodiment, a partition 43 is disposed in the frame of the connecting member 40. Therefore, the frame 42 of the connecting member 40 is spaced apart to form two grooves, that is, the first groove 41 and the first groove. 41 opposite to the first groove 46. The depth of the first groove 41 and the light transmissive element 9〇200923461 Preferably, the depth of the first groove 41 is the same as the thickness of the light transmissive element 90. The depth of the second groove 46 is greater than or equal to the thickness of the image sensing wafer 50, preferably The second recess 46 has the same depth as the image sensing wafer 50. The second recess 46 receives the image sensing wafer 50 and surrounds the image sensing wafer 50. The top surface 47 is opposite to the lens module 70. The top surface 47 defines a circular through opening 44. The through opening 44 has a size greater than or equal to the sensing area 51 of the image sensing wafer 50. The light transmissive element 90 is fixed on the top surface 47 of the partition plate 43 by the glue layer 80. The frame 42 is provided with a first clamping portion, and the first clamping portion In the embodiment, the first clamping portion is four equal height bumps 45 respectively disposed on different frames 42. The four bumps 45 and the frame are respectively arranged. 42 is made of the same material and is a unitary structure. The four bumps 45 and the frame 42 can also be two independent elements. The four bumps 45 are adhered to the frame 42 by adhesive bonding. In practical applications, the connecting member 40 may also be integrated with the substrate 60. The four bumps 45 are also The lens module 70 includes a lens group (not shown), a lens barrel 72, and a lens holder 74. The lens group includes at least a corner position of the frame 42. An optical lens is received in the lens barrel 74. The outer side of the lens barrel 72 is provided with an external thread 71. The inside of the lens holder 74 is provided with an internal thread 73. The lens barrel 72 is externally threaded 71. In the embodiment, the mirror base 74 includes a bottom surface 741 opposite to the image sensing wafer 50, and the bottom surface 200923461 741 corresponds to the frame 42. The first clamping portion is provided with a second clamping portion, and the second clamping portion is a plurality of receiving holes 742. In this embodiment, the four bumps 45 on the second engaging portion corresponding connector 40 correspond to four receiving holes 742. The bump 45 and the receiving hole 742 are fixed to the frame 42 of the connecting member 40 by an interference fit. In a practical application, the first locking portion of the frame 42 of the connecting member 40 may also be a plurality of receiving holes, and the second locking portion of the lens holder 74 is a plurality of protrusions. The connecting member 40 may not be provided with the partition plate 43, and the light transmitting member 90 is provided in the lens barrel 72, and is not limited to the embodiment. Please refer to FIG. 6 , which is an imaging module 300 according to a second embodiment of the present invention. The structure of the imaging module 300 is substantially the same as that of the imaging module 200 of the first embodiment. The structure of the imaging device 300 is different from the structure of the imaging device 200 in that: the first card on the connector 40 The frame portion is a plurality of four ribs 48 extending from the respective frame 42. The lens holder 74 of the lens module 70 includes four side edges 78 adjacent to each other, and the second card portion is the mirror frame 74. Each of the side edges 78 corresponds to the four locking grooves 75 formed by the ribs 48. The ribs 48 are locked in the locking groove 75 to fix the lens holder 74 to the frame 42 of the connecting member 40. A connecting member is disposed between the lens holder of the lens module and the substrate, and the connecting member is fixed on the substrate, and the lens holder of the lens module is detachably fixed to the connecting member. In this way, when dust falls on the image sensing wafer, it can be easily removed for cleaning. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the target of the invention of the present invention is not limited by the spirit of the present invention in the spirit of the present invention. Fig. 1 is a cross-sectional view of a prior art imaging module; Fig. 3 is an exploded perspective view of the imaging module of the first embodiment; Fig. 3 is the connection of Fig. 2 The other is a three-dimensional view of the angle of the image, and FIG. 4 is a perspective view of the lens holder of the imaging module of the present invention, which is a perspective view of the imaging module of the first embodiment of the present invention; An exploded perspective view of an imaging module of an embodiment. [Main component symbol description] 100, 200, 300 lens module 10, 70 71 lens barrel 12, 72 73 lens holder 14, 74 16 thermosetting glue 18 18 light transmitting element 15, 90 19 lower end surface 121 40 first groove 41 42 Separator 43 44 Bump 45 47 Image sensing wafer 20, 50 51 Substrate 30, 60 31, 61 Wafer pad 201 Imaging module External thread Internal thread Lens group Colloidal layer Wire connector Boundary through opening Top surface sensing Area bearing surface 11 200923461 Substrate pad 301 Second groove 46 bottom surface 741 receiving hole 742 rib 48 clamping groove 75 side 78 12