200924578 23296twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種導電層製程，特別是有關於一種 具有光亮表面的導電層製程。 【先前技術】 發光二紐（LED)的縣紐（paekaWier)包 Ο ，統的導線架（leadframe)及後來的封裝基板（package SUbStrate)。相較於傳統的導線帛，封裝基板可在同一平 f區域上提供多組接墊，這使得封裝基板可在-定面積内 ί裝更多顆led晶片，因而提高LED晶片的封裝密度。 ^ led封裴基板是利用電路板製程來加以製作。因此， 二見的封I基板it常具有兩圖案化導電層及—位於這些圖 j導電層之間的介電層。由於L E D晶片之功能是用來發 =光線，所以在需要封裝相同的LED晶片的情況下，封裝 基板的結構對於led晶片的發光效率有相當大的影響。 CJ 曰 【發明内容】 本發明提供一種導電層製程，以製作出具有光亮表面 的導電層。 本發明提出一種具有光亮表面的導電層製程。首先， 、:銅電鍍在一基板上，以形成一電鍍銅層。接著，電解拋 光電鍍銅層之表面，使之光亮。 在本發明之一實施例中’上述基板可為發光二極體封 200924578 2J^〇TwLaoc/n 裝基板 在本發明之-實施例中，上述基板更可具 層’而電鐘靖是覆蓋在初始銅層。 ^ 在本發明之-實施例中，更可在電解抛光電鐘銅層之 表面後’對電_層之表面的—部分進行—最終表^處 :覆:電表面的另一部分並未被最終表面處理層 Ο Ο 声ί二2 亮。前述最終表面處理可形成—層材料 曰设1在电鍍銅層之所暴露出的表面的部分。 蔣柏ί發明提出—種具有綠表面的導電層製程。首先， 光二=一基板上，以形成-電鍍銅層。接著，電解拋 :„表面’使之光亮。接著，在電解拋光電鍍銅 鑛鎳層。接著，電解拋光電鍍鎳層之表面，使之光1電 裝基ΐ本發明之—實簡中，上述基板可為發光二極體封 在本發明之-實_巾，上述基板具有—初始銅層， 而電鍍銅層是覆蓋在初始銅層。 在本發明之—實施财，更可在電職光電鐘錄層之 $以後，對電鑛鎳層之表面的一部分進行一最終表面處 =電麟層之表_另—部分並未被最終表面處理層 声二ΐ —以轉光免。前述最終表面處理可形成—層材料 d是盍在電鍍鎳層之所暴露出的表面的部分。 基於上述’本㈣可藉由電職絲光亮電路板之導 讀（例如電義層或麵鎳層）的表面。 200924578 23296twt；d〇c/n 一為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂’下文特舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 圖1繪示本發明一實施例的一種具有光亮表面的導電 層製程的流程。請參考圖卜在步驟11G巾，將銅電鐘在 基板上，以形成一電鍍銅層。上述基板可為一發光二極 〇 縣裝基板。在本實闕巾，基板具有-初始銅層，而電 鑛銅層則是覆蓋在初始銅層上。然而，在其他實施例中， 電鑛銅層則可直接形成在基板之表面上。 在步驟>120巾，電解拋光電鑛銅層之所暴露出的表 面’使之光亮。在本實施例中，電解拋光是指在適當溶液 中將電鑛銅層放置於陽極端，並施以適度的電流或電壓， 使得表面凹凸不平的電鍍銅層的表面金屬粒子可依照不同 的溶解速率轉至纽財，域由導電層之凸^解速 率快及凹面溶解速率慢的特性來平整化電鑛 G *步驟13〇中，可對電_層之所暴露出==一 部分進行-最終表面處理（surface fmish) 層之所暴露出的表面的另-部分而不作任何加工 該另一部分表面的光亮。 、 +在本實施例中，最終表面處理是指形成—層材料 t在，鑛銅層之所暴露出的表面的—部分，但是^並 未覆盖電鑛銅層之光亮面。最終表面處理例如為有機ς焊 劑（Organic Solderability Preservatives ’ 〇sp)、化鎳:j金 200924578 2i^y6twt.doc/n (Electroless Nickel and Immersion Gold，ENIG)、浸鑛銀 (Immersion Silver，I-Ag )、浸鍵錫（Immersion Tin，I-Sn )、 浸鐘錢（Immersion Bismuth，I-Bi)、喷錫（Hot Air Solder Leveling ’ HASL )、電鍍鎳與金（Nickel and Gold200924578 23296twf.doc/n IX. Description of the Invention: [Technical Field] The present invention relates to a process for conducting a conductive layer, and more particularly to a process for producing a conductive layer having a bright surface. [Prior Art] The light-emitting diode (LED) of the county (paekaWier) package, the leadframe and the subsequent package substrate (package SUbStrate). Compared with the conventional lead wire, the package substrate can provide a plurality of sets of pads on the same flat f area, which enables the package substrate to mount more LED chips in a predetermined area, thereby increasing the packaging density of the LED chips. ^ led package substrate is made using the board process. Therefore, the sealed I substrate of the second embodiment often has two patterned conductive layers and a dielectric layer between the conductive layers of these figures. Since the function of the L E D chip is to emit light, the structure of the package substrate has a considerable influence on the luminous efficiency of the LED wafer in the case where it is required to package the same LED wafer. CJ 曰 SUMMARY OF THE INVENTION The present invention provides a conductive layer process to produce a conductive layer having a shiny surface. The present invention provides a conductive layer process having a shiny surface. First, copper is electroplated on a substrate to form an electroplated copper layer. Next, the surface of the electroplated copper layer is electrolytically polished to make it bright. In an embodiment of the present invention, the substrate may be a light-emitting diode package 200924578 2J^〇TwLaoc/n package substrate. In the embodiment of the present invention, the substrate may be further provided with a layer and the electric clock is covered. Initial copper layer. ^ In the embodiment of the present invention, after electropolishing the surface of the copper layer of the electric clock, the portion of the surface of the electric layer is performed - the final surface is: the other part of the electric surface is not finally Surface treatment layer Ο 声 ί 2 2 bright. The foregoing final surface treatment can form a portion of the layer of material that is exposed on the exposed surface of the electroplated copper layer. Jiang Baili invented a process for producing a conductive layer with a green surface. First, Light II = a substrate to form a - plated copper layer. Then, electrolytic polishing: „surface' makes it bright. Then, electroplating electroplated copper ore nickel layer. Then, electrolytically polishing the surface of the electroplated nickel layer, so that the light is electrically charged according to the invention - the above, The substrate may be a light-emitting diode sealed in the present invention, the substrate has an initial copper layer, and the electroplated copper layer covers the initial copper layer. In the present invention, the implementation of the electricity, but also in the electric job photoelectric After the $ of the clock recording layer, a part of the surface of the nickel ore layer is subjected to a final surface = the surface of the electric layer. The other part is not subjected to the final surface treatment layer. The process can form a layer material d which is a portion of the surface exposed by the electroplated nickel layer. Based on the above (4), the surface of the electric circuit board can be guided by a conductive circuit board (for example, an electro-chemical layer or a nickel layer). The above and other objects, features, and advantages of the present invention will become more apparent and obvious <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; 1 shows an embodiment of the present invention A process for fabricating a conductive layer having a bright surface. Referring to Figure 12, a copper electric clock is placed on the substrate to form an electroplated copper layer. The substrate may be a light-emitting diode package. In the case of a real towel, the substrate has an initial copper layer, and the electro-mineralized copper layer covers the initial copper layer. However, in other embodiments, the electro-mineralized copper layer can be formed directly on the surface of the substrate. 120 towels, the surface of the electrolytically polished copper ore exposed is 'brightened. In the present embodiment, electrolytic polishing refers to placing an electric copper layer on the anode end in a suitable solution, and applying a moderate degree. Current or voltage, the surface metal particles of the electroplated copper layer with uneven surface can be transferred to New Zealand according to different dissolution rates, and the field is characterized by a high rate of convex solution of the conductive layer and a slow rate of dissolution of the concave surface. * In step 13, the portion of the exposed surface of the surface layer may be exposed to the == part of the surface layer without any processing of the surface of the other portion. + In the present embodiment, the final surface treatment refers to forming a portion of the surface of the layer of the copper layer exposed by the layer of the copper, but the surface of the layer of the ore is not covered. The final surface treatment is, for example, organic germanium. Flux (Organic Solderability Preservatives ' 〇sp), nickel: j gold 200924578 2i^y6twt.doc/n (Electroless Nickel and Immersion Gold, ENIG), Immersion Silver (I-Ag), dip tin (Immersion Tin, I-Sn), Immersion Bismuth (I-Bi), Hot Air Solder Leveling 'HASL, Nickel and Gold
Electroplating)、無電鈀鎳（Electroless Pd/Ni)、無電纪 銅（Electroless Pd/Cu)或電鍍錫鉍合金（SnBi)等。 圖2繪示本發明另一實施例的一種具有光亮表面的導 電層製程的流程。請參考圖2，在步驟210中，將銅電鍍 在一基板上，以形成一電鐘銅層。上述基板可為一介電層 或一外側具有介電層的疊層結構。在本實施例中，基板具 有一初始銅層，而電鍍銅層則是覆蓋在初始銅層上。然而， 在其他實施例中，電鍍銅層則可直接形成在基板之表面上。Electroplating, Electroless Pd/Ni, Electroless Pd/Cu or SnBi. 2 is a flow chart showing a process of a conductive layer having a bright surface according to another embodiment of the present invention. Referring to FIG. 2, in step 210, copper is electroplated on a substrate to form an electric clock copper layer. The substrate may be a dielectric layer or a laminate structure having a dielectric layer on the outside. In this embodiment, the substrate has an initial copper layer and the electroplated copper layer overlies the initial copper layer. However, in other embodiments, the electroplated copper layer can be formed directly on the surface of the substrate.
(J 在步驟220中，電解拋光電鍍銅層之所暴露出的表 面，使之光亮。在本實施例中，電解拋光是指在適當溶 中將電義層放置於陽極端，並施以適度的電流或電壓， 使得表面凹凸科的電_層的表面金雜子可依 =解速率溶解至處理液中，並藉由導電層之凸面 率快及凹面溶解速率慢的特性來平整化麵銅層的表面。、 在步驟230中，將鎳電鑛在電 面上，以形成-電_層。 曰W泰4出的表 在步驟240 t，電解抛光電鑛 面，使之光亮。在本實施例中，電 :=:的表 /又w -电流欢電壓， 鎳層的表φ金雜子可依照不同 鑛錄層放置於陽極端，並施以適度溶液 使付表面凹凸不平的電鍍.‘一 Ο Ο 200924578 zj^y&twr.aoc/n 的溶解逮率溶解至處理液中 率”凹面落解速率慢的特性速 部分進ί驟最2:面；'對電鑛鎳詹之所暴露出的表面的〆 部分而不你f 處理’並保留電鐘銅層之表面的另〆 乍任何加工，以維持該另一部分表面的 在本實施财’最終表面處 = 产電魏層之所暴露出的表面的—部分， 劑、化鋅= 終表面處理例如為有機保焊 Λ A鎳'文至、次鍍銀、浸鍍錫、浸鍍鉍、噴錫、雷辦錄 /、、’、無電鈀鎳、無電鈀銅或電鍍錫鉍合金等。 综上所述’本發明將電解拋光應用於電路板 2 =鑛銅層或電鎮鎳層）的表面平整化，以使導^ ^ 4表面光亮。因此，本發明可在咖封裝基板上藉由 的導電層在LED晶片周圍的表面形成反射面:因 而長:鬲LED晶片的發光效率。 雖然本發明已以實施例揭露如上，然其並非用以限定 本^明’任何所屬技術領域中具有通常知識者，在 1發明之精神和範_，#可作些許之更動與潤飾， 發明之保祕圍當視_之申請專截_界定者為準。 【圖式簡單說明】 圖1繪示本發明一實施例的一種具有光亮表面 層製程的流程。 、屯 圖2繪示本發明另一實施例的—種具有光亮表面的 電層製程的流程。(J) In step 220, the exposed surface of the electroplated copper layer is electrolytically polished to make it bright. In the present embodiment, electropolishing means placing the electro-chemical layer on the anode end in a suitable solution and applying a moderate degree. The current or voltage causes the surface gold particles of the surface of the surface to be dissolved into the treatment liquid at a rate of dissolution, and the surface copper is flattened by the high convexity rate of the conductive layer and the slow dissolution rate of the concave surface. The surface of the layer. In step 230, the nickel ore is placed on the electrical surface to form an electric layer. The surface of the 泰W泰 4 is in step 240 t, and the electric ore surface is electropolished to make it bright. In the embodiment, the electric: =: table / w - current voltage, the nickel layer of the table φ gold miscellaneous can be placed in the anode end according to different mineral recording layers, and a moderate solution is applied to make the surface uneven plating. '一Ο Ο 200924578 zj^y&twr.aoc/n The dissolution rate is dissolved into the treatment liquid rate. The concave speed of the concave surface is slow. The maximum speed is 2: face; 'The place of the electric mine nickel Zhan The exposed part of the surface is not treated by your f and retains the surface of the copper layer of the electric clock. Processing to maintain the surface of the other portion of the surface at the final surface of the implementation of the power generation = the surface of the electricity-producing layer, the agent, zinc, the final surface treatment, for example, the organic soldering Λ A nickel To, silver plating, immersion tin plating, immersion chrome plating, spray tin, lightning recording /, ', no electro-palladium nickel, electroless palladium copper or electroplated tin-bismuth alloy, etc. In summary, the present invention will be used for electrolytic polishing. The surface of the circuit board 2 = mineral copper layer or electro-strength nickel layer is planarized to make the surface of the conductive surface bright. Therefore, the present invention can form a conductive layer on the surface of the LED wafer by the conductive layer on the coffee package substrate. Reflective surface: thus long: illuminating efficiency of 鬲LED wafer. Although the invention has been disclosed above by way of example, it is not intended to limit the invention in the art of any of the art, in the spirit and scope of the invention. , # may make some changes and retouching, the invention of the secrets of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The process of Figure 2 illustrates another aspect of the present invention. Example - A seed layer having a glossy surface of the process flow.