TW200925006A - Automobile control system and valve - Google Patents
Automobile control system and valve Download PDFInfo
- Publication number
- TW200925006A TW200925006A TW097133644A TW97133644A TW200925006A TW 200925006 A TW200925006 A TW 200925006A TW 097133644 A TW097133644 A TW 097133644A TW 97133644 A TW97133644 A TW 97133644A TW 200925006 A TW200925006 A TW 200925006A
- Authority
- TW
- Taiwan
- Prior art keywords
- nozzle
- power supply
- tire
- unit
- signal
- Prior art date
Links
- 238000012544 monitoring process Methods 0.000 claims abstract description 74
- 238000005259 measurement Methods 0.000 claims abstract description 6
- 239000004065 semiconductor Substances 0.000 claims description 61
- 239000007789 gas Substances 0.000 claims description 59
- 238000004891 communication Methods 0.000 claims description 31
- 239000004020 conductor Substances 0.000 claims description 20
- 238000010248 power generation Methods 0.000 claims description 20
- 230000005540 biological transmission Effects 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 9
- 239000012212 insulator Substances 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 238000009530 blood pressure measurement Methods 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 210000002445 nipple Anatomy 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 68
- 239000002184 metal Substances 0.000 description 18
- 239000000919 ceramic Substances 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 241000251468 Actinopterygii Species 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 5
- 239000000725 suspension Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 230000000087 stabilizing effect Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 206010036790 Productive cough Diseases 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 210000004508 polar body Anatomy 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 210000003802 sputum Anatomy 0.000 description 1
- 208000024794 sputum Diseases 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
- B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
- B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
- B60C23/041—Means for supplying power to the signal- transmitting means on the wheel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
- B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
- B60C23/041—Means for supplying power to the signal- transmitting means on the wheel
- B60C23/0411—Piezoelectric generators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
- B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
- B60C23/041—Means for supplying power to the signal- transmitting means on the wheel
- B60C23/0413—Wireless charging of active radio frequency circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
- B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
- B60C23/0422—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver characterised by the type of signal transmission means
- B60C23/0433—Radio signals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
- B60C23/0491—Constructional details of means for attaching the control device
- B60C23/0496—Valve stem attachments positioned outside of the tyre chamber
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
200925006 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種監視輪胎内之氣壓之監控（monitoring) 技術’尤有關於一種對於藉由輪胎氣嘴（tire vaWe)與組入 成一體型之耽壓感測器進行輪胎内之氣壓之檢測有效之技 術。 【先前技術】 近年來，一種監視用於汽車之輪胎之氣壓，用以警告該 輪胎之氣壓不足等之TPMS(Tire Pressure Monitaring System，輪胎壓力監測系統）等之輪胎監視系統已日益普 及。 在此種TPMS中，具有將與輪胎之氣嘴成為一體之監視 單元（unit)内建於輪胎而計測氣壓或溫度等之直接式、與 使用搭載於》飞車之ABS(Anti-Lock Brake System，防鎖定 煞車系統）用等之車輪（wheel)速感測器，且以藉由減壓而 使輪胎之半徑改變作為旋轉數之差別來感知之間接式。 搭載有直接式TPMS之汽車之情形下，已知有在4輪之任 一者減壓之時點以警告燈等知會駕駛人者、或顯示表示4 輪之中哪一個輪胎已有減壓之位置資訊、或以數值分別顯 示4輪之輪胎之壓力者等。 例如，直接式TPMS係由監視單元與接收單元所構成。 監視單元係如前述所示嵌入氣嘴。此監視單元係例如由監 控氣壓或溫度等之感測器、將藉由該感測器監控之資訊予 以無線傳送之傳送機、及將電源供給至感測器或傳送機等 I34220.doc 200925006 之電池等所構成。 從傳送機所傳送之資訊，係例如藉由接收單元來處理， 用以[視輪胎内之漏及溫度等。此接收單元係與設於車 内之顯示部連接’用以顯示輪胎内之氣壓值及溫度等，且 於檢測出異常之際，不僅可進行異常顯示，亦可藉由警告 音等來進行警告。200925006 IX. INSTRUCTIONS: [Technical field of the invention] The present invention relates to a monitoring technique for monitoring the air pressure in a tire, particularly relating to an integral type with a tire valve (tire vaWe) A technique in which a pressure sensor detects an air pressure in a tire. [Prior Art] In recent years, a tire monitoring system such as a TPMS (Tire Pressure Monitaring System) for monitoring the air pressure of a tire for a vehicle to warn of the tire is insufficient. In such a TPMS, a monitoring unit (unit) integrated with a nozzle of a tire is built in a tire, and a direct type such as air pressure or temperature is measured, and an ABS (Anti-Lock Brake System) mounted on the "flying vehicle" is used. The anti-lock brake system uses a wheel speed sensor and senses the interconnection by changing the radius of the tire as a difference in the number of revolutions by decompression. In the case of a car equipped with a direct TPMS, it is known that the driver is informed by a warning light or the like at the time of decompression of any of the four wheels, or that one of the four wheels has been decompressed. Information, or numerically showing the pressure of the tires of 4 rounds, etc. For example, a direct TPMS consists of a monitoring unit and a receiving unit. The monitoring unit is embedded in the air nozzle as described above. The monitoring unit is, for example, a sensor that monitors air pressure or temperature, a transmitter that wirelessly transmits information monitored by the sensor, and a power supply to a sensor or a conveyor, etc. I34220.doc 200925006 A battery or the like is formed. The information transmitted from the conveyor is processed, for example, by a receiving unit for [depending on leakage and temperature in the tire. The receiving unit is connected to the display unit provided in the vehicle to display the air pressure value and temperature in the tire, and when an abnormality is detected, not only an abnormal display but also a warning sound or the like can be performed.
另外，以此種直料了屬之監視單元而言，係設成在 朝輪圈㈣之側方突出之樹料皮部之外側部位，以將傳 收送電波之線圈天線（c〇U antenn_氣嘴桿（ν_办岣之 周圍予以捲繞之方式埋設，且在從輪圈突出於輪胎内部之 樹脂外皮部之内側部位，埋設基板型感測器裝置者（例如 參照專利文獻1)、設成將不同識別體附在每一傳送機，使 該識別體在將傳送機安裝於各車輪之際亦可從外加以視句 者（例如參照專利文獻2)、或具備可自如裝卸於輪胎氣嘴2 螺絲部之輪胎氣嘴裝設部、氣壓感測部、控制電路部、電 池收容部、及發送部，且於該控制電路部， °又百用以設定 預先特定之氣壓及特定之電池電壓之設定功能 〜"此、及用以比 較此等設定值與新感知之各個氣壓或電池電壓而檢測各個 偏差之比較功能者（例如參照專利文獻3)等。 [專利文獻1]日本特開20〇5_186658號公報 [專利文獻2]日本特開2006-232 127號公報 [專利文獻3]日本特開20〇6_298292號公報 【發明内容】 [發明所欲解決之問題] 134220.doc 200925006 然而，在上述之直接式TPMS之監視單元中，已由本發 明人發現有以下之問題。 一般而言’為了要使監視單元安裝在車輪之内側，例如 將TPMS附加在汽車之情形下，需將輪胎從車輪卸除，替 換成組入有監視單元之氣嘴，而會有花費工時或成本等之 問題。 此外，會有由於監視單元成為錘，因此車輪平衡將大幅 〇 ❹ 失常，且於替換成組入有監視單元之氣嘴之後，將需再度 調整車輪平衡之作業之問題。 再者，在將輪胎安裝於安裝有監視單元之車輪之際，會 有輪胎拆裝機（tire changer)之工具等與監視單元接觸而破 壞之虞，且輪胎之組入將需要技能。 在監視單元中，如前所述，由於設有電源供給用之電 池’因此在電池用罄之情形下，需將輪胎從車輪卸除而進 订電池㈣’且由於此電池替換作業，而會有需要輪胎從 車輪裝卸或車輪平衡調整等之作業之問題。 此外’未表示有監視單元對於氣嘴之具體組入構成。 本發明之目的係在於提供-種將嵌人氣嘴之監視單元予 以小型化，且不必從車輪裝卸 .产 ^ 即可將組入有監視單 70之氣嘴進行替換之技術。 關於本發明之前述及其他目 書之記述及附圖當可明瞭。、新穎之特徵，由本說明 [解決問題之技術手段] 茲簡單說明本案所揭示^ ^ ^ ^ ^ ^ 贫乃甲具代表性者之概要如 134220.doc 200925006 下。 本發明之汽車控制系統包括. , A ^ 栝.監視部，其係具有無線通 訊功能，感知裝設於汽車之 咸各車輪之輪胎内之氣壓，且將 感知、纟。果予以無線傳送； ^ 制°卩’其係具有盔绫通訊功 旎，接收從該監視部所傳& …… 千^『 感知結果並進行處理，且顯 不輪月〇之乳壓資訊•及潇嘴 β 以嘴#部，㈣㈣於各個車輪之 輪圈〇ρ，且具有成為將空In addition, in the case of such a monitoring unit that is directly under the genus, it is set to be a coil antenna that transmits the electric wave to the outer side of the tree skin protruding toward the side of the rim (four) (c〇U antenn _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ It is assumed that a different identification body is attached to each of the conveyors, and the identification body can be attached to the vehicle when the conveyor is attached to each of the wheels (for example, refer to Patent Document 2), or can be detachably attached thereto. a tire nozzle mounting portion, a pneumatic sensing portion, a control circuit portion, a battery housing portion, and a transmitting portion of the tire nozzle 2, and in the control circuit portion, a plurality of predetermined air pressures and specific The battery voltage setting function is used to compare the set values with the newly sensed respective air pressures or battery voltages to detect the respective differences (see, for example, Patent Document 3). [Patent Document 1] Japan special opening 20〇5_18 [Patent Document 2] Japanese Laid-Open Patent Publication No. 2006-232 No. 127 [Patent Document 3] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. 20-298292. In the direct TPMS monitoring unit, the inventors have found the following problems. Generally speaking, in order to mount the monitoring unit on the inner side of the wheel, for example, when the TPMS is attached to the automobile, the tire needs to be unloaded from the wheel. In addition, it is replaced with a nozzle that is incorporated into a monitoring unit, which may cause problems such as labor hours or costs. In addition, since the monitoring unit becomes a hammer, the wheel balance will be greatly degraded and replaced with a group. After the nozzle of the monitoring unit, the problem of the wheel balance operation needs to be adjusted again. Further, when the tire is mounted on the wheel on which the monitoring unit is mounted, there is a tool for the tire changer (tire changer) and the like. After the monitoring unit contacts and breaks, and the assembly of the tires will require skills. In the monitoring unit, as described above, since the battery for power supply is provided, the battery is In the case of squatting, the tire needs to be removed from the wheel to order the battery (4)' and due to the replacement operation of the battery, there is a problem that the tire needs to be loaded or unloaded from the wheel or the balance of the wheel is adjusted. The specific composition of the air nozzle is constructed. The object of the present invention is to provide a small-sized monitoring unit for inserting a human air nozzle, and it is not necessary to load or unload from the wheel, and the air nozzle incorporated in the monitoring unit 70 can be assembled. The description of the above and other objects of the present invention and the accompanying drawings are clear. The novel features are explained by the present description [technical means for solving the problem], and the present disclosure is briefly explained. ^ ^ ^ ^ ^ ^ A summary of the representative of a representative is 134220.doc 200925006. The vehicle control system of the present invention includes a monitoring unit having a wireless communication function for sensing the air pressure installed in the tires of the various wheels of the automobile, and sensing and smashing. If it is transmitted wirelessly; ^ system 卩 'there is a helmet 绫 communication function, receiving the transmission from the monitoring department & ...... 千 ^ 『 perceive the results and process, and show the pressure of the new moon And the mouth of the mouth is in the mouth #, (4) (four) in the rim of each wheel ,ρ, and has become empty
❹ 乳供給至輪胎内或從輪胎内排出 二軋之路徑之内壁；該監視 栝.氣嘴芯部，其係安裝 於該氣嘴桿部，為可裝卸， 哀叹之狀態下，配置於該氣 嘴柃邛之内壁，且具有感知 柯胎円之氣壓之感測器部；及 氣嘴蓋(valve cap)部，其係安裝於該氣嘴芯部為可裝 卸’在裝設之狀態下，接收來自感測器部之感知結果並進 行無線傳送。 此外，本發明之汽車控制系統係前述氣嘴蓋部包括：通 訊控制部’其係將感知結果轉換為無線信號；及電源部， 其係將電壓供給至感測器部及該通訊控制部。 再者，本發明之汽車控制系統係前述感測器邹將輪胎内 之氣壓轉變為電信號；前述氣嘴芯部進一步具有進行空氣 供給至輪胎内或空氣從輪胎内排出之控制與電信號之傳送 之軸，氣嘴蓋部覆蓋氣嘴桿部之開放端及氣嘴芯部之軸，' 並且通訊控制部依據來自該轴之電信號而生成無線通訊 信號。 β 此外，簡單表示本案之其他發明之概要。 本發明之氣嘴係設於裝設有汽車輪胎之車輪；且該氣嘴 134220.doc 200925006 = 部’其係安裝於各個車輪之輪圈部，成為將 部，…二 排出空氣之路徑；氣嘴芯、 /有裝設於該氣嘴捍部謂輪胎内之氣 Γ=測器部、及進行空氣供給至輪胎内或空氣從: 月。内排出之控制與電信號之傳送之 輪 覆蓋該氣嘴桿邻之Η 、 ° 八係 … 端及該氣嘴芯部之轴，並且依據來 自該軸之電信號而傳送電線信號β 來 ❹ ❹ 有=卜2發明之氣嘴係前述轴在氣嘴桿部之開放端側具 氧:二接觸之—端；及在車輪之輪圈部側具有感測 =嘴=之内部具有將來自感測器部之電信號傳達至 興孔嘴蓋錢觸之—端之信號配線。 再者本發明之氣嘴係前述信號配線通過軸中心之中心 ^線；再者，該轴係以藉由絕緣層包圍十心配線之方式所 :’且具有將電源電麼或接地電壓賦予感測器部之電麼配 線0 卜本發月之氣嘴係在前述信號配線賦予有電源電壓 或接地電壓之任-方，且於電壓配線賦予有任—另一方。 再者纟發明之氣嘴係前述轴在氣嘴桿部之開放端側呈 =氣嘴蓋㈣觸之一端；及在車輪之輪圈部側具有感測 卩’感測盗係包括在排列於圓柱抽之方向切割圓柱之 面’在此面搭載有將氣壓轉變為電信號之半導體裝置。 此外’本發明之氣嘴係前述氣嘴蓋部包括：天線部，其 係收送電波；接觸部，其係與軸之—端接觸；通訊控制 部，其係經由該接觸部接收來自軸之信號，而生成無線通 I34220.doc 200925006 〇fL用仏號並傳至該天線部；及電源部，其俜將 接地《賦予感測器部及通訊控制部。其係將電源電麼及 二之氣嘴係前述氣嘴蓋部從氣嘴蓋部之開口 =觸：、通'控制部、電源部、天線部之順序配置。 组成明之4嘴係前述軸㈣㈣線（eable)結構所 二成.，該同㈣線結構係包括：約導體，其係形成於令 第/導#及第(2導Γ其係經由絕緣物而同心圓地形成於該 Ο ㈣愈之夕周部；該第1導體係成為感測器部所檢測出之 源部之電源電麼重複之信號線；該第2導體係成 為基準電位之信號線；氣嘴蓋部包括：電源部，其係 源電位供給至感測器部第 ' 1乐1接點，其係在裝設於氣嘴桿 部之際與第1導體接觸，被電性連接；及第2接點，其係在 裝設於氣嘴桿部之際與第2導體接觸被電性連接；經由 該第1接點及該第2接，點而對於第i導體及第2導體進行電源 部之電源供給；感測器部之任意電極與第】、第2導體係藉 由焊線（bonding wire)分別連接。 再者，本發明之氣嘴係前述氣嘴蓋部包•括：天線部，其 係收送電波；接觸部’其係與轴之一端接觸；通訊控制 部，其經由該接觸部接收來自軸之信號，而生成無線通訊 用信號並傳至天線部；及發電模組，其係使用輪胎之振動 或旋轉等之能量而進行發電；發電模組係將所發電之電力 供給至感測器部及通訊控制部。 此外，本發明之氣嘴係設於裝設有汽車輪胎之車輪；且 該氣嘴包括：氣嘴桿部，其係安裝於車輪之輪圈部，且具 134220.doc 200925006 有將空氣供給至輪胎内或從輪胎内排出空氣之路徑；氣嘴 心部’其係安裝於該氣嘴桿部，且具有感知輪胎内之氣壓 之感測器部；及氣嘴蓋部’其係安裝於該氣嘴芯部，為可 裝卸，具有將電壓供給至該氣嘴芯部之電源部，且在裝設 之狀態下，接收來自該感測器部之感知結果並進行無線傳 ' $;該氣嘴蓋部在氣壓測定前將電壓供給至氣嘴芯部，測 • 定後停止電壓之供給。 [發明之效果] %簡單說明在本案所4示之發明中由具代表性者所獲得 之效果如下。 (1) 可將安裝於氣嘴之監視部大幅小型化。 (2) 藉由上述（1)，在將監視部裝設於車輪之際，可不需 要輪胎之裝卸或車輪平衡調整等，而可大幅削減成本或工 時等。 【實施方式】 ❹ 乂下根據圖式詳細說明本發明之實施形態。另外，在 用以說明實施形態之全圖中，對於同一構件原則上賦予同 —符號，且其重複之說明省略。 另外’各實施形態之中，傳達信號或電壓（電流）之部 分’只要未特別聲明，均為具有導電性之金屬等之導體。 (實施形態1) 圖1係為表示本發明之實施形態1之輪胎監視系統、及輪 胎之構成例之說明圖，圖2係為圖1之輪胎監視系統之區塊 圖’圖3係為表示組入有設於圖2之輪胎監視系統之監視部 134220.doc 12 200925006 之氣嘴之構成之刮面圖，圖4係為設於圖3之氣嘴之氣嘴芯 部之剖面圖，圖5係為將圖3之氣嘴之頭、及軸周邊放大之 說明圖，圖6係為圖4之A-A’剖面圖，圖7係為圖42β·β,剖 面圖，圖8係為將設於圖3之氣嘴之閥墊圈座放大之說明 圖，圖9係為將設於圖3之氣嘴之閥墊圈座22放大之說明 圖，圖10係為設於圖3之氣嘴之氣嘴蓋部之剖面圖，圖η 係為設於圖3之氣嘴之氣嘴蓋部之底面圖。❹ The milk is supplied into the tire or the inner wall of the path of the second rolling is discharged from the tire; the monitoring core of the nozzle is attached to the nozzle portion of the nozzle, and is disposed in the detachable and lazy state. a sensor portion of the inner wall of the mouth, and having a pressure to sense the pressure of the sputum; and a valve cap portion mounted to the core of the nozzle for being detachably mounted, The perceived result from the sensor section is received and transmitted wirelessly. Further, in the vehicle control system of the present invention, the gas nozzle cover portion includes: a communication control portion that converts the sensing result into a wireless signal; and a power supply portion that supplies a voltage to the sensor portion and the communication control portion. Furthermore, the vehicle control system of the present invention converts the air pressure in the tire into an electrical signal; the nozzle core further has control and electrical signals for supplying air into the tire or for discharging air from the tire. The transmission shaft, the nozzle cover portion covers the open end of the nozzle shaft portion and the shaft of the nozzle core portion, and the communication control portion generates a wireless communication signal based on the electrical signal from the shaft. β In addition, a brief summary of other inventions in this case is provided. The air nozzle of the present invention is mounted on a wheel equipped with a tire for a vehicle; and the air nozzle 134220.doc 200925006 = the portion is mounted on the rim portion of each wheel to become a path for the air to be exhausted; The mouth core, / is installed in the inside of the nozzle, the air Γ = the detector part, and the air is supplied into the tire or the air is from: month. The inner discharge control and the transmission of the electric signal cover the axis of the nozzle, the octagonal end, and the axis of the core of the nozzle, and transmit the electric wire signal β according to the electrical signal from the shaft. The nozzle of the invention has the above-mentioned shaft having oxygen on the open end side of the nozzle portion: the end of the contact; and the sensing on the side of the wheel of the wheel = the inside of the mouth has the sense from the sensing The electrical signal of the device is transmitted to the signal wiring of the Xingkong mouth cover. Furthermore, the gas nozzle of the present invention is such that the signal wiring passes through the center line of the shaft center; further, the shaft is surrounded by the insulating layer to surround the ten-core wiring: 'and has a sense of power supply or ground voltage The power supply wiring of the measuring unit is the same as that of the power supply voltage or the ground voltage, and the voltage wiring is provided with the other side. Furthermore, the nozzle of the invention is characterized in that the shaft is at the open end side of the nozzle portion of the nozzle portion, and the sensing portion of the wheel is provided on the side of the wheel portion of the wheel; The direction in which the cylinder is drawn cuts the surface of the cylinder. On this surface, a semiconductor device that converts air pressure into an electrical signal is mounted. Further, the nozzle of the present invention includes the antenna portion that includes an antenna portion that receives an electric wave, the contact portion that is in contact with the end of the shaft, and the communication control portion that receives the shaft from the contact portion. The signal is generated and the wireless communication I34220.doc 200925006 〇fL is transmitted to the antenna unit with an apostrophe; and the power supply unit is grounded to the sensor unit and the communication control unit. The gas nozzle and the gas nozzle cover are arranged in the order of the opening of the nozzle cover portion, the control unit, the power supply unit, and the antenna unit. The four nozzles of the composition are the above-mentioned shaft (four) (four) line (eable) structure. The same (four) line structure includes: a conductor, which is formed in the order of the guide / guide # and the second guide through the insulator Concentrically formed on the periphery of the Ο (4), the first guiding system becomes a signal line in which the power supply of the source portion detected by the sensor portion is repeated; the second guiding system becomes a signal line of the reference potential The gas nozzle cover portion includes: a power supply portion that supplies a source potential to the '1st 1st contact of the sensor portion, which is in contact with the first conductor when being mounted on the nozzle portion, and is electrically connected And a second contact electrically connected to the second conductor when mounted on the nozzle portion; and the ith conductor and the second via the first contact and the second contact The conductor is supplied with power to the power supply unit; any of the electrodes of the sensor unit and the second and second conductive systems are respectively connected by a bonding wire. Further, the gas nozzle of the present invention is the gas nozzle cover package. An antenna portion that receives a radio wave; a contact portion that is in contact with one end of the shaft; and a communication control portion that passes through the contact portion The signal from the axis is generated to generate a signal for wireless communication and transmitted to the antenna unit; and the power generation module generates power by using energy such as vibration or rotation of the tire; the power generation module supplies the generated power to the sense Further, the air nozzle of the present invention is attached to a wheel on which an automobile tire is mounted; and the air nozzle includes: a valve stem portion that is mounted on a wheel rim portion and has 134220 .doc 200925006 There is a path for supplying air into or out of the tire; the core of the nozzle is mounted to the nozzle of the nozzle and has a sensor portion for sensing the air pressure in the tire; and a nozzle The cover portion is attached to the nozzle core portion and is detachable, and has a power supply portion that supplies a voltage to the nozzle core portion, and receives the sensing result from the sensor portion in a state of being mounted. Wireless transmission is performed; the gas nozzle cover portion supplies a voltage to the core of the gas nozzle before the air pressure measurement, and the supply of the voltage is stopped after the measurement is made. [Effect of the invention] % is simply explained in the invention shown in the fourth aspect of the present invention. The effect obtained by a representative person is as follows (1) The monitoring unit attached to the nozzle can be greatly reduced in size. (2) With the above (1), when the monitoring unit is mounted on the wheel, tire loading and unloading or wheel balance adjustment can be eliminated. In addition, the embodiment of the present invention will be described in detail with reference to the drawings. In the entire drawings for explaining the embodiments, the same components are given the same symbol in principle. In addition, in each of the embodiments, a part that transmits a signal or a voltage (current) is a conductor having a conductive metal or the like unless otherwise specified. (Embodiment 1) FIG. 1 FIG. 2 is a block diagram of the tire monitoring system of FIG. 1 and FIG. 3 is a block diagram showing the assembly of the tire monitoring system according to the first embodiment of the present invention. FIG. Fig. 4 is a cross-sectional view of the nozzle core portion of the nozzle of Fig. 3, and Fig. 5 is a gas diagram of Fig. 3 for the monitoring unit of the tire monitoring system 134220.doc 12 200925006 The head of the mouth and the enlargement of the periphery of the shaft Figure 6 is a cross-sectional view taken along line A-A' of Figure 4, Figure 7 is a cross-sectional view of Figure 42, β, and Figure 8, and Figure 8 is an enlarged view of the valve seat of the valve provided in Figure 3, 9 is an explanatory view for enlarging the valve seat 22 of the nozzle provided in FIG. 3, and FIG. 10 is a cross-sectional view of the nozzle cover provided in the nozzle of FIG. 3, and FIG. The bottom view of the nozzle cover of the nozzle.
❹ 在本實施形態1中，輪胎監視系統丨係為監視汽車之輪胎 之氣壓及溫度等之系統。輪胎監視系統丨係如圖丨（a)所示， 由監視部2、及控制部3所構成》 監視部2係分別嵌入裝設於4個車輪w之氣嘴B，用以測 定輪胎Ta之氣壓及溫度等，且藉由無線傳送其測定結果， 並且接收來自控制部3之各種資訊。 控制部3係例如安裝於車内，進行從監視部2所輸出之資 訊之處理，且顯示輪胎之氣壓及溫度等，而於異常之際， 進行藉由警告顯示或警告音等之警告。 在圖1(b)中係表示輪胎之構成例。在輪胎Ta中係設有車 輪W。在車輪w係設有本發明之用於監視部2之氣嘴8。 圖2係為表示輪胎監視系統1之構成例之區塊圖。 在圖2中，監視部2係由壓力/溫度感測器4、控制器 (〇〇ntroller)5 . RFIC(Radio Frequency-Integrated Circuit . 射頻積體電路）部6、電源部7、及天線部8所構成。 廢力^皿度感測器4係為測定輪胎内之氣壓或測定輪胎内 之環境氣體溫度之感測器 。控制器5係例如由 134220.doc -13- 200925006 ASIC(Applicati〇n Specific Integrated Circuit’ 特殊應用積 體電路設計）等所組成，用以進行壓力/溫度感測器4所檢測 出之壓力補償或溫度補償等之信號處理。 成為通訊控制部之RFIC^p 6係為高頻處理用之半導體裝 置，用以進行與控制部3之資訊之傳收送。所謂高頻處理 係為將輸入信號之頻率作成較輸入信號更高頻率之信號予 以輸出。 電源部7係將電源電壓供給至監視部2。天線部8係為將 從RFIC部6所輸出之無線通訊用信號作成電波予以傳送， 並且接收從控制部3所傳送之電波。天線部8與RFIC^p 6係 例如經由配線於氣嘴B之軸方向之跳線（jumper wire)等而 連接。 此外’控制部3係由天線部9、RFiC1〇、MPUCMicr·。 Processing Unit)ll、及顯示部12所構成。天線部9係傳送 從RFIC10所輸出之電波，並且接收從監視部2所傳送之電 波。RFIC10係與尺1?1(：部6同樣為高頻處理用半導體裝置， 用以進行與監視部2之資訊之傳收送。 MPU11係掌控制部3之所有控制。顯示部12係根據 MPU11之控制，來顯示輪胎内之氣壓及溫度等於異常之 際，進行藉由警告顯示或警告音等之警告。 此外，控制部3係例如連接於建構於車内網路系統nS2 車内LAN(Local Area Network，區域網路）13。車内網路系 統NS係為用於體（b〇dy)控制、溫度調整控制、儀表板 (dashboard)控制、導航（navigati〇n)、各種感測器控制、馬 134220.doc • 14· 200925006 達控制、底盤（chassis)控制等之系統。 車内網路系統NS係經由車内LAN 1 3，而使電子控制單元 (ECU: Electric Controll Unit)14、或 ESP(Electrical Power Steering，電子動力轉向）、ABS(Anti-Lock Brake System)、VSC(Vehie Stability Control，車輛穩定控制）等 各種感測器1 5等彼此連接。 圖3係為表示組入有監視部2之氣嘴b之構成之刮面圖。 ❹In the first embodiment, the tire monitoring system is a system for monitoring the air pressure and temperature of the tire of the automobile. The tire monitoring system is shown in Fig. (a), and is composed of the monitoring unit 2 and the control unit 3. The monitoring unit 2 is fitted into the nozzles B of the four wheels w for measuring the tire Ta. The air pressure, the temperature, and the like are transmitted by wirelessly, and the various information from the control unit 3 is received. The control unit 3 is installed in a vehicle, for example, and performs processing for outputting information from the monitoring unit 2, and displays the air pressure and temperature of the tire, and when an abnormality occurs, a warning such as a warning display or a warning sound is performed. Fig. 1(b) shows a configuration example of a tire. A wheel W is attached to the tire Ta. The gas nozzle 8 for the monitoring unit 2 of the present invention is provided on the wheel w. FIG. 2 is a block diagram showing a configuration example of the tire monitoring system 1. In FIG. 2, the monitoring unit 2 is composed of a pressure/temperature sensor 4, a controller (〇〇ntroller) 5, an RFIC (Radio Frequency-Integrated Circuit) unit 6, a power supply unit 7, and an antenna unit. 8 constitutes. The waste force sensor 4 is a sensor for measuring the air pressure in the tire or measuring the temperature of the ambient gas in the tire. The controller 5 is composed of, for example, 134220.doc -13-200925006 ASIC (Applicati〇n Specific Integrated Circuit'), for performing pressure compensation detected by the pressure/temperature sensor 4 or Signal processing such as temperature compensation. The RFIC device 6 serving as the communication control unit is a semiconductor device for high-frequency processing for transmitting and transmitting information to and from the control unit 3. The high frequency processing is to output a signal having a frequency higher than that of the input signal by the frequency of the input signal. The power supply unit 7 supplies a power supply voltage to the monitoring unit 2. The antenna unit 8 transmits a radio communication signal output from the RFIC unit 6 as a radio wave, and receives radio waves transmitted from the control unit 3. The antenna unit 8 and the RFIC device 6 are connected, for example, via a jumper wire or the like that is wired in the axial direction of the nozzle B. Further, the control unit 3 is composed of an antenna unit 9, RFiC1, and MPUCMicr. The processing unit ll and the display unit 12 are configured. The antenna unit 9 transmits the radio waves output from the RFIC 10 and receives the radio waves transmitted from the monitoring unit 2. The RFIC 10 is similar to the ruler 1 to 1 (the portion 6 is a high-frequency processing semiconductor device for transmitting and transmitting information to and from the monitoring unit 2. The MPU 11 controls all the controls of the control unit 3. The display unit 12 is based on the MPU 11. The control is to display a warning such as a warning display or a warning sound when the air pressure and temperature in the tire are equal to an abnormality. Further, the control unit 3 is connected to, for example, an in-vehicle network system nS2 in-vehicle LAN (Local Area Network) , regional network) 13. In-vehicle network system NS is used for body (b〇dy) control, temperature adjustment control, dashboard control, navigation (navigati〇n), various sensor control, horse 134220 .doc • 14· 200925006 System for control, chassis control, etc. The in-vehicle network system NS is via the in-vehicle LAN 1 3, and the electronic control unit (ECU: Electric Controll Unit) 14, or ESP (Electrical Power Steering) Various sensors, such as an electronic power steering, an ABS (Anti-Lock Brake System), and a VSC (Vehie Stability Control), are connected to each other. FIG. 3 is a view showing a nozzle in which the monitoring unit 2 is incorporated. b The scraped surface to FIG. ❹
氣嘴B係如圖所示由氣嘴桿部16、氣嘴芯部17、及氣嘴 蓋部18所構成。 氣嘴桿部16係安裝於車輪w之輪圈部HR,為用以供給輪 胎内之空氣、或進行排出之零件。在此氣嘴桿部16中係裝 設有氣嘴芯部17。 氣嘴芯部17係上部成為控制輪胎内之壓縮空氣逆止閥， 而其下邛則為供感測器部i 7a設置之圖4中後述之閥墊圈座 22所在。 在感測器部17a中，雖未表示於圖3，惟分別具備有壓 力/溫度感測器4(在圖4中係有半導體晶片26對應）、及控制 器5(在圖4中係有半導體晶片27對應）。控制器$係進行廢 力/溫度感測器4所檢測出之資料之補償處理，且將處理後 之資料從輸出端予以輸出。 氣嘴蓋部18係由蓋18a、接觸部⑽、天線部8、電源部 7、及RHC部6所構成。蓋⑻係以螺人式裝設於氣嘴桿部 16，用以防止來自氣嘴桿部16之空氣洩漏。 而於該天線部8之 天線部8係位於此蓋i 8a内部之上方 134220.doc 200925006 下方係設有電源部7。在此電源部7之下方係設有RFIC部 6，而於該RFIC部6之下方係設有成為氣嘴芯部17之軸與 RFIC部6之接觸用電極之接觸部18b。 在感測器部17a中所測定之壓力或溫度之電信號係取入 至控制器5，且從該控制器5分別經由氣嘴芯部丨7之轴、及 接觸部18b而輸出至氣嘴蓋部18iRFIC^p 6。 在氣嘴蓋部18中係從電源部7將電源供給至感測器部17& 之壓力/溫度感測器4、及控制器5，且藉由控制器5來處理 來自壓力/溫度感測器4之壓力、溫度等之信號，且從RFK： 部6經由天線部8進行無線傳送。 如此，藉由設為將感測器部17a内建於氣嘴芯前端，且 藉由設於氣嘴蓋部18之11171(：：部6來進行信號之傳收送之構 成，即可不需要在重新安裝輪胎監視系統丨之際安裝於車 輪W之氣嘴桿部1 6之替換。 此外，由於可將監視部2本身輕量化，因此對於車輪平 衡之影響亦可大幅減輕。 再者，氣嘴芯部17與氣嘴蓋部18亦可藉由使控制器5與 RFIC 6刀別具有固有ID等相互認證而使之動作，來實現 安裝位置之確認、竊盜等之防止。 此外，在搭載於感測器部j 7a之壓力/溫度感測器4中， 測疋壓力之壓力感測器係例如MEMS(Mi^〇 m Mechanic Systern ’微電子機械系統）壓力感測器之外， 亦可使用利用壓電元件者、利用導電性橡膠者。 關於汽車用輪胎氣嘴、及氣嘴芯之-般性構成，係由 134220.doc -16- 200925006 JIS D 4207、與 JIS D 42 11 分別決定。 關於氣嘴芯部17，茲使用圖4之剖面圖來說明。 在氣嘴芯部17之上部係設有頭19〇在此頭19之下部係裝 設有胴體20，而於該胴體20之下部係經由閥墊圈2丨而裝二 有閥墊圈座22。此外，在胴體20上方之任意之位置係ϋ 有胴體塾圈23。再者，閥塾圈座22之下部係形成作為感 器部17a。The gas nozzle B is composed of a nozzle stem portion 16, a nozzle core portion 17, and a nozzle lid portion 18 as shown in the drawing. The nozzle portion 16 is attached to the rim portion HR of the wheel w, and is a member for supplying air in the tire or discharging it. A nozzle core portion 17 is attached to the nozzle stem portion 16. The upper portion of the nozzle core portion 17 serves as a compressed air check valve for controlling the tire, and the lower portion thereof is the valve washer seat 22 which will be described later in Fig. 4 for the sensor portion i 7a. The sensor unit 17a is not shown in FIG. 3, but is provided with a pressure/temperature sensor 4 (corresponding to the semiconductor wafer 26 in FIG. 4) and a controller 5 (in FIG. 4 The semiconductor wafer 27 corresponds). The controller $ performs compensation processing of the data detected by the waste/temperature sensor 4, and outputs the processed data from the output. The nozzle cover portion 18 is composed of a cover 18a, a contact portion (10), an antenna portion 8, a power supply portion 7, and an RHC portion 6. The cover (8) is attached to the nozzle portion 16 in a screw type to prevent air leakage from the nozzle portion 16. The antenna portion 8 of the antenna portion 8 is located above the inside of the cover i 8a. The power supply portion 7 is provided below the 134220.doc 200925006. The RFIC unit 6 is provided below the power supply unit 7, and a contact portion 18b that serves as a contact electrode between the shaft of the nozzle core portion 17 and the RFIC unit 6 is provided below the RFIC unit 6. The electric signal of the pressure or temperature measured in the sensor portion 17a is taken into the controller 5, and is output from the controller 5 to the nozzle through the shaft of the nozzle core 丨7 and the contact portion 18b, respectively. Cover portion 18iRFIC^p 6. In the nozzle cover portion 18, power is supplied from the power supply portion 7 to the pressure/temperature sensor 4 of the sensor portion 17 & and the controller 5, and is processed by the controller 5 from pressure/temperature sensing. The signal of the pressure, temperature, and the like of the device 4 is wirelessly transmitted from the RFK: unit 6 via the antenna unit 8. In this manner, the sensor unit 17a is built in the tip end of the nozzle core, and the signal is transmitted and received by the 11171 (:: portion 6) of the nozzle cover portion 18, so that it is unnecessary. When the tire monitoring system is reinstalled, the nozzle stem portion 16 is attached to the wheel W. In addition, since the monitoring portion 2 itself can be lightened, the influence on the wheel balance can be greatly reduced. The nozzle core portion 17 and the nozzle cover portion 18 can also be operated by mutual authentication of the controller 5 and the RFIC 6 with an inherent ID or the like, thereby preventing the detection position, theft, and the like from being prevented. Mounted in the pressure/temperature sensor 4 of the sensor portion j 7a, the pressure sensor for measuring the pressure is, for example, a MEMS (Mi^〇m Mechanic Systern 'microelectromechanical system) pressure sensor, A person who uses a piezoelectric element or a conductive rubber can be used. The general configuration of the tire nozzle and the nozzle core of the automobile is 134220.doc -16-200925006 JIS D 4207 and JIS D 42 11 respectively. With regard to the nozzle core 17, the cross-sectional view of Fig. 4 is used. A head 19 is attached to the upper portion of the nozzle core portion 17, and a body 20 is attached to the lower portion of the head portion 19, and a valve gasket seat 22 is attached to the lower portion of the body portion 20 via a valve gasket 2''. Further, the body ring 23 is attached to any position above the body 20. Further, the lower portion of the valve ring seat 22 is formed as the sensor portion 17a.
此外，在頭19、胴體20、閥墊圈21、及閥墊圈座22之中 心部係以軸24貫通之方式設有孔，在軸24之外周部係設有 彈簧（spring)20a。 頭19係為藉由形成於圓筒狀之外周部之螺絲，將胴體π 按壓在具有斜錐（taper)之氣嘴桿部16之孔壁16a(參照圖 並加以固定之零件，所謂胴體20係以自在旋轉之方式一體 化0 在頭19之中央部係如圖5所示以突出之方式形成有軸 24，而於該頭19之上部係形成有與後述之信號/電源線24& 接觸之信號/電源線用電極19b。 屬於頭19之周邊部之19c係如後述所示成為基準電位位 準VSS，因此該頭19之信號/電源線用電極19b係藉由屬於 絕緣物之墊圈19a而與周邊部19c絕緣。 此外，在圖4中，胴體20係由圓筒狀所組成，透過屬於 軸24貫通之孔之中心孔20b將空氣供給至輪胎内或排出。 閥墊圈21係用以封閉胴體20之中心孔而使之氣密。闕塾 圈座22係藉由經由軸24而壓縮所安裝之彈簧2〇a之反作用 I34220.doc 200925006 力’發揮作為封閉胴體20之中心孔之逆止閱之功能。 軸24係將彈簧20a之壓縮力傳至閥墊圈座22。軸24與閥 墊圈座22係以密壁化之方式固定，藉由將該軸以向下壓， 壓縮彈簧20a而將閥解放。 此外，胴體塾圈2 3係用以保持洞體2 〇之外周與氣嘴桿部 16之孔壁16a(圖3)之氣密性之塾圈。 在閥墊圈座22之下面部係形成有收容感測器部1 之四 角形狀之收容溝22a。從此收容溝22a之下面側之任意位 置，到成為閥墊圈座22最下部之下面形成有由[字狀之孔 所組成之壓力導入孔22b。 在收容溝22a之上面係搭載有屬於印刷配線基板之内插 器（interp〇Ser)25。在内插器25之主面（晶片搭載面）係分別 搭載有半導體晶片26、27。半導體晶片26係為壓力/溫度 感測器4 ’而半導體晶片27係為控制器5。 此外’半導體晶片26係以壓力導入孔22b之一方之端部 位於該半導體晶片26之下面之方式搭載。在此，在内插器 25之任意位置，係設有孔25a，而半導體晶片26係可藉由 孔25a從壓力導入孔221?直接檢測壓力。 如此，藉由將壓力導入孔22b設為L字狀，可防止例如於 輪胎内有異物等之際，該異物直接與半導體晶片26撞擊， 且可減低半導體晶片之破損之危險性。 此外，在收容溝22a之開口部係藉由由金屬製等所組成 之金屬蓋28而密閉有開口部。半導體晶片26、27係經由焊 線29而進行信號之傳收送及電源供給等。 134220.doc •18- 200925006 接著詳細說明轴24之構成。 圖6係為圖4之A-A·剖面圖。 在轴24中’於中心部係如圖所示形成有成為第1導體之 信號/電源線24a ^在信號/電源線24a之外周係設有絕緣層 24b。在此絕緣層24b之外周部係形成有成為第2導體之套 • 筒（sleeve)狀之接地線（ground line)24c。再者，以覆蓋接 - 地線24c之方式裝設有閥墊圈座22。 ❹ 彳§號/電源線24a係為賦予有信號與電源電壓vcc之雙方 之信號線’接地線24c係為基準電位（接地電位）vss之信號 線。 如此’藉由使用賦予有信號與電源電壓vcc之雙方之信 號線，即可將配線數減少。 此外’只要在轴内部之配線之構成容易，則可設為信 號、電源電壓、基準電位（接地電位）之3配線。 此外’雖將信號與電源電壓組合，惟亦可將信號與基準 ❹ 電位（接地電位）組合。然而，由於基準電位亦有使用於其 他場所之可能性，因此以信號與電源電壓之組合為較佳。 此外，藉由以接地線、或電源線包圍信號線，即可抑制 來自外部之雜訊對於信號線之影響。 在圖4中，於頭19之上部係經由墊圈i9a而形成有信號/ 電源線用電極19b。信號/電源線用電極19b係為與轴24之 信號/電源線24a接觸之電極。 此外，接地線24c係如圖4之〇符號内所示，以頭19之上 部側之端部與胴體20接觸之方式折彎而形成，藉此，胴體 134220.doc -19- 200925006 20、及頭19即成為基準電位（接地電位）VSS位準。 圖7係為圖4之Β-Β'剖面圖。 閥墊圈座22係如圖所示從該閥墊圈座22之下方到上# $ 成有壓力導入孔22b，對於設於壓力導入孔22b之—端部之 上部之壓力/溫度感測器4(半導體晶片26)施加輪胎内之氣 - 壓，使電阻變化。 圖8係為將閥墊圈座22放大之說明圖。 在收容於收容溝22a之内插器25之上面，係實褒有半導 ® 體晶片26、27、或使用於電源平滑等之晶片電容器 (condenser)30等。半導體晶片26、27之各個電極與内插器 25之電極、及半導體晶片26之電極與半導體晶片27之電極 係經由焊線29而分別連接。 信號/電源線24a係經由焊線29a而連接於内插器25之任 意之電極，接地線24c係經由焊線29b而連接於半導體晶片 27之任意之電極。 ❹ 對於半導體晶片27之電源供給係經由焊線29a、29b而進 行。此外，如前所述，信號/電源線24a係重複有信號與電 源電壓，因此對於半導體晶片27之信號之傳收送亦經由信 號/電源線24a來進行。對於半導體晶片26之電源供給係藉 由與内插器25之電極或半導體晶片27直接連接之焊線29c 來進行。 此外在本實施形態1中，雖係使用内插器25 ,惟此内 插器25亦可予以省略。此情形下，例如，可省略晶片電容 器3〇,藉由將半導體晶片％、27直接黏晶（die bonding)於 134220.doc *20· 200925006 收容溝22a來實現。 再者，在此，雖係設為具有屬於壓力/溫度感測器4之半 導體晶片26與屬於控制器5之半導體晶片27之2晶片構成， 惟亦可設為將壓力/溫度感測器4與㈣器5形成為i個半導 體晶片之1晶片構成。 此外，壓力/溫度感測器4係可為具有壓力感測器與溫度 感測器之2個感測器者，或具有壓力感測器、或溫度感測 器之任一者一方之感測器之構成。 圖9係為將收容溝22a藉由金屬蓋28罩蓋之狀態之閥墊圈 座22放大之說明圖。 如圖所示，收容溝22a之開口部係藉由金屬蓋“而密 閉。金屬蓋28係例如藉由隔絕密封（hemetic “叫等封 黏，藉此，防止由於輪胎内之氣壓導致金屬蓋28之變形 等，而得以保持氣密性。 另外，在此，雖係例示金屬蓋28，惟亦可為陶瓷、玻 璃、塑膠、塑模（mold)樹脂等。 接著詳細說明氣嘴蓋部18 » 圖10係為氣嘴蓋部18之剖面圖，圖11係為從圖1〇之下方 觀看之氣嘴蓋部18之底面圖。 氣嘴蓋部18之蓋18a係為由氣嘴蓋罩套（c〇ver)18al、及 螺入於氣嘴桿部16之螺絲部18a2所構成。氣嘴蓋罩套 係為覆蓋螺絲部1 8a2、天線部8、電源部7、及11171(：部6之 罩套。 成為第2接觸之螺絲部1 8a2係以導電性之金屬形成，氣 134220.doc 21 200925006 嘴蓋罩套18a 1係例如由樹脂等所組成，藉由設為通過電磁 波之素材，而成為不會阻礙與尺1?1(：部6之通訊。 ❻Further, a hole is formed in the center of the head 19, the body 20, the valve gasket 21, and the valve gasket seat 22 so that the shaft 24 penetrates, and a spring 20a is provided on the outer periphery of the shaft 24. The head 19 is a member that presses the body π against the hole wall 16a of the nozzle stem portion 16 having a taper by a screw formed on the outer peripheral portion of the cylindrical shape (see the figure and fixed the part, the so-called body 20) In the central portion of the head 19, a shaft 24 is formed in a protruding manner as shown in FIG. 5, and a signal/power supply line 24& which is described later is formed on the upper portion of the head 19. The signal/power line electrode 19b. The 19c belonging to the peripheral portion of the head 19 becomes the reference potential level VSS as will be described later. Therefore, the signal/power line electrode 19b of the head 19 is made of the gasket 19a belonging to the insulator. In addition, in FIG. 4, the body 20 is composed of a cylindrical shape, and air is supplied into the tire or discharged through the center hole 20b which is a hole penetrating the shaft 24. The valve gasket 21 is used for The central hole of the body 20 is closed to make it airtight. The ring seat 22 compresses the reaction of the mounted spring 2〇a via the shaft 24 I34220.doc 200925006 The force acts as the inverse of the central hole of the closed body 20. The function of stopping the reading. The shaft 24 is the compression of the spring 20a. It is transmitted to the valve gasket seat 22. The shaft 24 and the valve gasket seat 22 are fixed in a closed manner, and the valve is released by pressing the shaft downward to compress the spring 20a. Further, the body ring 2 3 is used. In order to maintain the airtightness of the outer circumference of the hole body 2 and the hole wall 16a (Fig. 3) of the nozzle portion 16. The face portion of the valve holder seat 22 is formed with the shape of the four corners of the accommodation sensor portion 1. The accommodating groove 22a is formed at a position on the lower surface side of the accommodating groove 22a, and a pressure introduction hole 22b composed of a [shaped hole] is formed on the lower surface of the lowermost portion of the valve gasket seat 22. The upper surface of the accommodating groove 22a is mounted. There is an interposer 25 belonging to the printed wiring board. The semiconductor wafers 26 and 27 are mounted on the main surface (wafer mounting surface) of the interposer 25. The semiconductor wafer 26 is a pressure/temperature sensor. 4', the semiconductor wafer 27 is the controller 5. The semiconductor wafer 26 is mounted such that one end of the pressure introduction hole 22b is located below the semiconductor wafer 26. Here, the position of the interposer 25 is arbitrary. , the hole 25a is provided, and the semiconductor wafer 26 can be When the pressure introduction hole 22b is L-shaped, the foreign matter can directly collide with the semiconductor wafer 26, and can be reduced, for example, when foreign matter or the like is present in the tire. In addition, the opening of the receiving groove 22a is sealed by a metal cover 28 made of metal or the like. The semiconductor wafers 26 and 27 are signaled via the bonding wire 29. Transmission and power supply, etc. 134220.doc •18- 200925006 Next, the structure of the shaft 24 will be described in detail. Fig. 6 is a cross-sectional view taken along line A-A of Fig. 4. In the shaft 24, a signal/power supply line 24a serving as a first conductor is formed as shown in the center portion. An insulating layer 24b is provided on the periphery of the signal/power supply line 24a. A ground line 24c which is a sleeve-like shape of the second conductor is formed on the outer peripheral portion of the insulating layer 24b. Further, a valve gasket holder 22 is attached so as to cover the ground wire 24c. The 彳 彳 / / power supply line 24a is a signal line that is provided with a signal line and a power supply voltage vcc. The ground line 24c is a signal line of a reference potential (ground potential) vss. Thus, by using a signal line to which both the signal and the power supply voltage vcc are applied, the number of wirings can be reduced. Further, as long as the wiring of the wiring inside the shaft is easy, it can be set as the wiring of the signal, the power supply voltage, and the reference potential (ground potential). In addition, although the signal is combined with the power supply voltage, the signal can be combined with the reference ❹ potential (ground potential). However, since the reference potential also has the possibility of being used in other places, a combination of signal and power supply voltage is preferred. In addition, by surrounding the signal line with a ground line or a power line, the influence of noise from the outside on the signal line can be suppressed. In Fig. 4, a signal/power line electrode 19b is formed on the upper portion of the head 19 via a washer i9a. The signal/power line electrode 19b is an electrode that is in contact with the signal/power line 24a of the shaft 24. Further, the grounding wire 24c is formed by bending the end portion on the upper side of the head 19 in contact with the body 20 as shown in the symbol of FIG. 4, whereby the body 134220.doc -19-200925006 20, and The head 19 becomes the reference potential (ground potential) VSS level. Figure 7 is a cross-sectional view taken along line Β-Β of Figure 4. The valve gasket seat 22 is formed from the lower side of the valve gasket seat 22 to the top of the valve gasket seat 22 as a pressure introduction hole 22b, and the pressure/temperature sensor 4 provided on the upper end portion of the pressure introduction hole 22b ( The semiconductor wafer 26) applies a gas-pressure in the tire to change the electrical resistance. Fig. 8 is an explanatory view showing an enlarged view of the valve gasket holder 22. On the upper surface of the interposer 25 housed in the housing groove 22a, a semiconductor package 26, 27 or a wafer capacitor 30 for power supply smoothing or the like is used. The electrodes of the semiconductor wafers 26, 27 and the electrodes of the interposer 25, and the electrodes of the semiconductor wafer 26 and the electrodes of the semiconductor wafer 27 are connected via a bonding wire 29, respectively. The signal/power supply line 24a is connected to any of the electrodes of the interposer 25 via the bonding wire 29a, and the grounding line 24c is connected to any of the electrodes of the semiconductor wafer 27 via the bonding wire 29b.电源 The power supply to the semiconductor wafer 27 is performed via the bonding wires 29a and 29b. Further, as described above, the signal/power supply line 24a repeats the signal and the power supply voltage, so that the transmission and reception of the signal to the semiconductor wafer 27 is also performed via the signal/power supply line 24a. The power supply to the semiconductor wafer 26 is performed by a bonding wire 29c directly connected to the electrode of the interposer 25 or the semiconductor wafer 27. Further, in the first embodiment, the interposer 25 is used, but the interposer 25 may be omitted. In this case, for example, the wafer capacitors 3A can be omitted by directly bonding the semiconductor wafers % and 27 to the 134220.doc *20·200925006 housing groove 22a. Here, although it is configured to have a wafer of the semiconductor wafer 26 belonging to the pressure/temperature sensor 4 and the semiconductor wafer 27 belonging to the controller 5, it is also possible to provide the pressure/temperature sensor 4 The (4) device 5 is formed as one wafer of i semiconductor wafers. In addition, the pressure/temperature sensor 4 can be a sensor with two sensors of a pressure sensor and a temperature sensor, or one of a pressure sensor or a temperature sensor. The composition of the device. Fig. 9 is an enlarged view of the valve gasket seat 22 in a state in which the accommodation groove 22a is covered by the metal cover 28. As shown in the figure, the opening of the receiving groove 22a is sealed by a metal cover. The metal cover 28 is sealed by, for example, a hemetic seal, thereby preventing the metal cover 28 from being caused by the air pressure in the tire. Further, although the metal cover 28 is exemplified, it may be ceramic, glass, plastic, mold resin, etc. Next, the gas nozzle cover 18 will be described in detail. Figure 10 is a cross-sectional view of the gas nozzle cover portion 18, and Figure 11 is a bottom view of the gas nozzle cover portion 18 as viewed from the lower side of Figure 1. The lid 18a of the gas nozzle cover portion 18 is a gas nozzle cover. (c〇ver) 18al and a screw portion 18a2 screwed into the nozzle portion 16. The nozzle cover cover covers the screw portion 18a2, the antenna portion 8, the power supply portion 7, and the 11171 (: portion 6 The cover portion 1 8a2 which is the second contact is formed of a conductive metal, and the gas cover 134220.doc 21 200925006 The cover cover 18a 1 is composed of, for example, a resin, and is made of electromagnetic wave material. And it will not hinder the communication with the ruler 1?1 (: Part 6. ❻
在蓋18a内係從上方到下方，分別設有天線部8、電源部 7、RFIC部6、接觸部1 8b。天線部8係為舖設於捲繞於用以 獲得配合使用於通訊、電力供給等之頻率所需之電感 (inductance)之強磁性體之芯之線圈天線、形成於基板之天 線元件（element)圖案、或形成於磁性體上之元件、電介質 天線等之任一者之天線與連接配線所組成。 天線係亦利用於利用搬運波之電力而動作之際之接收， 而搬運波之電力係例如蓄積電性2重層電容（capacity)、或2 次電池等而使用。此外，電源部7係例如由紐扣⑽㈣電 池、2次電池、或電性2重層電容等所組成。 RFIC部6係於配線基板6a之上面搭載有半導體晶片❿， 而形成於該配線基板6a之配線圖案與半導體晶片⑼之電極 係經由焊線6c而連接。 再者，配線基板6a之上面、半導體晶片⑼、及焊線⑽ 藉由樹脂等密封而成為形成有封裝件（㈣一㈣之構成。 在配線基板㈣於任意位置分別設有電極6e、6f。 源部7之正（+)側電極7a > 電極6e係連接於設於上方之電 而電極6f係連接於電源部7之备 員（-)側電極7b。電極6e、6f 係例如與藉由銲錫等形成 又％配線基板6a之配線圖案連接。 經由電極6f而連接於雷调 電源部7之負（-)側電極7 b之配線基 板6a中之基準電位¥88之 配線圖案係例如藉由銲錫等而連 接於螺絲部18a2。 134220.doc -22· 200925006 由於螺絲部18 a2係螺入於成為基準電位v § §之頭19之周 邊部19c(圖4)，因此壓力/溫度感測器4、控制器5、及RFIC 部6之基準電位VSS位準將全部連接。 在RFIC部6之下方係設有接觸部181^接觸部i8b係由基 極電極18bl、接觸基極18b2、成為第1接觸之接觸電極 1 8b3、接觸彈簧1 8t>4、以及墊圈1 8b5所構成。 基極電極18bl係安裝於由絕緣構件所組成之接觸基極 1 8b2。基極電極18b 1係貫通配線基板6a，且以一方之端部 從該配線基板6a之表面之方式形成。 此基極電極18bl之一方之端部係連接於配線基板6a之信 號/電源之配線圖案，而該配線圖案係藉由焊線6c而連接 於半導體晶片6b。 此外，基極電極18bl之另一方之端部係以貫通接觸基極 18b2而從接觸基極18b2之背面突出之方式形成。此基極電 極18bl之另一方之端部係以設於接觸基極18b2之下方之接 觸彈簧18b4接觸之方式設置。 接觸電極18b3係由套筒形狀所組成，該接觸電極18b3之 内側設有接觸彈簧18b4e接觸電極l8b3之下方之端部係於 裝設有氣嘴蓋部18之際與信號/電源線用電極19b連接。 來自電源部7之電源係經由電極6e、6f而供給至111?1(：部 6，並且經由基極電極Ι8Μ、接觸彈簧i8b4、接觸電極 18b3、及信號/電源線24a而供給至半導體晶片％、27。 此外，從RFIC部6傳收送之信號亦同樣，經由基極電極 18bl、接觸彈簧18b4、接觸電極l8b3、及信號/電源線2切 134220.doc •23· 200925006 而輸出入於半導體晶片26、27。 ^•裝設氣嘴蓋部18 ’且接觸電極i8b3往上壓制信號/電 源線24a，則接觸彈簧18b4即藉由形成於接觸電極181?3之 下部之突部往上壓，將使接觸電極丨8b3、接觸彈簧丨8b4、 及基極電極18bl確實接觸。墊圈18b5係成為相對於氣嘴桿 部16之墊圈。 如此，RFIC部6係藉由墊圈I8b5、及接觸基極i8b2而保 持氣密性，該RFIC部6、或氣嘴蓋部18等可防止汽車之車 外之水、塵埃等之侵入’並且可防止來自氣嘴桿部丨6之空 氣茂漏。 此外’在圖11中，氣嘴蓋罩套1 8al、與螺絲部丨8a2係分 別位於氣嘴蓋部1 8之外周部’而墊圈18 b 5係位於螺絲部 18a2之内側《安裝於接觸基極I8b2之接觸電極I8b3係位於 此塾圈18 b 5之内側。 接著說明本實施形態1之輪胎監視系統1之動作。 壓力/溫度感測器4(半導體晶片26)所檢測出之輪胎内之 壓力、及溫度係經由焊線29而輸出至控制器5(半導體晶片 27)(參照圖4)。控制器5係進行壓力/溫度感測器4所檢測出 之資料之補償處理，且將處理後之資料從輸出端子予以輸 出。 從控制器5(半導體晶片27)所輸出之資料係分別經由焊 線29a、軸24之信號/電源線24a(參照圖8)、轴24(參照圖 4)、接觸電極18b3、接觸彈簧18b4、基極電極i8bl、配線 基板6a之配線圖案、及焊線6c而輸入至半導體晶片6b(參 134220.doc -24· 200925006 照圖12)。 RFIC部6係經由天線部8將從控制器5所輸出之資料傳送 至控制部3(參照圖2、1 〇)。控制部3係藉由天線部9接收從 RFIC部6所傳送之資料。 MPU11係根據所接收之資料，以在顯示部12顯示輪胎内 之氣壓值、及溫度之方式進行控制。顯示部12係根據 t MPU11之控制，顯示輪胎内之氣壓值、及溫度（參照圖2)。 ©综上’依據本實施形態1，藉由將監視部2内建於氣嘴芯 部17、及氣嘴蓋部18，在安裝監視部2之際，只要將氣嘴 芯部17裝設於氣嘴桿部16即可，因此可不需從車輪裝卸輪 胎或車輪平衡調整等之作業。 此外，監視部2之電源消失之情形下，只要替換氣嘴蓋 部18、或蓋部之電源部7(電池）即可，因此可容易進行電源 替換之作業，且亦可不需從車輪裝卸輪胎或車輪平衡調整 等之作業，因此可大幅削減作業成本或工時。 〇 再者，在本實施形態中，亦有以下複數個特徵》 另外，此等雖係在組合複數個特徵之狀態下於實施形態 1進行了說明，惟亦可各個獨立來使用。 在氣嘴蓋部18係設有電源部7、及11]71(：部6，而該氣嘴蓋 部18係成為未設有壓力/溫度感測器4之構成。壓力/溫度感 測器4係設於氣嘴桿部16之筒狀内。藉此，相較於在氣嘴 蓋邛1 8叹有感測器者，由於在輪胎側有感測器（壓力/溫度 感測器4)，因此可減低空氣從閥洩漏之影響。 此外，由於將壓力/溫度感測器4以可從氣嘴桿部16卸除 134220.doc -25- 200925006 之方式設置，因此不需要氣嘴桿部16其本身之替換，僅替 換氣嘴桿部16内部之零件即可進行修補。 再者，軋嘴蓋部18與壓力/溫度感測器4之信號傳達係使 用氣嘴心41 7之轴來進行。此情形下，氣嘴怒部17之轴係 成為既維持藉由軸之動作之閥塾圈2 i之開閉動作，又傳達 仏號或電源電壓者。換言之’僅以i個構成即實現開閉動 . 作與信號等之傳達。 藉此’相較於使用開閉動作用零件與信號等之傳達零件 11 之2個者，可謀求精簡化。 再者’氣嘴芯部17之軸係傳達2信號以上，因此例如圖 23所不，6又為在轴内、或軸使2信號間絕緣之結構。另 外，在本實施形^中，係、如圖6所示，在抽設為1信號、 在胴體設為1信號。 此外，藉由信號/電源線24a設為信號與電源電麼重複之 構成’即可削減配線數。 〇 再者，設有感測器部17a之閥墊圈座22係為將圓柱之一 部分去除之形態，為由在將圓柱並排於圓柱軸之方向切割 卩刀之形或將圓柱之一部分從縱向切割之形態（以 T稱魚板形）所組成，而於其平面部分設為搭载有半導體 晶片7 0之構成。 藉由使用魚板形，相輕於你用圓& * A丨r 仲权於便用圓柱之剖面之圓之情形， 即可確保更廣之實裝面積。 藉此，亦將料搭载較大之半㈣晶片或複數個半導體 晶片。 134220.doc -26- 200925006 夕卜 -丄 ，半導體晶片較小之情形下，配置成圓柱之剖面之 圓亦可。 立再者，監視部2係從氣嘴蓋部18之上方到下方，依天線 邛8、電源部7、及RFIC^p 6之順序設置。藉由在氣嘴蓋部 之氣嘴蓋罩套與天線部之間不設置電源部或RFIC部，而成 為可合易進行天線部之電波之傳收送之構成。 (實施形態2) 圖12係為表示本發明之實施形態2之設於氣嘴之氣嘴蓋 部之結構之剖面圖，圖13係為圖12之氣嘴蓋部之外觀立體 圖。 在本實施形態2中，輪胎監視系統〗（圖1}係與前述實施 形態1同樣，由監視部2、及控制部3所構成。此外，輪胎 監視系統1之監視部2(圖2)之構成，係與前述實施形態1同 樣’由壓力/溫度感測器4、控制器5、RFIC部6、電源部 7、及天線部8所組成，控制部3(圖2)之構成亦與前述實施 形態1同樣，由天線部9、RFIC10、MPU11、以及顯示部12 所組成。 再者’氣嘴B之構成亦同樣，由氣嘴桿部16、氣嘴芯部 17、及氣嘴蓋部18所組成。在本實施形態2中，與前述實 施形態1不同之處，係為氣嘴蓋部1 8之内部構成，而成為 該氣嘴蓋部1 8可進行電源部7之替換之構成之點。 氣嘴蓋部18係如圖12所示，設有成為氣嘴b之蓋之蓋部 18a。蓋18a係由氣嘴蓋罩套18a 1、螺入於氣嘴桿部16之螺 絲部18a2所構成。氣嘴蓋罩套18al係為覆蓋螺絲部〗8a2、 134220.doc -27- 200925006 或天線部8、電源部7、及RFIC部6之罩套。 ，在螺絲部18a2之外周面之任意位置係形成有栓鎖（iatch) 溝30而於氣嘴蓋罩套18a 1之内面圓周之任意位置係形成 有凸形狀之栓鎖3 1。 再者，藉由將氣嘴蓋罩套18al之栓鎖31嵌入於螺絲部 1 8a2之栓鎖溝30，而成為在螺絲部18a2安裝氣嘴蓋罩套 . 18al之結構。 ❹ 此外，藉由從螺絲部18a2之栓鎖溝30拔除氣嘴蓋罩套 18al之栓鎖31，而成為從螺絲部18a2卸除氣嘴蓋罩套1831 之結構。 螺絲部18a2係與前述實施形態i同樣，由導電性之金屬 組成，氣嘴蓋罩套l8al係由樹脂等組成。在蓋18a内，係 從上方到下方，分別設有天線部8、電源部7、RFIC部ό、 及接觸部18b。 在此，在氣嘴B之内部構成中，RFIC^p 6以外之構成係 ❹ 與前述實施形態1同樣’因此說明予以省略。此外，在 RFIC 6中，半導體晶片6b、焊線6e、及封裝件6d之構成 係與前述實施形態1同樣，不同之點係為配線基板6a之構 成。 配線基板6a係如圖12、及圖13所示，係由無圓柱之圓周 壁之一部分之橫倒U字狀之形狀所組成，在搭載半導體晶 片6b之搭載面’係以突出之方式形成有電極μ，而從圓周 壁係以突出之方式形成有電極6e(圖13所示）。 電極6e係連接於電源部7之正（+)側電極7a，而電極“係 134220.doc -28· 200925006 連接於電源部7之負㈠側電極7be電極6e、6f係與例如藉 由銲錫等形成於配線基板6a之配線圖案連接。 電源部7係例如由鈕扣電池或2次電池等所組成，以夾入 於電極6f與配線基板6a之圓柱之一方之端面之方式裝設， 且於裝設之際藉由電極6f之彈力固定。 . 此外，在螺絲部18al係具備有〇環32，藉由此〇環32而 、 保持螺絲部18al與氣嘴蓋罩套18a2之氣密性。 如圖13所示，在替換電源部7之際，係於從螺絲部1832 卸下氣嘴蓋罩套l8al之後，從螺絲部18al取出橫倒1字狀 之配線基板6a。再者，從配線基板6a取出被夾入之電源部 7，且裝設新的電源部7。 接下來，在將配線基板6&裝設於螺絲部18&1之後將氣 嘴蓋罩套18a2嵌入於該螺絲部18&1，電源部7之替換即終 了。 ' 如此，藉由將電源部7設為可替換，即使來自電源部7之 〇 電源切斷之際’亦可容易僅將電源部7在短時間更換為新 的。 藉此，在本實施形態2中，即可使監視部2之維修費低成 本化。 (實施形態3) 圖14係為表示本發明之實施形態3之設於氣嘴之氣嘴蓋 邻之結構之剖面圖，圖丨5係為表示本發明之實施形態3之 .設於RFIC部之電源部之一例之說明圖。 在本實施形態3中’係說明氣嘴B(圖1)中之氣嘴蓋部18 134220.doc •29· 200925006 之其他内部構成例。 此情形下，氣嘴蓋部18係如圖14所示，成為在與由氣嘴 蓋部18、天線部8、電源部7、rFIC部6、及接觸部18b所組 成之刖述實施形態1同樣之構成中，新設有發電部3 3之構 成。 此發電部33係設於電源部7與RFIC部6之間。發電部33係 由發電線圈34、永久磁石35、磁石懸吊彈簧36、及框體37 所構成。 在圓筒狀之框體3 7之内側，係於一方之端面側設有發電 線圈34。於另一方之端面側，係固定有磁石懸吊彈簧36之 一端，而在該磁石懸吊彈簧36之另一端，係安裝有永久磁 石35，而該永久磁石35係成為位於發電線圈34之下方。 發電部33係由因為汽車行進時等產生振動之際，相對於 固定之發電線圈34，藉由安裝於磁石懸吊彈簧之永久磁石 35移動於氣嘴B之軸方向等而發電之音圈（v〇ice⑺丨丨）型態 所組成。 發電部33所發電之電源係輸出至111?1€部6，且於被整流 平π之後，蓄電於由二次電池、或電性2重層電容等所組 成之電源部7。 在框體37之上面，係分別形成有電極37a、37b，成為電 極37a連接於電源部7之正側電極7a，而電極37匕連接於 電源部7之負（-)侧電極7b之構成。 發電部33與RFIC部6、及111?1(：：部6與連接於電源部7之電 極37a、37b，係經由配線於氣嘴3之軸方向之跳線等而連 I34220.doc 200925006 接。 圖1 5係為表示設於RFIC部6之穩定化電源部3 8之一例之 說明圖。 穩定化電源部38係為在將藉由發電部33所發電之電源予 以整流之後使之穩定化之電路。穩定化電源部38係由二極 、 體（diode)39〜42、定電壓電路43、及電容器44所構成。二 • 極體3 9〜42係構成二極體橋接電路，用以將從發電部33所 輸出之電源予以整流。 ❹ 藉由二極體39〜42所整流之電源係藉由定電壓電路们而 調節為任意之電壓位準，且藉由電容器44平滑而輸出至電 源部7。 藉此，在本實施形態3中，由於可不需電源部7之替換， 因此不需電池替換所需之作業工時，而可使監視部2之維 修費更低成本化。 (實施形態4) 〇 圖16係為表示本發明之實施形態4之設於氣嘴之氣嘴蓋 部之結構之剖面圖。 在本實施形態4中，氣嘴蓋部18中之發電部33係與前述 • 冑施形態3所示之音圈型態不同，表示藉由偏心馬達型態 構成之例外’氣嘴蓋部i 8之其他構成係與前述實施 形態3同樣，故說明予以省略。 此清形下’偏心馬達型態之發電部33係如圖16所示設有 ·_且以圓形之永久磁石46位於該框體45之中央部之 弋X置在此永久磁石46之中心部係安裝有轴柄 134220.doc 200925006 (shaft)47。 軸柄47係經由軸承45a而貫通框體45。在軸柄叼之前端 部係安裝有偏心法碼（weight)47e此外，在框體仙，係 以發電線圈48位於永久磁石46之外周部附近之方式固定。 偏心法碼47係藉由因為汽車之行進時等之輪胎之上下動 作、旋轉運動而旋轉，且安裝於該偏心法碼47之永久磁石 46亦旋轉而進行發電。 ΟThe antenna portion 8, the power supply portion 7, the RFIC portion 6, and the contact portion 18b are provided in the cover 18a from the top to the bottom. The antenna unit 8 is a coil antenna that is laid around a core of a ferromagnetic body that is used for obtaining an inductance required for use in communication, power supply, or the like, and an element pattern formed on the substrate. Or an antenna formed on a magnetic body, a dielectric antenna, or the like, and a connection wiring. The antenna system is also used for receiving when the power of the carrier wave is operated, and the power for transporting the wave is used, for example, to store an electric double layer capacitor or a secondary battery. Further, the power supply unit 7 is composed of, for example, a button (10) (four) battery, a secondary battery, or an electric double layer capacitor. The RFIC unit 6 is mounted with a semiconductor wafer on the upper surface of the wiring board 6a, and the wiring pattern formed on the wiring board 6a and the electrode of the semiconductor wafer (9) are connected via a bonding wire 6c. Further, the upper surface of the wiring board 6a, the semiconductor wafer (9), and the bonding wire (10) are sealed by a resin or the like to form a package ((4)-(4). The electrodes 6e and 6f are provided at arbitrary positions on the wiring board (4). The positive (+) side electrode 7a of the source portion 7 is electrically connected to the electrode (6), and the electrode 6f is connected to the reserve member (-) side electrode 7b of the power supply unit 7. The electrodes 6e and 6f are, for example, borrowed. The wiring pattern of the % of the wiring board 6a is formed by soldering or the like. The wiring pattern of the reference potential of the wiring board 6a connected to the negative (-) side electrode 7b of the lightning power supply unit 7 via the electrode 6f is, for example, borrowed. It is connected to the screw portion 18a2 by solder or the like. 134220.doc -22· 200925006 Since the screw portion 18 a2 is screwed into the peripheral portion 19c (Fig. 4) which becomes the head 19 of the reference potential v § §, the pressure/temperature sensing The reference potential VSS level of the controller 4, the controller 5, and the RFIC unit 6 are all connected. The contact portion 181 is provided below the RFIC unit 6. The contact portion i8b is formed by the base electrode 18b1 and the contact base 18b2. 1 contact contact electrode 1 8b3, contact spring 1 8t > 4, and pad The base electrode 18b1 is attached to the contact base 18b2 composed of an insulating member. The base electrode 18b1 penetrates the wiring board 6a and has one end portion from the surface of the wiring board 6a. One end of the base electrode 18b1 is connected to the signal pattern of the signal/power source of the wiring substrate 6a, and the wiring pattern is connected to the semiconductor wafer 6b by the bonding wire 6c. Further, the base electrode 18b1 The other end portion is formed so as to protrude from the back surface of the contact base 18b2 through the contact base 18b2. The other end of the base electrode 18b1 is a contact spring 18b4 provided below the contact base 18b2. The contact electrode 18b3 is formed by a sleeve shape, and the inner side of the contact electrode 18b3 is provided with a contact spring 18b4e contacting the lower end of the electrode l8b3 at the time of mounting the nozzle cover portion 18 with the signal / The power supply line is connected to the electrode 19b. The power supply from the power supply unit 7 is supplied to the 111?1 (the portion 6 via the electrodes 6e, 6f), via the base electrode Ι8, the contact spring i8b4, the contact electrode 18b3, and the signal/power supply. The line 24a is supplied to the semiconductor wafers % and 27. Further, the signals transmitted from the RFIC unit 6 are similarly cut by the base electrode 18b1, the contact spring 18b4, the contact electrode 18b3, and the signal/power line 2 134220.doc • 23· 200925006 and outputted to the semiconductor wafers 26 and 27. ^• The nozzle cover portion 18' is mounted and the contact electrode i8b3 presses up the signal/power supply line 24a, and the contact spring 18b4 is formed on the contact electrode 181? The protrusion of the lower portion is pressed upward, and the contact electrode 8b3, the contact spring 8b4, and the base electrode 18b1 are surely contacted. The washer 18b5 is a washer with respect to the nozzle stem 16. In this manner, the RFIC unit 6 is kept airtight by the gasket I8b5 and the contact base i8b2, and the RFIC unit 6, the gas nozzle cover 18, and the like can prevent the intrusion of water, dust, and the like outside the vehicle, and can be prevented. The air from the nozzle shank 6 leaks. Further, in Fig. 11, the nozzle cover cover 18a and the screw portion 8a2 are respectively located at the outer peripheral portion of the nozzle cover portion 18, and the washer 18b5 is located inside the screw portion 18a2 "mounted on the contact base. The contact electrode I8b3 of the pole I8b2 is located inside the loop 18 b 5 . Next, the operation of the tire monitoring system 1 of the first embodiment will be described. The pressure and temperature in the tire detected by the pressure/temperature sensor 4 (semiconductor wafer 26) are output to the controller 5 (semiconductor wafer 27) via the bonding wire 29 (see Fig. 4). The controller 5 performs compensation processing of the data detected by the pressure/temperature sensor 4, and outputs the processed data from the output terminal. The data output from the controller 5 (semiconductor wafer 27) passes through the bonding wire 29a, the signal/power supply line 24a of the shaft 24 (refer to FIG. 8), the shaft 24 (refer to FIG. 4), the contact electrode 18b3, the contact spring 18b4, The base electrode i8b1, the wiring pattern of the wiring board 6a, and the bonding wire 6c are input to the semiconductor wafer 6b (see 134220.doc -24·200925006 and Fig. 12). The RFIC unit 6 transmits the data output from the controller 5 to the control unit 3 via the antenna unit 8 (see Figs. 2 and 1). The control unit 3 receives the data transmitted from the RFIC unit 6 via the antenna unit 9. The MPU 11 controls the display unit 12 to display the air pressure value and the temperature in the tire based on the received data. The display unit 12 displays the air pressure value and the temperature in the tire in accordance with the control of the t MPU 11 (see Fig. 2). According to the first embodiment, the monitoring unit 2 is built in the nozzle core portion 17 and the nozzle cover portion 18, and when the monitoring unit 2 is attached, the nozzle core portion 17 is attached to The nozzle portion 16 is sufficient, so that it is not necessary to load or unload the tire or the wheel balance adjustment work. Further, in the case where the power of the monitoring unit 2 disappears, the gas nozzle cover 18 or the power supply unit 7 (battery) of the lid portion can be replaced, so that the power supply can be easily replaced, and the tire can be loaded and unloaded from the wheel. Or work such as wheel balance adjustment, so work costs or man-hours can be drastically reduced. Further, in the present embodiment, the following plural features are also described. Further, although these are described in the first embodiment in a state in which a plurality of features are combined, they may be used independently. The gas nozzle cover portion 18 is provided with power supply portions 7 and 11] 71 (: portion 6), and the gas nozzle cover portion 18 is configured without a pressure/temperature sensor 4. Pressure/temperature sensor 4 is provided in the cylindrical shape of the nozzle portion 16. Thereby, there is a sensor on the tire side (pressure/temperature sensor 4) compared to the sensor in the nozzle cover 邛1 Therefore, the influence of air leakage from the valve can be reduced. Further, since the pressure/temperature sensor 4 is disposed in such a manner that it can be removed from the nozzle stem portion 134220.doc -25- 200925006, the nozzle rod is not required. The replacement of the portion 16 itself can be repaired by replacing only the parts inside the nozzle portion 16. Further, the signal transmission of the nozzle cover portion 18 and the pressure/temperature sensor 4 uses the axis of the nozzle core 41 7 In this case, the axis of the nozzle anger portion 17 is a function that maintains the opening and closing operation of the valve ring 2 i by the action of the shaft, and conveys the nickname or the power supply voltage. In other words, it is composed of only one element. The opening and closing movements are realized. The signals are transmitted, etc., and the two parts of the parts 11 that are used for opening and closing operations, such as parts and signals, are used. Further, the axis of the nozzle core portion 17 transmits two signals or more. Therefore, for example, as shown in Fig. 23, the structure of the second signal is insulated between the two signals in the shaft or the shaft. In the middle, as shown in Fig. 6, the signal is set to 1 and the signal is set to 1 signal. In addition, the signal/power line 24a is configured to repeat the signal and the power supply. Furthermore, the valve gasket seat 22 provided with the sensor portion 17a is in the form of removing one part of the cylinder, and is formed by cutting the shape of the boring tool in the direction in which the cylinder is arranged side by side in the cylindrical axis or by taking a part of the cylinder from the longitudinal direction. The shape of the cut (in the shape of a fish plate in the shape of T) is formed, and the semiconductor wafer 70 is mounted on the flat portion thereof. By using the fish plate shape, it is lighter than the circle & * A丨r The right to use the circle of the cross section of the cylinder to ensure a wider mounting area. Therefore, the larger half (four) wafer or a plurality of semiconductor wafers are also loaded. 134220.doc -26- 200925006 -丄, when the semiconductor wafer is small, it is configured as a section of a cylinder. Further, the monitoring unit 2 is provided from the upper side to the lower side of the nozzle cover portion 18 in the order of the antenna 邛 8, the power supply unit 7, and the RFIC p p 6. By the gas in the nozzle cover portion The power supply unit or the RFIC unit is not provided between the mouth cover cover and the antenna unit, and the radio wave transmission and reception of the antenna unit can be easily performed. (Embodiment 2) FIG. 12 shows Embodiment 2 of the present invention. FIG. 13 is a perspective view showing the appearance of the nozzle cover portion of the nozzle, and FIG. 13 is an external perspective view of the nozzle cover portion of FIG. 12. In the second embodiment, the tire monitoring system (FIG. 1) is implemented as described above. Similarly to the first aspect, the monitoring unit 2 and the control unit 3 are configured. Further, the configuration of the monitoring unit 2 (FIG. 2) of the tire monitoring system 1 is the same as that of the first embodiment. The pressure/temperature sensor 4, the controller 5, the RFIC unit 6, the power supply unit 7, and the antenna unit 8 are provided. In the same manner as in the first embodiment, the configuration of the control unit 3 (Fig. 2) is composed of the antenna unit 9, the RFIC 10, the MPU 11, and the display unit 12. Further, the configuration of the nozzle B is similarly composed of the nozzle portion 16, the nozzle core portion 17, and the nozzle cover portion 18. In the second embodiment, the difference from the first embodiment is the internal configuration of the nozzle cover portion 18, and the nozzle cover portion 18 can be replaced with the power supply portion 7. As shown in Fig. 12, the gas nozzle cover portion 18 is provided with a lid portion 18a which serves as a lid for the gas nozzle b. The cover 18a is composed of a nozzle cover cover 18a1 and a screw portion 18a2 screwed into the nozzle stem portion 16. The nozzle cover cover 18a is a cover covering the screw portion 8a2, 134220.doc -27- 200925006 or the antenna portion 8, the power supply portion 7, and the RFIC portion 6. An iatch groove 30 is formed at any position on the outer peripheral surface of the screw portion 18a2, and a convex latch 31 is formed at any position on the inner circumference of the nozzle cover cover 18a1. Further, the latch 31 of the nozzle cover 18a is fitted into the latch groove 30 of the screw portion 18a2, and the air nozzle cover cover 18a is attached to the screw portion 18a2. Further, by detaching the latch 31 of the nozzle cover cover 18a from the latch groove 30 of the screw portion 18a2, the nozzle cover cover 1831 is removed from the screw portion 18a2. The screw portion 18a2 is made of a conductive metal as in the above-described embodiment i, and the nozzle cover cover l8a is made of resin or the like. In the cover 18a, an antenna portion 8, a power supply portion 7, an RFIC portion ό, and a contact portion 18b are provided from above to below. Here, in the internal configuration of the nozzle B, the configuration other than the RFIC is not the same as that of the first embodiment. Therefore, the description will be omitted. Further, in the RFIC 6, the configuration of the semiconductor wafer 6b, the bonding wire 6e, and the package 6d is the same as that of the first embodiment, and the difference is the configuration of the wiring substrate 6a. As shown in FIG. 12 and FIG. 13, the wiring board 6a is composed of a U-shaped U-shaped portion of a peripheral wall having no cylinder, and is formed so that the mounting surface of the semiconductor wafer 6b is protruded. The electrode μ is formed with an electrode 6e (shown in Fig. 13) protruding from the circumferential wall. The electrode 6e is connected to the positive (+) side electrode 7a of the power supply unit 7, and the electrode "134240.doc -28· 200925006 is connected to the negative (one) side electrode 7be electrode 6e, 6f of the power supply unit 7 and is, for example, soldered. The wiring pattern formed on the wiring board 6a is connected. The power supply unit 7 is composed of, for example, a button battery or a secondary battery, and is mounted so as to be sandwiched between the electrode 6f and the end surface of one of the columns of the wiring board 6a. The screw portion 18a is provided with a loop 32, and the airtightness of the screw portion 18al and the nozzle cover cover 18a2 is maintained by the loop 32. As shown in Fig. 13, when the power supply unit 7 is replaced, the valve cover cover 8a is removed from the screw portion 1832, and the wiring board 6a which is crossed in a line shape is taken out from the screw portion 18a1. 6a, the power supply unit 7 that has been pinched is taken out, and a new power supply unit 7 is installed. Next, after the wiring board 6& is mounted on the screw portion 18&1, the nozzle cover cover 18a2 is fitted in the screw portion 18&; 1, the replacement of the power supply unit 7 is finished. 'So, by setting the power supply unit 7 as an alternative Even when the power supply unit 7 is turned off, the power supply unit 7 can be easily replaced with a new one in a short time. Thus, in the second embodiment, the maintenance cost of the monitoring unit 2 can be made low. (Embodiment 3) FIG. 14 is a cross-sectional view showing a structure in which a gas nozzle cover of a gas nozzle according to Embodiment 3 of the present invention is adjacent, and FIG. 5 is a view showing a third embodiment of the present invention. An illustration of an example of a power supply unit of the RFIC unit. In the third embodiment, another internal configuration example of the nozzle cover 18 134220.doc • 29· 200925006 in the nozzle B (Fig. 1) will be described. As shown in Fig. 14, the nozzle cover portion 18 is the same as that of the first embodiment described above, which is composed of the nozzle cover portion 18, the antenna portion 8, the power supply portion 7, the rFIC portion 6, and the contact portion 18b. In the configuration, the power generation unit 33 is newly provided. The power generation unit 33 is provided between the power supply unit 7 and the RFIC unit 6. The power generation unit 33 is composed of the power generation coil 34, the permanent magnet 35, the magnet suspension spring 36, and the frame. The body 37 is formed. On the inner side of the cylindrical frame body 37, the power generating coil 34 is provided on one end face side. One end of the magnet suspension spring 36 is fixed to the end face side of one side, and a permanent magnet 35 is attached to the other end of the magnet suspension spring 36, and the permanent magnet 35 is located below the power generating coil 34. The portion 33 is a voice coil that generates electricity by moving the permanent magnet 35 attached to the magnet suspension spring to the axis direction of the nozzle B with respect to the fixed power generating coil 34 when the vehicle vibrates during traveling. The electric power generated by the power generation unit 33 is output to the 111?1€ unit 6, and after being rectified and π, the electric power is stored in a secondary battery or an electric double layer capacitor. The power supply unit 7 is composed. On the upper surface of the casing 37, electrodes 37a and 37b are formed, respectively, and the electrode 37a is connected to the positive electrode 7a of the power supply unit 7, and the electrode 37 is connected to the negative (-) side electrode 7b of the power supply unit 7. The power generation unit 33, the RFIC unit 6, and the 111?1 (:: part 6 and the electrodes 37a and 37b connected to the power supply unit 7 are connected to the I34220.doc 200925006 via a jumper wire in the axial direction of the nozzle 3, etc.) Fig. 15 is an explanatory view showing an example of the stabilizing power supply unit 38 provided in the RFIC unit 6. The stabilizing power supply unit 38 stabilizes the power source generated by the power generating unit 33 after rectifying the power generated by the power generating unit 33. The stabilized power supply unit 38 is composed of two poles, diodes 39 to 42, a constant voltage circuit 43, and a capacitor 44. The two pole bodies 39 to 42 constitute a diode bridge circuit for The power source output from the power generation unit 33 is rectified. 电源 The power source rectified by the diodes 39 to 42 is adjusted to an arbitrary voltage level by the constant voltage circuit, and is output to the capacitor 44 by smoothing. Therefore, in the third embodiment, since the replacement of the power supply unit 7 is not required, the maintenance time required for the battery replacement can be eliminated, and the maintenance cost of the monitoring unit 2 can be reduced. Embodiment 4) FIG. 16 is a view showing a gas provided in a nozzle according to Embodiment 4 of the present invention. In the fourth embodiment, the power generation unit 33 in the nozzle cover portion 18 is different from the voice coil type shown in the above-described third embodiment, and is represented by an eccentric motor type. The other configuration of the nozzle cover portion 8 is the same as that of the third embodiment. Therefore, the power generation unit 33 of the eccentric motor type is provided as shown in FIG. A shaft 134220.doc 200925006 (shaft) 47 is attached to a central portion of the permanent magnet 46 with a circular permanent magnet 46 located at a central portion of the frame 45. The shank 47 is passed through the bearing 45a. The frame 45 is provided with an eccentric weight 47e at the end before the shank, and is fixed in such a manner that the power generating coil 48 is located in the vicinity of the outer periphery of the permanent magnet 46. The eccentric code 47 is attached. The electric power is rotated by the upper and lower movements and the rotational motion of the tire during the traveling of the automobile, and the permanent magnet 46 attached to the eccentric code 47 is also rotated to generate electricity.
在本實施形態4中’發電部33所發電之電源係輸出至 6，且於藉由RFI(^p 6之穩定化電源部38(圖丨5)而整 机平π之後，蓄電於由二次電池、或電性2重層電容等所 組成之電源部7 ^此外，發電部33與111?1(：部6、及 與電源部7係經由配線於氣嘴B之軸方向之跳線等而連接。 藉此，在本實施形態4中，由於可不需電源部7之替換， 因此不需電池替換所需之作業工時，而可使監視部2之維 修費更低成本化。 (實施形態5) 圖17係為表示本發明之實施形態5之設於氣嘴之氣嘴蓋 部之結構之剖面圖，圖18係為表示本發明之實施形態5之 設於RFIC部之電源部之一例之說明圖。 在本實施形態4中’係使用壓電元件構成氣嘴蓋部丨8中 之發電部33。此外，氣嘴蓋部18之其他構成係成為與前述 實施形態3同樣，因此說明予以省略。 壓電元件型態之發電部33係如圖17所示設有金屬板49， 而在此金屬板49之上面搭載有壓電陶瓷50»金屬板49係固 134220.doc -32- 200925006 疋在固疋於螺絲部之夾甜（elamp)5 1。 此外’在金屬板49之下面係安裝有法碼52。再者，在法 碼52之下方係安裝有任意抑制法碼52過於振動之減振器橡 膠53。In the fourth embodiment, the power source generated by the power generation unit 33 is output to 6, and is stored in the second phase by the RFI (the stabilized power supply unit 38 (Fig. 5) of the RFI). The power supply unit 7 including the secondary battery or the electric double layer capacitor, etc., the power generation unit 33 and the 111?1 (the portion 6 and the power supply unit 7 are routed via the wiring in the axial direction of the nozzle B, etc.) Therefore, in the fourth embodiment, since the replacement of the power supply unit 7 is not required, the maintenance time required for the battery replacement can be eliminated, and the maintenance cost of the monitoring unit 2 can be reduced. Fig. 17 is a cross-sectional view showing a configuration of a nozzle cover portion provided in a nozzle according to a fifth embodiment of the present invention, and Fig. 18 is a diagram showing a power supply unit provided in the RFIC unit according to the fifth embodiment of the present invention. In the fourth embodiment, the piezoelectric element is used to constitute the power generating portion 33 in the nozzle cover portion 8. The other configuration of the nozzle cover portion 18 is the same as that of the third embodiment. The description will be omitted. The piezoelectric element type power generation unit 33 is provided with a metal plate 49 as shown in FIG. The upper surface of the plate 49 is equipped with a piezoelectric ceramic 50»metal plate 49 fastening 134220.doc -32- 200925006 疋 疋 疋 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝 螺丝There is a code 52. Further, under the code 52, a damper rubber 53 having any suppression method code 52 excessively vibrating is attached.
藉由因為汽車行進時等之振動輪胎之上下動作等而施加 應力於搭載於金屬板49之壓電陶瓷50，而從該壓電陶瓷5〇 產生電壓。此電壓係於藉由RFIC部6之穩定化電源部38(圖 15)整流平滑之後，蓄電於由二次電池、或電性2重層電容 等所組成之電源部7 〇 此外，穩定化電源部3 8之發電量較少之情形下，亦可藉 由減、金屬板49之固定部位而增加施加於壓電陶瓷5〇之應 力，或將搭載有壓電陶瓷50之金屬板49設為複數片等，而 可增加發電力。 圖18係為表示將搭載有壓電陶瓷5〇之金屬板钩設置複數 片之際之RFIC部6申之穩定化電源部38之一例之說明圖。 穩定化電源部38係由二極體54〜59、定電壓電路杓、及 電容器44所構成。此情形下，2個壓電陶瓷5〇、5如係並聯 連接。 在歷電陶瓮 -π 饮W田一你姐 54〜57所構成之二極體橋接之一方之輸入部，在該壓電陶 究50之另-方之輸出部’係連接於由二極體Μ〜57所構成 之二極體橋接之另一方之輸入部。 在壓電陶瓷50a之一方之輸出部，係 Π 你運接有壓電陶瓷50 之另一方之輸出部，而在壓電陶瓷5〇a之另一方之輸出 I34220.doc •33- 200925006 部，係連接有二極體58之陽極、以及二極體59之陰極。 二極體58之陰極係連接於由二極體54〜”所構成之二極 體橋接之-方之輸出部，而二極體59之陽極係連接於由二 極體54〜57所構成之二極體橋接之另一方之輸出部。 藉此，在本實施形態5中，亦由於可不需電源部7之替 換’因此不需電池替換所需之作業工時，巾可使監視部2 之維修費更低成本化。 (實施形態6) 圖19係為本發明之實施形態6之氣嘴之剖面圖，圖係 為設於圖19之氣嘴之氣嘴蓋之接觸電極之說明圖，圖以係 為接續圖20之說明圖，圖22係為表示接觸電極與形成於頭 之側面之彳g號/電源線用電極之連接例之說明圖。 在本實施形態6中，氣嘴B係如圖19所示，氣嘴蓋部18係 設為從氣嘴芯部17之轴24之側面進行信號/電源之連接之 構成者。與前述實施形態1之氣嘴蓋部18(圖1〇)不同之處， 係如圖20所示’新設有接觸電極6〇、及彈簧61，以取代基 極電極18bl、接觸電極18b3、及接觸彈簧18b4(圖1〇)之 點。 在配線基板6a之下方係經由彈簧61而設有接觸基極 1 8b2。接觸基極1 8b2係得以藉由彈簧61而按壓至塾圈丨8匕5 側0 接觸電極60係如圖21所示由4條長方形板狀所組成，且 以延伸於氣嘴B之軸方向之下側（軸24側）之方式等間隔形 成。此接觸電極60之前端部係施有折彎加工，如圖22所 134220.doc • 34. 200925006 不’此經折彎加工之部分係與形成於頭19之側面之信號/ 電源線用電極19b接觸而連接。 如前述實施形態1所示，氣嘴芯部丨7之頭丨9係成為基準 電位位準VSS ’因此信號/電源線用電極19b之間係藉由橡 膠等之絕緣物62而絕緣。 - (實施形態7) 圖23係為本發明之實施形態7之氣嘴芯部之刮面圖，圖 ❹ 24係為表示設於圖23之氣嘴芯部之閥墊圈座22之構成例之 說明圖’圖25係為本實施形態7之氣嘴蓋之剖面圖，圖26 係為本實施形態7之氣嘴之剖面圖。 在前述實施形態1中，雖係設為形成有在軸24重複有信 號線與電源電壓之信號/電源線24&與接地線24c之構成，惟 在本實施形態7中，係如圖23所示，設為與設於氣嘴B之軸 24同轴結構，且設為信號與電源不重複之構成。 在氣嘴芯部1 7中，軸24之内部係如圖23所示，於中心部 〇 形成有成為第3導體之信號線63，而在其外周面係經由絕 緣物64而形成有成為第4導體之電源電壓線65。再者，在 絕緣物64之外周部，係成為經由絕緣物66而形成有成為第 5導體之接地線67之同軸構成。 電源電壓線65、及接地線67係以露出於從頭19突出之軸 24之任意之側面之方式形成，成為此等電源線電極、接 地電極69，而此等係分別連接於設於氣嘴蓋部18之後述之 接觸電極74、75(圖25)。 此外’設有感測器部17a之閥墊圈座22，係如圖24所 134220.doc -35- 200925006 示’由去除圓柱之一部分之魚板形所組成，而於其平面部 分係搭載有半導體晶片70。 半導體晶片70係成為壓力/溫度感測器4與控制器5形成 於1個半導體晶片之所謂之1晶片構成。在閥墊圈座22之任 意位置’係如圖23所示形成有L字狀之壓力導入孔22b »半 ' 導體晶片70係用以計測經由壓力導入孔22b所導入之輪胎 内之氣壓、及溫度。 軸24之信號線63、電源電壓線65、及接地線67係經由焊 線71而分別與設於半導體晶片7〇之焊接（b〇nding)電極連 接。 此情形下，安裝有轴24之閥墊圈座22之前端部係以成為 魚板形之方式形成，藉此，將焊線71連接於所露出之信號 線63、電源電壓線65、以及接地線67之露出面。 在閥墊圈座22係如圖23所示裝設圓筒狀之蓋部72，而得 以例如藉由隔絕密封等封裝而保持氣密。 ❹ 此外，在蓋部72係於與壓力導入孔22b之開口部對應之 位置形成有孔72a，且經由此孔72a而導入壓力。 圖25係為本實施形態7之氣嘴蓋部丨8之剖面圖。 在蓋1 8a内，從上下到下方，係與前述實施形態i同樣， 分別設有天線部8、電源部7、RFIC部6、接觸部18b，在 此，接觸部18b之構成係與前述實施形態1不同。 在接觸部18b中，於圖1〇之接觸基極18b2，係分別設有 成為第3接觸之接觸電極73、成為第4接觸之接觸電極74、 即成為第5接觸之接觸電極乃。接觸電極73係如圖23與圖 134220.doc -36 - 200925006 26所不，為連接於軸24之中心部之信號線63之電極。 此外接觸電極74係為連接於形成於軸24之電源電壓線 65(參照圖23)之電極，而該接觸電極74之前端部係與形成 於軸24之側面之電源電壓線65之露出面65S連接（參照圖 26)。 . 接觸電極75係為連接於形成於軸24之接地線67(參照圖 23)之電極，而該接觸電極75之前端部係與形成於軸以之 側面之接地線之露出面64S連接（參照圖26)。 ❹ 此外，在本實施形態7中’係記載有壓力導入孔22b形成 為L字狀之情形。然而，若半導體晶片7〇之破損之問題等 較少’則壓力導入孔22b係一方之開口部與另一方之開口 部亦可為直線狀。此在其他實施形態中亦同樣。 此外，例如，如圖27所示，亦可設為以相對於氣嘴6之 軸方向成為傾斜之方式形成壓力導入孔22b。藉此，即可 減低因為半導體晶片70之異物所導致之破損等之產生。 0 再者，再本實施形態7中，雖係將閥墊圈座22設為將圓 柱之一部分去除之魚板形，惟例如圖28所示，亦可設為在 閥塾圈座22之前端部之端面部分形成圓命形22^；之結構。 藉此’即可提高蓋部7 2之剛性，因此可更正確測定壓 力。 (實施形態8) 圖29係為表示本實施形態8之監視部之構成例之區塊 圖。圖30係為圖29之監視部中之信號之時序圖。 在本實施形態中’圖29係為連接於氣嘴芯部17與氣嘴蓋 134220.doc •37- 200925006 邛1 8間之信號/電源線24a成為賦予有信號與電源電壓Vcc 之兩方之彳s號線之監視部2之構成例，而接地線24c係成為 基準電位VSS之信號線。 在監視部2中，於氣嘴芯部丨7係設有控制器$、及壓力/ 溫度感測器4，而於氣嘴蓋部18係設有111?1(：部1〇()、電源部 • 7、及天線部8。在此，壓力/溫度感測器4亦可個別為壓力 . 感測器、溫度感測器。 〇 控制器5係由ASIC5a、輸出入部5b、電源部5c所組成。 此外’ RFIC部100係由RFIC10、輸出入部1〇3、以及拉升 (pull up)用之電阻l〇b所組成。 輸出入部5b係以開汲極（open drain)等之電路構成，且從 電源部7經由電阻l〇b而供給Hi位準之信號。連接於成為壓 力/溫度感測器4等之控制器之ASIC5a之電源部5c，係由二 極體Di與靜電電容元件C所組成，且藉由二極體Di將信號 ❹ 整流’且以靜電電容元件C予以平滑而作為ASIC用之電源 供給至ASIC5a。 藉此’即可共用信號線與電源線，與基準電位vss之線 配合’而可藉由2線而連接設於氣嘴芯部17之控制器5與設 於氣嘴蓋部18之RFIC部100。 如例所示’電源之靜電電容元件c、或拉升用之電阻 10b，係可與ASIC或RFIC作成1晶片化，亦可作成外接零 件。此外’為了簡單起見，電源部5c雖表示二極體Di與靜 電電容元件C之例’惟以使用組合主動元件或被動元件之 開關調節器（regulator)或過濾（filter)電路、或穩定化電源 134220.doc 38- 200925006 電路等來使用不影響高效率化或信號通訊之方法為較佳。 此外，控制器5或壓力/溫度感測器4、或尺!?1(：部1〇〇亦可 視需要予以1晶片化。 圖30係為氣嘴芯部17與氣嘴蓋部18之間之通訊，為表示 控制之例之時序圖。 ' 氣嘴蓋部182RFIC10係在每一定時間或欲更新輪胎資訊 時’或是在接收要求來自設於車體側之控制部之測定之信 ❹ 號’而於需要最新之輪胎資訊時進行以下順序。 為了進行藉由設於氣嘴芯部17之壓力/溫度感測器4之測 定，在判斷為在該感測器部保持有充分之電力之情形下， 需將電源供給至設於氣嘴芯部17iASIC5a，而設為可動作 狀態。 在圖中，於休止狀態之情形下，最初進行電源供給，而 確保控制器5之初期化所花費之時間。其後，傳送向 ASIC5a詢問狀態之請求（request)信號，或自發性等待來自 ❹ 該ASIC5a之初期化完成之響應。 確s忍成為可通訊狀態，其次適宜混合測定之控制之信號 之傳送或電力供給，並進行測定結果之傳收送•錯誤訂正 等之通矾，通訊即完成。此外，為了減低消耗電力，暫時 不需通訊之情形下，於通訊後將電源切斷亦可。 藉由以上順序，即可抑制消耗電力，進行輪胎氣壓等之 監視。 (實施形態9) 圖31係為表示本發明之實施形態9之氣嘴芯部之構成例 134220.doc -39- 200925006 之說明圖’圖32係為表示設於圖31之氣嘴芯部之閥墊圈座 22之構成例之說明圖，圖33係為將圖32之閥墊圈座予以放 大之說明圖。 在前述實施形態1中，雖係記載將半導體晶片26、27配 置於魚板狀之平面之例，惟在本實施形態9，亦可設為例 ' 如以1個半導體晶片構成壓力/溫度感測器4與控制器5，且 - 設於閥墊圈座22之前端部之構成。 ❹ 圖31係為表示氣嘴芯部17之構成例之說明圖，圖32係為 表示設於圖3 1之氣嘴芯部之閥墊圈座22之構成例之說明 圖，圖33係為將藉由樹脂塑模將搭載於設於氣嘴芯部口之 閥墊圈座2 2之半導體晶片7 〇予以封閉之狀態之閥墊圈座2 2 予以放大之說明圖。 在前述實施形態1中，係於閥墊圈座22之下面部，形成 收容感測器部17a之四角形狀之收容溝22a，雖搭載有半導 體晶片26、27，惟如上所述，藉由將半導體晶片7〇小型 ❹ 化，如圖32所示在閥墊圈座22之底面搭載半導體晶片，且 藉由焊線71而連接設於半導體晶片7〇之焊接電極、重複有 軸24貫通閥墊圈座22之剖面之信號線與電源電壓之信號/ 電源線24a、及接地線24c。 藉此’即可將間塾圈座22之結構相較於實施形態〖作成 簡單之結構。 雖係表示半導By applying a stress to the piezoelectric ceramic 50 mounted on the metal plate 49 by the vibration of the tire during the traveling of the automobile or the like, a voltage is generated from the piezoelectric ceramic 5?. This voltage is rectified and smoothed by the stabilizing power supply unit 38 (FIG. 15) of the RFIC unit 6, and then stored in a power supply unit 7 composed of a secondary battery or an electric double layer capacitor, etc., and the power supply unit is stabilized. In the case where the amount of power generation is small, the stress applied to the piezoelectric ceramics 5 may be increased by subtracting the fixed portion of the metal plate 49, or the metal plate 49 on which the piezoelectric ceramic 50 is mounted may be plural. Tablets, etc., can increase power generation. FIG. 18 is an explanatory view showing an example of the stabilizing power supply unit 38 in the RFIC unit 6 when a plurality of metal plate hooks on which the piezoelectric ceramics 5 are mounted are provided. The stabilized power supply unit 38 is composed of diodes 54 to 59, a constant voltage circuit 杓, and a capacitor 44. In this case, the two piezoelectric ceramics 5, 5, and 5 are connected in parallel. In the input part of the diode bridge formed by the electric pottery pottery-π drink W field one your sister 54~57, the output part of the piezoelectric pottery 50 is connected to the pole The input portion of the other of the diode bridges formed by the body 57 57. In the output portion of one of the piezoelectric ceramics 50a, the output of the other of the piezoelectric ceramics 50 is transferred, and the output of the other of the piezoelectric ceramics 5a is I34220.doc • 33-200925006, The anode of the diode 58 and the cathode of the diode 59 are connected. The cathode of the diode 58 is connected to the output portion of the diode bridged by the diodes 54 to ”, and the anode of the diode 59 is connected to the diodes 54 to 57. The output portion of the other of the diode bridges. Therefore, in the fifth embodiment, since the replacement of the power supply unit 7 is not required, the operation time required for the battery replacement is not required, and the towel can be used by the monitoring unit 2 (Embodiment 6) FIG. 19 is a cross-sectional view showing a nozzle of a sixth embodiment of the present invention, and is an explanatory view of a contact electrode of a nozzle cover provided in the nozzle of FIG. FIG. 22 is an explanatory view showing an example of connection between the contact electrode and the electrode for the power source line formed on the side surface of the head. In the sixth embodiment, the gas nozzle B is shown in FIG. As shown in Fig. 19, the nozzle cover portion 18 is configured to connect signals/power sources from the side surface of the shaft 24 of the nozzle core portion 17. The nozzle cover portion 18 of the first embodiment (Fig. 1) 〇) The difference is as shown in Fig. 20 'newly provided contact electrode 6〇, and spring 61 to replace the base electrode 18bl, contact The pole 18b3 and the contact spring 18b4 (Fig. 1A) are provided. The contact base 18b2 is provided under the wiring board 6a via the spring 61. The contact base 18b2 is pressed to the loop by the spring 61.丨8匕5 Side 0 The contact electrode 60 is composed of four rectangular plates as shown in Fig. 21, and is formed at equal intervals so as to extend below the axial direction of the nozzle B (the shaft 24 side). The front end of the electrode 60 is subjected to a bending process, as shown in Fig. 22, 134220.doc • 34. 200925006 No part of the bending process is in contact with the signal/power line electrode 19b formed on the side of the head 19 As shown in the first embodiment, the head 丨9 of the nozzle core unit 7 is at the reference potential level VSS', so that the signal/power line electrode 19b is insulated by the insulator 62 such as rubber. (Embodiment 7) Fig. 23 is a plan view showing a nozzle core portion according to Embodiment 7 of the present invention, and Fig. 24 is a configuration example showing a valve gasket seat 22 provided in the core portion of the nozzle of Fig. 23. Figure 25 is a cross-sectional view of the gas nozzle cover of the seventh embodiment, and Figure 26 is a gas nozzle of the seventh embodiment. In the first embodiment, the signal/power supply line 24& and the ground line 24c in which the signal line and the power supply voltage are repeated on the shaft 24 are formed. However, in the seventh embodiment, As shown in Fig. 23, it is configured to be coaxial with the shaft 24 provided on the nozzle B, and the signal and the power source are not overlapped. In the nozzle core portion 17, the inside of the shaft 24 is as shown in Fig. 23. A signal line 63 serving as a third conductor is formed in the center portion, and a power supply voltage line 65 serving as a fourth conductor is formed on the outer peripheral surface via the insulator 64. Further, the outer periphery of the insulator 64 is formed. This is a coaxial structure in which the ground line 67 serving as the fifth conductor is formed via the insulator 66. The power supply voltage line 65 and the grounding line 67 are formed so as to be exposed on any side of the shaft 24 protruding from the head 19, and become the power line electrode and the ground electrode 69, and these are respectively connected to the gas nozzle cover. The contact electrodes 74, 75 (Fig. 25) will be described later in the portion 18. Further, the valve gasket seat 22 provided with the sensor portion 17a is composed of a fish plate shape which removes one of the cylinders as shown in Fig. 24, 134220.doc-35-200925006, and a semiconductor is mounted on the flat portion thereof. Wafer 70. The semiconductor wafer 70 is constituted by a so-called one wafer in which the pressure/temperature sensor 4 and the controller 5 are formed in one semiconductor wafer. At any position of the valve gasket seat 22, an L-shaped pressure introduction hole 22b is formed as shown in Fig. 23. The semi-'-conductor wafer 70 is for measuring the gas pressure and temperature in the tire introduced through the pressure introduction hole 22b. . The signal line 63 of the shaft 24, the power supply voltage line 65, and the ground line 67 are connected to the bonding electrodes provided on the semiconductor wafer 7 via the bonding wires 71, respectively. In this case, the front end portion of the valve gasket seat 22 to which the shaft 24 is attached is formed in a fish plate shape, whereby the bonding wire 71 is connected to the exposed signal line 63, the power source voltage line 65, and the ground line. The face of 67 is exposed. The valve holder seat 22 is provided with a cylindrical lid portion 72 as shown in Fig. 23, and is kept airtight by, for example, sealing by a sealing or the like. Further, the lid portion 72 is formed with a hole 72a at a position corresponding to the opening of the pressure introduction hole 22b, and the pressure is introduced through the hole 72a. Figure 25 is a cross-sectional view showing the nozzle cover portion 8 of the seventh embodiment. In the cover 18a, from the top to the bottom, the antenna unit 8, the power supply unit 7, the RFIC unit 6, and the contact portion 18b are provided in the same manner as in the above-described embodiment i. Here, the configuration of the contact portion 18b and the above-described implementation are performed. Form 1 is different. In the contact portion 18b, the contact base electrode 18b of the third contact is provided with the contact electrode 73 serving as the third contact, and the contact electrode 74 serving as the fourth contact, that is, the contact electrode serving as the fifth contact. The contact electrode 73 is an electrode connected to the signal line 63 at the center of the shaft 24 as shown in Figs. 23 and 134220.doc-36 - 200925006. Further, the contact electrode 74 is an electrode connected to a power supply voltage line 65 (refer to FIG. 23) formed on the shaft 24, and the front end portion of the contact electrode 74 is exposed to the power supply voltage line 65 formed on the side of the shaft 24, 65S. Connection (refer to Figure 26). The contact electrode 75 is connected to an electrode formed on the ground line 67 (see FIG. 23) of the shaft 24, and the front end of the contact electrode 75 is connected to the exposed surface 64S of the ground line formed on the side of the shaft (refer to Figure 26). Further, in the seventh embodiment, the case where the pressure introduction hole 22b is formed in an L shape is described. However, if the problem of damage to the semiconductor wafer 7 is small, the opening of the pressure introducing hole 22b and the opening of the other opening may be linear. This is also the same in other embodiments. Further, for example, as shown in Fig. 27, the pressure introduction hole 22b may be formed so as to be inclined with respect to the axial direction of the nozzle 6. Thereby, the occurrence of breakage or the like due to foreign matter of the semiconductor wafer 70 can be reduced. Further, in the seventh embodiment, the valve washer seat 22 is formed in a fish plate shape in which one part of the cylinder is removed. However, as shown in Fig. 28, for example, the front end of the valve ring seat 22 may be used. The end face portion forms a structure of a round shape 22; Thereby, the rigidity of the lid portion 7 2 can be increased, so that the pressure can be more accurately measured. (Embodiment 8) FIG. 29 is a block diagram showing a configuration example of a monitoring unit according to Embodiment 8. Figure 30 is a timing diagram of signals in the monitoring section of Figure 29. In the present embodiment, Fig. 29 is a signal/power supply line 24a connected between the nozzle core portion 17 and the nozzle cover 134220.doc • 37- 200925006 邛18, which is provided with both the signal and the power supply voltage Vcc. In the configuration example of the monitoring unit 2 of the 彳s line, the ground line 24c is a signal line of the reference potential VSS. In the monitoring unit 2, the controller $ and the pressure/temperature sensor 4 are provided in the nozzle core unit 7, and the nozzle cover 18 is provided with 111?1 (: part 1〇(), The power supply unit 7 and the antenna unit 8. Here, the pressure/temperature sensor 4 may be individually a pressure sensor or a temperature sensor. The controller 5 is composed of an ASIC 5a, an input/output unit 5b, and a power supply unit 5c. In addition, the RFIC unit 100 is composed of an RFIC 10, an input/output unit 1〇3, and a pull-up resistor l〇b. The input/output unit 5b is formed by a circuit such as an open drain. The signal of the Hi level is supplied from the power supply unit 7 via the resistor l〇b. The power supply unit 5c connected to the ASIC 5a which is a controller of the pressure/temperature sensor 4 or the like is composed of the diode Di and the electrostatic capacitance element. The composition of C is rectified by the diode Di and is smoothed by the capacitance element C, and supplied to the ASIC 5a as a power source for the ASIC. By this, the signal line and the power line can be shared, and the reference potential vss The line 5 is connected to the controller 5 provided in the nozzle core portion 17 and the RFIC unit 100 provided in the nozzle cover portion 18 by two wires. As shown in the example, 'the electrostatic capacitance element c of the power supply or the resistor 10b for lifting can be made into one wafer with the ASIC or the RFIC, or can be made as an external component. Further, for the sake of simplicity, the power supply unit 5c indicates two. The example of the polar body Di and the electrostatic capacitance element C is only used by a switch regulator or filter circuit using a combination active or passive component, or a stabilized power supply 134220.doc 38-200925006 circuit, etc. Preferably, the method of high efficiency or signal communication is preferred. In addition, the controller 5 or the pressure/temperature sensor 4, or the ruler??1 (: part 1〇〇 can also be waferized as needed. Fig. 30 is gas The communication between the nozzle core portion 17 and the nozzle cover portion 18 is a timing chart showing an example of control. 'The nozzle cover portion 182RFIC 10 is for every certain time or when the tire information is to be updated' or the receiving request is from the setting. In the case where the latest tire information is required, the following procedure is performed when the latest tire information is required. In order to perform the measurement by the pressure/temperature sensor 4 provided in the nozzle core portion 17, it is judged as Keep adequate in the sensor section In the case of electric power, the power supply is supplied to the nozzle core portion 17iASIC 5a, and is in an operable state. In the figure, in the case of the rest state, the power supply is first performed, and the initialization of the controller 5 is ensured. The time spent is followed by a request signal for inquiring about the status of the ASIC 5a, or a spontaneous wait for the response from the initialization of the ASIC 5a. Indeed, it is a communicable state, and secondly, it is suitable for the control of the mixed measurement. The communication is completed by the transmission or the power supply, and the transmission of the measurement result, the error correction, and the like. In addition, in order to reduce power consumption, if communication is not required temporarily, the power may be cut off after communication. By the above procedure, power consumption can be suppressed, and tire pressure and the like can be monitored. (Embodiment 9) FIG. 31 is a view showing a configuration example of a nozzle core portion according to Embodiment 9 of the present invention, 134220.doc-39-200925006. FIG. 32 is a view showing a core portion of the nozzle provided in FIG. FIG. 33 is an explanatory view showing an enlarged view of a configuration of a valve gasket holder 22, and FIG. In the first embodiment, the semiconductor wafers 26 and 27 are arranged on the surface of the fish plate. However, in the ninth embodiment, the pressure/temperature feeling may be formed by one semiconductor wafer. The detector 4 and the controller 5, and - are disposed at the front end of the valve gasket seat 22. FIG. 31 is an explanatory view showing a configuration example of the nozzle core portion 17, and FIG. 32 is an explanatory view showing a configuration example of the valve gasket seat 22 provided in the core portion of the nozzle of FIG. The valve holder seat 2 2 in a state in which the semiconductor wafer 7 搭载 mounted on the valve holder seat 2 2 provided in the nozzle core port is closed by a resin mold is enlarged. In the first embodiment, the receiving groove 22a that accommodates the four corners of the sensor portion 17a is formed on the lower surface of the valve holder seat 22, and the semiconductor wafers 26 and 27 are mounted, but the semiconductor is used as described above. The wafer 7 is miniaturized, and a semiconductor wafer is mounted on the bottom surface of the valve holder 22 as shown in Fig. 32, and the bonding electrode provided on the semiconductor wafer 7 is connected by the bonding wire 71, and the shaft 24 is passed through the valve holder 22 The signal line of the cross section and the signal of the power supply voltage / the power supply line 24a and the ground line 24c. By this, the structure of the inter-turn ring seat 22 can be made simpler than that of the embodiment. Although semi-conductive
此外，在此，係與前述實施形態8同樣， 體晶片70係將厂 體晶片之例， 134220.doc •40- 200925006 導體晶片’或亦可使用内插器將複數個半導體晶片、搭載 有零件之内插器搭載於閥墊圈座22。 再者，如圖33所示，所搭載之半導體晶片係以壓力導入 八之方之端成為半導體晶片上之方式設置壓力導入穴 102，且藉由樹脂塑模101封閉其他，而設為保護半導體晶 片70 '焊線71等之結構。 藉此’即可將氣嘴芯部設為最小型、輕量。 (實施形態10) 圖3 4係為表示本實施形態丨〇之氣嘴蓋部之構成之一例之 說明圖。 在本實施形態10中，係表示設於氣嘴芯部17之蓋18a内 之監視部2之配置例。 在圖34中，係從蓋1 8a之上方到下方，依電源部7、天線 部8、以及尺1；1(:部6之順序設置。蓋18&係由圓筒狀所組 成在其上面係成為藉由螺絲自如卸除電池蓋1 〇3之構 〇 成。此情形下’藉由電池等構成電源部7,即可藉此成為 可容易進行電源部7之替換之構成。 • 以上雖根據實施形態具體說明了由本發明人所為之發 明，惟本發明並不限定於前述實施形態，在不脫離其要旨 之範圍内，當然可作各種變更。 例如將各實施形態所記載之中之一部分或全部與其他 實施形態組合，或將一部分與其他實施形態之—部分替換 亦可。 、 [產業上之可利用性] 134220.doc •41 200925006 本發明係適於使用與輪胎氣嘴έ且人+ 机$組入成—體型之感測器而 監視輪胎内之氣壓之監控技術。 【圖式簡單說明】 _、㈣為表示本發明之實施形態」之輪胎監視系 統、及輪胎之構成例之說明圖。 圖2係為圖1之輪胎監視系統之區塊圖。 ' 圖3係為表示組入有設於圖2之輪胎監視系統之監視部之 氣嘴之構成之剖面圖。 圖4係為設於圖3之氣嘴之氣嘴芯部之剖面圖。 圖5係為將圖3之氣嘴之頭、及軸周邊加以放大之說明 圖。 圖6係為圖4之Α-Α’剖面圖。 圖7係為圖4之Β-Β，剖面圖。 圖8係為將設於圖3之氣嘴之閥墊圈座放大之說明圖。 圖9係為將設於圖3之氣嘴之閥墊圈座22放大之說明圖。 Q 圖10係為設於圖3之氣嘴之氣嘴蓋部之剖面圖。 圖11係為設於圖3之氣嘴之氣嘴蓋部之底面圖。 . 圖12係為表示本發明之實施形態2之設於氣嘴之氣嘴蓋 部之結構之剖面圖。 圖13係為圖12之氣嘴蓋部之外觀立體圖。 圖14係為表示本發明之實施形態3之設於氣嘴之氣嘴蓋 部之結構之剖面圖。 圖15係為表示本發明之實施形態3之設於RFIC部之電源 部之一例之說明圖。 134220.doc -42- 200925006 圖16係為表示本發明之實施形態*之設於氣嘴之氣嘴蓋 部之結構之剖面圖。 圖17係為表示本發明之實施形態$之設於氣嘴之氣嘴蓋 部之結構之剖面圖。 圖18係為表示本發明之實施形態$之設於rFIC部之電源 部之一例之說明圖。 • 圖19係為本發明之實施形態6之氣嘴之剖面圖。 圖20係為設於圖19之氣嘴之氣嘴蓋之接觸電極之說明 ❹ 圖。 圖21係為接續圖2〇之說明圖。 圖22係為表示接觸電極與形成於頭之側面之信號/電源 線用電極之連接例之說明圖。 圖23係為本發明之實施形態7之氣嘴芯部之剖面圖。 圖24係為表示設於圖23之氣嘴芯部之閥墊圈座22之構成 例之說明圖。 Q 圖25係為本實施形態7之氣嘴蓋之剖面圖。 圖26係為本實施形態7之氣嘴之剖面圖。 圖27係為表示本發明之其他實施形態之設於閥墊圈座之 壓力導入孔之一例之說明圖。 圖28係為表示本發明之其他實施形態之閥墊圈座之一例 之說明圖。 圖29係為表示本發明之實施形態8之監視部之構成例之 區塊圖。 圖30係為圖29之監視部之信號之時序圖。 134220.doc -43- 200925006 圖3 1係為表示本發明之實施形態9之氣嘴芯部之構成例 之說明圖。 圖32係為表示設於圖3丨之氣嘴芯部之閥墊圈座22之構成 例之說明圖。 圖33係為將圖32之閥墊圈座放大之說明圖。 圖34係為表示本實施形態10之氣嘴蓋部之構成之一例之 說明圖。Here, as in the eighth embodiment, the bulk wafer 70 is an example of a factory wafer, 134220.doc • 40-200925006 conductor wafer 'or a plurality of semiconductor wafers and components may be mounted using an interposer. The interposer is mounted on the valve gasket seat 22. In addition, as shown in FIG. 33, the mounted semiconductor wafer is provided with a pressure introduction hole 102 so that the end of the pressure is introduced into the semiconductor wafer, and is sealed by the resin mold 101 to protect the semiconductor. Wafer 70' structure of bonding wire 71 and the like. By this, the core of the nozzle can be made the smallest and light. (Embodiment 10) Fig. 3 is an explanatory view showing an example of a configuration of a nozzle cover portion of the present embodiment. In the tenth embodiment, an arrangement example of the monitoring unit 2 provided in the lid 18a of the nozzle core portion 17 is shown. In Fig. 34, from the upper side to the lower side of the cover 18a, the power supply unit 7, the antenna unit 8, and the ruler 1; 1 (: part 6 are provided in order. The cover 18 & is composed of a cylindrical shape thereon. The battery cover 1 〇 3 is detached by screws. In this case, the power supply unit 7 can be easily formed by a battery or the like. The invention made by the inventors of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention. For example, some of the embodiments are described. Or all of them may be combined with other embodiments, or some of them may be replaced with other embodiments. [Industrial Applicability] 134220.doc • 41 200925006 The present invention is suitable for use with tires and tires. + The monitoring technology for monitoring the air pressure in the tire is incorporated into the sensor of the body type. [Brief Description] _, (4) is a tire monitoring system showing an embodiment of the present invention, and a configuration example of the tire Say Fig. 2 is a block diagram of the tire monitoring system of Fig. 1. Fig. 3 is a cross-sectional view showing the configuration of a nozzle in which a monitoring unit provided in the tire monitoring system of Fig. 2 is incorporated. Fig. 5 is an enlarged view of the head of the nozzle of Fig. 3 and the periphery of the shaft. Fig. 6 is a cross section of Fig. 4 Fig. 7 is a cross-sectional view of Fig. 4, Fig. 8 is an enlarged view of a valve seat of the valve provided in Fig. 3. Fig. 9 is a gas nozzle which will be provided in Fig. 3. Fig. 10 is a cross-sectional view of the nozzle cover portion of the air nozzle of Fig. 3. Fig. 11 is a bottom view of the nozzle cover portion of the air nozzle of Fig. 3. Fig. 12 is a cross-sectional view showing a configuration of a nozzle cover portion provided in a nozzle according to a second embodiment of the present invention. Fig. 13 is an external perspective view of a nozzle cover portion of Fig. 12. Fig. 14 is a perspective view showing the present invention. Fig. 15 is a cross-sectional view showing an example of a power supply unit provided in the RFIC unit according to the third embodiment of the present invention. Fig. 15 is an explanatory view showing an example of a power supply unit provided in the RFIC unit according to the third embodiment of the present invention. 2-200925006 Fig. 16 is a cross-sectional view showing the structure of a nozzle cover provided in a nozzle according to an embodiment of the present invention. Fig. 17 is a view showing a nozzle cover provided in a nozzle of an embodiment of the present invention. Fig. 18 is an explanatory view showing an example of a power supply unit provided in the rFIC unit according to the embodiment of the present invention. Fig. 19 is a cross-sectional view showing a gas nozzle according to a sixth embodiment of the present invention. Figure 20 is an explanatory view of the contact electrode of the nozzle cover provided in the nozzle of Figure 19. Figure 21 is an explanatory view of Figure 2, and Figure 22 is a diagram showing the contact electrode and the signal formed on the side of the head. / Explanation of the connection example of the electrode for the power supply line. Figure 23 is a cross-sectional view showing a core portion of a nozzle according to a seventh embodiment of the present invention. Fig. 24 is an explanatory view showing a configuration example of the valve gasket seat 22 provided in the core portion of the nozzle of Fig. 23. Figure 25 is a cross-sectional view showing the nozzle cover of the seventh embodiment. Figure 26 is a cross-sectional view showing the gas nozzle of the seventh embodiment. Fig. 27 is an explanatory view showing an example of a pressure introduction hole provided in a valve gasket seat according to another embodiment of the present invention. Fig. 28 is an explanatory view showing an example of a valve gasket seat according to another embodiment of the present invention. Figure 29 is a block diagram showing an example of the configuration of a monitoring unit in the eighth embodiment of the present invention. Fig. 30 is a timing chart showing signals of the monitoring unit of Fig. 29. 134220.doc-43-200925006 Fig. 3 is an explanatory view showing a configuration example of a nozzle core portion according to Embodiment 9 of the present invention. Fig. 32 is an explanatory view showing a configuration example of the valve gasket seat 22 provided in the core portion of the nozzle of Fig. 3; Figure 33 is an explanatory view showing an enlarged view of the valve holder of Figure 32; Fig. 34 is an explanatory view showing an example of the configuration of the nozzle cover portion of the tenth embodiment.
【主要元件符號說明】 1 輪胎監視系統 2 監視部 3 控制部 4 壓力/溫度感測器 5 控制器 5a ASIC 5b > l〇a 輸出入部 5c ' 7 電源部 6 、 10 、 100 RFIC 部 6a 配線基板 6b > 26 ' 27 ' 70 半導體晶片 6c、29、29a、29b、71 焊線 6d 封裝件 6e、6f、37a、37b 電極 7a 正（+)側電極 7b 負（-)側電極 134220.doc • 44- 200925006 8、9 天線部 10b 電阻 11 MPU 12 顯示部 13 車内LAN 14 電子控制單元 15 感測器 16 氣嘴桿部 〇 16a 孔壁 17 氣嘴芯部 17a 感測器部 18 氣嘴蓋部 18a 蓋 18al 氣嘴蓋罩套 18a2 螺絲部 18b 接觸部 〇 18bl 基極電極 18b2 接觸基極 18b3 、 60 、 73〜75 接觸電極 • 18b4 接觸彈簧 18b5 、 19a 墊圈 19 頭 19b 信號/電源線用電極 19c 周邊部 134220.doc -45- 200925006[Description of main component symbols] 1 Tire monitoring system 2 Monitoring unit 3 Control unit 4 Pressure/temperature sensor 5 Controller 5a ASIC 5b > l〇a Input/output unit 5c ' 7 Power supply unit 6, 10, 100 RFIC part 6a Wiring Substrate 6b > 26 ' 27 ' 70 semiconductor wafer 6c, 29, 29a, 29b, 71 bonding wire 6d package 6e, 6f, 37a, 37b electrode 7a positive (+) side electrode 7b negative (-) side electrode 134220.doc • 44- 200925006 8, 9 Antenna section 10b Resistor 11 MPU 12 Display section 13 In-vehicle LAN 14 Electronic control unit 15 Sensor 16 Valve stem 〇 16a Hole wall 17 Valve core 17a Sensor part 18 Valve cover Portion 18a Cover 18al Valve cover cover 18a2 Screw portion 18b Contact portion bl18b1 Base electrode 18b2 Contact base 18b3, 60, 73~75 Contact electrode • 18b4 Contact spring 18b5, 19a Washer 19 Head 19b Signal/power line electrode 19c Peripheral 134220.doc -45- 200925006
20 胴體 20a、61 彈簧 20b 中心孔 21 閥墊圈 22 閥墊圈座 22a 收容溝 22b 壓力導入孔 22t 圓筒形 23 胴體墊圈 24 軸 24a 信號/電源線 24b 絕緣層 24c 、 67 接地線 25 内插器 25a > 72a 子L 28 金屬蓋 29c 焊線 30 、 栓鎖溝 31 栓鎖 32 〇環 33 發電部 34、48 發電線圈 35、46 永久磁石 36 磁石懸吊彈菁 134220.doc •46- 20092500620 Carcass 20a, 61 Spring 20b Center hole 21 Valve washer 22 Valve washer seat 22a Containment groove 22b Pressure introduction hole 22t Cylindrical 23 Carcass washer 24 Shaft 24a Signal/power supply line 24b Insulation layer 24c, 67 Ground line 25 Interposer 25a > 72a sub L 28 metal cover 29c bonding wire 30, latching groove 31 latching 32 〇 ring 33 power generation part 34, 48 power generation coil 35, 46 permanent magnet 36 magnet suspension elanet 134220.doc • 46- 200925006
37、45 框體 38 穩定化電源部 39〜42 、 54〜59 、 Di 二極體 43 定電壓電路 44 電容器 45a 轴承 47 轴柄 49 金屬板 50 、 50a 壓電陶瓷 51 夾鉗 52 法碼 53 減振器橡膠 62 、 64 、 66 絕緣物 63 信號線 64S 、 65S 露出面 65 電源電壓線 72 蓋部 101 樹脂塑模 102 壓力導入穴 103 電池蓋 B 氣嘴 C 靜電電容元件 HR 輪圈部 NS 車内網路系統 134220.doc -47- 20092500637, 45 Frame 38 Stabilized power supply unit 39~42, 54~59, Di diode 43 Constant voltage circuit 44 Capacitor 45a Bearing 47 Shaft shank 49 Metal plate 50, 50a Piezoelectric ceramic 51 Clamp 52 Method 53 minus Vibrator rubber 62, 64, 66 Insulator 63 Signal line 64S, 65S Exposed surface 65 Power supply voltage line 72 Cover part 101 Resin mold 102 Pressure introduction hole 103 Battery cover B Air nozzle C Electrostatic capacitance element HR Wheel part NS Intranet Road system 134220.doc -47- 200925006
Ta 輪胎 VCC 電源電壓 W 車輪 ❹ ❹ 134220.doc -48-Ta tire VCC power supply voltage W wheel ❹ 134 134220.doc -48-
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2007/071302 WO2009057214A1 (en) | 2007-11-01 | 2007-11-01 | Automobile control system and valve |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200925006A true TW200925006A (en) | 2009-06-16 |
Family
ID=40590623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097133644A TW200925006A (en) | 2007-11-01 | 2008-09-02 | Automobile control system and valve |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW200925006A (en) |
| WO (1) | WO2009057214A1 (en) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2009308949B2 (en) | 2008-10-27 | 2014-10-23 | Mueller International Llc | Infrastructure monitoring system and method |
| EP3422319A1 (en) | 2009-05-22 | 2019-01-02 | Mueller International, LLC | Infrastructure monitoring devices, systems, and methods |
| FR2947321A1 (en) * | 2009-06-26 | 2010-12-31 | Schrader Sas | VALVE INTEGRATING A SENSOR |
| CA3116787C (en) | 2010-06-16 | 2023-07-11 | Mueller International, Llc | Infrastructure monitoring devices, systems, and methods |
| US9772250B2 (en) | 2011-08-12 | 2017-09-26 | Mueller International, Llc | Leak detector and sensor |
| US8855569B2 (en) | 2011-10-27 | 2014-10-07 | Mueller International, Llc | Systems and methods for dynamic squelching in radio frequency devices |
| CN103552432A (en) * | 2013-11-05 | 2014-02-05 | 苏州贝克微电子有限公司 | low-tire-pressure alarming system |
| US9494249B2 (en) | 2014-05-09 | 2016-11-15 | Mueller International, Llc | Mechanical stop for actuator and orifice |
| US9565620B2 (en) | 2014-09-02 | 2017-02-07 | Mueller International, Llc | Dynamic routing in a mesh network |
| JP5953388B1 (en) * | 2015-03-16 | 2016-07-20 | 啓二 森 | Tire pressure alarm |
| US11198335B2 (en) | 2016-01-21 | 2021-12-14 | Dana Heavy Vehicle Systems Group, Llc | Integrated-sensor valve apparatus |
| US10283857B2 (en) | 2016-02-12 | 2019-05-07 | Mueller International, Llc | Nozzle cap multi-band antenna assembly |
| US10305178B2 (en) | 2016-02-12 | 2019-05-28 | Mueller International, Llc | Nozzle cap multi-band antenna assembly |
| JP2019087943A (en) | 2017-11-09 | 2019-06-06 | 株式会社東芝 | Radio communication device |
| JP2019138318A (en) * | 2018-02-06 | 2019-08-22 | 太平洋工業株式会社 | Valve core and manufacturing method of the same and tire valve |
| JP6917940B2 (en) * | 2018-03-29 | 2021-08-11 | 太平洋工業株式会社 | Valve cap and valve with cap |
| WO2019193744A1 (en) * | 2018-04-06 | 2019-10-10 | 太平洋工業株式会社 | Tire valve |
| US10859462B2 (en) | 2018-09-04 | 2020-12-08 | Mueller International, Llc | Hydrant cap leak detector with oriented sensor |
| US11342656B2 (en) | 2018-12-28 | 2022-05-24 | Mueller International, Llc | Nozzle cap encapsulated antenna system |
| US11473993B2 (en) | 2019-05-31 | 2022-10-18 | Mueller International, Llc | Hydrant nozzle cap |
| US11542690B2 (en) | 2020-05-14 | 2023-01-03 | Mueller International, Llc | Hydrant nozzle cap adapter |
| JP7329482B2 (en) * | 2020-08-11 | 2023-08-18 | 太平洋工業株式会社 | valve stems and tire valves |
| US12578245B2 (en) | 2022-10-28 | 2026-03-17 | Mueller International, Llc | Self-leveling sensor assembly |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2724831B2 (en) * | 1987-12-15 | 1998-03-09 | 株式会社ブリヂストン | Tire valve |
| JP2654621B2 (en) * | 1987-12-23 | 1997-09-17 | 株式会社ブリヂストン | Tire valve core |
| JPH08178784A (en) * | 1994-12-22 | 1996-07-12 | Pacific Ind Co Ltd | Tire air pressure alarm |
| AUPN133795A0 (en) * | 1995-02-23 | 1995-03-16 | Cohen, Phillip | Tyre pressure telemetry system |
| JP3354887B2 (en) * | 1998-12-17 | 2002-12-09 | 太平洋工業株式会社 | Tire pressure warning device transmitter |
| JP2003002019A (en) * | 2001-06-25 | 2003-01-08 | Yokohama Rubber Co Ltd:The | Cap of tire pressure injection valve, tire pressure injection valve, and tire monitoring system |
| JP2004205476A (en) * | 2002-10-30 | 2004-07-22 | Aisotoronikusu:Kk | Tire pressure sensor |
| JP2005178676A (en) * | 2003-12-22 | 2005-07-07 | Kyoei Sangyo Kk | Tire valve cap and tire pressure management apparatus using the cap |
| JP2006015925A (en) * | 2004-07-02 | 2006-01-19 | Honda Motor Co Ltd | Air pressure sensor unit and tire pressure monitoring system |
| JP2006062414A (en) * | 2004-08-24 | 2006-03-09 | Honda Motor Co Ltd | Sensor unit |
-
2007
- 2007-11-01 WO PCT/JP2007/071302 patent/WO2009057214A1/en not_active Ceased
-
2008
- 2008-09-02 TW TW097133644A patent/TW200925006A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009057214A1 (en) | 2009-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200925006A (en) | Automobile control system and valve | |
| EP1547827B1 (en) | Self-powered sensing module and tire pressure monitoring system using the same | |
| RU2377137C2 (en) | System for generation of electric energy from mechanical energy of rotating tyre | |
| KR101149248B1 (en) | Improvements in tyre data monitoring systems | |
| EP2096418B1 (en) | Sensor module, wheel with sensor and tire/wheel assembly | |
| US8176776B2 (en) | Pressure sensor mounting method, tire and wheel having pressure sensor, and tire pressure detection device | |
| JP6528676B2 (en) | Tire mount sensor | |
| JP2012144246A (en) | Tire pressure monitoring system | |
| JP2006056501A (en) | Power conversion from piezoelectric elements | |
| US20200256968A1 (en) | Ultrasonic sensor | |
| JP2008545986A (en) | Use of piezoelectric sensors attached to electronic device packages and housings | |
| EP3814152B1 (en) | Structures and methods providing tread sensor integration | |
| US8074507B2 (en) | Tire module with piezoelectric transducer | |
| CN113165454A (en) | Functional component | |
| EP1897078B1 (en) | Inductive coupling of pulses from piezoelectric device | |
| US20030011276A1 (en) | Arrangement for generating an operating voltage for an electric sub-assembly of a vehicle | |
| JP2004189034A (en) | Transponder of tire status monitoring device | |
| CN114502910B (en) | Measuring devices and measuring systems | |
| US6966227B2 (en) | Pressure sensor, transmitter, and tire condition monitoring apparatus | |
| EP2415619A1 (en) | Self-powered sensing module and system for monitoring the conditions of the tyres of a vehicle provided with at least one self-powered sensing module | |
| JP2005186658A (en) | Tire valve equipped with tire air pressure sensing means and tire air pressure sensing device using the valve | |
| JP2001174357A (en) | Tire air pressure sensor | |
| Löhndorf et al. | MEMS for automotive tire pressure monitoring systems | |
| JP2005114558A (en) | Tire pressure sensing device | |
| WO2019191246A1 (en) | Structures and methods providing sensor-package integration |