TW200925200A - Insulating resin composition and application thereof - Google Patents

Insulating resin composition and application thereof Download PDF

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Publication number
TW200925200A
TW200925200A TW097130074A TW97130074A TW200925200A TW 200925200 A TW200925200 A TW 200925200A TW 097130074 A TW097130074 A TW 097130074A TW 97130074 A TW97130074 A TW 97130074A TW 200925200 A TW200925200 A TW 200925200A
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Taiwan
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resin composition
component
liquid crystal
crystal polyester
structural unit
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TW097130074A
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Chinese (zh)
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TWI453244B (en
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Shintaro Komatsu
Mitsuo Maeda
Hiroshi Harada
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Sumitomo Chemical Co
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/08Oxygen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00Carbon; Compounds thereof
    • C01B32/90Carbides
    • C01B32/914Carbides of single elements
    • C01B32/956Silicon carbide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/5406Silicon-containing compounds containing elements other than oxygen or nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/06Elements
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/42Insulated conductors or cables characterised by their form with arrangements for heat dissipation or conduction
    • H01B7/428Heat conduction
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inorganic Insulating Materials (AREA)
  • Organic Insulating Materials (AREA)

Abstract

The present invention provides a resin composition comprising: (A) a thermoplastic resin, (B) a granular material which has a number average particle diameter of 0.5 to 5 mm and is obtainable by granulating a fiber mainly having alumina with a number average fiber diameter of 1 to 50 μm, and (C) a filler composed of a material of which electric resistivity at 300 K is 10<SP>2</SP> Ωm or less. The resin composition can be molded into a molded article with electric insulation. The electric resistivity of the molded article has sufficient electric insulation in applications such as in electric and electronic parts.

Description

200925200 九、發明說明 【發明所屬之技術領域】 本發明係關於絕緣樹脂組成物,其可提供用於電絕緣 之導熱性極佳之模塑物件。 【先前技術】 近年來,電力和電子零件的領域中,零件內部產生的 〇 熱已造成微小化和以前技術進步之困難。當用以增進熱管 理的設備不足以用於此熱生成時,電力和電子零件的效能 可能會因熱的累積而降低。欲處理此困難及確保熱生成之 安全’較佳地’電力和電子零件中使用一種具有高導熱性 的元件。 在須要高導熱性的零件中,目前主要使用金屬材料, 但金屬材料具有保留重量和在模塑於採用之微小化的零件 上的缺點,因此它們越來越常被樹脂材料所取代。 © 已針對包括高導熱性塡料的導熱性樹脂組成物進行許 多硏究。導熱性塡料以纖維形式(纖維性導熱塡料)用於 模塑物件中’於物件中提供導熱途徑,使得物件具有極佳 的導熱性。例如,曾提出具有導熱性塡料的熱塑性組成物 ’其中具有特定纖維長度的碳纖維成束(請參考,日本未 審理的專利申請案第(JP-A- ) 9- 1 57403號(段落〔0023 〕至〔 0026〕;相當於US 6, 120,8 94;及熱塑性樹脂與氮 化銘纖維和具有高導熱性的無機粉末之組成物(請參考 JP_A-8-28345 6 (申請專利範圍))。 200925200 然而,自前文所提出的組成物得到之模塑物件並非皆 能符合實際使用的要求。例如,自JP-A-9- 1 57403所揭示 的組成物得到之模塑物件,其中,導熱途徑主要製自碳纖 維,由於自碳纖維製得的導熱途徑具有導電性,所以可能 不適用於電絕緣的電力或電子零件。自JP-A-8-283456揭 示之組成物得到的模塑物件之導熱性不足。 0 【發明內容】 發明總論 在這樣的情況下,本發明的目的之一係提供一種絕緣 樹脂組成物,其可提供具有用於電力和電子零件之極佳導 熱性和足夠電絕緣性的模塑物件。 本發明的發明者致力於硏究以達到此目的並已完成本 發明。本發明提供一種樹脂組成物包含: (A )熱塑性樹脂; 〇 (B)粒狀材料,其數均粒子直徑爲0.5至5毫米且 可藉由將主要具有數均纖維直徑爲1至50微米的氧化鋁 之纖維加以粒化而得;和 (C)塡料,其由300K的電阻率爲102歐姆米或較低 的材料所構成。 進一步,本發明提供一種藉由模塑前述樹脂組成物可 得之模塑物件。 本發明之樹脂組成物爲絕緣樹脂組成物,其可經模塑 ’例如,藉由已知方法模塑成具有電絕緣性之模塑物件。 -6- 200925200 此模塑物件的電阻率基本上是ίο12歐姆米或較 ,此模塑物件在如電力和電子零件的應用上, 電絕緣性。 自本發明之絕緣樹脂組成物,可得到具有 極佳電子絕緣性的模塑物件並可作爲具有此極 力和電子零件。特別地,此模塑物件適用於與 零件有關的元件,且在工業上非常有用。 〇 【實施方式】 本發明之樹脂組成物包含: (A) 熱塑性樹脂; (B) 粒狀材料,其數均粒子直徑爲〇.5 3 可藉由將主要具有數均纖維直徑爲1至50微 之纖維加以粒化而得·,和 (C) 塡料’其由300K的電阻率爲i〇2歐 Q 的材料所構成。 本發明使用的組份(c )係由3 00Κ的電阻 姆米或較低的材料所構成。 塡料的較佳例子包括由材料如,Au( 3x10. 、Ag(2xlO_8 歐姆米)、Cu(2xl(T8 歐姆米) 碳化矽(lxlO·6歐姆米)和石墨(ΐχ10.5歐姆 維(3χ 1 0·6歐姆米)所構成的塡料。特別地, 由碳化砂所構的塡料、石墨所構成的塡料或碳i 此處’前述括弧內的値各者代表於3〇〇K測得的 高,並因此 具有足夠的 高導熱性和 佳性質之電 電力和電子 5 5毫米且 米的氧化鋁 姆米或較低 率爲1 〇2歐 _8歐姆米) ..等金屬、 米)及碳纖 較佳地使用 截維塡料。 電阻率。 200925200 由碳化矽所構成的塡料以數均粒子直徑爲0.1至30 微米爲佳(0.5至20微米較佳,1至1〇微米更佳)的粒 狀塡料。當粒子直徑在0.1至30微米範圍內時,所得模 塑物件的表面不會明顯退化。因此,將得到具有極佳外觀 的此模塑物件,且導熱性的改良效果變得足夠。此外,當 粒子直徑在此範圍內,一優點在於絕緣樹脂組合物的模塑 性變得良好。 Q 碳化矽粒子的例子包括OY系列(註冊名稱:BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating resin composition which can provide a molded article excellent in thermal conductivity for electrical insulation. [Prior Art] In recent years, in the field of electric power and electronic parts, the heat generated inside the parts has caused miniaturization and difficulties in advancement of the prior art. When equipment used to enhance heat management is not sufficient for this heat generation, the performance of electrical and electronic components may be reduced by the accumulation of heat. To handle this difficulty and to ensure the safety of heat generation, a component with high thermal conductivity is preferably used in power and electronic parts. Among the parts requiring high thermal conductivity, metal materials are mainly used at present, but metal materials have the disadvantages of retaining weight and being molded on miniaturized parts, and thus they are more and more often replaced by resin materials. © Many studies have been conducted on thermal conductive resin compositions including high thermal conductivity materials. Thermally conductive tantalum is used in molded articles in the form of fibers (fibrous thermally conductive tantalum) to provide a thermally conductive path in the article to provide excellent thermal conductivity. For example, a thermoplastic composition having a thermal conductive material has been proposed in which a carbon fiber having a specific fiber length is bundled (refer to Japanese Unexamined Patent Application No. (JP-A-) No. 9-157740 (paragraph [0023] 〕 to [0026]; equivalent to US 6, 120, 8 94; and a composition of a thermoplastic resin and a nitrided fiber and an inorganic powder having high thermal conductivity (refer to JP_A-8-28345 6 (Scope of Application)) 200925200 However, the molded articles obtained from the composition proposed in the foregoing are not all in accordance with the requirements of the actual use. For example, the molded article obtained from the composition disclosed in JP-A-9-157,403, wherein heat conduction The route is mainly made of carbon fiber, and since the heat conduction path made of carbon fiber is electrically conductive, it may not be suitable for electrically insulating electric or electronic parts. The heat conduction of the molded article obtained from the composition disclosed in JP-A-8-283456 Insufficiency. 0 SUMMARY OF THE INVENTION In such a case, one of the objects of the present invention is to provide an insulating resin composition which can provide an excellent guide for electric power and electronic parts. The present invention has been made in an effort to achieve the object and has completed the present invention. The present invention provides a resin composition comprising: (A) a thermoplastic resin; bismuth (B) particles. a material having a number average particle diameter of 0.5 to 5 mm and which can be obtained by granulating fibers mainly having alumina having a number average fiber diameter of 1 to 50 μm; and (C) a dip material, which is 300 K Further, the present invention provides a molded article obtainable by molding the foregoing resin composition. The resin composition of the present invention is an insulating resin composition, which can be Molded by, for example, molding into a molded article having electrical insulation by a known method. -6- 200925200 The resistivity of the molded article is substantially ίο12 ohm meters or more, and the molded article is in, for example, electric power. And electrical insulation of the application of the electronic component. From the insulating resin composition of the present invention, a molded article having excellent electronic insulation can be obtained and can be used as the main component and the electronic component. In particular, the molded article is suitable. It is an element related to parts and is very useful in industry. 实施 [Embodiment] The resin composition of the present invention comprises: (A) a thermoplastic resin; (B) a granular material having a number average particle diameter of 〇.5 3 It can be obtained by granulating a fiber having a number average fiber diameter of 1 to 50 μm, and (C) a material which is composed of a material having a resistivity of 300 K i 〇 2 ohm Q. The component (c) used is composed of a resistance of 300 Å or a lower material. Preferred examples of the material include materials such as Au (3x10., Ag (2x10_8 ohm meters), Cu (2xl ( T8 ohm meters) bismuth carbide (lxlO·6 ohm meters) and graphite (ΐχ10.5 ohm dimensions (3χ 1 0·6 ohm meters). In particular, the crucible made of carbonized sand, the crucible composed of graphite or the carbon i here, the one in the aforementioned brackets, represents a high measured at 3 〇〇 K and thus has a sufficiently high thermal conductivity. It is better to use a cut-off dip material for electric power and electrons of 5 5 mm and meters of alumina or a lower rate of 1 〇 2 ohms _ 8 ohm meters. Resistivity. 200925200 A crucible composed of niobium carbide is preferably a granular material having a number average particle diameter of 0.1 to 30 μm (preferably 0.5 to 20 μm, more preferably 1 to 1 μm). When the particle diameter is in the range of 0.1 to 30 μm, the surface of the resulting molded article is not significantly degraded. Therefore, this molded article having an excellent appearance is obtained, and the effect of improving the thermal conductivity becomes sufficient. Further, when the particle diameter is within this range, there is an advantage in that the moldability of the insulating resin composition becomes good. Examples of Q niobium carbide particles include the OY series (registered name:

Yakushima Denko Co., Ltd.)。 較佳碳纖維包括以樹脂爲基礎的碳纖維。於溫度爲 300K測定時,此碳纖維的導熱率爲1〇〇瓦/米κ,以導熱 率爲120瓦/米K或較高爲佳,且導熱率爲200瓦/米K或 較高更佳。此碳纖維的纖維直徑以1至20微米爲佳,纖 維直徑爲5至15微米更佳。 此碳纖維的例子包括 Dialead ( Mitsubishi Plastic Inc. ❺ 製造)和 Granock( Nippon Graphite Fiber Corporation 製 造)。 此石墨可爲天然石墨或可爲人造石墨。以天然石墨爲 佳。由此石墨構成的塡料(石墨塡料)形狀可爲鱗屑狀或 球狀。此石墨塡料的數均粒子直徑以30至300微米爲佳 ,數均粒子直徑以30至1〇〇微米更佳。數均粒子直徑以 3〇至3 00微米爲佳,此因當石墨塡料混入熱塑性樹脂(特 別是下文所述的液晶聚酯)中時,所得樹脂組成物的高導 熱性和模塑性均衡極佳之故。數均粒子直徑可藉由使用測 -8- 200925200 定雷射繞射粒子大小分佈之方法簡便測得。以藉雷射繞射 粒子大小分佈方法得到的數均粒子直徑爲基礎,可以選擇 適用於本發明的石墨塡料。 易取得之石墨塡料市售品的例子包括鱗屑狀的石墨粉 末或粒化的石墨粉末(二者皆製自 Nippon Graphite Industries Co.,Ltd )和鱗屑狀的石墨(製自 Nishimura Grpahite Inc ., Ltd .)。 〇 在這些例示石墨中,以使用鱗屑狀石墨爲佳,此由於 所得的樹脂組成物具有優良的模塑性之故。此鱗屑狀的石 墨之優點在於成本,此由於其比粒狀石墨便宜之故。 已經知道物質的導熱率與電阻率呈反比。當電阻率低 的材料(低電阻率材料)(如,金屬材料或碳纖維)作爲 高導熱塡料時’所得模塑物件的電絕緣性有降低的趨勢。 因此’用於一般須要電絕緣性的電力和電子零件,低電阻 率材料之使用受到限制。另一方面,本發明提供一種樹脂 G 組成物’其可利用由低導電性材料所構成的塡料之高導熱 性及維持足夠的電絕緣性製成模塑物件。本發明中,藉由 使用低電阻率材料所構成的塡料與下述組份(Β )倂用, 所得模塑物件具有優點,使得電絕緣性和導熱性高度協調 〇 本發明之樹脂組成物中,由低電阻率材料構成的塡料 的使用濃度以與塡料彼此接觸而形成導電途徑處之濃度( 渗透濃度)相同或較之爲低爲佳,且組份(Β )有效地位 於由低電阻率材料構成的塡料中。因此’導熱途徑係由組 -9- 200925200 份(B )(將主要具有氧化鋁的纖維加以粒化的材料)和 組份(C)(低電阻率材料)二者所構成,以具有高導熱 性並維持導熱途徑的電絕緣性。 此外,即使當導熱途徑的製造方式使得由低電阻率材 料構成的塡料彼此與適當的電絕緣體連接,仍須注意所謂 的樹介電瓦解發生於低電阻率材料構成的塡料之間,且所 得模塑物件的介電強度電壓明顯變低。然而,關於自本發 φ 明的絕緣樹脂組成物得到之模塑物件,令人訝異地,這樣 的介電瓦解受到非常足夠的抑制,且容易達得到電力和電 子零件所須的介電強度電位(介電瓦解電壓:1千伏特/毫 米或較高)之極佳效果。 如前述者,適當地選擇組份(C )的混合量,使得其 爲在得到的模塑物件中爲滲透濃度或較低,且以組份(A )的種類爲基礎’必須使得組份(C )的混合量最適化, 以控制混合量爲滲透濃度或較少。組份(C )的較佳混合 〇 量以組份(A )爲基礎’相對於1 0 0重量份之組份(A ) 的熱塑性樹脂’組份(C )以1至5 0重量份爲佳,1至4 0 重量份更佳,5至40重量份又更佳。當組份(c)的混合 量在前述範圍中時’電絕緣足以維持,且可得到導熱性較 高的模塑物件。 本發明之樹脂組成物包含粒狀材料(組份(B )), 其數均粒子直徑爲0.5至5毫米且可藉由將主要具有數均 纖維直徑爲1至5 G微米的氧化鋁之纖維加以粒化而得。 此處’ “粒狀材料”中的粒度是指材料爲粒狀且縱橫比 -10- 200925200 (其爲材料的主要軸長度與次要軸長度的比値)在1至2 的範圍內。“數均粒子直徑”係使用掃描式電子顯微鏡或光 學顯微鏡,針對粒狀材料的主要軸和次要軸外部觀察,以 1 〇〇或更多個粒狀材料測得的値之算術平均得到。請注意 纖維的1000或更多次測定被拍照且藉影像處理裝置二元 化,可得到纖維狀塡料的數均纖維直徑。 粒狀材料,組份(B),是可藉由將主要具有氧化鋁 Φ (如,氧化鋁纖維)的纖維加以粒化而得的材料。藉此粒 狀材料和組份(C)的增效效應,電絕緣和導熱性高度協 調。 “主要具有氧化鋁”的纖維以含有約50重量%或更多氧 化鋁(即,氧化鋁(ai2o3 ))爲佳的纖維。纖維中的氧 化鋁含量以約70重量%或更多爲佳,且約90重量或更多 最佳。 主要具有氧化鋁之纖維具有氧化鋁以外的組份,如, Q 氧化矽(si〇2)。 未限制粒狀材料中所用氧化鋁纖維的數均纖維直徑且 可在1至50微米的範圍內,以1至30微米爲佳,1至20 微米更佳。當數均纖維直徑在1至50微米的範圍內時, 用以得到粒狀材料的粒化加工性良好,且具有纖維本身在 粒化法中難以切割的優點。當直徑過短之氧化鋁的粒狀材 料作爲組份(B )時,導熱性的改良效果將受損。 未限制氧化鉬纖維的纖維強度。市售氧化鋁纖維可用 於本發明,且市售氧化鋁之纖維強度爲100微米至100毫 -11 - 200925200 米,以100微米至80毫米爲佳,且150微米至60毫米更 佳。纖維強度在1〇〇微米至1〇〇毫米範圍中時,所得之本 發明之樹脂組成物的模塑性極佳,且導熱性(其爲本發明 的目的之一)更獲改良。 氧化銘纖維市售品的例子包括 Altex( Sumitomo Chemical Co., Ltd.製造)、D enka A1 ceη ( D enki Kagaku kogyou 製造)、Maftec bulk fiber ( Mitsubishi Plastic ❹ Inc.製造)和 Saffil alumina fiber ( Saffil Japan Ltd.製造 )0 較佳地,氧化鋁纖維是整體密度爲0.2至1克/立方公 分的纖維,其可根據 Japanese Industrial Standards (JIS )K5 101-12測定。使用此纖維時,除了較易製造粒狀材 料以外,其優點在於自本發明之所得的樹脂組成物得到之 模塑物件的導熱性更獲改良。整體密度以0.2至0.5克/立 方公分爲佳,0.2至0.4克/立方公分更佳,且0.2至0.35 ❹ 克/立方公分最佳。雖然具此整體密度的氧化鋁纖維成爲 叢毛狀,其可於下述製備本發明之樹脂組成物的粒化步驟 中變成粒狀材料,而具有較佳的操作性。 藉由將氧化鋁纖維加以粒化,可得到組份(Β )的粒 狀材料。粒化法的例子包括已知方法,如,攪拌粒化、振 動粒化和硏磨粒化。其中,以攪拌粒化爲佳。用於攪拌粒 化之攪拌機的例子包括顛動機、Nauta混合機、螺條式混 合機和Henschel混合機。其中,就短時間處理的觀點, 以Henschel混合機爲佳。 -12- 200925200 如前述者,粒狀材料的數均粒子直徑在0.5毫米至5 毫米的範圍內,以1毫米至2毫米爲佳,1毫米至1.5毫 米更佳。當數均粒子直徑爲0.5毫米或較高時,加工性( 特別是得到所得樹脂組成物的加工性)變得良好。當數均 粒子直徑爲5毫米或較低時,粒狀材料在熔融樹脂中之分 散性變好,以藉熔化此樹脂組成物得到模塑物件,此二者 皆提供良好的模塑性。欲得到具有此數均粒子直徑的粒狀 φ 材料’處理條件因攪拌機械而不同,且基本上,它們可以 藉攪拌速率和攪拌時間控制,且經由事前實驗可達到最高 條件。此外,此粒化處理之後,藉分類操作移除細粒和粗 粒,可得到數均粒子直徑爲0.5至5毫米的粒狀材料。分 類操作的例子包括使用Dorco分粒機、虹吸分粒機、傾斜 分粒機、螺旋分粒機··等作爲濕式分類操作;和使用離心 分類機、慣性分類法、篩網..等作爲乾式分類操作。 此攪拌粒化可藉已知方法進行,其粒子包括使用前述 〇 攪拌機用於粉末粒化之方法、氧化鋁纖維在適當溶劑中混 合之後攪拌和乾燥之方法,及藉混合機或類似者攪拌同時 噴灑適當溶劑繼而乾燥之方法。此外,其可爲藉混合機或 類似者攪拌並同時將適當溶劑噴灑在氧化鋁纖維的粒料上 繼而乾燥之方法。此方法中,可用溶劑爲,如,水、有機 溶劑或它們的混合物。較佳地,適合使用水或水/有機溶 劑混合物(其中水爲主要組份)作爲溶劑。溶劑之中,較 佳者是水。 本發明的攪拌粒化中,收斂劑可含於溶劑中。 -13- 200925200 未特別限制此收斂劑,且可以使用各種種類。收斂劑 的例子包括以矽烷爲基礎和以鈦酸酯爲基礎的偶合劑。 以矽烷爲基礎的偶合劑之例子包括,如,γ-巯丙基三 甲氧基矽烷、2-苯乙烯基乙基三甲氧基矽烷、Ν-ρ-(胺乙 基)-γ-胺丙基三甲氧基矽烷、β-(3,4-環氧環己基)乙基 三甲氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、苯基 三甲氧基矽烷、甲基二甲氧基矽烷,其可以單獨使用或者 u 二或較多種倂用。 以鈦酸酯爲基礎之偶合劑的例子包括異丙基三異硬脂 醯基鈦酸酯、異丙基三辛醯基鈦酸酯、異丙基三(二辛基 焦磷酸酯)鈦酸酯、異丙基三(二甲基丙烯醯基)異硬脂 醯基鈦酸酯、異丙基三(Ν,Ν-二胺基乙基)鈦酸酯、異丙 基三(十二烷基苯磺醯基)鈦酸酯、異丙基異硬脂醯基二 丙烯醯基鈦酸酯、異丙基三(二辛基磷酸酯)鈦酸酯、異 丙基三枯苯基鈦酸酯、四異丙基雙(二辛基磷酸酯)鈦酸 φ 酯、四辛基雙(二(十二烷基)磷酸酯)鈦酸酯、四( 2,2-二烯丙基氧基甲基-1-丁基)雙(二(十三烷基)磷酸 酯)鈦酸酯、雙(二辛基焦磷酸酯)氧乙酸酯鈦酸酯及雙 (二辛基焦磷酸酯)鈦酸乙二酯’其可以單獨使用或者二 或較多種倂用。此外,矽烷偶合劑及鈦酸酯偶合劑可以一 起使用。 相對於1 0 0重量份的氧化鋁纖維總量’偶合劑含量可 爲5重量份或較少,以2重量份或較少爲佳。本發明之粒 狀材料中,難觀察到藉收斂劑(如’偶合劑)改良導熱性 -14- 200925200 之效果,但當偶合劑的量過大時,將因爲自所得樹脂組成 物得到之模塑物件的導熱性和機械性變低而非較佳者。然 而,就此粒狀材料提高與欲混合的樹脂之親和性,及改良 模塑所得樹脂組成物於模塑時的投料性質觀之,可以使用 自經少量偶合劑處理的纖維狀塡料得到之粒狀材料。 藉此得到組份(B )的粒狀材料時,可以在組份(B ) 用於本發明之樹脂組成物之前,藉分類操作而使得組份( φ B)具有本發明的較佳數均粒子直徑。 與組份(C)倂用之組份(B )的混合量可以設定在具 有高度導熱性和電絕緣性的範圍內。以1 00重量份的熱塑 性樹脂(組份(A ))計,組份(B )的用量以在10至 400重量份爲佳,1〇至300重量份更佳。當組份(C)的 混合量在10至400重量份範圍中時,電絕緣性和導熱性 可尚度相容。 本發明中使用的組份(A)之熱塑性樹脂可以是可在 © 200至450°C模塑溫度(熔化溫度)模塑且可作爲電絕緣 材料的樹脂。作爲組份(A)之熱塑性樹脂的例子包括聚 嫌烴、聚苯乙烯、聚醯胺、鹵化乙烯樹脂、聚縮醛、飽和 聚酯 '聚碳酸酯、聚芳基颯、聚芳基酮、聚苯醚、聚苯硫 酸、聚芳基醚酮、聚醚楓、聚苯硫醚碾、聚烯丙酸酯、芳 族聚醯胺、液晶聚酯和氟樹脂。此熱塑性樹脂可以單獨使 用’或者可以由二或更多種熱塑性樹脂所構成之聚合物混 雜物使用。 熱塑性樹脂中,較佳樹脂是液晶聚酯、聚醚碾、聚烯 -15- 200925200 丙酯、聚苯硫醚、聚醯胺4/6或聚醯胺6T,其爲耐熱性特 別佳者。其中,聚苯硫醚和液晶聚酯是特別佳者,此外, 就良好薄壁模塑性而言,液晶聚酯更佳。具良好薄壁模塑 性的液晶聚酯特別適用以製造電力和電子零件中使用之具 有複雜形狀的元件。 下文將更詳細地描述作爲適當熱塑性樹脂之聚苯硫醚 和液晶聚酯。Yakushima Denko Co., Ltd.). Preferred carbon fibers include resin-based carbon fibers. When measured at a temperature of 300K, the carbon fiber has a thermal conductivity of 1 watt/mK, a thermal conductivity of 120 watts/meter K or higher, and a thermal conductivity of 200 watts/meter K or higher. . The carbon fiber preferably has a fiber diameter of 1 to 20 μm and a fiber diameter of 5 to 15 μm. Examples of the carbon fiber include Dialead (manufactured by Mitsubishi Plastic Inc.) and Granock (manufactured by Nippon Graphite Fiber Corporation). This graphite may be natural graphite or may be artificial graphite. Natural graphite is preferred. The shape of the pigment (graphite crucible) composed of graphite can be scaly or spherical. The graphite crucible preferably has a number average particle diameter of 30 to 300 μm and a number average particle diameter of 30 to 1 μm. The number average particle diameter is preferably from 3 Å to 300 μm, because the high thermal conductivity and moldability of the resulting resin composition are balanced when the graphite mash is mixed into a thermoplastic resin (particularly a liquid crystal polyester described below). Excellent reason. The number average particle diameter can be easily measured by using the method of measuring the size distribution of the laser diffraction particles -8-200925200. The graphite crucible suitable for use in the present invention can be selected based on the number average particle diameter obtained by the laser diffraction particle size distribution method. Examples of readily available graphite crucibles include scaly graphite powder or granulated graphite powder (both from Nippon Graphite Industries Co., Ltd.) and scaly graphite (made from Nishimura Grpahite Inc., Ltd .). 〇 Among these exemplified graphites, scaly graphite is preferably used because the obtained resin composition has excellent moldability. The advantage of this scaly graphite is the cost, since it is cheaper than granular graphite. It is known that the thermal conductivity of a substance is inversely proportional to the electrical resistivity. When a material having a low resistivity (low resistivity material) (e.g., a metal material or a carbon fiber) is used as a highly thermally conductive material, the electrical insulation of the resulting molded article tends to decrease. Therefore, the use of low-resistivity materials is limited for power and electronic parts that generally require electrical insulation. On the other hand, the present invention provides a resin G composition which can be molded into a molded article by utilizing high thermal conductivity of a crucible composed of a low-conductivity material and maintaining sufficient electrical insulation. In the present invention, by using a dip material composed of a low-resistivity material and the following composition, the obtained molded article has an advantage that the electrical insulating property and the thermal conductivity are highly coordinated to the resin composition of the present invention. In the middle, the concentration of the material consisting of the low-resistivity material is preferably the same as or lower than the concentration (osmotic concentration) at which the conductive material is in contact with each other to form a conductive path, and the component (Β) is effectively located by A material consisting of low resistivity materials. Therefore, the 'thermal conduction pathway' consists of Group-9-200925200 parts (B) (materials that granulate mainly alumina fibers) and component (C) (low-resistivity materials) to have high thermal conductivity. And maintain the electrical insulation of the thermal path. Furthermore, even when the thermally conductive path is fabricated in such a way that the materials consisting of the low resistivity material are connected to each other with a suitable electrical insulator, it must be noted that the so-called tree dielectric disintegration occurs between the materials of low resistivity material, and The dielectric strength voltage of the obtained molded article was remarkably low. However, with respect to the molded article obtained from the insulating resin composition of the present invention, it is surprising that such dielectric collapse is sufficiently suppressed and the dielectric strength required for electric power and electronic parts is easily obtained. Excellent effect of potential (dielectric breakdown voltage: 1 kV/mm or higher). As the foregoing, the mixing amount of the component (C) is appropriately selected such that it is an osmotic concentration or lower in the obtained molded article, and based on the kind of the component (A), it is necessary to make the component ( The amount of mixing of C) is optimized to control the amount of mixing to be osmolality or less. The preferred mixing amount of the component (C) is based on the component (A), and is 1 to 50 parts by weight relative to 100 parts by weight of the thermoplastic resin component (C) of the component (A). Preferably, it is preferably from 1 to 40 parts by weight, more preferably from 5 to 40 parts by weight. When the compounding amount of the component (c) is in the foregoing range, the electrical insulation is sufficiently maintained, and a molded article having a high thermal conductivity can be obtained. The resin composition of the present invention comprises a particulate material (component (B)) having a number average particle diameter of 0.5 to 5 mm and which can be obtained by a fiber mainly having an alumina having a number average fiber diameter of 1 to 5 G It is obtained by granulation. Here, the particle size in the "granular material" means that the material is granular and the aspect ratio -10-200925200 (which is the ratio of the major axial length of the material to the minor axis length) is in the range of 1 to 2. The "number average particle diameter" is obtained by scanning electron microscopy or optical microscopy for the observation of the main axis and the minor axis of the granular material, and the arithmetic mean of 値 measured by 1 〇〇 or more of the granular material. Please note that 1000 or more measurements of the fiber are photographed and binarized by the image processing device to obtain the number average fiber diameter of the fibrous material. The particulate material, component (B), is a material obtainable by granulating fibers mainly having alumina Φ (e.g., alumina fibers). Thereby, the synergistic effect of the granular material and the component (C), the electrical insulation and the thermal conductivity are highly coordinated. The "mainly alumina" fiber preferably contains about 50% by weight or more of alumina (i.e., alumina (ai2o3)). The aluminum oxide content in the fiber is preferably about 70% by weight or more, and preferably about 90% by weight or more. The fiber mainly having alumina has a component other than alumina, such as Q yttrium oxide (si〇2). The number average fiber diameter of the alumina fibers used in the particulate material is not limited and may be in the range of 1 to 50 μm, preferably 1 to 30 μm, more preferably 1 to 20 μm. When the number average fiber diameter is in the range of 1 to 50 μm, the granulation workability for obtaining a granular material is good, and there is an advantage that the fiber itself is difficult to cut in the granulation method. When the granular material of alumina having a too short diameter is used as the component (B), the effect of improving the thermal conductivity is impaired. The fiber strength of the molybdenum oxide fiber is not limited. Commercially available alumina fibers are useful in the present invention, and commercially available alumina has a fiber strength of from 100 μm to 100 η -11 to 200925200 m, preferably from 100 μm to 80 mm, and more preferably from 150 μm to 60 mm. When the fiber strength is in the range of from 1 μm to 1 mm, the resulting resin composition of the present invention is excellent in moldability, and thermal conductivity (which is one of the objects of the present invention) is further improved. Examples of commercially available oxidized Ming fibers include Altex (manufactured by Sumitomo Chemical Co., Ltd.), D enka A1 ceη (manufactured by D enki Kagaku kogyou), Maftec bulk fiber (manufactured by Mitsubishi Plastic ❹ Inc.), and Saffil alumina fiber (Saffil). Made by Japan Ltd.) Preferably, the alumina fiber is a fiber having an overall density of 0.2 to 1 g/cm 3 which can be measured according to Japanese Industrial Standards (JIS) K5 101-12. When this fiber is used, in addition to the ease of production of the granular material, it is advantageous in that the thermal conductivity of the molded article obtained from the resin composition obtained by the present invention is further improved. The overall density is preferably from 0.2 to 0.5 g/cm, more preferably from 0.2 to 0.4 g/cm, and most preferably from 0.2 to 0.35 g/cm. Although the alumina fibers having such an overall density are in the form of tufts, they can be made into a granular material in the granulation step of preparing the resin composition of the present invention described below, and have preferable workability. By granulating the alumina fibers, a particulate material of the component (Β) can be obtained. Examples of the granulation method include known methods such as agitating granulation, vibrating granulation, and honing granulation. Among them, stirring granulation is preferred. Examples of the agitator for agitating granulation include a rotary machine, a Nauta mixer, a ribbon blender, and a Henschel mixer. Among them, the Henschel mixer is preferred for the purpose of short-term processing. -12- 200925200 As the foregoing, the number average particle diameter of the granular material is in the range of 0.5 mm to 5 mm, preferably 1 mm to 2 mm, more preferably 1 mm to 1.5 mm. When the number average particle diameter is 0.5 mm or more, the workability (especially, the workability of the obtained resin composition) becomes good. When the number average particle diameter is 5 mm or less, the dispersibility of the particulate material in the molten resin becomes good to obtain a molded article by melting the resin composition, both of which provide good moldability. The conditions for obtaining granular φ material having such a number average particle diameter vary depending on the stirring machine, and basically, they can be controlled by the stirring rate and the stirring time, and the highest conditions can be attained by the prior experiment. Further, after the granulation treatment, the fine particles and the coarse particles are removed by a sorting operation to obtain a granular material having a number average particle diameter of 0.5 to 5 mm. Examples of classification operations include the use of a Dorco classifier, a siphon classifier, a tilting classifier, a spiral classifier, etc. as a wet sorting operation; and the use of a centrifugal sorter, inertial sorting, screen, etc. Dry sorting operation. This agitation granulation can be carried out by a known method, and the particles thereof include a method for powder granulation using the aforementioned mash mixer, a method of stirring and drying the alumina fibers after mixing in a suitable solvent, and stirring by a mixer or the like. Spray the appropriate solvent and then dry. Further, it may be a method of stirring by a mixer or the like while spraying a suitable solvent onto the pellet of alumina fiber. In this method, the usable solvent is, for example, water, an organic solvent or a mixture thereof. Preferably, water or a water/organic solvent mixture (wherein water is the main component) is suitably used as the solvent. Among the solvents, water is preferred. In the agitation granulation of the present invention, the astringent may be contained in a solvent. -13- 200925200 This astringent is not particularly limited and various types can be used. Examples of astringents include decane-based and titanate-based coupling agents. Examples of the decane-based coupling agent include, for example, γ-mercaptopropyltrimethoxydecane, 2-styrylethyltrimethoxydecane, Ν-ρ-(aminoethyl)-γ-aminopropyl Trimethoxydecane, β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, γ-glycidoxypropyltrimethoxydecane, phenyltrimethoxydecane, methyldimethoxy Decane, which can be used alone or in combination with two or more. Examples of titanate-based coupling agents include isopropyl triisostearate titanate, isopropyl trioctylide titanate, isopropyl tris(dioctyl pyrophosphate) titanate, Isopropyl tris(dimethylpropenyl)isostearyl decyl titanate, isopropyl tris(indene, fluorenyl-diaminoethyl) titanate, isopropyl tris(dodecylbenzene) Sulfonyl) titanate, isopropylisostearylnonyl propylene acrylate titanate, isopropyl tris(dioctyl phosphate) titanate, isopropyl tricumyl phenyl titanate, Tetraisopropylbis(dioctylphosphonate)titanate φ ester, tetraoctylbis(di(dodecyl)phosphate) titanate, tetrakis(2,2-diallyloxymethyl) -1-butyl)bis(di(tridecyl)phosphate) titanate, bis(dioctylpyrophosphate)oxyacetate titanate and bis(dioctylpyrophosphate) titanate Ethylene glycol 'can be used alone or in combination with two or more. Further, a decane coupling agent and a titanate coupling agent can be used together. The coupling agent content may be 5 parts by weight or less with respect to 100 parts by weight of the total amount of alumina fibers, preferably 2 parts by weight or less. In the granular material of the present invention, it is difficult to observe the effect of improving the thermal conductivity-14-200925200 by an astringent (e.g., 'coupling agent), but when the amount of the coupling agent is too large, it will be molded by the obtained resin composition. The thermal conductivity and mechanical properties of the article are lower than preferred. However, in view of the affinity of the granular material for the resin to be mixed, and the improvement of the feeding property of the molded resin composition at the time of molding, the fibrous material obtained by treating a small amount of the coupling agent can be used. Shaped material. When the particulate material of the component (B) is thereby obtained, the component (?B) can have a preferred number of the present invention by the classification operation before the component (B) is used in the resin composition of the present invention. Particle diameter. The amount of the component (B) to be used in combination with the component (C) can be set within a range having high thermal conductivity and electrical insulation. The component (B) is preferably used in an amount of 10 to 400 parts by weight, more preferably 1 to 300 parts by weight, based on 100 parts by mass of the thermoplastic resin (component (A)). When the mixing amount of the component (C) is in the range of 10 to 400 parts by weight, the electrical insulating property and the thermal conductivity are still compatible. The thermoplastic resin of the component (A) used in the present invention may be a resin which can be molded at a molding temperature (melting temperature) of from 200 to 450 ° C and which can be used as an electrically insulating material. Examples of the thermoplastic resin as the component (A) include polyisolated hydrocarbons, polystyrene, polyamine, vinyl halide resin, polyacetal, saturated polyester 'polycarbonate, polyarylsulfonium, polyaryl ketone, Polyphenylene ether, polyphenylene sulfate, polyaryl ether ketone, polyether maple, polyphenylene sulfide mill, polyallyl ester, aromatic polyamine, liquid crystal polyester, and fluororesin. This thermoplastic resin may be used singly or may be used as a polymer mixture composed of two or more thermoplastic resins. Among the thermoplastic resins, preferred resins are liquid crystal polyester, polyether mill, polyene-15-200925200 propyl ester, polyphenylene sulfide, polyamine 4/6 or polyamine 6T, which are particularly excellent in heat resistance. Among them, polyphenylene sulfide and liquid crystal polyester are particularly preferable, and in addition, liquid crystal polyester is more preferable in terms of good thin-wall moldability. Liquid crystal polyesters having good thin-wall moldability are particularly suitable for the manufacture of components having complex shapes for use in electric power and electronic parts. Polyphenylene sulfide and liquid crystal polyester as suitable thermoplastic resins will be described in more detail below.

基本上,聚苯硫醚是主要包括以下列式(10)所示之 結構單元的樹脂。至於製造此聚苯硫醚之方法,方法的例 子包括經鹵素取代之芳族化合物與鹼金屬硫化物反應之方 法(如美國專利案第2,5 13,188號及日本審理中的專利申 請案第44-27671號所示),噻酚在鹼性觸媒、銅鹽之類 之存在下進行縮合反應(如美國專利案第3,274,165號所 示)’或芳族化合物與氯化硫在路易斯酸存在下進行縮合 反應(如日本審理中的專利申請案第46-27255號所示) 。此外,亦可使用易取得之市售的聚苯硫醚(例如自 Dainippon Ink and Chemicals Inc.取得的聚苯硫醚)。Basically, polyphenylene sulfide is a resin mainly comprising a structural unit represented by the following formula (10). As a method of producing the polyphenylene sulfide, examples of the method include a method of reacting a halogen-substituted aromatic compound with an alkali metal sulfide (for example, U.S. Patent No. 2,5,13,188 and Japanese Patent Application No. 44) -27671), a condensation reaction of thiophene in the presence of a basic catalyst, a copper salt or the like (as shown in U.S. Patent No. 3,274,165) or an aromatic compound and sulfur chloride in a Lewis acid The condensation reaction is carried out in the presence (as shown in Japanese Patent Application No. 46-27255). Further, commercially available polyphenylene sulfide (for example, polyphenylene sulfide obtained from Dainippon Ink and Chemicals Inc.) can also be used.

本發明中使用的液晶聚酯可以稱爲熱致液晶聚合物, 其於450°C或較低的溫度形成熔體。 此液晶聚酯的開始流動溫度爲28(TC或較高。請注意“ 開始流動溫度”是液晶聚酯之受熱的熔融物於升溫速率爲4 -16- 200925200 °c/分鐘,於100公斤/平方公分載量下,自噴嘴被壓出時 具有熔黏度爲48000泊之溫度。 液晶聚酯的例子包括: (1) 藉芳族羥基羧酸、芳族二羧酸及芳族二醇組合 之聚合反應製得者, (2) 藉不同類型之芳族羥基羧酸的聚合反應製得者 φ (3)藉芳族二羧酸與芳族二醇的聚合反應製得者, 和 (4)藉晶狀聚酯(如,聚對苯二甲酸乙二酯)與芳 族羥基羧酸的反應製得者。 藉由使用它們之生酯衍生物代替這些芳族羥基羧酸、 芳族二羧酸或芳族二醇,液晶聚酯之產製變得容易,此爲 較佳者。 當所用之芳族羥基羧酸及芳族二羧酸具有分子內的羧 Q 基時,生酯衍生物的例子包括藉羧酸基團轉化成高反應性 基團(如,酸醯鹵基團及酸酐)之轉化反應製得者,及可 藉轉酯化作用生成聚酯之具有醇及乙二醇的酯類。當所用 之芳族羥基羧酸及芳族二醇具有分子內的酚系羥基時,生 酯衍生物的例子包括酚系羥基與低碳羧酸之可藉轉酯化作 用生成聚酯之酯類。 此芳族羥基羧酸、芳族二羧酸及芳族二醇的芳環上可 具有鹵素原子(如,氯原子和氟原子)、烷基(如,甲基 和乙基)和芳基(如,苯基),其具有的程度不會過度干 -17- 200925200 擾其生酯性質。 本發明之液晶聚酯中的結構單元的例子包括下列者: 衍生自芳族羥基羧酸的結構單元:The liquid crystal polyester used in the present invention may be referred to as a thermotropic liquid crystal polymer which forms a melt at 450 ° C or lower. The liquid crystal polyester has a starting flow temperature of 28 (TC or higher. Note that the "starting flow temperature" is a heated melt of the liquid crystal polyester at a heating rate of 4 -16 to 200925200 ° C / min at 100 kg / At a square centimeter load, the melt has a melt viscosity of 48,000 poise when it is extruded. Examples of liquid crystal polyesters include: (1) by a combination of an aromatic hydroxycarboxylic acid, an aromatic dicarboxylic acid, and an aromatic diol Produced by polymerization, (2) by the polymerization of different types of aromatic hydroxycarboxylic acid, φ (3) by polymerization of aromatic dicarboxylic acid and aromatic diol, and (4) By the reaction of a crystalline polyester (e.g., polyethylene terephthalate) with an aromatic hydroxycarboxylic acid. These aromatic hydroxycarboxylic acids, aromatic dicarboxylic acids are replaced by the use of their ester derivatives. The acid or aromatic diol, liquid crystal polyester is easy to produce, which is preferred. When the aromatic hydroxycarboxylic acid and the aromatic dicarboxylic acid used have an intramolecular carboxy Q group, the ester derivative Examples include conversion reactions in which a carboxylic acid group is converted into a highly reactive group (e.g., a hydrazine halide group and an acid anhydride). Derivatives, and esters of alcohols and ethylene glycols which can be converted to esterification to form polyesters. When the aromatic hydroxycarboxylic acids and aromatic diols used have intramolecular phenolic hydroxyl groups, the ester derivatives Examples include esters of a phenolic hydroxyl group and a lower carboxylic acid which can be esterified to form a polyester. The aromatic hydroxycarboxylic acid, the aromatic dicarboxylic acid and the aromatic diol may have a halogen atom on the aromatic ring. (e.g., chlorine and fluorine atoms), alkyl (e.g., methyl and ethyl), and aryl (e.g., phenyl), to the extent that they do not excessively dry. Examples of the structural unit in the liquid crystal polyester of the invention include the following: a structural unit derived from an aromatic hydroxycarboxylic acid:

(Αι) 前述結構單元可以具有鹵素原子、烷基或芳基作爲取 代基。 衍生自芳族二羧酸的結構單元: -18- 200925200(Αι) The aforementioned structural unit may have a halogen atom, an alkyl group or an aryl group as a substituent. Structural unit derived from an aromatic dicarboxylic acid: -18- 200925200

前述結構單元可以具有鹵素原子、烷基或芳基作爲取 代基。 衍生自芳族二醇的結構單元: -19- 200925200The aforementioned structural unit may have a halogen atom, an alkyl group or an aryl group as a substituent. Structural unit derived from aromatic diol: -19- 200925200

前述結構單元可以具有鹵素原子、烷基或芳基作爲取 代基。 選自前示單元的結構單元之組合的例子構成包括下面 的組合(a)至(h)之液晶聚醋。 (a ) : ( A, ) 、(Β,)及(C,)的組合,或者(A! )、(Βι ) 、( B2 )及(Ci )的組合; (b ) : ( A2 ) 、( B3 )及(C2 )的組合,或者(A2 )、(B! ) 、( B3 )及(C2 )的組合; -20- 200925200 (c) : ( A,)及(A2)的組合; (d) :將結構單元組合(a)之部分或全部的(A!) 以(A2)替代所得到的組合; (e ):將結構單元組合(a )之部分或全部的(B!) 以(B3 )替代所得到的組合; (f):將結構單元組合(a)之部分或全部的(C!) 以(C3)替代所得到的組合; φ ( g):將結構單元組合(b)之部分或全部的(A2) 以(Ai )替代所得到的組合; (h):將(Bd及(C2)加至結構單元組合(〇所 得到的組合。 就耐熱性、機械性質和加工性之間平衡的觀點,特別 佳的液晶聚酯具有(Ad所示結構單元的量爲以液晶聚醋 總結構單元計之至少30莫耳%。 相當於組合(a )和(b )之液晶聚酯分別揭示於,例 ❹ 如,日本審理的專利申請案第47-47870和63-3888號,且 可藉揭示於,例如,日本未審理的專利申請案第2002-146003號,中之方法製備。例如,製備此液晶聚酯之方法 的步驟包含單體(芳族羥基羧酸、芳族二羧酸、芳族二醇 或其生酯衍生物)進行熔融聚縮合反應以製得分子量相當 低的芳族液晶聚酯(在下文中簡稱爲“預聚物’,),之後, 將預聚物製成粉末,並將粉末加熱以引發固相聚合反應。 進行此固相聚合反應時,可進一步聚合,得到較高分子量 的聚合物。此外’藉合倂熔融聚合反應和固相聚合反應而 -21 - 200925200 製造液晶聚酯之方法可改良所得液晶聚酯的 。特別地,藉由適當地使固相聚合反應之聚 ,能夠簡便地製得具有所欲開始流動溫度的 就具有液晶性的觀點,較佳地,本發明 聚酯是衍生自對-羥基苯甲酸的結構單元和名 6-萘酸的結構單元共爲以液晶聚酯總結構單 80莫耳%;衍生自氬醌的結構單元和衍生目 0 聯苯的結構單元共爲以液晶聚酯總結構單元 莫耳%;及衍生自對酞酸的結構單元、衍生 構單元和衍生自2,6-萘二羧酸的結構單元共 總結構單元計之1 0至3 5莫耳%的液晶聚酯 本發明之樹脂組成物包含組份(A )、 。使用該組成物,可得到具電絕緣性和高導 件。本發明之樹脂組成物可進一步包含(E (組份(D))作爲導熱塡料。此包含氧化 φ 組成物更能進一步改良導熱性。此外,當液 份(A)的熱塑性樹脂時,所得模塑物件的 向異性。藉由含有組份(D )作爲導熱塡料 方面具有的此各向異性可被可以適當地降低 作爲組份(D)氧化銘細粒以由氧化銘 爲96重量%或更多且數均粒子直徑爲01 α-氧化鋁所構成的細粒爲佳。就導熱性的 含量越高越有利,以99重量%或較多爲佳, 較多更佳。此外’數均粒子直徑在前述範圍 丨開始流動溫度 :合條件最適化 液晶聚醋。 丨中使用的液晶 ίί生自2-羥基-.元計之3 0至 自4,4’-二羥基 計之10至35 自異酞酸的結 :爲以液晶聚酯 〇 (Β )和(C ) 熱性的模塑物 &gt; )氧化鋁細粒 鋁細粒的樹脂 晶聚酯作爲組 導熱性具有各 ,在導熱性質 〇 (Α12〇3 )含量 至100微米的 觀點,氧化鋁 99.5重量%或 中時,模塑性 -22- 200925200 極佳的原因與在組份(B)中相同,這樣的數均粒子直徑 以0.1至70微米爲佳,0.1至50微米更佳,0.1至20微 米特別佳。此處,數均粒子直徑係使用掃描式電子顯微鏡 取得粉狀細粒的照片並自照片選擇50至100個粒子以進 行影像分析而得的平均値。此外,較佳地,測定累積的粒 子大小分佈時,此氧化鋁細粒具有窄的粒子大小分佈, D90/1()(自細粒側之10%累積的粒子直徑和90%累積的粒 U 子直徑分別定義爲D1G和D9G )爲7或較小。Dlfl和D90係 藉,例如,使用 Mastersizer ( Malvern Instruments Ltd.製 造)之雷射繞射粒子大小分佈測定法測定。 只要氧化鋁細粒滿足前述氧化鋁含量和前述數均粒子 直徑,未特別限制其形狀,但以球狀、約球狀或多面體形 狀爲佳。此外,較佳地,將氧化鋁細粒的主軸長度視爲L (微米)和次要軸長度視爲S (微米),其L/S比是1.0 至 3.0。 φ 此氧化鋁細粒可爲市售的氧化鋁細粒。市售氧化鋁細 粒的例子包括 Sumitomo Chemical Co.,Ltd 生產的 Sumikorandom。此外,可以使用市售品(如Showa Denko K.K.生產的氧化銘細粒或Nippon Light Metal Co_,Ltd.生 產的氧化鋁細粒)作爲組份(D )。 當本發明之樹脂組成物除了組份(A )至(C )以外, 另含有組份(D )時,以100重量份組份(A )計,組份 (D )的用量以5至250重量份爲佳,1〇至200重量份更 佳,20至150重量份最佳。 -23- 200925200 組份(D )的用量是5至250重量份時,其優點在於 導熱性的改良效果極佳,且模塑性未明顯受損。 如前述者,本發明之樹脂組成物含有組份(B )和(C ),或組份(B ) 、( C )和(D ),及組份(A ),並提 供具有良好導熱性的模塑物件。 模塑物件可藉各種已知方法製造。方法的例子包括擠 壓模塑、射出模塑、加壓模塑和吹塑。 φ 此外,本發明之模塑組成物中,在不會損及本發明所 欲效果的範圍內,一種類型或多種慣用添加劑可添加使用 ’包括塡料(如,玻璃纖維)、氟樹脂、脫模劑(如,金 屬皂)、著色劑(如,染料和顏料)、抗氧化劑、熱安定 劑、UV吸收劑、抗靜電劑 '界面活性劑..等。此外,一種 類型或具有外在潤滑效果的更多物質可添加使用,如,高 碳脂肪酸、高碳脂肪酸酯、高碳脂肪酸金屬鹽和以氟化碳 爲基礎的界面活性劑。 © 未特別限制本發明之絕緣樹脂組成物之製法,其例子 包括’合倂組份(A)至(C)的方法,或使用Henschel 混合機、顛動機或類似者混合組份(A )至(D ),之後 使用擠壓機熔融捏和。此外’例子包括藉擠壓機熔融捏和 的方法,組份(A)自第一投料處投入,在其他組份使用 Henschel混合機、顛動機或類似者混合之後,它們自側投 料處投料,並熔融捏和。 藉此而得的樹脂組成物可以取決於標的零件形狀地選 擇適當的模塑方法,但以射出模塑爲佳。至於藉射出模塑 -24- 200925200 得到的模塑物件,可得到具有複雜形狀的模塑物件,如, 薄壁零件。 藉前述方式得到的模塑物件可爲3 00K的電阻率爲 1〇12歐姆米或較高,且1毫米厚的介電瓦解電壓爲2千伏 特/毫米或較高的模塑物件。此模塑物件具高度導熱性, 即使使用組份(C )表示之具低電阻率的塡料亦然,作爲 電力和電子零件時,其具有極佳的電絕緣性和足夠的介電 ^ 瓦解電壓,因此其在與此零件有關的應用方面非常有用。 此外,自本發明之絕緣樹脂組成物得到尺寸爲64毫 米x64毫米χ3毫米厚的模塑物件之後,根據ASTMD257測 定此模塑物件的電阻率。 此外,自本發明之絕緣樹脂組成物得到尺寸爲64毫 米χ64毫米xl毫米厚的模塑物件之後,根據JIS C2110中 描述的短期瓦解試驗測定此模塑物件的瓦解電壓。 至於自本發明之樹脂組成物得到的模塑物件之較佳應 φ 用,下列應用可爲例示。 關於自本發明之絕緣樹脂組成物得到的模塑物件之應 用,適當的應用包括用於電力和電子裝置的外殻,及電力 設備(如,發電機、馬達、變壓機、交流發電機、電壓調 整器、整流器、變極器、中繼器、電力介面、開關、斷路 器、刀形開關、電桿(P〇le rod )、電力零件箱、插座、 繼電器箱)的零件。此外,其適合用於操作時生熱的電子 零件,如,偵測器、LED燈、燈座、燈反射燈、燈罩、連 接器、小尺寸開關、線圈軸、電容器、振盪器、多種端子 -25- 200925200 、變壓器、插頭、印刷電路板、小尺寸馬達、磁頭機座、 電力模組、硬碟驅動零件(硬碟驅動輪轂、執行器、硬碟 基板··等)、DVD零件(如,光學讀寫頭··等)和電腦相 關零件。 此外,其可用於供半導體元件、線圈··等使用的包封 樹脂、供光學設備(如,相機)使用的光學零件、產生高 摩擦熱的零件(如,滾輪軸承)、供車和與載具相關的零 φ 件使用的照射組件及電力組件絕緣板。 已藉此描述本發明,顯見其可以多種方式變化。這些 變化應視爲在本發明之精神與範圍內,意欲將嫻於本技藝 之人士顯見的所有該等修飾含括於下列申請專利範圍的範 圍內。 茲將2007年9月12日提出申請的日本專利申請案第 2007-236374號、2008年5月8日提出申請的日本專利申 請案第2008-122025號所揭示者(包括專利說明書、申請 Q 專利範圍及槪述)全數倂於本文中作爲參考。 實例 藉以下實例詳細說明本發明,但不應以這些實例限制 本發明之範圍。 使用下列者作爲組份(C )。 碳化砂 1 : OY-3 » Yakushima Denko Co., Ltd.生產。 碳纖維 1 : D i al e ad K 2 2 3 H G,M i t s u b i s hi P1 a s t i c In c . 生產。 -26- 200925200 石墨 1 : CB-150,Nippon Graphite Fiber Corporation 生產。 使用下列者作爲組份(D )。 氧化銘細粒 1 . Advanced alumina AA-18,Sumitomo Chemical Co.,Ltd.生產,數均粒子直徑18微米,氧化鋁 含量爲99.6重量%。 氧化鋁細粒 2 : Advanced alumina AA-1.5,Sumitomo 0 Chemical Co.,Ltd·生產’數均粒子直徑1 .5微米,氧化鋁 含量爲99.6重量%。 氧化鋁細粒3 : L ow-soda alumina ALM-41,Sumitomo Chemical Co_,Ltd·生產’數均粒子直徑1.5微米,氧化鋁 含量爲99.9重量%。 氧化銘細粒 4: Advanced alumina AA-03,Sumitomo Chemical Co.,Ltd.生產’數均粒子直徑0.3微米,氧化鋁 含量爲99.6重量%。 ❹ 產製例1 〔微粒材料1之製法〕 氧化銘纖維(Denka Alcen,Denki Kagaku Kogyo K.K.生產,氧化鋁含量100重量%,數均纖維直徑3 ·2微 米’整體密度〇_28克/立方公分)投入Henschel混合機( Super mixer G1 00,K a w at a M G F C ο .,L t d .生產)中,並攪 拌和粒化而得到微粒材料1。藉光學顯微鏡測得微粒材料 1的數均粒子直徑爲1.0毫米。 -27- 200925200 產製例2 〔液晶聚酯之產製〕 在配備攪拌設備、扭矩計、通氮氣的管、溫度計和迴 餾冷凝器的反應器中投入994.5克(7.2莫耳)的對-羥基 苯甲酸、446.9克(2.4莫耳)的4,4,-二羥基聯苯、299.0 克(1.8莫耳)的對酞酸、99.7克(0·6莫耳)的異酞酸和 @ 1347.86克(13.2莫耳)的醋酸酐,反應器內側以氮氣充 份替代’之後在氮氣流下,提高至150。(:達30分鐘,並在 維持此溫度時迴餾1小時。 之後,提高至320 °C達2小時50分鐘,同時蒸除經蒸 餾的副產物醋酸和未反應的醋酸酐,藉此得到預聚物,此 時觀察到扭矩提高並將此視爲反應完全。 所得的預聚物冷卻至室溫,以粗硏磨機硏磨,之後在 氮氣下,以一小時自室溫提高至250 °C,之後再以5小時 © 自250°C提高至285 °C,並維持於285 °C3小時,以進行固 態聚合反應。所得液晶聚酯的開始流動溫度是327t。此 藉此而得的液晶聚酯以LCP 1表示。 實例1至7和比較例1至4 產製例1中得到的微粒材料1、產製例2中得到的液 晶聚酯、選自氧化鋁細粒1至4中之一者、氮化矽1、碳 纖維1或石墨1藉表1中所示之組成,使用相同方向的雙 螺旋擠壓機(PCM-30,Ikegai Iron Works,Ltd.生產)於 -28- 200925200 340 °C捏和及粒化。使用射出機(PS40E5ASE,Nissei Plastic Industrial Co.,Ltd.生產),所得粒狀物於圓筒溫 度3 50°C和模具溫度130°C射出模塑,得到模塑物件1: 126毫米xl2毫米x6毫米,模塑物件2: 64毫米X64毫米X 3毫米厚,模塑物件3 : 64毫米χ64毫米xl毫米厚。在以 垂直於模塑物件1主軸的方向切下厚度1毫米的板(MD ),以其作爲導熱性評估的樣品。使用此樣品,以雷射閃 U 光法的熱恆定測定設備(TC-7000,Ulvac-Riko Inc.製造 )量測這些樣品的熱擴散率。並以 DSC ( DSC7, PERKINELMER Japan C 〇 ·, Lt d ·製造)量測比熱,以自動 比重量測設備(ASG-320K,Kanto-measure Co·,Ltd.)量 測比重。樣品的導熱率係熱擴散率x比熱X比重而得。 使用模塑物件2,根據ASTMD257,測定300K的電 阻率。使用模塑物件3,根據JIS C2110中描述的短期瓦 解試驗測定介電瓦解電壓。 @ 其結果示於表1。 -29- 200925200 ο £ ο 比較例4 § ^ (N 3_0χ109 ο 比較例3 § δ 23.9 m τ·^ 1 比較例2 1 2 ^ r-H rn 3.0x10° 00 (N L比較例1I 〇 m O — (N 1—Η (Ν 11.ΟχΙΟ10] oo o 卜 Μ O _4. 22 - Ο ν〇 1 3.0χ10131 o r-i 實例6 ι&gt; σ&lt; 1 6.0x1 ο12 1 o 實例5 §2 s ^ 〇〇 σν 11.0x10° 1 v〇 ro 實例4 §g ^ ^ ο 00 9.0χ1012 1 m IK 寸 ΟΝ 1 9·0χ1012 o 寸· 實例2 §2 ^ Ο ν〇 1 3.0χ10131 o cn 實例1 i 2jqS 00 ΙΟ 1 4.0χ10131 〇 o /—N y—N /—V ^ Φ Φ Φ Φ φ A ^ _ oiW^^^WiiliilW φβΙιΐιίΙΦ^^^^ S^^^SlISi _]募——粗墨爾墨攝 ft起翠蘧an安与安与 2藜磐整屯减嘁囍祕 導熱率(MD)(瓦/米Κ) 電阻率(歐姆米) 介電瓦解電壓(千伏特/«米) -30- 200925200 由實例1至7的絕緣樹脂組成物可清楚看出,所得模 塑物件在MD方向上的導熱率是5瓦/米K或較高,具有 極佳的導熱性。此外,電阻率皆爲1〇〗2歐姆米或較高,並 顯不足以作爲電力和電子零件中所用之絕緣元件的電阻値 ’且介電瓦解電壓皆爲2千伏特/毫米或較高,此極佳。 在使用碳化矽塡料或碳纖維的比較例1和2之樹脂組 成物中,所得模塑物件的導熱性不足,而在混合大量碳纖 ❾ 維或石墨的比較例3、4中,所得模塑物件的電阻率變小 ,且電絕緣性不足。 實例8The aforementioned structural unit may have a halogen atom, an alkyl group or an aryl group as a substituent. An example of a combination of structural units selected from the preceding units constitutes a liquid crystal polyester comprising the following combinations (a) to (h). (a) : a combination of ( A, ), (Β,) and (C,), or a combination of (A!), (Βι), (B2) and (Ci); (b) : ( A2 ) , ( a combination of B3) and (C2), or a combination of (A2), (B!), (B3), and (C2); -20- 200925200 (c): a combination of (A,) and (A2); ) : Substituting some or all of (A!) of the structural unit combination (a) with (A2) for the resulting combination; (e): combining some or all of (B!) of the structural unit combination (a) with ( B3) replacing the resulting combination; (f): replacing some or all of (C!) of the structural unit combination (a) with (C3); φ (g): combining structural units (b) Part or all of (A2) replaces the obtained combination with (Ai); (h): adds (Bd and (C2) to the structural unit combination (the combination obtained by 〇. in terms of heat resistance, mechanical properties and processability) From the viewpoint of balance, a particularly preferred liquid crystal polyester has (the amount of the structural unit represented by Ad is at least 30 mol% based on the total structural unit of the liquid crystal polyacetate. The liquid crystal poly is equivalent to the combination of (a) and (b) Esters are disclosed in, for example, Japanese trials Patent application Nos. 47-47870 and 63-3888, and can be prepared by the method disclosed in, for example, Japanese Unexamined Patent Application No. 2002-146003. For example, the steps of the method for preparing the liquid crystal polyester A monomer (an aromatic hydroxycarboxylic acid, an aromatic dicarboxylic acid, an aromatic diol or a crude ester derivative thereof) is subjected to a melt polycondensation reaction to obtain an aromatic liquid crystal polyester having a relatively low molecular weight (hereinafter referred to as " Prepolymer ',), after which the prepolymer is powdered and the powder is heated to initiate solid phase polymerization. When this solid phase polymerization is carried out, it can be further polymerized to obtain a polymer having a higher molecular weight. By the combination of melt polymerization and solid phase polymerization - 21 - 200925200 The method for producing a liquid crystal polyester can improve the obtained liquid crystal polyester. In particular, it can be easily produced by appropriately solidifying a solid phase polymerization reaction. From the viewpoint of having a liquid crystal property at a desired starting temperature, preferably, the polyester of the present invention is a structural unit derived from p-hydroxybenzoic acid and a structural unit derived from 6-naphthoic acid. a structural unit of 80 mol%; a structural unit derived from argon-arsenic and a structural unit derived from 0-biphenyl are a total of 100% of the total structural unit of the liquid crystal polyester; and a structural unit derived from citric acid, a derivative unit, and The liquid crystal polyester of the present invention having a total structural unit derived from 2,6-naphthalenedicarboxylic acid of 10 to 35 mol% comprises the component (A), using the composition, An electrically insulating and high-conductive member can be obtained. The resin composition of the present invention may further comprise (E (component (D)) as a thermal conductive coating. This inclusion of the oxidized φ composition further improves the thermal conductivity. Further, when the thermoplastic resin of the liquid (A) is used, the resulting molded article is anisotropic. The anisotropy which is possessed by containing the component (D) as a heat-conductive crucible can be appropriately reduced as the component (D) to oxidize the ingot to be 96% by weight or more and the number average particle by oxidation. Fine particles composed of 01 α-alumina are preferred. The higher the content of the thermal conductivity, the more advantageous it is, and it is preferably 99% by weight or more, more preferably more. Further, the 'number average particle diameter is in the above range 丨 starting flow temperature: the conditions are optimal for liquid crystal polycondensation. The liquid crystal used in the crucible is derived from the 2-hydroxy-.30 to the 10,35 from the 4,4'-dihydroxy group. The isocyanate is formed by the liquid crystal polyester (Β) and C) Thermal moldings&gt;) Alumina fine-grained aluminum fine-grained resin crystalline polyester has a thermal conductivity as a group, and the thermal conductivity 〇(Α12〇3) content is 100 μm, and the alumina is 99.5% by weight. Or medium, moldability-22-200925200 The reason for the excellent is the same as in the component (B), such a number average particle diameter is preferably 0.1 to 70 μm, more preferably 0.1 to 50 μm, 0.1 to 20 μm. Especially good. Here, the number average particle diameter is an average enthalpy obtained by taking a photograph of the powdery fine particles using a scanning electron microscope and selecting 50 to 100 particles from the photograph for image analysis. Further, preferably, when the cumulative particle size distribution is measured, the alumina fine particles have a narrow particle size distribution, D90/1() (10% cumulative particle diameter from the fine particle side and 90% cumulative particle U) The sub diameters are defined as D1G and D9G, respectively, being 7 or less. Dlfl and D90 are measured, for example, by a laser diffraction particle size distribution measurement method using a Mastersizer (manufactured by Malvern Instruments Ltd.). The alumina fine particles are not particularly limited in shape as long as they satisfy the aforementioned alumina content and the number average particle diameter, but are preferably spherical, about spherical or polyhedral. Further, preferably, the major axis length of the alumina fine particles is regarded as L (micrometer) and the minor axis length is regarded as S (micrometer), and the L/S ratio is 1.0 to 3.0. φ This alumina fine particle may be a commercially available alumina fine particle. Examples of commercially available alumina fine particles include Sumikorandom manufactured by Sumitomo Chemical Co., Ltd. Further, a commercially available product (e.g., oxidized fine granules produced by Showa Denko K.K. or alumina fine granules produced by Nippon Light Metal Co., Ltd.) can be used as the component (D). When the resin composition of the present invention contains the component (D) in addition to the components (A) to (C), the component (D) is used in an amount of 5 to 250 based on 100 parts by weight of the component (A). The parts by weight are preferably from 1 to 200 parts by weight, more preferably from 20 to 150 parts by weight. -23- 200925200 When the amount of the component (D) is 5 to 250 parts by weight, the advantage is that the heat conductivity is excellent, and the moldability is not significantly impaired. As described above, the resin composition of the present invention contains components (B) and (C), or components (B), (C) and (D), and component (A), and provides good thermal conductivity. Molded items. Molded articles can be made by a variety of known methods. Examples of the method include extrusion molding, injection molding, pressure molding, and blow molding. Further, in the molding composition of the present invention, one type or a plurality of conventional additives may be added and used in the range of not impairing the desired effects of the present invention, including "including a pigment (for example, glass fiber), a fluororesin, and a detachment. Molding agents (eg, metal soaps), colorants (eg, dyes and pigments), antioxidants, thermal stabilizers, UV absorbers, antistatic agents, surfactants, and the like. In addition, one type or more substances with external lubrication can be added, such as high carbon fatty acids, high carbon fatty acid esters, high carbon fatty acid metal salts, and fluorinated carbon based surfactants. © The method for producing the insulating resin composition of the present invention is not particularly limited, and examples thereof include a method of combining the components (A) to (C), or using a Henschel mixer, a rotary machine or the like to mix the components (A) to (D), followed by melt kneading using an extruder. Further, 'examples include a method of melt-kneading by an extruder, component (A) is charged from the first charge, and after the other components are mixed using a Henschel mixer, a pusher or the like, they are fed from the side feed, And melted and kneaded. The resin composition thus obtained can be appropriately molded depending on the shape of the target part, but it is preferably injection molding. As for the molded article obtained by injection molding -24-200925200, a molded article having a complicated shape such as a thin-walled member can be obtained. The molded article obtained in the foregoing manner may be a molded article having a dielectric constant of 1 〇 12 ohm meters or higher and a dielectric breakdown voltage of 1 mm thick of 2 kV/mm or higher. The molded article has a high thermal conductivity, and even if it is a low resistivity material represented by the component (C), it has excellent electrical insulation and sufficient dielectric disintegration as power and electronic parts. Voltage, so it is very useful in applications related to this part. Further, after a molded article having a size of 64 mm x 64 mm χ 3 mm thick was obtained from the insulating resin composition of the present invention, the resistivity of the molded article was measured in accordance with ASTM D257. Further, after a molded article having a size of 64 mm χ 64 mm x 1 mm thick was obtained from the insulating resin composition of the present invention, the disintegration voltage of the molded article was measured in accordance with the short-term disintegration test described in JIS C2110. As for the preferred φ of the molded article obtained from the resin composition of the present invention, the following applications can be exemplified. With regard to the application of molded articles obtained from the insulating resin composition of the present invention, suitable applications include housings for electric power and electronic devices, and electric equipment (eg, generators, motors, transformers, alternators, Parts of voltage regulators, rectifiers, inverters, repeaters, power interfaces, switches, circuit breakers, blade switches, poles, power boxes, sockets, relay boxes. In addition, it is suitable for electronic components that generate heat during operation, such as detectors, LED lamps, lamp holders, lamp reflector lamps, lampshades, connectors, small-sized switches, coil shafts, capacitors, oscillators, and various terminals - 25- 200925200, transformers, plugs, printed circuit boards, small-sized motors, head mounts, power modules, hard disk drive parts (hard disk drive hubs, actuators, hard disk substrates, etc.), DVD parts (eg, Optical heads, etc.) and computer related parts. In addition, it can be used for encapsulating resins for semiconductor elements, coils, etc., optical parts for optical devices (such as cameras), parts for generating high friction heat (such as roller bearings), and for vehicles and loads. Irradiation components and power component insulation boards for use with related zero φ pieces. The invention has been described herein, and it will be apparent that it can be varied in many ways. Such variations are intended to be included within the spirit and scope of the present invention, and all such modifications as may be apparent to those skilled in the art are included in the scope of the following claims. Japanese Patent Application No. 2007-236374, filed on Sep. 12, 2007, and the Japanese Patent Application No. 2008-122025, filed on May 8, 2008 The scope and details are fully incorporated herein by reference. EXAMPLES The present invention is illustrated by the following examples, which are not intended to limit the scope of the invention. Use the following as component (C). Carbonized sand 1 : OY-3 » Yakushima Denko Co., Ltd. Carbon fiber 1 : D i al e ad K 2 2 3 H G, M i t s u b i s hi P1 a s t i c In c . -26- 200925200 Graphite 1 : CB-150, produced by Nippon Graphite Fiber Corporation. Use the following as component (D). Oxidized ingots 1. Advanced alumina AA-18, manufactured by Sumitomo Chemical Co., Ltd., having a number average particle diameter of 18 μm and an alumina content of 99.6% by weight. Alumina fine particles 2 : Advanced alumina AA-1.5, Sumitomo 0 Chemical Co., Ltd. produced 'number average particle diameter of 1.5 μm, and alumina content of 99.6% by weight. Alumina fine particle 3: L ow-soda alumina ALM-41, Sumitomo Chemical Co., Ltd. produced 'number average particle diameter of 1.5 μm and alumina content of 99.9% by weight. Oxidized ingot 4: Advanced alumina AA-03, Sumitomo Chemical Co., Ltd. produced a number average particle diameter of 0.3 μm and an alumina content of 99.6% by weight.产 Production Example 1 [Method of Preparation of Particulate Material 1] Oxidized Ming Fiber (Denka Alcen, manufactured by Denki Kagaku Kogyo KK, alumina content 100% by weight, number average fiber diameter 3 · 2 μm) overall density 〇 28 g / cm ^ 3 It was put into a Henschel mixer (Super mixer G1 00, Kaw at a MGFC ο., manufactured by L td.), and stirred and granulated to obtain a particulate material 1. The number average particle diameter of the particulate material 1 was measured by an optical microscope to be 1.0 mm. -27- 200925200 Production Example 2 [Production of Liquid Crystal Polyester] In a reactor equipped with a stirring device, a torque meter, a nitrogen-passing tube, a thermometer, and a reflux condenser, 994.5 g (7.2 m) of a pair was placed. Hydroxybenzoic acid, 446.9 g (2.4 mol) of 4,4,-dihydroxybiphenyl, 299.0 g (1.8 mol) of p-nonanoic acid, 99.7 g (0.6 mol) of isophthalic acid and @1347.86 Acetic acid anhydride (13.2 mol) was replaced with nitrogen in the inside of the reactor, and then increased to 150 under a nitrogen stream. (: up to 30 minutes, and re-distilled for 1 hour while maintaining this temperature. Thereafter, increase to 320 ° C for 2 hours and 50 minutes while distilling off the distilled by-product acetic acid and unreacted acetic anhydride, thereby obtaining a pre- Polymer, at which time an increase in torque was observed and this was considered complete. The resulting prepolymer was cooled to room temperature, honed with a coarse honing machine, and then increased from room temperature to 250 ° C for one hour under nitrogen. Then, it was raised to 5 hours from 250 ° C to 285 ° C and maintained at 285 ° C for 3 hours to carry out solid state polymerization. The starting liquid temperature of the obtained liquid crystal polyester was 327 t. The ester is represented by LCP 1. Examples 1 to 7 and Comparative Examples 1 to 4 The particulate material obtained in Production Example 1, the liquid crystal polyester obtained in Production Example 2, and one selected from alumina fine particles 1 to 4 , tantalum nitride 1, carbon fiber 1 or graphite 1 by the composition shown in Table 1, using the same direction of the twin screw extruder (PCM-30, manufactured by Ikegai Iron Works, Ltd.) at -28-200925200 340 ° C kneading and granulation. Using an injection machine (PS40E5ASE, manufactured by Nissei Plastic Industrial Co., Ltd.) The obtained granules were injection-molded at a cylinder temperature of 3 50 ° C and a mold temperature of 130 ° C to obtain a molded article 1: 126 mm x 12 mm x 6 mm, molded article 2: 64 mm X 64 mm X 3 mm thick, mold Plastic article 3: 64 mm χ 64 mm x 1 mm thick. A plate (MD) having a thickness of 1 mm was cut in a direction perpendicular to the major axis of the molded article 1 as a sample for thermal conductivity evaluation. This sample was used for laser irradiation. The thermal constant measurement device (TC-7000, manufactured by Ulvac-Riko Inc.) of the flash U-ray method was used to measure the thermal diffusivity of these samples, and the specific heat was measured by DSC (DSC7, PERKINELMER Japan C 〇·, Lt d · manufactured). The specific gravity was measured by an automatic specific gravity measuring device (ASG-320K, Kanto-measure Co., Ltd.) The thermal conductivity of the sample was obtained by thermal diffusivity x specific gravity of heat X. Using molded article 2, determined according to ASTM D257 Resistivity of 300 K. Using dielectric article 3, the dielectric breakdown voltage was measured according to the short-term collapse test described in JIS C2110. @ The results are shown in Table 1. -29- 200925200 ο £ ο Comparative Example 4 § ^ (N 3_0χ109 ο Comparative Example 3 § δ 23.9 m τ·^ 1 Comparative Example 2 1 2 ^ rH rn 3.0x10 ° 00 (NL Comparative Example 1I 〇m O - (N 1 - Η (Ν 11.ΟχΙΟ10) oo o Μ O _4. 22 - Ο ν〇1 3.0χ10131 o ri Instance 6 ι&gt;σ&lt; 1 6.0x1 ο12 1 o Example 5 §2 s ^ 〇〇σν 11.0x10° 1 v〇ro Example 4 §g ^ ^ ο 00 9.0χ1012 1 m IK inch ΟΝ 1 9·0χ1012 o inch · Example 2 §2 ^ Ο ν〇1 3.0χ10131 o cn Example 1 i 2jqS 00 ΙΟ 1 4.0χ10131 〇o /—N y—N /—V ^ Φ Φ Φ Φ φ A ^ _ oiW^^^WiiliilW φβΙιΐιίΙΦ^^^^ S^^^SlISi _] —粗墨墨墨拍 ft 起翠蘧an An and An and 2藜磐 屯 嘁囍 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热M) -30- 200925200 It is clear from the insulating resin compositions of Examples 1 to 7 that the obtained molded article has a thermal conductivity in the MD direction of 5 W/mK or higher and has excellent thermal conductivity. In addition, the resistivity is 1 〇 2 ohm meters or higher, and is not sufficient as the resistance 値 ' of the insulating components used in power and electronic parts and the dielectric breakdown voltage is 2 kV / mm or higher. This is excellent. In the resin compositions of Comparative Examples 1 and 2 using carbonized tantalum or carbon fibers, the heat conductivity of the obtained molded article was insufficient, and in Comparative Examples 3 and 4 in which a large amount of carbon fiber or graphite was mixed, the obtained molded article was obtained. The resistivity becomes small and the electrical insulation is insufficient. Example 8

聚苯硫酸 PPS1 ( T-3G,Dainippon Ink and Chemicals Inc.生產)、產製例1中得到的微粒材料1、碳纖維1和 氧化銘粒子2藉表2中所示之組成,使用相同方向的雙螺 旋擠壓機(PCM-30,Ikegai Iron Works, Ltd.生產)於 300 〇 °c捏和及粒化。使用射出機(PS40E5 ASE,Nissei Plastic Industrial Co.,Ltd.生產),所得粒狀物於圓筒溫度3 5 0 °C 和模具溫度1 3 0 °C射出模塑,得到模塑物件1 : 1 26毫米χ 12毫米χ6毫米,模塑物件2 : 64毫米χ64毫米x3毫米厚 ,模塑物件3 : 64毫米X64毫米xl毫米厚。在以垂直於模 塑物件1主軸的方向切下厚度1毫米的板(MD),以其 作爲導熱性評估的樣品。使用此樣品,以雷射閃光法的熱 恆定測定設備(TC-7000,Ulvac-Riko Inc.製造)量測這 些樣品的熱擴散率。並以 DSC ( DSC7,PERKINELMER -31 - 200925200Polyphenylene sulfate PPS1 (T-3G, manufactured by Dainippon Ink and Chemicals Inc.), particulate material 1 obtained in Production Example 1, carbon fiber 1 and oxidized mineral particles 2 are represented by the composition shown in Table 2, using the same direction of the double A screw extruder (PCM-30, manufactured by Ikegai Iron Works, Ltd.) was kneaded and granulated at 300 °C. Using an injection machine (PS40E5 ASE, manufactured by Nissei Plastic Industrial Co., Ltd.), the obtained granules were injection-molded at a cylinder temperature of 305 ° C and a mold temperature of 130 ° C to obtain a molded article 1 : 1 26 mm χ 12 mm χ 6 mm, molded object 2: 64 mm χ 64 mm x 3 mm thick, molded article 3: 64 mm X 64 mm x 1 mm thick. A plate (MD) having a thickness of 1 mm was cut in a direction perpendicular to the major axis of the molded article 1 as a sample for thermal conductivity evaluation. Using this sample, the thermal diffusivity of these samples was measured by a thermal constant measuring apparatus (TC-7000, manufactured by Ulvac-Riko Inc.) of a laser flash method. And by DSC (DSC7, PERKINELMER -31 - 200925200

Japan Co.,Ltd.製造)量測比熱,以自動比重量測設備( ASG-320K,Kanto-measure Co.,Ltd.)量測比重。樣品的 導熱率係熱擴散率X比熱X比重而得。 使用模塑物件2,根據ASTMD257,測定300K的電 阻率。使用模塑物件3,根據JIS C21 10中描述的短期瓦 解試驗測定介電瓦解電壓。 其結果示於表2。 〇 表2 實例8 PPS1 (重量份) 100 粒狀材料1 (重量份) 190 碳纖維1 (重量份) 17 氧化鋁細粒2 (重量份) 27 導熱率(MD)(瓦/米K) 6.2 電阻率(歐姆米) Ι.ΟχΙΟ13 介電瓦解電壓(千伏特/毫米) 2.0 〇Japan Co., Ltd. manufactured by measuring the specific heat, and measuring the specific gravity by an automatic specific weight measuring device (ASG-320K, Kanto-measure Co., Ltd.). The thermal conductivity of the sample is obtained by the thermal diffusivity X being greater than the thermal X specific gravity. Using a molded article 2, a resistivity of 300 K was measured in accordance with ASTM D257. Using the molded article 3, the dielectric collapse voltage was measured in accordance with the short-term collapse test described in JIS C21 10. The results are shown in Table 2. 〇 Table 2 Example 8 PPS1 (parts by weight) 100 Particulate material 1 (parts by weight) 190 Carbon fiber 1 (parts by weight) 17 Alumina fine particles 2 (parts by weight) 27 Thermal conductivity (MD) (Watts per meter K) 6.2 Resistance Rate (ohm meters) Ι.ΟχΙΟ13 Dielectric breakdown voltage (kV/mm) 2.0 〇

由使用聚苯硫醚作爲組份(A )的實例8之絕緣樹脂 組成物可清楚看出’所得模塑物件的導熱率爲5瓦/米K 或較高’具有極佳的導熱性,且亦具有良好的電阻率和介 電瓦解電壓結果。 -32-It is clear from the insulating resin composition of Example 8 using polyphenylene sulfide as the component (A) that the obtained molded article has a thermal conductivity of 5 W/mK or higher and has excellent thermal conductivity, and It also has good resistivity and dielectric breakdown voltage results. -32-

Claims (1)

200925200 十、申請專利範圍 1 · 一種樹脂組成物包含: (A )熱塑性樹脂; (B) 粒狀材料,其數均粒子直徑爲〇.5至5毫米且 可藉由將主要具有數均纖維直徑爲1至5〇微米的氧化鋁 之纖維加以粒化而得;和 (C) 塡料,其由3〇〇κ的電阻率爲1〇2歐姆米或較低 D 的材料所構成。 2.如申請專利範圍第1項之樹脂組成物,其中以1 〇〇 重量份組份(A )計,組份(C )在組成物中之含量由1至 5 〇重量份。 3 ·如申請專利範圍第1項之樹脂組成物,其中組份 (C)係塡料’其選自碳化矽所構成的塡料、由石墨所構 成的塡料或碳纖維塡料。 4 ·如申請專利範圍第1項之樹脂組成物,其中組份 Ο (B)爲可藉由將主要具有整體密度爲0.2至1克/立方 公分的氧化鋁之纖維加以粒化而得粒狀材料。 5 ·如申請專利範圍第1項之樹脂組成物,其中組份 (B)係可藉由在攪拌時將主要具有氧化鋁的纖維加以粒 化而得的粒狀材料。 6.如申請專利範圍第1項之樹脂組成物,其中以100 重量份組份(A )計,組份(b )在組成物中之含量由10 至4 0 〇重量份。 7 ·如申請專利範圍第1項之樹脂組成物,其中組份 -33- 200925200 (A )包含聚苯硫。 8. 如申請專利範圍第1項之樹脂組成物,其中組份 (A)包含液晶聚酯。 9. 如申請專利範圍第8項之樹脂組成物,其中液晶 聚酯爲開始流動溫度爲2 80°C或較高的液晶聚酯。 10. 如申請專利範圍第8或9項之樹脂組成物,其中 液晶聚酯爲下列液晶聚酯: φ 以液晶聚酯的總結構單元計,衍生自對-羥基苯甲酸 的結構單元和衍生自2 -羥基-6-萘酸的結構單元的總和爲 3 〇至8 0莫耳% ; 以液晶聚酯的總結構單元計,衍生自氫醌的結構單元 和衍生自4,4,-二羥基聯苯的結構單元的總和爲10至35 莫耳% ;和 以液晶聚酯的總結構單元計’衍生自對酞酸的結構單 元、衍生自異酞酸的結構單元和衍生自2,6-萘二殘酸的結 〇 構單元的總和爲1 0至3 5莫耳%。 1 1 .如申請專利範圍第1項之樹脂組成物’其中進一 步包含(D)數均粒子直徑爲〇·1至100微米的氧化鋁細 粒。 12.如申請專利範圍第1 1或1 2項之樹脂組成物’其 中以1 0 0重量份組份(A )計’組份(D )之含量由5至 2 5 0重量份。 1 3 . —種模塑物件,其藉由模塑申請專利範圍第1項 之組成物而得。 -34- 200925200 1 4 .如申請專利範圍第1 3項之模塑物件,其中模塑 物件的300K的電阻率爲1012歐姆米或較高,且1毫米厚 的介電瓦解電壓爲2千伏特/毫米或較高。200925200 X. Patent Application No. 1 · A resin composition comprising: (A) a thermoplastic resin; (B) a granular material having a number average particle diameter of 〇.5 to 5 mm and which may have a number average fiber diameter It is obtained by granulating fibers of alumina of 1 to 5 micrometers; and (C) pigment, which is composed of a material having a resistivity of 1 〇 2 ohm meters or lower D of 3 Å. 2. The resin composition of claim 1, wherein the component (C) is contained in the composition in an amount of from 1 to 5 parts by weight based on 1 part by weight of the component (A). 3. The resin composition of claim 1, wherein the component (C) is a material selected from the group consisting of tantalum carbide, tantalum or carbon fiber pigment. 4. The resin composition of claim 1, wherein the component Ο (B) is granulated by granulating fibers mainly having an overall density of 0.2 to 1 g/cm 3 of alumina. material. 5. The resin composition of claim 1, wherein the component (B) is a granular material obtained by granulating a fiber mainly having alumina while stirring. 6. The resin composition of claim 1, wherein the component (b) is contained in the composition in an amount of from 10 to 40 parts by weight based on 100 parts by weight of the component (A). 7 · The resin composition of claim 1 of the patent scope, wherein component -33- 200925200 (A) comprises polyphenylene sulfide. 8. The resin composition of claim 1, wherein component (A) comprises a liquid crystal polyester. 9. The resin composition of claim 8, wherein the liquid crystal polyester is a liquid crystal polyester having a starting temperature of 2 80 ° C or higher. 10. The resin composition of claim 8 or 9, wherein the liquid crystal polyester is the following liquid crystal polyester: φ is derived from the total structural unit of the liquid crystal polyester, derived from a structural unit of p-hydroxybenzoic acid and derived from The sum of the structural units of 2-hydroxy-6-naphthoic acid is from 3 8 to 80% by mole; based on the total structural unit of the liquid crystal polyester, the structural unit derived from hydroquinone and derived from 4,4,-dihydroxyl The sum of the structural units of biphenyl is 10 to 35 mol%; and the structural unit derived from citric acid, the structural unit derived from isodecanoic acid, and the derived from 2,6-, based on the total structural unit of the liquid crystal polyester. The sum of the knotted units of the naphthalene diacid is from 10 to 35 mol%. 1 1. A resin composition as claimed in claim 1 which further comprises (D) alumina fine particles having a number average particle diameter of from 1 to 100 μm. 12. The resin composition of claim 1 or 1 wherein the content of component (D) is from 5 to 250 parts by weight based on 100 parts by weight of component (A). A molded article obtained by molding the composition of claim 1 of the patent application. -34- 200925200 1 4. The molded article of claim 13 wherein the molded article has a resistivity of 1012 ohm meters or higher and a dielectric fracture voltage of 1 millivolt is 1 kilovolt. /mm or higher. -35- 200925200 七 明 說 單 簡 號 為符 圖件 表元 代之 定圖 指表 :案代 圖本本 表' ' 代} } 定一二 指 /IV /|\ 無 無 0 八、本案若有化學式時,請揭示最能顯示發明特徵的化學 式:無 ❹ -4--35- 200925200 七明说单单单为符图表表代定图指表:案代图本本表' '代代} } 定一指/IV /|\ 无无0 八, this case if there is a chemical formula When revealing the chemical formula that best shows the characteristics of the invention: no ❹ -4-
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