2twf.doc/n 200935621 九、發明說明·· 【發明所屬之技術領域】 本發明是有關於一種發光二極體（Light Emitting2twf.doc/n 200935621 IX. Inventive Description·· Technical Field of the Invention The present invention relates to a light emitting diode (Light Emitting)
Diode，LED)封裝結構與發光二極體封裝方法，且特別是有 關於一種具有高可撓性的發光二極體封裝結構與發光二極 體封裝方法。 【先前技術】 ❿由於發光二極體的發光效率不斷提升，使得發光二極 體在某些領域已漸漸取代日光燈與白熾燈泡，例如需要高 速反應的掃描器燈源、液晶顯示器的背光源或前光源、汽 車的儀表板照明、交通號誌燈以及一般的照明裝置等。發 光二極體與傳統燈泡相較之下具有絕對的優勢，例如體積 小、壽命長、低電壓/電流驅動、不易破裂、不含水銀(沒 有污染問題)以及發光效率佳(省電）等特性。 圖1為一習知發光二極體封裴結構配置於印刷電路板 上的剖示圖。請參照圖1，在現有技術中，發光二極體晶 ❹ 片U0會先被固定在一導線架120的晶片座122上。接著， 以打線方式利用金線130將晶片11〇與導線架120的引腳 124電性連接。然後，再利用封裝膠體ι4〇將晶片11〇、晶 片座122、金線130與引腳124的部分區域封住，但露出 引腳124的其他部分。如此，即完成習知的發光二極體封 裝結構100。在某些應用領域中，通常需要將多個發光二 極體封裝結構100配置於同一個印刷電路板5〇上，以提供 足夠的照明亮度。 200935621 2twf.doc/n 然而’這意味著必需進行另一道製程，以將 體封裝結構100的引腳124與印刷電路板50雷 僅費時也費工。而且…般印刷電路板5()是 ’不 無法與非平©的物件貼合。另外，發光二極m 乂 組裝至印刷電路板50後，還有存放不易的裝、'、。構刚 【發明内容】 Ο 技術=二光: 時間提供—種發光二鋪封裝枝，適於減少製程 本發明提出-種發光二極體封裝結 路板、一保護片、至少—發光二極體晶二==電 :方軟::路γϊ有一線路層。保護片配置於軟‘電路i 並與線===性電路板與保護片之間， 遵片之間。此發光二極體封裝結構具有高可撓性。…、 -門=發光二極體封裝結構的一實謝，更包括至少 間隙物(spacer)，配置於軟性電路板與保護片之間。 廳ί此發光二極體封裝結構的—實施射，更包括-黏 ‘配晉膜’其中黏膠層與發光二極體晶 路板的不同面，且黏膠層配置於離形膜與 光材在職結構的—實施财，更包括一鱗 材酉己置於軟性電路板與保護片之間，且覆蓋發光^ 6 2twf.doc/n 200935621 體晶片。 在此發光二極體封裝結構的—實施例中，更包括一導 熱材，其中發光二極體晶片具有相對的一主動面與一背 面，線路層具有一散熱線路，導熱材配置於晶片的背面與 散熱線路之間。此外，導熱材可為銀膠。 在此發光二極體封裝結構的一實施例中，更包括多條 導線，電性連接於發光二極體晶片與線路層之間。Diode, LED) package structure and light-emitting diode package method, and in particular, a light-emitting diode package structure and a light-emitting diode package method with high flexibility. [Prior Art] ❿ Due to the increasing luminous efficiency of light-emitting diodes, light-emitting diodes have gradually replaced fluorescent lamps and incandescent light bulbs in some fields, such as scanner light sources requiring high-speed response, backlights of liquid crystal displays, or front Light source, dashboard lighting for cars, traffic lights, and general lighting. Light-emitting diodes have absolute advantages over traditional light bulbs, such as small size, long life, low voltage/current drive, non-breaking, no mercury (no pollution), and good luminous efficiency (power saving). . BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing a conventional light emitting diode package structure disposed on a printed circuit board. Referring to FIG. 1, in the prior art, the LED wafer U0 is first fixed on the wafer holder 122 of the lead frame 120. Next, the wafer 11A is electrically connected to the leads 124 of the lead frame 120 by wire bonding. Then, a portion of the wafer 11A, the wafer holder 122, the gold wire 130, and the pin 124 are sealed by the encapsulant ι4, but the other portions of the pin 124 are exposed. Thus, the conventional light emitting diode package structure 100 is completed. In some fields of application, it is often desirable to have a plurality of LED packages 100 disposed on the same printed circuit board 5 to provide sufficient illumination. 200935621 2twf.doc/n However, this means that another process is necessary to take the pins 124 of the package 100 and the printed circuit board 50, which is time consuming and labor intensive. Moreover, the printed circuit board 5() is ‘not incompatible with the non-flat object. In addition, after the light-emitting diodes 乂 are assembled to the printed circuit board 50, there is also a storage that is difficult to store.刚刚[Inventive content] Ο Technology = two light: time supply - a kind of light-emitting two-package package, suitable for reducing the process proposed by the invention - a light-emitting diode package junction board, a protective sheet, at least - a light-emitting diode Jing 2 == Electricity: Fang soft:: The road γ ϊ has a circuit layer. The protection sheet is placed between the soft 'circuit i and the line=== between the circuit board and the protection sheet, between the slices. The light emitting diode package structure has high flexibility. ..., - Gate = a light-emitting diode package structure, further including at least a spacer disposed between the flexible circuit board and the protective sheet. Hall ί This LED package structure - the implementation of the shot, including - adhesive 'with the film" in which the adhesive layer and the light-emitting diode plate different surface, and the adhesive layer is placed in the film and light In-service structure-implementation, including a scale material has been placed between the flexible circuit board and the protective sheet, and covered with light ^ 6 2twf.doc / n 200935621 body wafer. In an embodiment of the LED package structure, the method further includes a heat conductive material, wherein the light emitting diode chip has an opposite active surface and a back surface, the circuit layer has a heat dissipation line, and the heat conductive material is disposed on the back surface of the wafer. Between the heat sink and the heat sink. In addition, the heat conductive material may be silver glue. In an embodiment of the LED package structure, a plurality of wires are further electrically connected between the LED chip and the circuit layer.
在此發光二極體封裝結構的一實施例中，更包括多個 凸塊(bump) ’電性連接於發光二極體晶片與線路層之間。 在此發光二極體封裝結構的一實施例中，更包括至少 條導線與至少—凸塊’電性連接於發光二極體晶片斑 路層之間。 μ 在此發光二極體封裝結構的一實施例中，軟性填充料 包括矽膠(silicone)或環氧樹脂(ep〇xy resin)。 、 ♦本發明的發光二極體封裝方法包括下列步驟。配置一 發光二極體晶片於—軟性電路板上，並將發光二極體 電路板的一線路層電性連接。配置一軟性填充‘於 路板上’其中軟性填充料覆蓋發光二極體。配置一 晶片封合於軟性電路板與保護真充枓與發光二極體 間隙物於軟性電路板上 牛驟^ 赌縣妓的—實補+，更包括下列 步驟。配置—师層於軟性電路板上，其中黏谬層 殖右Ϊ此發光二極體封裝方法的—實施例中，在配置軟性 填充料之前，更包括配置至少 置軟性 7 之tw£doc/n 200935621 面。覆蓋一離形膜於 配置於軟性電路板的不同 極體盘纽封裝方法的—實施射，在將發光二 括配^ m2連接之後與配置軟性填紐之前，更包 括酉n紐於軟性電路板上μ蓋發光二極體晶片。In an embodiment of the LED package structure, a plurality of bumps are electrically connected between the LED chip and the circuit layer. In an embodiment of the LED package structure, at least one of the wires and the at least bumps are electrically connected between the LED chip layer layers. In one embodiment of the light emitting diode package structure, the soft filler comprises silicone or epoxy resin. ♦ The light emitting diode packaging method of the present invention comprises the following steps. A light-emitting diode chip is disposed on the flexible circuit board, and a circuit layer of the light-emitting diode circuit board is electrically connected. A soft fill is placed on the 'on-board' where the soft fill material covers the light-emitting diode. Configuring a wafer to be sealed on a flexible circuit board and protecting the true charge and light-emitting diodes on the flexible circuit board. The following steps are included. Configuration—the layer is on the flexible circuit board, where the adhesive layer is stacked on the right side of the LED package method—in the embodiment, before configuring the soft filler, the configuration includes at least the softness 7 tw£doc/n 200935621 face. Covering a release film in a different polar body package method disposed on a flexible circuit board, the implementation of the method, after the connection of the light-emitting diodes and the configuration of the soft-filled, further includes a flexible circuit board The upper cover covers the LED chip.
曰>5且L發ΐ二極體封裝方法的一實施例中，發光二極體 片之2▲動面與—背面。在配置發光二極體晶 :L括配置—導熱材於線路層的—散熱線路上。 熱、二=極體晶片之後，導熱材位於晶片的背面與散 在此發光二極體封裝方法的—實施例中，發光二極體 曰曰片是藉由多條導線電性連接於線路層。 曰，此發光二極體封裝方法的一實施例中，發光二極體 曰曰片是藉由多個凸塊電性連接於線路層。 曰，此發光一極體封裝方法的一實施例中，發光二極體 疋藉由至少一條導線與至少一凸塊電性連接於線路 層。 综上所述，本發明之發光二極體封裝結構與發光二極 封裝方法具有組裝製程簡化、成本低廉、產品可撓性高 且容易存放的優點。 為讓本發明之上述和其特徵和優點能更明顯易懂，下 =特舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖2為本發明一實施例之發光二極體封裝結構的局部 8 200935621 2twf.doc/n 〇In one embodiment of the 曰>5 and L-pin diode packaging method, the 2 ▲ moving surface and the back surface of the LED sheet are used. In the configuration of the light-emitting diode crystal: L includes the configuration - the heat-conducting material on the wiring layer - the heat-dissipating line. After the heat, the two-pole wafer, the heat-conducting material is located on the back side of the wafer and in the embodiment of the light-emitting diode package method, the light-emitting diode chip is electrically connected to the circuit layer by a plurality of wires. In an embodiment of the LED package method, the LED is electrically connected to the circuit layer by a plurality of bumps. In one embodiment of the method for packaging a light-emitting body, the light-emitting diode is electrically connected to the wiring layer by at least one wire and at least one bump. In summary, the LED package structure and the LED package method of the present invention have the advantages of simplified assembly process, low cost, high product flexibility, and easy storage. The above and other features and advantages of the present invention will become more apparent and understood. Embodiment 2 FIG. 2 is a partial view of a light emitting diode package structure according to an embodiment of the present invention. 8 200935621 2twf.doc/n 〇
剖視圖。請參照圖2，本實施例之發光二極體封裝結構200 包括一軟性電路板210、一保護片220、至少一發光二極體 晶片230以及一軟性填充料240。本實施例中發光二極體 晶片230的數量以三個為例，但也可更多或更少。軟性電 路板210具有一線路層212。保護片22〇配置於軟性電路 板210上方。發光二極體晶片配置於軟性電路板21〇 與保護片220之間，並與線路層212電性連接。軟性填充 料240填充於軟性電路板21〇與保護片220之間。保護片 220與軟性填充料240可選用透明材質。 請參照圖1，習知技術中發光二極體晶片11〇需先打 線接合於導線架11〇，再以封裝膠體14〇密封，最後才組 裝至印刷電路板5G上ϋ請參照圖2，在本實施例之 發光一極體封裝結構2〇〇中，發光二極體晶片23〇是直接 組裝至軟性電路板21G上，再利用保護片22()與軟性填充 料240將發光二極體晶片230密封。因此，本實施例之發 光二極體職結構200她於f知技術具錢 點，並可節省製程成本。 ，1的習知發光二極體封裝結構觸採用不可挽曲的 ί7 '路板50而無法與非平面的物件貼合。人 :將：刷電路板5〇更換為軟性電路板以解決前述問題。缺 二由於軟性電路板與堅硬且有稜 二=接、 觸時極容綱力_财犧，目=== ⑽_的方式存放:同時，發^ -體封裝、、，。構200的主要構件如軟性電路板训、保護 2twf.doc/n 200935621 片220及軟性填充料240都具有高可撓性，故可將發光二 極體封裝結構200捲曲而易於成捆存放。當發光二極體封 裝結構200要貼合在非平面的物件上時，也可輕易獲得極 佳的貼合度。此外，由於貼合度較佳，故發光二極體封裝 結構200與散熱器（未繪示）貼合時可獲得較高的熱傳導 率。 舉例而言，軟性電路板210的線路層212可形成在一 基材214上’且線路層212的局部區域可由一焊罩層（s〇lder mask)(未繪示）覆蓋。其中，基材214的材質例如是聚脂 樹脂(mylar)或聚酿亞胺(p〇iyjmide)。線路層212除了用於 傳導電訊號的線路以外，還可包括用於導熱的散熱線路 212a。此時，可將發光二極體晶片23〇放置於散熱線路以仏 上，以藉由散熱線路212a快速將熱量導出。 本實施例中’發光二極體晶片230具有相對的一主動 面232與一背面234，亦即主動面232上具有電極（未繪 示），而背面234上則沒有電極。當然，發光二極體晶片 230的兩個表面上也有可能都有電極。發光二極體晶片 例如是採用打接合技術而以導線250電性連接至線路層 212。但是’發光二極體晶片23〇也可採用覆晶接合技術而 以凸塊（未繪示）電性連接至線路層212。或者，發光二 極體晶片230也可同時利用凸塊技術（Bumping)，如： 導線與凸塊或其他適當技術而電性連接至線路層212。另 外’也可在發光二極體晶片230的背面234與散熱線路 212a之間配置一導熱材26〇’以加強熱傳導率。導熱材260 200935621 2twf.d〇c/n 例如是銀膠或其他適當導熱材。 虽發光二極體晶片230所發出的光線是紫外光或其他 非最終所需的光線時，可配置一燐光材27〇於軟性電^板 210與保護片22〇之間，且覆蓋發光二極體晶片23〇。燐光 材的作用疋將發光二極體晶片230所發出的光線轉換 為最終所需的光線，因此燐光材270的選擇是以可搭配發 光一極體晶片230為原則。此外，軟性填充料240可以是 〇 石夕膠 、環氧樹脂或其他適當材料。 另外’發光二極體封裝結構200也可更包括至少一間 隙物280 ’配置於軟性電路板21〇與保護片220之間，以 利用硬度較大的間隙物280進一步維持軟性電路板21〇與 保護片220之間的適當間距。 再者’發光二極體封裝結構200還可包括一黏膠層290 與—離形膜295。黏膠層290與發光二極體晶片230分別 配置於軟性電路板21〇的不同面上，且黏膠層290配置於 ❾ 離形膜295與軟性電路板210之間。藉此，發光二極體封 裝結構200可利用黏膠層29〇而輕易貼合在任意物件上， 在施工方面具有極佳的便利性，也便於增減發光二極體封 裳結構200所覆蓋的面積。黏膠層29〇的材質還可選用附 加有導熱及防水功能的材質。離形膜295則用於在貼合發 光二極體封裝結構200之前覆蓋黏膠層290，以方便存放 發光二極體封裝結構200。 圖3為本發明一實施例的發光二極體封裝方法的流程 圖。請參照圖2與圖3，本實施例的發光二極體封裝方法 11 200935621 2twf.doc/n 是先配置間隙物280於軟性電路板21〇上，步驟sn〇。間 隙物28G可以是多個構件，或製作為網狀的單一構件以方 便施工。接I，在軟性電路板210的線路層212的散熱線 路212a的局部區域上配置導熱材26〇，步驟si2〇。當然’ 也可將導熱材260先配置於發光二極體晶片23()的背面 234。然後’將發光二極體晶片23〇以背面234朝向軟性電 路板210的方式配置於軟性電路板21〇上的導熱材· ❹ 上’步驟_。之後’將發光二極體晶片230與軟性電路 〇的線路層212電性連接，步驟sl4〇。本實施例中， 是採用打接合技術—導線⑽電性連接發光二極體晶片 230與線路層212 ’但也可以採用覆晶接合技術而以凸塊， 如球型凸塊（未緣不）電性連接發光二極體晶片23〇盘線 路層212,或同時利用導線與凸塊或其他適當技術而^性 連接發光一極體晶片230與線路層212。 接著，配置燐光材270於軟性電路板21〇上且覆蓋發 光二極體晶片230，步驟S15〇。步驟sl5〇的進行與否， ❹ 是根據發光二極體晶片230所提供的光線是否需要進行波 長轉換而決定。職’配置雛填紐於軟性電路板 210上，步驟S16(^軟性填充料24〇覆蓋發光二極體23〇 以及其用於電性連接至軟性電路板21〇的導線25〇或其他 用於電性連接的構件。之後，配置保護片22()於軟性電路 板210上方，以將軟性填充料24〇與發光二極體晶片2孙 封合於軟性電路板210與保護片22〇之間，步驟sl7〇。 另外，還可配置一黏膠層於軟性電路板21〇上， 並覆蓋一離形膜295於黏膠層290上，步驟sl8〇。其中， 12 200935621 ^twf.doc/n 黏膠層290與發光二極體晶片23〇配置於軟性電路板2i〇 的不同面。 本實施例的發光二極體封裝方法並不限定需包括上 述所有步驟，且各步驟的實施順序也可視情況而做調整。 Ο 綜上所述，在本發明之發光二極體封裝結構與發光二 極體封裝方法中’是直接將發光二極體晶片封裝在軟性電 路板與保護片之間，可簡化組裝製程與成本，且發光二極 體，裝結構具有高可撓性而容易存放與使用。另外，可撓 陡问的發光二極體封裝結構搭配散熱器時，具有更快的熱 =導率。當增加黏膠層於發光二極體封裝結構的表面時丁 還可增進施工效率。 雖然本發明已以較佳實施例揭露如上，然其 :定本發明，任何所屬技術領域中具有通常知 離本發明之精神和範圍内，當可作些許之更動與潤飾， 此本發明之保護範圍當視後附之申請專利範圍所界定者 準。 【圖式簡單說明】 圖1為一習知發光二極體封裝結構配置於印刷電路板 上的剖示圖。 圖2為本發明一實施例之發光二極體封裝結構的局部 σ J現圖。 圖。圖3為本發明一實施例的發光二極體封裝方法的流程 【主要元件符號說明】 50 :印刷電路板 13 200935621 .«.tNvf.doc/ii loo :發光二極體封裝結構 lio :發光二極體晶片 120 :導線架 122 :晶片座 124 :引腳 130 :金線 140 :封裝膠體 200 :發光二極體封裝結構 210 :軟性電路板 212 :線路層 212a :散熱線路 214 :基材 220 :保護片 230 :發光二極體晶片 232 :主動面 234 :背面 240 :軟性填充料 250 :導線 260 :導熱材 270 :燐光材 280 :間隙物 290 :黏膠層 295 :離形膜 S110〜S180 :步驟Cutaway view. Referring to FIG. 2, the LED package structure 200 of the present embodiment includes a flexible circuit board 210, a protection sheet 220, at least one LED chip 230, and a soft filler 240. The number of the light-emitting diode wafers 230 in this embodiment is exemplified by three, but may be more or less. The flexible circuit board 210 has a wiring layer 212. The protective sheet 22 is disposed above the flexible circuit board 210. The LED chip is disposed between the flexible circuit board 21A and the protection sheet 220, and is electrically connected to the circuit layer 212. The soft filler 240 is filled between the flexible circuit board 21A and the protective sheet 220. The protective sheet 220 and the soft filler 240 may be made of a transparent material. Referring to FIG. 1 , in the prior art, the LED chip 11 needs to be wire bonded to the lead frame 11 , and then sealed by the encapsulant 14 , and finally assembled to the printed circuit board 5G. Referring to FIG. 2 , In the light-emitting diode package structure of the embodiment, the light-emitting diode chip 23 is directly assembled to the flexible circuit board 21G, and the light-emitting diode wafer is further processed by the protective sheet 22 () and the soft filler 240. 230 sealed. Therefore, the light-emitting diode structure 200 of the present embodiment has a wealth of points and can save process costs. The conventional light-emitting diode package structure of 1 uses an irrevocable ί7 'way board 50 and cannot be attached to non-planar objects. Person: Replace the brush circuit board 5〇 with a flexible circuit board to solve the aforementioned problems. The second is due to the soft circuit board and the hard and ribbed two = connection, the touch time is extremely capacity _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The main components of the structure 200, such as the flexible circuit board training, the protection 2twf.doc/n 200935621 sheet 220 and the soft filler 240 are all highly flexible, so that the LED package structure 200 can be curled and easily stored in bundles. When the light-emitting diode package structure 200 is to be attached to a non-planar object, an excellent fit can be easily obtained. In addition, since the bonding degree is better, the LED package structure 200 can be attached to a heat sink (not shown) to obtain a higher thermal conductivity. For example, the circuit layer 212 of the flexible circuit board 210 can be formed on a substrate 214' and a portion of the circuit layer 212 can be covered by a solder mask (not shown). The material of the substrate 214 is, for example, a polyester resin (mylar) or a polyacrylamide (p〇iyjmide). The circuit layer 212 may include a heat dissipation line 212a for conducting heat in addition to the line for conducting electrical signals. At this time, the light-emitting diode chip 23 can be placed on the heat-dissipating line to be quickly discharged by the heat-dissipating line 212a. In the present embodiment, the LED array 230 has an opposite active surface 232 and a back surface 234, that is, the active surface 232 has electrodes (not shown), and the back surface 234 has no electrodes. Of course, electrodes may also be present on both surfaces of the LED wafer 230. The light-emitting diode wafer is electrically connected to the wiring layer 212 by a wire 250, for example, by a bonding technique. However, the light-emitting diode wafer 23 can also be electrically connected to the wiring layer 212 by bumps (not shown) by flip chip bonding. Alternatively, the LED chip 230 can be electrically connected to the wiring layer 212 using bumping techniques such as wires and bumps or other suitable techniques. Alternatively, a heat transfer material 26'' may be disposed between the back surface 234 of the light-emitting diode wafer 230 and the heat dissipation line 212a to enhance the thermal conductivity. The heat conductive material 260 200935621 2twf.d〇c/n is, for example, silver glue or other suitable heat conductive material. Although the light emitted by the LED chip 230 is ultraviolet light or other non-final desired light, a phosphor 27 can be disposed between the flexible board 210 and the protective sheet 22, and covers the light emitting diode. The body wafer 23 is. The action of the bismuth material 转换 converts the light emitted by the illuminating diode 230 into the final desired light. Therefore, the glazing 270 is selected in accordance with the principle of being compatible with the illuminating body wafer 230. Additionally, the soft filler 240 can be a raytail, epoxy or other suitable material. In addition, the LED package structure 200 may further include at least one spacer 280 ′ disposed between the flexible circuit board 21 〇 and the protection sheet 220 to further maintain the flexible circuit board 21 by using the spacer 280 having a relatively high hardness. The proper spacing between the sheets 220 is protected. Furthermore, the light emitting diode package structure 200 may further include an adhesive layer 290 and a release film 295. The adhesive layer 290 and the LED array 230 are disposed on different surfaces of the flexible circuit board 21, respectively, and the adhesive layer 290 is disposed between the ❾ release film 295 and the flexible circuit board 210. Thereby, the LED package structure 200 can be easily attached to any object by using the adhesive layer 29, which has excellent convenience in construction, and is also convenient for increasing or decreasing the coverage of the LED body cover structure 200. Area. The material of the adhesive layer 29〇 can also be selected from materials with heat conduction and waterproof function. The release film 295 is used to cover the adhesive layer 290 before attaching the light-emitting diode package structure 200 to facilitate storage of the LED package structure 200. 3 is a flow chart of a method of packaging a light emitting diode according to an embodiment of the present invention. Referring to FIG. 2 and FIG. 3, the LED package method of the present embodiment 11 200935621 2twf.doc/n is to first arrange the spacer 280 on the flexible circuit board 21, step sn〇. The gap 28G may be a plurality of members or a single member made of a mesh to facilitate construction. Next, the heat transfer material 26 is placed on a portion of the heat dissipation line 212a of the circuit layer 212 of the flexible circuit board 210, step si2. Of course, the heat conductive material 260 may be disposed on the back surface 234 of the light emitting diode chip 23 (). Then, the light-emitting diode chip 23 is placed on the heat-conductive material ❹ on the flexible circuit board 21A so that the back surface 234 faces the flexible circuit board 210. Thereafter, the light-emitting diode chip 230 is electrically connected to the circuit layer 212 of the flexible circuit board, step s14. In this embodiment, the bonding technology is used—the wire (10) is electrically connected to the LED chip 230 and the wiring layer 212', but the flip chip bonding technique may also be used to form a bump, such as a ball bump. The light-emitting diode chip 23 is electrically connected to the circuit board layer 212, or the light-emitting body wafer 230 and the circuit layer 212 are electrically connected by wires and bumps or other suitable techniques. Next, the phosphor 270 is placed on the flexible circuit board 21 and covered with the light-emitting diode wafer 230, step S15. The step sl5 is performed or not, and ❹ is determined according to whether or not the light supplied from the LED chip 230 needs to be wavelength-converted. The job 'configuration is filled on the flexible circuit board 210, step S16 (^ soft filler 24 〇 covers the light-emitting diode 23 〇 and its wire 25 for electrical connection to the flexible circuit board 21 〇 or other Electrically connected components. Thereafter, a protective sheet 22 is disposed over the flexible circuit board 210 to seal the flexible filler 24 and the LED wafer 2 between the flexible circuit board 210 and the protective sheet 22 Step s17. In addition, an adhesive layer may be disposed on the flexible circuit board 21, and a release film 295 is disposed on the adhesive layer 290, step s18. 其中 12 200935621 ^twf.doc/n The adhesive layer 290 and the light-emitting diode chip 23 are disposed on different surfaces of the flexible circuit board 2i. The light-emitting diode packaging method of the embodiment is not limited to include all the above steps, and the implementation sequence of each step is also visible. In the above, in the LED package structure and the LED package method of the present invention, the LED package is directly packaged between the flexible circuit board and the protection sheet. Simplify assembly process and cost, and illuminate The polar body has a high flexibility and is easy to store and use. In addition, the flexible diode package with a heat sink has a faster heat=conductivity. When the adhesive layer is added to the light The surface of the diode package structure can also improve the construction efficiency. Although the invention has been disclosed in the preferred embodiments as described above, it is intended that the invention be within the spirit and scope of the invention, The scope of protection of the present invention is defined by the scope of the appended claims. [FIG. 1] A conventional LED package structure is disposed on a printed circuit. 2 is a cross-sectional view of a light emitting diode package structure according to an embodiment of the invention. Fig. 3 is a flow chart of a method for packaging a light emitting diode according to an embodiment of the invention [mainly Component Symbol Description 50: Printed Circuit Board 13 200935621 .«.tNvf.doc/ii loo: Light Emitting Diode lio: Light Emitting Diode Wafer 120: Lead Frame 122: Wafer Holder 124: Pin 130: Gold Wire 140 : Seal Glue 200: LED package structure 210: flexible circuit board 212: circuit layer 212a: heat dissipation line 214: substrate 220: protection sheet 230: light-emitting diode wafer 232: active surface 234: back surface 240: soft filler 250: wire 260: heat conductive material 270: calender material 280: spacer 290: adhesive layer 295: release film S110~S180: steps