TW200940654A - Thermal conductive silicone lubricating grease composition - Google Patents

Thermal conductive silicone lubricating grease composition Download PDF

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Publication number
TW200940654A
TW200940654A TW098106693A TW98106693A TW200940654A TW 200940654 A TW200940654 A TW 200940654A TW 098106693 A TW098106693 A TW 098106693A TW 98106693 A TW98106693 A TW 98106693A TW 200940654 A TW200940654 A TW 200940654A
Authority
TW
Taiwan
Prior art keywords
thermal conductive
lubricating grease
grease composition
conductive silicone
compound
Prior art date
Application number
TW098106693A
Other languages
Chinese (zh)
Other versions
TWI437049B (en
Inventor
Nobuaki Matsumoto
Kenichi Isobe
Kei Miyoshi
Ikuo Sakurai
Kunihiro Yamada
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200940654A publication Critical patent/TW200940654A/en
Application granted granted Critical
Publication of TWI437049B publication Critical patent/TWI437049B/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M107/00—Lubricating compositions characterised by the base-material being a macromolecular compound
    • C10M107/50—Lubricating compositions characterised by the base-material being a macromolecular compound containing silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
    • B01J23/40—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals of the platinum group metals
    • B01J23/42—Platinum

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lubricants (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention provides a thermal conductive silicone lubricating grease composition. The liquid thermal conductive silicone lubricating grease composition is cured after flowing between a heating body and a heat releasing body so that thermal conductivity can be improved and on the other hand the distribution performance can be kept. The thermal conductive silicone lubricating grease composition of the invention contains the following components: (A) organic polysiloxane having two or more alkenyl groups in every molecule; (B) organic hydrogen polysiloxane represented by the general formula (1); (C) organic hydrogen polysiloxane represented by the general formula (2); (D) thermal conductive filler with thermal conductivity of above 10W/ m degree Celsius; (E) catalyst selected from the group consisting of platinum and platinum compounds; (F) regulator selected from acetylene compound, nitrogen compound, organophosphorus compound, oxime compound and organic chloride compound; and (G) volatile solvent having a boiling point of 80 to 360 degrees Celsius, capable of dispersing or dissolving the foregoing components. The viscosity of the composition at 25 degrees Celsius is between 50 and 1,000 Pa.s.
TW098106693A 2008-03-03 2009-03-02 Thermal conductive silicone grease composition TWI437049B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008051926A JP4656340B2 (en) 2008-03-03 2008-03-03 Thermally conductive silicone grease composition

Publications (2)

Publication Number Publication Date
TW200940654A true TW200940654A (en) 2009-10-01
TWI437049B TWI437049B (en) 2014-05-11

Family

ID=41093565

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098106693A TWI437049B (en) 2008-03-03 2009-03-02 Thermal conductive silicone grease composition

Country Status (4)

Country Link
JP (1) JP4656340B2 (en)
KR (1) KR20090094761A (en)
CN (1) CN101525489A (en)
TW (1) TWI437049B (en)

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CN101880578B (en) * 2010-06-24 2012-11-28 福州三辰新材料有限公司 Grease special for plastic and preparation method thereof
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JP5783128B2 (en) * 2012-04-24 2015-09-24 信越化学工業株式会社 Heat curing type heat conductive silicone grease composition
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JP2015212318A (en) * 2014-05-01 2015-11-26 信越化学工業株式会社 Thermally conductive silicone composition
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WO2018079215A1 (en) 2016-10-31 2018-05-03 東レ・ダウコーニング株式会社 One-pack curable type thermally conductive silicone grease composition and electronic/electrical component
KR102625362B1 (en) * 2017-07-24 2024-01-18 다우 도레이 캄파니 리미티드 Thermal conductive silicone gel composition, thermally conductive member and heat dissipation structure
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
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US11072706B2 (en) * 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
WO2019181713A1 (en) 2018-03-23 2019-09-26 信越化学工業株式会社 Silicone composition
CN112088205B (en) * 2018-04-13 2022-11-08 株式会社Moresco Lubricating oil composition and lubricant using same
JP7476793B2 (en) 2018-10-12 2024-05-01 信越化学工業株式会社 Addition-curable silicone composition and method for producing same
JP6959950B2 (en) 2019-03-04 2021-11-05 信越化学工業株式会社 Non-curable thermally conductive silicone composition
CN110128830A (en) * 2019-03-22 2019-08-16 中国科学院工程热物理研究所 A kind of high thermal conductivity thermal conductive silica gel gasket and preparation method thereof
JP7027368B2 (en) 2019-04-01 2022-03-01 信越化学工業株式会社 Thermally conductive silicone composition, its manufacturing method and semiconductor device
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
KR20220074901A (en) 2019-09-27 2022-06-03 신에쓰 가가꾸 고교 가부시끼가이샤 Thermally conductive silicone composition, manufacturing method thereof, and semiconductor device
JP7325324B2 (en) 2019-12-23 2023-08-14 信越化学工業株式会社 Thermally conductive silicone composition
CN115667406B (en) 2020-05-22 2024-12-03 信越化学工业株式会社 Thermally conductive silicone composition, method for producing the same, and semiconductor device
JPWO2022210782A1 (en) 2021-03-31 2022-10-06
JPWO2022210781A1 (en) 2021-03-31 2022-10-06
JP7644726B2 (en) 2022-01-31 2025-03-12 信越化学工業株式会社 Thermally conductive addition-curable silicone composition and its cured product
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Also Published As

Publication number Publication date
JP4656340B2 (en) 2011-03-23
TWI437049B (en) 2014-05-11
JP2009209230A (en) 2009-09-17
CN101525489A (en) 2009-09-09
KR20090094761A (en) 2009-09-08

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