200945480 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種軟性基板的載台（handling substrate)，且特別有關於一種可撓式顯示器的製造方法。 【先前技術】 以軟性基板取代玻璃基板製作顯示器已成為下世代顯 示器發展的趨勢。為因應軟性基板導入製程所造成的問 φ題，除了設計適用軟性基板的設備外，就降低設備成本而 言，可利用載台來支撐軟性基板，並以現有設備進行製程。 需注意的是，將軟性基板固定於載台上的效果好壞，可能 會影響後續形成於軟性基板上之電子裝置的製程良率。 目前有幾種方法可將軟性基板固定於載台上，包括全 =性的膠材塗佈於載台上、以真空吸附方式將軟性基板固 定於載台上以及利用夾具固定軟性基板於載台上等方式。 其中:全面性的膠材塗佈所需的膠材量較高，且膠材的熱 ❿膨脹係數必須介於軟性基板與載台之間才能降低高溫製程 二：者熱膨係數差異所造成的應力。再者，雖然全面塗佈 膠材可增加軟性基板與載台之間的附著性，但在進行剝離 製程時單一膠材的剝離效果無法經由控制接著面積大小來 進行微調，只能進行配方調整來達到剝離的 成本較高。 现展^ 此外’使用真空吸附方式來固定軟性基板時，若 吸附的孔洞過大，可能會使得軟性基板上局部區域變形Γ 200945480 導致製程失效。另外， 板的四周固定在載台上，但性基板雖可將軟性基 仍可能不足。 一人土之中間區域的平整声 【發明内容】 本發明提供一種顯示器的製造方法 台，該載台包含一薄板材料及複數=:提供一載 薄板材料之中，每個霉槽圖案，形成於該 摊阁安4紅 籌槽圖案包括複數個溝槽，一、类 _1括-亦可為每―溝槽 至溝 中該孔洞穿過該薄板材料且位於該槽^一孔洞，其 槽形成-空氣通道;放置-軟性基板於2:!:與該些溝 用一製程機台進行一顯干匍 、栽ο上，以及使 件於該軟性基板上。疋件製程，Μ形成複數個顯示元 參 本發明又提供-種軟性基板的載台，包括：一薄板材 料；以及複數個溝槽圖案，形成於該薄板材料之中，每個 溝槽圖案包括複數個溝槽，至少一溝槽圖案包括一孔洞， 亦Τ為每一溝槽圖案包括一孔洞，其中該孔洞穿過該薄板 材料且位於該些溝槽下方，與該些溝槽形成一空氣通道。 本發明更提供一種顯示器的生產設備，包括：一收捲 裝置’用以將一軟性基板捲繞成一捲狀結構；一放捲裝置， 用以將該捲狀結構的基板展開成一平坦結構；以及一具有 複數個第一溝槽的基板傳送平台，設置於該收捲裝置與該 200945480 放捲裝置之間，以傳送錄轉板，其中該 的每一個彼此相連。 Λ 4匕 溝槽 【實施方式】 以下將以實施例詳細 係伴隨著圖示說明之。在月，參考，且範例 分係使用相同之圖號。tmr相似或相同之部 可擴大，以簡化或:二中圈實:例之形狀或是厚度 各種孰習此技藏未緣示或描述之元件，可以具有 於一基二的形n卜’當敛述一層係位 層上上時’此層可直接位於基板或是另-工或疋其間亦可以有中介層。 以下配合第1A圖至第1〇圖說明本發明一 有溝槽圖案之載台的形成方法。如第^ 實…，、 佑, 邪圖所示，首先塗 :光阻層m於例域璃切晶圓之薄板#料隐上。 髻 如第則所示，依序進行曝光及顯影製程， 圖案化光阻層134於薄板材料13〇a上。 所示，利用圖案化光阻層134 ，如第1C圖 施1刻製程，以形成具有複=溝:涛:一實 1 圖、:其中’這些溝槽8a的每，彼此相連。：二材二 可藉由例如侧、雷射觀或频觀f 至乂 一個孔洞4a於溝槽8a之至少一者 方式形成 應於後續進行顯示器製程中之制 ，較佳方法為對 7 200945480 施例中’係形成至少一個貫穿薄板材料i遍的孔洞 4a於這些賴8a之至少1下方，㈣絲夠適用於軟性 基板的載台1〇〇。在一實施例中，載台1〇〇包含一薄板材 料及複數個溝槽圖案’形成於此薄板材料之中’其中每個 溝槽圖案更包括複數個溝槽，至少一溝槽圖案包括一孔 '同，亦可為每一溝槽圖案包括一孔洞，且上述孔洞穿過薄 板材料並位於這些溝槽下方，以與這些溝槽形成一空氣通 道。 m 如第2圖所示，在另一實施例中，亦可於這些溝槽8a =一者下方形成往溝槽8a之邊緣偏移的孔洞4b，其中孔 洞4b之頂部的一部份P1與溝槽8a的底部T1相互連接。 請參照第3A圖至第3C圖，其繪示另一實施例之溝槽 的1作方法。如第3A圖所示，首先提供一例如高分子 的薄板材料130a以及具有溝槽8a之圖案的母模具 接著，如第3B圖所示，藉由熱壓製程將上述具有溝 上之圖案的母模具126壓印至此高分子材料的載台130a 有^參照第3C圖，隨後移開母模具126,因而形成一具 或雷個溝槽8a的薄板材料130a。接著，可利用機械鑽孔 :、射鑽孔，形成複數個孔洞於溝槽8a之至少一者中（圖 禾顯示彳，、丄u 8 7 11些孔洞可為如第1D圖之實施例中，位於溝槽 8 ]部的孔洞4a也可以是與第2圖實施例相似之往溝槽 &的邊緣偏移的孔洞4b。換言之，這些孔洞可位於溝槽 a之—的中央部，然而，亦可位於溝槽8a之一的邊緣部， 且與未形成溝槽8a的薄板材料的區域重疊。 8 200945480 值得注意的是，上述形点 几里政V 〜成於栽台100之中的孔洞4a或 4b的位置係分別對應於後繒 $ 員不器製程之製程設備中的真 工吸附孔的位置。當&些製程設備巾的真空吸附系統操作 時’可透過上述真空吸附孔、對應這些真”及附孔的孔洞 4a或4b以及與孔洞4a或仆連接的溝槽，而將載台 100上的軟性基板115均句地固定在載台_上。另外， 由於這些溝槽8a面積較大，可平均分散真空吸附力，讓吸200945480 IX. Description of the Invention: TECHNICAL FIELD The present invention relates to a handling substrate for a flexible substrate, and more particularly to a method of manufacturing a flexible display. [Prior Art] The use of a flexible substrate instead of a glass substrate to produce a display has become a trend for the development of next generation displays. In order to solve the problem of the flexible substrate introduction process, in addition to designing a device suitable for a flexible substrate, the cost of the device can be reduced, and the stage can be used to support the flexible substrate and be processed by existing equipment. It should be noted that the effect of fixing the flexible substrate on the stage may affect the process yield of the electronic device subsequently formed on the flexible substrate. At present, there are several methods for fixing a flexible substrate to a stage, including applying a full-size adhesive material to the stage, fixing the flexible substrate to the stage by vacuum adsorption, and fixing the flexible substrate to the stage by using a clamp. The best way. Among them: the comprehensive amount of glue required for coating the rubber material is high, and the thermal expansion coefficient of the rubber material must be between the soft substrate and the stage to reduce the high temperature process 2: the difference in thermal expansion coefficient stress. Furthermore, although the overall coating of the rubber material can increase the adhesion between the flexible substrate and the stage, the peeling effect of the single rubber material during the peeling process cannot be finely adjusted by controlling the size of the subsequent area, and only the formulation adjustment can be performed. The cost of achieving the peeling is higher. In addition, when the vacuum substrate is used to fix the flexible substrate, if the hole is too large, the local area on the flexible substrate may be deformed. 200945480 causes the process to fail. In addition, the periphery of the board is fixed on the stage, but the flexible substrate may still have insufficient soft base. The present invention provides a display manufacturing method for a display, the carrier includes a thin plate material and a plurality of materials: each of the carrier materials is formed in the carrier material. The booth pattern of the pavilion 4 includes a plurality of grooves, one, the type _1 is included - and the hole may pass through the sheet material in each of the grooves to the groove and is located in the hole of the groove, and the groove is formed - Air channel; placement-soft substrate at 2:!: and the trenches are dried, planted, and placed on the flexible substrate using a process machine. The invention further provides a plurality of display elements. The invention further provides a stage for a flexible substrate, comprising: a sheet material; and a plurality of groove patterns formed in the sheet material, each groove pattern comprising a plurality of trenches, at least one of the trench patterns includes a hole, and each of the trench patterns includes a hole, wherein the hole passes through the thin plate material and is located below the trenches to form an air with the trenches aisle. The invention further provides a production device for a display, comprising: a winding device for winding a flexible substrate into a roll structure; and a unwinding device for unfolding the substrate of the roll structure into a flat structure; A substrate transfer platform having a plurality of first grooves is disposed between the winding device and the 200945480 unwinding device to transport the recording and rewinding plates, wherein each of the ones is connected to each other. Λ 4匕 Groove [Embodiment] Hereinafter, the details of the embodiment will be described with reference to the drawings. In the month, reference, and the example is used to use the same figure number. The similar or identical parts of tmr can be expanded to simplify or: the second middle circle: the shape or thickness of the various components that are not shown or described in this technology, can have the shape of a base two When arranging a layer of the layer on the top layer, the layer can be directly on the substrate or it can be interposed or interposed. Hereinafter, a method of forming a stage having a groove pattern according to the present invention will be described with reference to Figs. 1A to 1B. Such as the first ^, ..., You, evil map, first painted: the photoresist layer m in the case of the glass cut wafer sheet # material hidden.髻 As shown in the figure, the exposure and development processes are sequentially performed, and the photoresist layer 134 is patterned on the thin plate material 13A. As shown, the patterned photoresist layer 134 is patterned as shown in Fig. 1C to form a pattern having a complex groove: a solid pattern, wherein each of the grooves 8a is connected to each other. The two materials can be formed by, for example, the side, the laser view or the frequency f to the at least one hole 4a in the trench 8a, which should be formed in the subsequent display process, preferably by applying the method to the 200945480 In the example, at least one hole 4a penetrating through the sheet material i is formed below at least 1 of the sheets 8a, and (4) the wire is suitable for the stage 1 of the flexible substrate. In one embodiment, the stage 1 includes a thin plate material and a plurality of groove patterns formed in the thin plate material. Each of the groove patterns further includes a plurality of grooves, and at least one groove pattern includes one The holes may also include a hole for each groove pattern, and the holes pass through the sheet material and are located below the grooves to form an air passage with the grooves. m, as shown in FIG. 2, in another embodiment, a hole 4b offset from the edge of the groove 8a may be formed below the grooves 8a=one, wherein a portion P1 of the top of the hole 4b is The bottoms T1 of the grooves 8a are connected to each other. Referring to Figures 3A through 3C, a method of making a trench of another embodiment is illustrated. As shown in FIG. 3A, first, a thin plate material 130a such as a polymer and a mother mold having a pattern of grooves 8a are provided. Next, as shown in FIG. 3B, the above-mentioned mother mold having a pattern on the groove is formed by a hot pressing process. The stage 130a embossed to the polymer material has a reference to FIG. 3C, and then the mother mold 126 is removed, thereby forming a sheet material 130a having a groove 8a. Then, the mechanical drilling: the drilling hole can be used to form a plurality of holes in at least one of the grooves 8a (Fig. 彳, 丄u 8 7 11) may be in the embodiment as in the 1D figure. The hole 4a at the portion of the groove 8 can also be a hole 4b which is offset from the edge of the groove & similar to the embodiment of Fig. 2. In other words, the hole can be located at the center of the groove a, however It may also be located at the edge of one of the grooves 8a and overlap with the area of the sheet material on which the groove 8a is not formed. 8 200945480 It is worth noting that the above-mentioned shape is several times in the plant 100. The positions of the holes 4a or 4b correspond to the positions of the real adsorption holes in the process equipment of the process of the process, respectively. When the vacuum adsorption system of the process equipments is operated, the vacuum suction holes are Corresponding to these holes and the holes 4a or 4b with holes and the grooves connected to the holes 4a or servants, the flexible substrate 115 on the stage 100 is uniformly fixed on the stage_. Further, since these grooves 8a Larger area, can evenly disperse the vacuum adsorption force, let the suction
附在載台100上的軟性基板的平整性大幅提升並可進一 步避免傳統載台上用以吸附軟性基板的孔洞過大所造成之 軟性基板局部區域變形的問題。 請參考第4A圖，其顯示在本發明之較佳實施例中，上 述載台100更包括複數個失具120，且這些夾具120皆位 於載台100的周圍。如第4B圖所示，這些夾具12〇可將後 續用以製作顯示器元件的軟性基板115大致固定在具有溝 槽8a和孔洞4a之載台100上。如第4A圖所示，載台1 〇〇 上形成有複數個溝8a ’其中這些溝槽ga彼此相連。再者， 上述溝槽8a之至少一者中形成有孔洞4a，且孔洞4a各別 對應於顯示器製程設備上之真空吸附孔。在_實施例中， 上述溝槽8a和孔洞4a或4b可構成溝槽圖案u，且溝槽圖 案11可為分佈形式排列。 如第4A圖及第5A圖至第5B圖所示，其分別顯示本 發明之實施例之溝槽圖案11的排列示意圖。在一實施例 中，上述分佈形式排列的溝槽圖案11可以是一交錯形式排 列（如第5A圖所示）、一叢集（cluster)形式排列（如第4A圖 200945480 圖未顯示）或其組合排 與5B圖所示）、不規則分散排列 列。 需注意的是，在第4A圖中，溝槽^的幾 形條狀，然而’本發明並未限定於此。舉例而士〜狀為方The flatness of the flexible substrate attached to the stage 100 is greatly improved, and the problem of deformation of a local portion of the flexible substrate caused by excessively large holes for adsorbing the flexible substrate on the conventional stage can be further avoided. Referring to Figure 4A, which shows that in the preferred embodiment of the present invention, the stage 100 further includes a plurality of dislocations 120, and the jigs 120 are located around the stage 100. As shown in Fig. 4B, the jigs 12 are substantially fixed to the stage 100 having the grooves 8a and the holes 4a, which are used to form the display elements. As shown in Fig. 4A, the stage 1 is formed with a plurality of grooves 8a' in which the grooves ga are connected to each other. Further, at least one of the grooves 8a is formed with a hole 4a, and the holes 4a each correspond to a vacuum suction hole on the display processing apparatus. In the embodiment, the above-mentioned grooves 8a and holes 4a or 4b may constitute a groove pattern u, and the groove pattern 11 may be arranged in a distributed form. As shown in Fig. 4A and Figs. 5A to 5B, there are respectively shown schematic views of the arrangement of the groove patterns 11 of the embodiment of the present invention. In an embodiment, the groove patterns 11 arranged in the above-mentioned distribution form may be arranged in a staggered manner (as shown in FIG. 5A), in a cluster form (as shown in FIG. 4A and 200945480), or a combination thereof. Rows are shown in Figure 5B. It should be noted that in Fig. 4A, the grooves are formed in a strip shape, however, the present invention is not limited thereto. For example, the gentleman ~ shape is square
圖至第6D圖所示，溝槽的幾何形狀可^四邊^ 第6A 6A圖所示）、五邊型8c (如第6B圖所示）、十字型（如第 第6C圖所示）、弧形條狀或含圓角之條狀8e(如第(如 ^0。 圖所 # 帛7圖_本發明—較佳實關之可撓式顯示器的製 造流程。首先在步驟701中，提供一載台1〇〇，載台 形成有複數個溝槽及孔洞（如第4A圖所示）。在一較:實施 例中，該載台更包括有一夾具120,設置於該載台的邊緣， 用以將軟性基板固定於該載台上。接著，在步驟7〇2中， 放置一軟性基板115於載台1〇〇上(如第4B圖所示），其中 軟性基板115藉由夾具120’固定於形成有複數個溝槽8a 和孔洞4a的載台100上。在本實施例中軟性基板115包括 ❹聚碳酸酯（polycarbonate，PC)基板、聚醚酯（polyethersulfone， PES)基板、聚丙烯酸酯(polyarylate，PAR)基板、聚原冰片 烯(polynorbornene，PNB)基板、聚亞醯胺(Polyimide，PI)基 板、聚對苯二甲酸二乙醋（Polyethylene terephathalate，PET) 基板聚基板、聚萘二曱 酸乙二醋（Polyethylenenaphthalate, PEN)或聚贼醯亞胺 (polyetherimide，PEI)基板。之後，在步驟703中，使用一 製程機台進行一顯示元件製程，以形成複數個顯示元件於 200945480 • 上述軟性基板上，這些顯示元件可 料或發光二極體元件。其中，上:/ 、 a曰體、液晶材 附系統(圖未顯示)’且此真空吸：：：：包括-真空吸 孔，對應於上述載台的孔洞。、、、匕括一真空吸附 請參照第8圖，其顯示裝载有軟 與具有複數個真空吸附孔9之顯〒 的载台100 剖面圖。其中，設備平台5的真空吸附孔9盘:：：5的 系統（圖未顯示）中的真空管、線6〇 述:吸附 ❿基板⑴的載台議傳送至設備平Ϊ5β;上迷裝载有軟性 附系統，使得軟性基板115與栽 ’ H動真空吸 丹執台100之間的空翕研你甴 通過溝槽8a、孔洞4a以及連接溝槽8a和孔洞 =’：，真空吸附系統中的一排氣裝置(圖未顯;)， 軟性基板115與載☆100緊密固定的吸附 性基板115均句且牢.固地固定在載台100上。 勺括二：9圖，其顯示上述顯示器製程的設備平台更 包括„ 300、機器”52以及一基㈣置 響.卜如第H)圖所示’基板E裝置1Q包括複數個切 (CaSSette)ld’用以分別放置上述裝載有軟性基板115的載 台 100。 _請再次參照第9圖，當裝載有軟性基板 115的載台100 經由基板傳送|置傳送至基板暫放平台 200上時，可 藉由機器手臂52將裝載有軟性基板115的載台1G0傳送至 上述卡匣Id之一者上。 請參照第11圖，其㈣—用以製造可撓式顯示器的生 200945480 產設備90,包括：一收捲裝置140’用以將一軟性基板15〇 捲繞成一捲狀結構；一放捲裝置16〇,用以將捲狀結構的 基板展開成一平坦結構；以及一具有複數個第一溝槽MS 的基板傳送平台170,設置於收捲裝置14〇與放捲裝置 之間，用以傳送軟性基板150，其中第一溝槽165的每一 個彼此相連。在本實施例中，上述收捲裝置14〇或放捲裝 置160包括有複數個第二溝槽175。在一較佳實施例中， 上述第一溝槽165和第二溝槽175之至少—者設置有真空 ®吸附孔180。上述第一溝槽165和第二溝槽175可利用例 如車床、洗床等機械加工方式來形成。較佳者，第一溝槽 165和第二溝槽175的幾何形狀可包括方形條狀、弧形條 狀、四邊型、五邊型、六邊型、十字型或含圓角之條狀。 再者’可挽式顯不的生產設備90更包括一真空吸附系統 (圖未顯示）’且此真空吸附系統連接收捲裝置140、放捲裝 置160以及基板傳送平台17〇。當真空吸附系統運作時， 魯可透過真空吸附孔180、第一溝槽165以及第二溝槽ι75， 將設置於收捲裝置140、放捲裝置160以及基板傳送平台 Π〇上的軟性基板150固定’以避免製程期間因軟性基板 150移動造成製程量率的降低。在另一實施例中，上述收 捲裝置140及放捲裝置160上並不具溝槽結構。 综上所述，利用本發明之實施例具有許多優點。舉例 而言，利用上述實施例之具有溝槽8a和孔洞4a的載台 100 ’可將軟性基板115均勻且形牢固地固定在載台1〇〇 上，同時在軟性基板115上也不會有局部區域變形的問 12 200945480 . 題，因此可避免製程中因軟性基板115的平整度不佳或局 部區域變形所造成之製程量率降低的問題。再者，由於軟 性基板115係設置於硬性的載台100上，因而可將製程中 或製程完成後的軟性基板115放置於基板匣裝置10的卡匣 Id中，以改善軟性基板放置於基板匣裝置中的卡匣上時， 因過度彎曲而不易放置的問題。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此項技藝者，在不脫離本發明之精 Φ 神和範圍内，當可做更動與潤飾，因此本發明之保護範圍 當視後附之申請專利範圍所界定者為準。 Φ 13 200945480 【圖式簡單說明】 • 第1A圖至第1D圖為一系列之按照一實施例所製造之 載台的剖面圖。 第2圖為一實施例之載台的剖面圖。 第3A圖至第3C圖係繪示一實施例之溝槽的製作方 法。 第4A圖係繪示一實施例之載台的上視圖。 第4B圖係繪示一實施例之裝載有軟性基板之載台的 ❿剖面圖。 第5A圖顯示一實施例之溝槽的排列示意圖。 第5B圖顯示一實施例之溝槽的排列示意圖。 第6A圖至第6D圖係繪示一實施例之溝槽的幾何形 狀。 第7圖顯示一軟性顯示器之製造流程。 第8圖顯示裝載有軟性基板的載台與具有複數個真空 吸附孔之設備平台的剖面圖。 _ .第9圖顯示一實施例之顯示器製程的部分設備平台。 第10圖顯示一基板匣裝置的剖面圖。 第11圖顯示一可撓式顯示器的生產設備。 【主要元件符號說明】As shown in Fig. 6D, the geometry of the groove can be as shown in Fig. 6A 6A, pentagon 8c (as shown in Fig. 6B), cross (as shown in Fig. 6C), Curved strips or strips 8e with rounded corners (eg, the same as the manufacturing process of the flexible display of the present invention - preferably in step 701, provided in step 701 A stage 1 is formed, the stage is formed with a plurality of grooves and holes (as shown in FIG. 4A). In a preferred embodiment, the stage further includes a clamp 120 disposed at an edge of the stage. The flexible substrate is fixed on the stage. Then, in step 7〇2, a flexible substrate 115 is placed on the stage 1 (as shown in FIG. 4B), wherein the flexible substrate 115 is supported by the fixture. The 120' is fixed on the stage 100 on which the plurality of grooves 8a and the holes 4a are formed. In the embodiment, the flexible substrate 115 comprises a polycarbonate (PC) substrate, a polyethersulfone (PES) substrate, Polyarylate (PAR) substrate, polynorbornene (PNB) substrate, polyimide (PI) substrate, Polyethylene terephathalate (PET) substrate poly substrate, polyethylene naphthalate (PEN) or polyetherimide (PEI) substrate. Thereafter, in step 703 Using a process machine to perform a display component process to form a plurality of display elements on 200945480. The above flexible substrate can be used as a material or a light-emitting diode component. Among them, upper: /, a body, liquid crystal material Attached system (not shown) 'and this vacuum suction:::: includes - vacuum suction hole, corresponding to the hole of the above-mentioned stage.,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, A cross-sectional view of the stage 100 with a plurality of vacuum adsorption holes 9 in which a vacuum tube, line 6 of the system of vacuum adsorption holes 9 of the equipment platform 5 (not shown), line 6 description: adsorption The carrier of the substrate (1) is transferred to the device 5β; the upper part is loaded with a soft attachment system, so that the space between the flexible substrate 115 and the planted H-vacuum suction station 100 passes through the groove 8a, Hole 4a and even The groove 8a and the hole = ':, an exhaust device in the vacuum adsorption system (not shown;), the flexible substrate 115 and the adsorption substrate 115 which is tightly fixed by the load ☆ 100 are fixed and fixed on the stage. 100. Spoon 2: 9 figure, which shows that the device platform of the above display process further includes „300, machine” 52 and a base (four) sound. As shown in the figure H), the substrate E device 1Q includes a plurality of cuts. (CaSSette) ld' is used to respectively place the above-described stage 100 on which the flexible substrate 115 is mounted. Referring again to FIG. 9, when the stage 100 on which the flexible substrate 115 is loaded is transferred to the substrate temporary placement stage 200 via the substrate transfer, the stage 1G0 loaded with the flexible substrate 115 can be transferred by the robot arm 52. To one of the above cards Id. Please refer to FIG. 11 , which is a manufacturing device 90 for manufacturing a flexible display, comprising: a winding device 140 ′ for winding a flexible substrate 15 成 into a roll structure; a unwinding device 16〇 for unfolding the substrate of the roll structure into a flat structure; and a substrate transfer platform 170 having a plurality of first grooves MS disposed between the winding device 14 and the unwinding device for transmitting softness The substrate 150, wherein each of the first trenches 165 is connected to each other. In the present embodiment, the winding device 14 or the unwinding device 160 includes a plurality of second grooves 175. In a preferred embodiment, at least one of the first trench 165 and the second trench 175 is provided with a vacuum ® adsorption hole 180. The first groove 165 and the second groove 175 described above may be formed by machining such as a lathe or a washing machine. Preferably, the geometry of the first trench 165 and the second trench 175 may comprise a square strip, a curved strip, a quadrilateral, a pentagon, a hexagon, a cross or a strip with rounded corners. Further, the portable production device 90 further includes a vacuum adsorption system (not shown) and the vacuum adsorption system is connected to the winding device 140, the unwinding device 160, and the substrate transfer platform 17A. When the vacuum adsorption system is in operation, the flexible substrate 150 disposed on the winding device 140, the unwinding device 160, and the substrate transfer platform 透过 through the vacuum adsorption hole 180, the first groove 165, and the second groove ι75 Fixed 'to avoid a decrease in the process rate due to the movement of the flexible substrate 150 during the process. In another embodiment, the winding device 140 and the unwinding device 160 are not grooved. In summary, embodiments utilizing the present invention have many advantages. For example, with the stage 100' having the groove 8a and the hole 4a of the above embodiment, the flexible substrate 115 can be uniformly and firmly fixed on the stage 1 , while not being on the flexible substrate 115. The local area deformation problem can avoid the problem of a decrease in the process rate due to poor flatness of the flexible substrate 115 or local area deformation in the process. Furthermore, since the flexible substrate 115 is disposed on the rigid stage 100, the flexible substrate 115 in the process or after the process is completed can be placed in the cassette Id of the substrate device 10 to improve the placement of the flexible substrate on the substrate. When the cassette in the device is on the cassette, it is not easy to place due to excessive bending. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any person skilled in the art can make changes and retouching without departing from the scope of the present invention. The scope of the invention is defined by the scope of the appended claims. Φ 13 200945480 [Simple description of the drawings] • Figs. 1A to 1D are cross-sectional views of a series of stages manufactured in accordance with an embodiment. Figure 2 is a cross-sectional view of a stage of an embodiment. 3A to 3C are views showing a method of fabricating a groove of an embodiment. Figure 4A is a top plan view of the stage of an embodiment. Fig. 4B is a cross-sectional view showing the susceptor of the embodiment loaded with the flexible substrate. Fig. 5A is a view showing the arrangement of the grooves of an embodiment. Fig. 5B is a view showing the arrangement of the grooves of an embodiment. 6A to 6D are views showing the geometry of the groove of an embodiment. Figure 7 shows the manufacturing process of a flexible display. Figure 8 is a cross-sectional view showing a stage on which a flexible substrate is loaded and a device platform having a plurality of vacuum adsorption holes. Figure 9 shows a portion of the device platform of the display process of an embodiment. Figure 10 shows a cross-sectional view of a substrate cassette device. Figure 11 shows a production device for a flexible display. [Main component symbol description]
Id :卡匣； 4a :孔洞； 4b :孔洞； 14 200945480 . 5:設備平台； 8a :溝槽； 8b :四邊型； 8c :五邊型； 8d :十字型； 8e :含圓角之條狀 9 :真空吸附孔； 10 :基板匣裝置； ® 11 :溝槽圖案； 52 :機器手臂； 60 :真空管線； 90 :可撓式顯示器的生產設備； 115 :軟性基板； 120 :夾具； 126 :母模具； 130a :薄板材料； ❹ 100 :載台； 132 :光阻層； 134 :圖案化光阻層； 140 : —收捲裝置； 150 :軟性基板； 160 :放捲裝置； 165 :第一溝槽； 170 :基板傳送平台； 15 200945480 ， 175 :第二溝槽； 180 :真空吸附孔； 200 :暫放平台； 300 :基板傳送裝置； 701 :步驟； 702 :步驟； 703 :步驟； 704 :步驟； ❹ P1 :孔洞4b之頂部的一部份； T1 :溝槽8a底部。 16Id: cassette; 4a: hole; 4b: hole; 14 200945480 . 5: equipment platform; 8a: groove; 8b: quadrilateral; 8c: pentagonal; 8d: cross; 8e: strip with rounded corners 9: vacuum adsorption hole; 10: substrate 匣 device; ® 11: groove pattern; 52: robot arm; 60: vacuum line; 90: flexible display production equipment; 115: flexible substrate; 120: clamp; Master mold; 130a: sheet material; ❹100: stage; 132: photoresist layer; 134: patterned photoresist layer; 140: - winding device; 150: flexible substrate; 160: unwinding device; 165: first Trench; 170: substrate transfer platform; 15 200945480, 175: second trench; 180: vacuum adsorption hole; 200: temporary release platform; 300: substrate transfer device; 701: step; 702: step; 703: step; : step; ❹ P1 : a part of the top of the hole 4b; T1 : the bottom of the groove 8a. 16