TW200946253A - Method for cleaning electronic parts and cleaning system - Google Patents

Method for cleaning electronic parts and cleaning system Download PDF

Info

Publication number
TW200946253A
TW200946253A TW098107270A TW98107270A TW200946253A TW 200946253 A TW200946253 A TW 200946253A TW 098107270 A TW098107270 A TW 098107270A TW 98107270 A TW98107270 A TW 98107270A TW 200946253 A TW200946253 A TW 200946253A
Authority
TW
Taiwan
Prior art keywords
cleaning
electronic component
fluorine
agent composition
refining
Prior art date
Application number
TW098107270A
Other languages
Chinese (zh)
Inventor
Hideaki Kikuchi
Original Assignee
Mitsui Du Pont Fluorchemical
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Du Pont Fluorchemical filed Critical Mitsui Du Pont Fluorchemical
Publication of TW200946253A publication Critical patent/TW200946253A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/14—Removing waste, e.g. labels, from cleaning liquid
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/004—Surface-active compounds containing F
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)

Abstract

This invention provides a method for cleaning electronic parts, the method including the steps of purifying an unused, fluorine-containing organic cleaning agent composition with a purifying device, cleaning the electronic parts by using the purified cleaning agent composition supplied from the purifying device to a cleaning device, and delivering the cleaning liquid already used in cleaning from the cleaning device to the purifying device, re-purifying the used cleaning liquid and circulatingly supplying the re-purified cleaning liquid to the cleaning device; wherein at least the removal of organic contaminants by a purifying distillation device and the removal of solid contaminants by a filter device are performed during the above said purifying step.

Description

200946253 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種使用含氟有機清洗劑組成物液來 清洗電子組件之方法及清洗系統。 【先前技術】 以往，就使用含氟有機清洗劑組成物液（以下亦稱為 「乱糸清洗液」）來清洗梦晶圓、砍晶片、印刷基板等電 子組件之裝置而言，係使用蒸氣脫脂清洗裝置（例如專利 ❿文獻1)。 此外，已提案有一種方法，係將使用於電子組件的清 洗之在清洗裝置内已污染的氟系清洗液投入至另外設置的 再生裝置予以再生，而再次使用於電子組件的清洗（例如 專利文獻2)。 專利文獻1 :美國專利第3881949號 專利文獻2 :日本特開2001-129302號公報 φ 【發明内容】 (發明所欲解決之課題） 近年來，由於電子組件中的元件與配線等的高密度 化，以往所容許之在元件與配線的圖案形成所產生的殘渣 量亦逐漸變得無法容許，且元件與配線的間距間隔亦逐漸 變窄，因此要求氟系清洗液的高純度化。 另一方面，在以往的蒸氣脫脂清洗裝置中，污垢成分 堆積於清洗裝置内，隨著時間的經過，清洗裝置内的氟系 清洗液的清洗能力會降低，故必須頻繁地更換未使用的氟 3 321091 200946253 系清洗液或再生的氟系清洗液。 然而，由於未使用的氟系清洗液通常係收容於容器， 並由製造商運送至使用現場，因此容器内的微量污垢成分 很可能會混入氟系清洗液中，而且在將該容器開封以將氟 系清洗液投入清洗裝置内時，氟系清洗液接觸外部環境而 使外部環境中的污垢成分混入氟系清洗液中的可能性很 高，因此即使是未使用的氟系清洗液亦未必一定是以所要 求的高純度來使用。 此外，在再生的氟系清洗液的情形時，由於在再生後 的氟系清洗液從再生裝置收容至容器並予以搬運的期間， 以及在將容器開封並將氟系清洗液投入至清洗裝置内的期 間，亦與前述相同氟系清洗液會被污染，因此再生的氟系 清洗液未必以所要求的高純度來使用。 因此，為了清洗傾向於更高密度化與小型化的電子組 件，係期望使用更高純度的氟系清洗液。 (解決課題的手段） 本發明乃有鑑於上述課題而研創者，其目的係提供一 種能以高純度使用氟系清洗液之電子組件之清洗方法以及 使用該清洗方法之清洗系統。 亦即，本發明係提供一種清洗方法，係包含有：精製 步驟，係藉由精製裝置精製未使用之含氟有機清洗劑組成 物液；清洗步驟，係使用從前述精製裝置供給至清洗裝置 内之精製後的清洗劑組成物液來清洗電子組件；以及循環 供給步驟，係將使用於清洗的清洗液從清洗裝置輸送至前 4 321091 200946253 述精製裝置，將使用完畢的清洗液予以再精製，並循環供 給至清洗裝置；在前述精製步驟中，至少進行藉由精餾裝 置所進行之有機性污染物的去除以及藉由過濾裝置所進行 之固體污染物的去除來精製前述清洗劑組成物液，並使用 如上方式精製的清洗劑組成物液來清洗電子組件。 此外，依據本發明的另一觀點，本發明係提供一種電 子組件之清洗系統，係藉由前述清洗方法來清洗電子組 件，該清洗系統係具備有：精製裝置，係去除未使用的含 ® 氟有機清洗劑組成物液所含有的污染物而予以精製；以及 清洗裝置，係使用由該精製裝置所精製的前述清洗劑組成 物液來清洗電子組件；前述精製裝置係至少具備有用以去 除有機性污染物之精餾裝置、以及用以去除固體污染物之 過濾裝置，於前述精餾裝置以及前述過濾裝置流通前述清 洗劑組成物液並予以精製，藉由前述精製裝置將在前述清 洗裝置内使用於電子組件的清洗的清洗液予以再精製，並 D 循環供給至清洗裝置。 (發明之效果） 依據本發明，能將含氟有機清洗劑組成物液（氟系清 洗液）的製造商所運輸來的未使用之氟系清洗液從該容器 投入至精製裝置，並以精製裝置去除未使用的氟系清洗液 中的污垢成分以精製該清洗液。 因此，在製造商端，由於在附著有微量的污垢成分的 容器内填充氟系清洗液，因此即使於氟系清洗液中混入污 垢成分，亦能以精製裝置去除氟系清洗液中的污垢成分而 5 321091 200946253 予以精製，因此能使所精製的 ^ 外部環境之情形下供給至清、，度氟系清洗液不會接觸 之’依據本發明，可防止:因;子組件。換言 子組件的品質降低。 、未使用的氟系清洗液之電 因此，本發明係能對應矽 矽晶圓所彳0日μ , 阳囫、陶瓷晶圓、切斷前述 /曰日園所侍之矽晶片、切斷 片、玻璁其此 Α嵐盆J 魂陶曼晶圓所得之陶甍晶 ^玻1埸基板、金屬基板、彩_^ 以；你^ 巴/慝光片基板、印刷基板、 與小型化。 于、，且件的進一步的高密度化200946253 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method and a cleaning system for cleaning an electronic component using a composition liquid of a fluorine-containing organic cleaning agent. [Prior Art] Conventionally, a device using a fluorine-containing organic detergent composition liquid (hereinafter also referred to as "scraping cleaning liquid") for cleaning electronic components such as a dream wafer, a chip, and a printed circuit board is used. Degreasing cleaning device (for example, patent ❿ Document 1). In addition, a method has been proposed in which a fluorine-based cleaning liquid contaminated in a cleaning device for use in cleaning of an electronic component is put into a separately provided regeneration device for regeneration, and is reused for cleaning of an electronic component (for example, patent document) 2). [Patent Document 1] US Patent No. 388 1949 Patent Document 2: JP-A-2001-129302 (Explanation of the Invention) In recent years, high density of components and wirings in electronic components has been achieved. In the past, the amount of residue generated in the pattern formation of the device and the wiring is gradually unacceptable, and the interval between the element and the wiring is gradually narrowed. Therefore, the purity of the fluorine-based cleaning liquid is required to be high. On the other hand, in the conventional vapor degreasing cleaning apparatus, the dirt component is deposited in the cleaning device, and the cleaning ability of the fluorine-based cleaning liquid in the cleaning device is lowered as time passes, so that it is necessary to frequently replace the unused fluorine. 3 321091 200946253 A cleaning solution or a regenerated fluoride-based cleaning solution. However, since the unused fluorine-based cleaning liquid is usually stored in a container and transported to the use site by the manufacturer, a trace amount of the dirt component in the container is likely to be mixed into the fluorine-based cleaning liquid, and the container is opened to be opened. When the fluorine-based cleaning liquid is introduced into the cleaning device, the fluorine-based cleaning liquid is likely to be in contact with the external environment, and the dirt component in the external environment is likely to be mixed into the fluorine-based cleaning liquid. Therefore, even the unused fluorine-based cleaning liquid does not necessarily have to be fixed. It is used in the required high purity. In the case of the regenerated fluorine-based cleaning liquid, the fluorine-based cleaning liquid after the regeneration is stored in the container from the regeneration device and transported, and the container is opened and the fluorine-based cleaning liquid is introduced into the cleaning device. In the meantime, since the same fluorine-based cleaning liquid is contaminated as described above, the regenerated fluorine-based cleaning liquid is not necessarily used in the required high purity. Therefore, in order to clean an electronic component which tends to be higher in density and miniaturization, it is desirable to use a fluorine-based cleaning liquid of higher purity. (Means for Solving the Problems) The present invention has been made in view of the above problems, and an object thereof is to provide a cleaning method for an electronic component capable of using a fluorine-based cleaning liquid with high purity and a cleaning system using the cleaning method. That is, the present invention provides a cleaning method comprising: a refining step of purifying an unused fluorine-containing organic cleaning composition liquid by a refining device; and a cleaning step of supplying the cleaning device from the refining device to the cleaning device The purified cleaning agent composition liquid is used to clean the electronic component; and the circulating supply step is to transport the cleaning liquid used for cleaning from the cleaning device to the refining device of the first 4 321091 200946253, and re-refining the used cleaning solution. And circulating to the cleaning device; in the refining step, at least the removal of the organic contaminant by the rectification device and the removal of the solid contaminant by the filtering device to purify the cleaning agent composition liquid And cleaning the electronic component using the detergent composition liquid refined as described above. Further, according to another aspect of the present invention, the present invention provides a cleaning system for an electronic component, which is characterized by the above-described cleaning method, the cleaning system comprising: a refining device for removing unused ?-containing fluorine And cleaning the apparatus by using the cleaning agent composition liquid purified by the refining apparatus; and the refining apparatus is at least useful for removing organic matter. a rectifying device for contaminants and a filtering device for removing solid contaminants, wherein the cleaning agent composition liquid is circulated and purified in the rectifying device and the filtering device, and the refining device is used in the cleaning device The cleaning solution for cleaning the electronic components is re-refined and D is circulated to the cleaning device. (Effect of the Invention) According to the present invention, an unused fluorine-based cleaning liquid transported by a manufacturer of a fluorine-containing organic cleaning composition liquid (fluorine-based cleaning liquid) can be supplied from the container to the refining device and refined. The apparatus removes the dirt component in the unused fluorine-based cleaning liquid to purify the cleaning liquid. Therefore, at the manufacturer's end, since the fluorine-based cleaning liquid is filled in the container to which a small amount of the dirt component is adhered, the dirt component in the fluorine-based cleaning liquid can be removed by the refining device even if the fluorine-based cleaning liquid is mixed with the dirt component. Since 5 321091 200946253 is purified, it can be supplied to the cleaned environment, and the fluorine-based cleaning liquid can not be contacted. According to the present invention, it is possible to prevent: the sub-assembly. In other words, the quality of the subcomponents is reduced. Therefore, the present invention is capable of responding to the 日 wafer of the 矽矽 wafer, the imperfection, the ceramic wafer, the cutting of the wafer, the cut piece, The glass enamel is made of ceramic enamel crystal, glass substrate, metal substrate, color _^; you ^ bar / enamel substrate, printed substrate, and miniaturization. Further, and further high density of parts

此外，可㈣地以高純度之_清淨化 來凊洗電子組件，而能確保穩定的清洗品質。 此外，由於基本上無須進行盡 及翁金、主* — ^ 订氣糸清洗液的更換作業i 及氟糸清洗液的廢液處理，因此如 沐太丄 此把大幅降低伴隨這些作！ 所產生的龐大勞力、資源、以及 久粑量的浪費，結果能大巾 降低電子組件的清洗處理的成本。 【實施方式】 〇 本發明的電子組件的清洗方法係包含有：精製步驟， 係藉由精製裝置精製未使社含氟有機清洗劑組成物液； 凊洗步驟，係使用從前述精製裝置供給至清洗裝置内之精 製後的清洗劑組成物液來清洗電子組件；以及循環供給步 驟，係將使用於清洗的清洗液從清洗裝置輸送至前述精製 裝置’將使用完畢的清洗液予以再精製，並循環供給至清 洗裝置；在前述精製步驟中，至少進行藉由精餾裝置所進 行之有機性污染物的去除、以及藉由過濾裝置所進行之固 321091 6 200946253 體污染物的去除，並任意地進行藉由水清洗裝置所進行的 水溶性污染物的去除。 在前述精製步驟中，去除有機性污染物、水溶性污染 物、固體污染物之順序雖為任意，但從有效地去除各種污 染物的觀點而言，較佳為以有機性污染物、水溶性污染物、 固體污染物的順序，或者以水溶性污染物、有機性污染物、 固體污染物的順序予以去除，以精製清洗劑組成物液。 此清洗方法雖未限定電子組件，但可應用於清洗要求 ©以高純度的氟系清洗液所進行的高清淨化之矽晶圓、陶瓷 晶圓、切斷前述矽晶圓所得之矽晶片、切斷前述陶瓷晶圓 所得之陶瓷晶片、玻璃基板、金屬基板、彩色濾光片基板、 印刷基板、以及使用該等之電子組件等電子組件。 該清洗方法亦能作為其他的電子組件的清洗方法來 使用，例如亦能作為液晶單元、PDP(plasmadisplaypanel;In addition, the electronic components can be washed with high-purity purification to ensure stable cleaning quality. In addition, since there is basically no need to carry out the replacement of the Weng Jin, the main * - ^ 糸 糸 cleaning liquid and the waste liquid treatment of the fluorocarbon cleaning liquid, it is greatly reduced with the use of such a work! The enormous labor, resources, and waste of long-term production have resulted in a reduction in the cost of cleaning the electronic components. [Embodiment] The method for cleaning an electronic component according to the present invention includes: a purification step of purifying a non-organic fluoroorganic detergent composition liquid by a refining device; and a rinsing step using the refining device Cleaning the electronic component by cleaning the purified cleaning agent composition liquid in the apparatus; and circulating the supply step of conveying the cleaning liquid used for cleaning from the cleaning device to the refining device to re-refin the used cleaning solution, and Circulatingly supplied to the cleaning device; in the above-mentioned refining step, at least the removal of the organic contaminant by the rectification device, and the removal of the solid contaminant by the filtration device, and optionally The removal of the water-soluble contaminants by the water washing device is performed. In the above-mentioned refining step, the order of removing organic contaminants, water-soluble contaminants, and solid contaminants is arbitrary, but from the viewpoint of effectively removing various contaminants, it is preferable to use organic contaminants and water-soluble. The order of contaminants and solid contaminants is removed in the order of water-soluble contaminants, organic contaminants, and solid contaminants to refine the detergent composition liquid. Although the cleaning method is not limited to an electronic component, it can be applied to a cleaning process: a high-purity fluorine-based cleaning liquid for high-definition purification of a wafer, a ceramic wafer, a wafer obtained by cutting the wafer, and cutting. A ceramic wafer, a glass substrate, a metal substrate, a color filter substrate, a printed substrate, and an electronic component using the electronic component obtained by the ceramic wafer are cut off. The cleaning method can also be used as a cleaning method for other electronic components, for example, as a liquid crystal cell, a PDP (plasma display panel;

電漿顯示器）面板、壓膜（stamper)、塑模、磁頭、VCM 瘳（voice-coil ;發聲圈馬達）、HAS (取“如仏Plasma display) panel, stamper, mold, magnetic head, VCM voice (voice-coil; vocal ring motor), HAS (take "such as 仏

Assembly;磁頭組合）、以及卡匣等的清洗方法來使用。 在本發明中，就氟系清洗液而言，亦能使用適用於電 子組件的清洗之清洗液。 就含氟有機清洗劑組成物液而言，係能例舉分子量未 滿1000且骨架中含有碳原子與氟原子，在室溫中為液狀且 具有揮發性之氟化合物。該氟化合物雖未特別限定，但從 防止地球暖化的觀點來看，為了縮短在大氣中的壽命，較 佳為復含有氫原子。此外，亦可含有氧原子、硫石黃肩子、 321091 7 200946253 二:原IT異質原子。碳骨架係可為直鏈(iln㈣狀 '分 或％狀中的任一者，亦可具有雙鍵或三鍵。 作為具有此種特性的氟㈣洗液，係 —七氟基醚、以1，3,3—五氟 丁燒、1，1，2,2,3,3,4 1，心仏二’其中，… 〇 上的=2：^氣罐咖為—種或兩種以 種以為㈣料㈣其他錢㈣的—種或兩 f的一。就有機溶劍而言，係能例舉例如2—丙 機酸=醇等醇類、丙酮等_、二乙趟等_、乙酸等有 機酸類、乙酸乙酯等酯類、_ w 化烴類等。 一乳乙却、二氣五氟丙燒等鹵 〇 有$曰有因應電子組件和污垢的 作〜與=rjr醇類)—=:) 佳為::沸=:r為具有共綠成之混合物時’較 洗系Γ著’說明以此清洗方法清洗電子組件之本發明的清 料==:?洗方法清洗電子組件，該清 先糸統具儀有.精製裝置，係去除未使用的錢有機清洗 321091 200946253 劑組成物液所含有的污染物並予以精製；以及清洗裝置， 係使用由該精製裝置所精製的前述清洗劑組成物液來清洗 電子組件；前述精製裝置係至少具備有用以去除有機性污 染物之精餾裝置、及用以去除固體污染物之過濾裝置；於 前述精顧裝置及前述過濾、裝置流通前述清洗劑組成物液並 予以精製；藉由前述精製裝置將在前述清洗裝置内使用於 電子組件的清洗的清洗液予以再精製，並循環供給至清洗 裝置。 ® 該精製裝置亦可復具備有用以去除水溶性污染物之 水清洗裝置、以及用以去除水分之水分去除裝置。 在前述精製裝置中，精餾裝置、水清洗裝置、水分去 除裝置、過濾裝置的配置順序雖為任意，但如前述從有效 地去除各污染物的觀點來看，精製裝置較佳為以精餾裝 置、水清洗裝置、水分去除裝置、以及過遽裝置的順序， 或者是以水清洗裝置、水分去除裝置、精餾裝置、以及過 Q 濾裝置的順序流通前述清洗劑組成物液並予以精製。 (清洗裝置的說明） 在本發明中，前述清洗裝置只要構成為收容用以去除 附著於電子組件的污垢之氟系清洗液，且在清洗裝置内清 洗電子組件即可，並無特別限定。 就清洗裝置的構成而言，係能例舉例如具備有：洗滌 槽，係被供給有由精製裝置所精製的氟系清洗液；清洗槽， 係收容從該清洗槽溢出的氟系清洗液並予以加熱；蒸氣滯 留部，係滞留有在該清洗槽内加熱而氣化的氣系清洗液的 9 321091 200946253 蒸氣；以及蒸氣凝結部，係使該蒸氣滯留部的蒸氣凝結並 回流至前述洗滌槽；將電子組件浸潰於前述清洗槽内的氟 系清洗液中予以清洗，並將清洗後的電子組件浸潰於前述 洗滌槽内的氟系清洗液中予以洗滌，再以蒸氣滯留部的前 述蒸氣將洗滌後的電子組件予以蒸氣清洗。具體而言，能 使用例如日本特開平8-243515號公報或曰本特開平 10-192797號公報等記載的公知多槽式清洗裝置。 此外，清洗裝置亦可構成為復具備有淋浴喷嘴，從前 述淋浴喷嘴喷出由精製裝置所精製的氟系清洗液，並將前 述蒸氣清洗後的電子組件予以淋浴清洗。 依據此構成，能進一步提高藉由本發明的清洗系統之 電子組件的清淨度。 (精製裝置的說明） 本發明的前述精製裝置係為因應污垢的種類將混入 於未使用的氟系清洗液中的污垢成分予以去除之裝置，如 上所述，至少具備有用以去除有機性污染物之精餾裝置以 及用以去除固體污染物之過濾裝置，並且亦可具備有用以 去除水溶性污染物之水清洗裝置、用以去除水分之水分去 除裝置、以及用以去除離子性污染物之離子性污染物去除 裝置。 在本發明中，就污染物的種類而言，係能例舉前述有 機性污染物、水溶性污染物、離子性污染物、以及固體污 染物。就此等各種污染物而言，具體而言可例舉下述者。 就有機性污染物而言，可例舉氟油（例如Krutox (註 10 321091 200946253 冊商標））、氟聚合物等。 就水溶性污染物而言，可例舉異丙醇（isopropyl alcohol)、乙醇等醇類、丙銅等酮類等。 就離子性污染物而言，可例舉氟離子、硝酸離子、碳 酸氫離子、銨離子、鈉離子等離子類。 就固體污染物而言，可例舉塑膠或彈性體（elastomer) 等有機高分子化合物粒子、金屬粒子、以及粉塵等。 以下，說明精製裝置的具體構成。此外，精製裝置當 ® 然亦可具有用以去除前述以外的污染物之裝置。 <精餾裝置> 就精餾裝置而言，係能構成為藉由利用氟系清洗液的 沸點與有機性污染物的沸點之差（以下稱為「沸點差」） 的熱交換作用，去除未使用的氟系清洗液中所含有的有機 性污染物。 例如，在沸點差較小的情形時，氟系清洗液與有機性 φ 污染物的分離係需要複數次的熱交換作用，並選擇具有高 度的回流功能之精餾裝置，而在沸點差較大的情形時，則 選擇在使單蒸餾裝置或氟系清洗液不會沸騰之情形下進行 加溫的加溫裝置。 如此，精餾裝置係因應氟系请洗液與有機性污染物的 沸點差或電子組件所需的清淨度適當地選擇最佳的裝置。 此外，在精餾裝置（例如蒸餾裝置）與清洗裝置一體 化的情形時，精製裝置係能省略精餾裝置。 <水清洗裝置> 11 321091 200946253 由於使I系清洗液接觸水並將水溶性污染物溶入水 中係可有效地進行氟系清洗液中所含有的水溶性污染物的 去除’因此水_裝置係適合作為水清洗裝置。雖然接觸 方法並未特職定’但考慮到簡便性及操作性，較佳為向 流型接觸方法。 就此種水接觸裝置而言，可例舉例如於上游端具有清 洗液流入口及水排出口且下游端具有清洗液排出口及水流 入口之筒體的内部配置複數個區隔板或填充填充物，藉此 提高在内部麵路徑的氟系清洗液與水㈣觸率之水接觸 〇 裝置。此種構成的水接觸裝置較佳為於上部配置上游端， 於下部配置下游端，從上方朝下方使氣系清洗液流入從下 方朝上方流動的水流中。 此外’由於藉此使氟系清洗液與水接觸，藉此使微量 的水溶解純》清統巾，因此於錢觸裝置的下游側併 設用以去除氟系清洗液中的水分之前述水分去除襄置 ❹ 此外’如前所述’在清洗液由氧系清洗液與ς溶性有 機洛劑之混合物所構成的情形時，精製裝置 立 裝置與水分去除裝置。 水/月/先 <水分去除裝置> 就水分去除裝置而言，係可例舉例如於上游端呈 洗^流入π且下游端具有清洗液排出α之筒體的内部填充 二St)在為:表性的粒狀吸收材料而構成的水分 去除f置。此外，在水溶性污染物亦具有離子性的 藉由則述水接縣置與水分去除裝置所騎的水溶性污染 321091 12 200946253 物的去除亦兼具離子性污染物的去除。 此外，由於吸濕材料的水分吸附量有所極限，因此水 分去除裝置亦可具備用以將吸附於吸濕材料的水分排出至 外部的水分排出手段。 就水分排出手段而言，係能使用下述構成者：具備有 例如：空氣流入口與空氣排出口，係形成於水分去除裝置 的上游端與下游端；帶狀加熱器（band heater)，係捲繞 於用以將熱風吹入至空氣流入口之熱風供給裝置、或用以 ® 將室溫空氣吹入至空氣流入口之送風機及筒體，並加熱内 部；藉由使經過加熱的空氣流通於筒體，而使吸濕材料乾 燥。 此外，水分去除裝置較佳為排列設置兩個以上。如 此，由於能在一個水分去除裝置的吸濕材料乾燥中時以另 一個水分去除裝置進行氟系清洗液中的水分去除，因此能 提高精製裝置所進行的氟系清洗液的清淨化效率。 φ 此外，以透明窗構成筒體的周圍壁的一部分，且將以 藍色矽膠為代表的飽和指示材料與吸濕材料預先混合，藉 此能藉由飽和指示材料的顏色目視吸濕材料的吸濕程度 (乾燥程度）。或者，亦可於水分去除裝置的下游測設置 水分測量裝置，以水分測量裝置測量有助於乾燥的空氣中 的水分率，藉此調查吸濕材料的乾燥程度。 此外，為了提升以吸濕材料進行的水分去除效率，利 用氟系清洗液的比重與溶解於氟系清洗液中的水分的比重 之差將氟系清洗液與水予以分離之水分離器，亦可設置於 17 321091 200946253 水接觸裝置與水分去除裝置間。 <離子性污染物去除裝置> 就離子性污染物去除裝置而言，係可例舉例如於上游 端具有清洗液流入口且下游端具有清洗液排出口的筒體内 部填充氧化紹凝膠（alumina gel )而構成的離子性污染物 去除裝置。 <過濾裝置> 就用以去除固體污染物之過濾裝置而言，係能例舉於 用以使氟系清洗液通過之筒體内設置精密過濾膜或超過濾 膜等過濾裝置。在此情形中，以過濾裝置所去除的固體污 染物係藉由濾心的交換而從筒體内排出至外部。此外，亦 可組合複數個相同的過濾膜或不同的過濾膜來使用。 以有效地去除前述各種污染物的觀點來看，本清洗系 統中的精製裝置較佳為以從上游朝向下游，亦即以精餾裝 置、水清洗裝置、水分去除裝置、以及過濾裝置的順序、 或者以水清洗裝置、水分去除裝置、精餾裝置、以及過濾 裝置的順序以配管連續性地連接各裝置。此外，在精製裝 置具有離子性污染物去除裝置的情形時，只要在水清洗裝 置與水分去除裝置之間以外，離子性污染物去除裝置的設 置位置並未限定。 本清洗系統係以配管連接以配管連續連接各種污染 物去除裝置之精製裝置與清洗裝置使其一體化，藉此可將 從未使用的氟系清洗液連續地去除各種污染物而精製的高 純度氟系清洗液直接供給至清洗裝置而不會與外部環境接 14 321091 200946253 觸。此外，在精製裝置中，為了不使未使用的氣系清 的移送停滯，係將例如泵式或空氣式的移送手段設置於= 管中途，或藉由重力差移送氟系清洗液。 5配 <其他構成> 本清洗系統亦可於前述精製裝置與前述清洗襞置之 間復具備暫時地儲留清洗劑組成物液之緩衝样。 在將緩衝槽設置於清洗裳置的下游側之情形時，在藉 由精製裝置將清洗裝置内辦污的使用完畢的氣系清洗^ 以再精製時，一邊將使用完畢的氟系清洗液移送至緩衝 槽’一邊從精製裝置將精製完畢的氟系清洗液供給至清洗 裝置，於清洗裝置進行清洗步驟的期間，將使用完畢的氣 系清洗液從再生用缓衝槽供給至精製裝置以進行再精製。 此外，於清洗裝置的上游侧設置另一個緩衝槽時，能將再 精製的氣系清洗液連續地送入至該另一個緩衝槽，以作為 下一批次用的氟系清洗液予以儲留。 ❿ 本發明的清洗系統係以循環配管連接以配管連續性 地連接前述各污染物去除裝置之精製裝置與清洗裝置而成 為一體化，藉此能將從未使用的氟系清洗液連續地去除各 種污染物而精製成的高純度氟系清洗液直接供給至清洗裝 置而不會與外部環境接觸。此外，由於在同一系統路徑内 進行再精製（再生）而無須將清洗後髒污的氟系清洗液排 出至外部，因此能重複使用未從外部混入污染物之高純度 再生的氟系清洗液。 此外，在本清洗系統中，為了不使氣系清洗液的移送 15 321091 200946253 停滯，係可將例如泵式或空氣式的移送手段設置於配管的 中途，亦可藉由重力差移送清洗液。 (清洗方法的說明） 在上述構成的清洗系統中，用以清洗電子組件之本發 明的清洗方法亦可包含清洗液補給步驟，係將所精製的氟 系清洗液從精製裝置補給至清洗裝置。 此外，清洗步驟亦可為將電子組件浸潰於清洗槽内的 氟系清洗液中進行清洗，將清洗後的電子組件浸潰於洗滌 槽内的氟系清洗液中予以洗滌，以蒸氣滞留部的蒸氣將洗 滌後的電子組件予以蒸氣清洗，藉由來自淋浴喷嘴之精製 完畢的氟系清洗液將經過蒸氣清洗的電子組件予以淋浴清 洗。 以下，參照附圖詳細說明本發明的實施形態。此外， 本發明並未限定於以下例示的實施形態。 (實施形態一） 第1圖係顯示本發明的清洗系統的實施形態一的概略 構成圖。 實施形態一的清洗系統係由清洗裝置10、以及藉由循 環配管31而與清洗裝置10連接的精製裝置20所構成。 清洗裝置10係具備有：上方為開口狀的主體11、配 置於主體11内下部的清洗槽12與洗滌槽13、以及沿著主 體11的上部開口緣配置的蒸氣凝結部14,於清洗槽12與 洗滌槽13的内部收容有氟系清洗液C。此外，在第1圖中， 二點鏈線係表示氟系清洗液C的液面，氟系清洗液C的量 16 321091 200946253 係設定成清洗槽12的液面恆常地低於洗滌槽13的液面。 清洗槽12係於内部底面具有加熱器12a，藉由加熱器 12a加熱清洗槽12内的氟系清洗液C。此外，清洗槽12 内之被加熱的氟系清洗液C的一部分係變成蒸氣而上升， 於清洗槽12及洗滌槽13的上方形成氟系清洗液C的蒸氣 層S。此外，在第1圖中，虛線係表示蒸氣層S與大氣的 交界。 洗務槽13係於内部底面具有超音波產生機13a，藉由 ® 超音波產生機13a對洗滌槽13内的氟系清洗液C施予超 音波。 蒸氣凝結部14係具備有：凝結管14a，係沿著主體 11的上部開口緣的内面而設置；未圖示的冷卻循環部，係 使冷煤循環於凝結管14a内；排水槽部14b，係設置於凝 結管14a的下部；以及水分離器14c，係經由配管連接排 水槽部14b及洗滌槽13。 〇 蒸氣層S中的蒸氣的一部分係與凝結管14接觸而喪 失熱能，藉此會液化而聚集至排水槽部14b。由於液化的 氟系清洗液C係含有空氣中的水蒸氣所凝結的水分，因此 氟系清洗液C係從排水槽部14b導入至水分離器14c内而 與水分離，比重比氟系清洗液C還小的水係從水分離器14c 上部的排水口排出至外部，氟系清洗液C係從水分離器14c 下部的開口經過配管而導入至洗滌槽13内。 精製裝置20係藉由配管從上游側依序串聯連接有： 構成用以去除水溶性污染物的水清洗裝置之水接觸管柱 17 321091 200946253 21、構成水分去除裝置之水分離器22與吸濕材料管柱23、 構成離子性污染物去除裝置之離子性污染物去除管柱 24、構成用以去除有機性污染物的精餾裝置之加熱器内建 型蒸餾塔25、以及用以去除固體污染物之過濾裝置26。 水接觸管柱21係於上部的上游端具有清洗液流入口 與水排出口，並於下部的下游端具有清洗液排出口與水流 入口，清洗液流入口係經由配管連接用以將未使用的氟系 清洗液C導入至内部之給料斗（hopper ) 21 a，水流入口係 經由配管連接未圖示的水供給源。 此外，過濾裝置26係以配管連接清洗裝置10的洗滌 槽13。 使用該清洗系統之清洗方法係包含有：精製步驟，係 將未使用的氟系清洗液供給至精製裝置20予以精製；清洗 步驟，係藉由清洗裝置10内的氟系清洗液C清洗電子組 件；以及循環供給步驟，係將使用於清洗的氟系清洗液從 清洗裝置10移送至精製裝置20，將使用完畢的氟系清洗 液予以再精製，並循環供給至清洗裝置10。 <關於精製步驟> 在水接觸管柱21内，氟系清洗液係從上方流入，水 係從下方流入。在氟系清洗液中含有水溶性污染物的情形 時，在氟系清洗液下降的期間去除水溶性污染物後，移送 至水分離器22。此外，從水接觸管柱21的上部排出處理 所使用的水。 由於移送至水分離器22的氟系清洗液含有微量的 18 321091 * 200946253 水，因此在水分離器22内氟系清洗液與水係分離成下層與 上層，下層的氟系清洗液係移送至吸濕材料管柱23。此 外，從水分離器22的上部排出分離的水。 由於移送至吸濕材料管柱23的氟系清洗液含有微量 的水分，因此藉由吸濕材料（例如沸石）去除水分後，氟 系清洗液係移送至離子性污染物去除管柱24。 在移送至離子性污染物去除管柱24的氟系清洗液中 含有離子性污染物之情形時，在離子性污染物去除管柱24 ® 内藉由離子性污染物去除材料（例如氧化鋁凝膠）去除該 離子性污染物後，氟系清洗液係移送至蒸餾塔25。 在移送至蒸餾塔25的氟系清洗液中含有有機性污染 物之情形時，藉由使用有機性污染物與氟系清洗液的沸點 差之蒸餾塔25内的蒸餾操作去除該有機性污染物後，氟系 清洗液係移送至過濾裝置26。 在移送至過濾裝置26的氟系清洗液中含有固體污染 φ物的情形時，藉由具有精密過濾膜舆超過濾膜之過濾裝置 26去除固體污染物。此外，有時固體污染物亦會含有上游 側的吸濕材料或離子性污染物去除材料。 如此，通過水接觸管柱21、水分離器22、吸濕材料 管柱23、離子性污染物去除管柱24、蒸餾塔25、以及過 濾裝置26之氟系清洗液係成為未含有水溶性、離子性、有 機性、以及固體性的污染物之以高純度所精製的氟系清洗 液C，將精製過的氟系清洗液C供給至清洗裝置10的空 的洗滌槽13内，並將從洗滌槽13溢出的氟系清洗液C供 19 321091 200946253 給至清洗槽12。 <關於清洗步驟> 在清洗步驟中，首先，將電子組件浸潰於清洗槽12 内之經過加熱的氟系清洗液C中，去除電子組件表面的髒 污（主要為有機性污染物）。 接著，將電子組件浸潰於洗滌槽13内的氟系清洗液C 中。由於洗滌槽13内的氟系清洗液C係保持於比清洗槽 12内的氟系清洗液C還低的溫度，因此在洗滌槽13内冷 卻電子組件。此外，由於在洗滌槽13中藉由超音波產生機 13a對氟系清洗液C施予超音波，因此在清洗槽12中未被 去除而殘留於電子組件表面的髒污係藉由超音波的作用而 從電子組件剝離去除。 之後，從洗滌槽13撈出電子零件並導入至蒸氣層S， 藉由在電子組件表面凝結液化的氟系清洗液進行最後的洗 滌，從清洗裝置10上方的開口部取出電子組件。 在清洗步驟中，在凝結部14凝結液化之清淨的氟系 清洗液係在進行水分離後返回洗滌槽13，隨著電子組件從 清洗槽12帶入至洗滌槽13的污染物係藉由溢流而返回清 洗槽12。 在該清洗步驟中，由於能使用進一步提高未使用的氟 系清洗液的純度之氟系清洗液來清洗電子組件，因此能進 一步地提升電子組件的清淨度。 此外，在清洗步驟中，能將清洗槽12内髒污的氟系 清洗液C通過循環配管31連續或間歇地導入至精製裝置 20 321091 200946253 20的水接觸管柱21，使氟系清洗液依序通過水接觸管柱 21、水分離器22、吸濕材料管柱23、離子性污染物去除管 柱24、蒸餾塔25、以及過濾器26，將各種污染物予以去 除，並將氟系清洗液予以再生，再通過循環配管31將再生 的氟系清洗液連續或間歇地供給至清洗裝置10的洗滌槽 13。因此，能一邊將未含有污染物的清淨的氟系清洗液隨 時供給至洗滌槽13，一邊清洗電子組件。 此外，亦可在清洗裝置10中進行預定個數的電子組 ϋ ¥ 件的清洗處理（1批次清洗處理）後，一邊從清诜裝置10 連續地將髒污的氟系清洗液導入至精製裝置20並予以再 生，一邊使再生的氟系清洗液循環至清洗裝置10。 此外，在因清洗裝置10反覆進行電子組件的清洗處 理而使内部的氟系清洗液C減少時，亦能於请洗中及/或 清洗後將精製的氟系清洗液補充至洗滌槽13。 此外，在本清洗系統中，亦可更換經再生而重複使用 φ過的敗系清洗液C。 此時，開啟設置於清洗槽12與洗滌槽13底部之未圖 示的排出口的閥，將内部使用完畢的氟系清洗液回收至回 收容器，並依需要以由精製裝置20所精製的氟系清洗液C 清洗空的清洗裝置10的内部，關閉前述排出口後，如前述 將由精製裝置20所精製的氟系清洗液C導入至洗滌槽13 與清洗槽12。 此外，所回收之使用完畢的氟系清洗液係被廢棄處 分，或亦可藉由再生裝置予以再生，並將再生的氟系清洗 21 321091 200946253 液直接導入至清洗襞置10並予以再使用，亦可藉由精製裝 置進一步提高純度後導入至清洗裝置並予以再使用。 (實施形態二） 第2圖係本發明的清洗系統的實施形態二的概略構成 圖。 與實施形態一相同，實施形態二的清洗系統係由清洗 裝置100以及藉由配管連接清洗裝置1〇〇之精製裝置200 所構成’但清洗裝置1〇〇與精製裝置2〇〇的構成係與實施 形態一些微不同。 〇 以下’主要說明實施形態二中之與實施形態一的不同 點。 清洗裝置100係具備有：上方為開口狀的主體110、 配置於主體110内的下部之清洗槽120與洗滌槽130、沿 著主體110的上部開口緣而配置的蒸氣凝結部140、與清 洗槽120鄰接配置的蒸氣產生槽15〇、以及配置於蒸氣產 生槽150上方的蒸餾塔16卜 ❹ 與實施形態一相同，清洗槽120係具有加熱器120a， 洗滌槽130係具有超音波產生機i3〇a，蒸氣凝結部140係 具有凝結管140a、排水槽部140b、以及水分離器140c。 此外’亦可取代加熱器12〇a，將超音波產生機設置於清洗 槽120内。 蒸氣產生槽150係從蒸氣凝結部140設置於外侧，於 内部底面具有加熱器150a。 主體110係具有覆蓋蒸氣產生槽150上方之部分，於 22 321091 200946253 該部分搭載蒸餾塔160。此外，蒸餾塔160與蒸氣產生槽 150係藉由形成於主體110的連通孔而相互連通。 此外，於蒸餾塔160的上端形成有用以排出蒸氣之排 出口，該排出口係經由循環配管310而與後述的精製裝置 200的水接觸管柱210連接。 藉由清洗裝置100所進行的電子組件的清洗步驟亦與 實施形態一相同，首先，電子組件係浸潰於清洗槽120内 之經過加熱的氟系清洗液C中進行清洗，接著浸潰於洗滌 ® 槽130中之施予有超音波的氟系清洗液C中進行洗滌，撈 出至清洗槽120内之加熱後的氟系清洗液C所氣化的蒸氣 層S中予以蒸氣清洗後，取出至外部。 在此期間，溢流出清洗槽120的氟系清洗液C係被導 入至蒸氣產生槽150内，在蒸氣產生槽150内被加熱而氣 化的氟系清洗液C的蒸氣的一部分係通過蒸餾塔16 0與循 環配管310而導入至精製裝置200。亦即，在清洗步驟中， ❹清洗槽120内癖污的氟系清洗液係流入至蒸氣產生槽 150，含有有機污染物的氟系清洗液係於蒸氣產生槽160 氣化，該蒸氣中的有機污染物的蒸氣係藉由蒸餾塔160而 冷卻、液化並返回蒸氣產生槽160,僅未含有機污染物的 氟系清洗液的蒸氣通過蒸餾塔160,並在通過循環配管310 的期間冷卻液化，未含有機污染物的氟系清洗液係被導入 至精製裝置200。 精製裝置200係構成為以配管連續地串聯連接有：連 接有給料斗210a之水接觸管柱210、水分離器220、吸濕 23 321091 200946253 管柱230、離子性污染物去除管柱240、以及過濾器260。 如上所述，水接觸管柱210係構成為藉由循環配管310而 與清洗裝置100的蒸留塔160連接，過濾器260係構成為 藉由循環配管310而與清洗裝置100之洗滌槽130連接。 依據該實施形態二的清洗系統，能將經過藉由精製裝 置200進行未使用的氟系清洗液中的有機性污染物以外的 水溶性污染物的去除、離子性污染物的去除、以及固體污 染物的去除而精製的氟系清洗液導入至清洗裝置100的洗 滌槽130，一邊藉由清洗裝置100清洗電子組件，一邊藉 由蒸餾塔160以及精製裝置200將含有各種污染物的氟系 清洗液予以清淨化及再生，並將再生的氟系清洗液循環供 給至清洗裝置100。此外，在因清洗裝置100反覆進行電 子組件的清洗處理而使内部的氟系清洗液C減少時，能在 清洗中及/或清洗後，將精製過的氟系清洗液補充至洗滌 槽 130。 (實施形態三） 第3圖係顯示本發明的清洗系統的實施形態三的概略 構成圖。 實施形態三的清洗系統係在第1圖所說明的實施形態 一的清洗系統中的清洗裝置10的洗滌槽13與精製裝置20 的過濾器26之間復具備有用以暫時儲留精製過的氟系清 洗液之緩衝槽41。 依據實施形態三的清洗系統，由於能在以清洗裝置10 清洗電子組件的期間精製下一批量以上的氟系清洗液並預 24 321091 200946253 先儲留於緩衝槽41内，因此能提升清洗系統所進行的清洗 處理的效率。此外，能在結束清洗裝置10所進行的第一批 次的清洗處理後，將清洗裝置10内髒污的氟系清洗液導入 至精製裝置20並予以再精製，在此期間係將缓衝槽41内 精製的第二批次的氟系清洗液供給至清洗裝置10，並於緩 衝槽41内儲留再精製的氟系清洗液，藉由清洗裝置10進 行第二批次的清洗處理，之後反覆進行此等步驟。此外， 亦可將缓衝槽41所儲留的精製後的氟系清洗液的一部分 ® 隨時補充至清洗中的清洗裝置10。 此外，精製用緩衝槽41的位置亦可位於蒸餾塔25與 過濾器26之間、離子性污染物去除管柱24與蒸餾塔25 之間、吸濕材料管柱23與離子性污染物去除管柱24之間、 或清洗裝置10與水接觸管柱21之間。此時，於缓衝槽41 暫時地儲留精製中、再生中或再生前的氟系清洗液。 此外，在實施形態三中，缓衝槽亦可配置於清洗裝置 φ 10的清洗槽12與精製裝置20之間，或亦可配置於清洗裝 置10的上游侧與下游侧雙方。 此外，具備有此種構成的缓衝槽41之構成，除了實 施形態一的清洗系統之外，亦能應用於上述實施形態二的 清洗系統。 (實施形態四） 第4圖係顯示本發明的清洗系統的實施形態四的概略 構成圖。 實施形態四的清洗系統係構成為具備有與第1圖所說 25 321091 200946253 明的實施形態一相同的清洗裝置10與精製裝置20’清洗 裝置1G復具備有淋浴喷嘴17,從前述淋浴喷嘴17噴出由 精製裝置20所精製的氣系清洗液，將蒸氣清洗後的電子植 件予以淋浴清洗。此外，在第4圖中，與第i圖相同的構 成要素係附上相同的符號。 以下，主要說明實施形態四中之與實施形態-的不同 點。 在實施形態四中，例如將淋浴喷嘴17配置於清洗裝 置10中的洛氣滯留部S的上方且為接近清洗槽12的主體 11、的上緣附近，並設置分歧配管28 ’連接分歧配管28與 ，冷喷嘴17’該分歧配管28係從連接精製裝置2〇的過據 =26與/月洗裝置1〇之循環配管31的中途分歧。此外，於 歧-笞28的中途设置開閉閥，並於比循環配管31 的分歧配管2 8更下游侧之位置設置開閉閥3 i a。 依據此種構成，能於清洗步驟中關閉開閉闕27a，開 啟開閉閥28a’從淋浴喷嘴17喷出由精製裝置2〇所精製 =亂系清洗液’將#由蒸氣滯留部的蒸氣s進行蒸氣清洗 i的電子組件予以淋浴清洗。此外，能使供淋浴清洗用的 系清洗液落人清洗槽12中’在清洗槽12内予以再利用。 …因此’即使蒸氣s中含有有機性污染物的蒸氣，且於 蒸氣清洗後的電子組件的表面殘留有機性污染物，亦能藉 由精製過的淋浴狀的氟系清洗液沖洗電子組件表面的有機 性污染物，而進一步提升電子組件的清淨度。 此外’可進行此種琳浴清洗之構成，除了實施形態— 321091 26 200946253 的清洗系統之外，亦能應用於上述實施形態二與實施形態 三的清洗系統。 其中，較佳為構成為能從精製用緩衝槽41 (參照第3 圖）隨時將精製完畢的氟系清洗液供給至淋浴喷嘴17。 (實施形態五） 第5圖係顯示本發明的清洗系統的實施形態五的概略 構成圖。 實施形態五的清洗系統除了與第1圖所說明的實施形 ® 態一的清洗系統中的清洗裝置10不同之外，係與實施形態 一相同。在第5圖中，與第1圖相同的構成要素係附上相 同的符號。 以下，主要說明實施形態五中之與實施形態一的不同 點。 實施形態五中的清洗裝置10A係具備有：主體11， 係具有上方開口部；蓋體11a，係可開閉地遮蔽主體11的 φ 上方開口部；以及清洗槽12與洗滌槽13，係階層式地配 置於主體11内的下部；於清洗槽12與洗滌槽13的内部收 容氟系清洗液C。氟系清洗液C的量係設為比清洗槽12 的液面恆常地低於洗滌槽13的液面。 此外，於清洗槽12與洗滌槽13的内部底面分別具有 超音波產生機13a，藉由各超音波產生機13a對清洗槽12 與洗滌槽13内的氟系清洗液C施予超音波。 在藉由該清洗裝置10 A進行電子組件的清洗時，打開 蓋體11a，首先，將電子組件浸潰於室溫的清洗槽12内的 27 . 321091 200946253 氟系清洗液c中，藉由超音波的作用剝離電子組件表面的 髒污。接著，將電子組件浸潰於室溫的洗滌槽13内的氟系 清洗液C中，藉由超音波的作用剝離殘留於電子組件表面 的髒污後，從清洗裝置10A的上方開口部取出電子組件。 如上所述，在實施形態五中，係省略實施形態一所進 行的蒸氣清洗。此外，除了電子組件的清洗步驟外，基本 上蓋體11a係關閉，且以灰塵、塵埃、髒物等不會進入清 洗槽12與洗滌槽13内之方式密閉清洗裝置10A内。 (實施形態六） 第6圖係顯示本發明的清洗系統的實施形態六的概略 構成圖。 實施形態六的清洗系統除了與第5圖所說明的實施形 態五的清洗系統中的清洗裝置10A不同之外，係與實施形 態五相同。在第6圖中，與第5圖相同的構成要素係附上 相同的符號。 以下，主要說明實施形態六中之與實施形態五的不同 點。 實施形態六中的清洗裝置10B係為於實施形態五中 的清洗裝置10A設置有淋浴喷嘴17 (參照第6圖）者。淋 浴喷嘴17係與實施形態四同樣，與精製裝置20連接。 在藉由清洗裝置10B進行電子組件的清洗時，與實施 形態五相同，電子組件係於清洗槽12與洗滌槽13清洗後， 藉由從淋浴喷嘴17所喷出之精製過的氟系清洗液C進行 淋浴清洗。或者，亦可省略清洗槽12的清洗與洗滌槽13 28 321091 200946253 的清洗中的一方或雙方，直接進行淋浴清洗。此外，淋浴 清洗亦可為高壓淋浴清洗。 (實施形態七） 第7圖係顯示本發明的清洗系統的實施形態七的概略 構成圖。 實施形態七的清洗系統除了與第1圖所說明的實施形 態一的清洗系統中的清洗裝置10不同之外，係與實施形態 一相同。在弟7圖中’與弟1圖相同的構成要素係附上相 ®同的符號。 以下，主要說明實施形態七中之與實施形態一的不同 點。 實施形態七中的清洗裝置10C係省略實施形態一中 的清洗裝置10的洗滌槽13。 在藉由清洗裝置10C進行電子組件的清洗時，電子組 件係不浸潰於清洗槽12内經過加熱的氟系清洗液C中， 0 而於蒸氣層S内進行清洗。此時，在電子組件冷卻的狀態 下置入於蒸氣層S内時，在組件表面上清洗液的蒸氣會凝 結並液化，藉此沖洗組件表面上的髒污。之後，暫時放置， 由於電子組件的溫度逐漸上升最後達到清洗液的沸點，因 此組件表面上的清洗液會氣化，電子組件則會乾燥。此外， 亦可於電子組件乾燥前從蒸氣層S取出電子組件，使電子 組件自然乾燥或藉由外部的乾燥裝置使其乾燥。 (其他實施形態） (1)在前述各實施形態中，亦可構成為設置用以循 29 .321091 200946253 環清洗裝置的洗滌槽内的氟系清洗液之循環路徑，於該循 環路徑設置過濾器，循環式地使洗滌槽内的氟系清洗液通 過過滤器而清淨化。依據此構成，即使在清洗前附著於電 子組件的固體污染物在洗滌槽内剝離而混入於氟系清洗液 中之情形時，亦能從洗滌槽内的氟系清洗液去除固體污染 物，而能進一步提高電子組件的清淨度。 (2) 在實施形態二（參照第2圖）的清洗系統中’ 雖構成為從精製裝置200的水接觸管柱210導入未使用的 氟系清洗液，然而亦可將未使用的氟系清洗液導入至清洗 裝置100的蒸氣產生槽150。依據此構成，未使用的氟系 清洗液係被蒸氣產生槽150内的加熱器150a加熱而變成蒸 氣，當該蒸氣含有有機性污染物時，已去除有機性污染物 的蒸氣係通過蒸餾塔160導入至精製裝置200。因此，能 將已去除有機性污染物之更高純度的精製氟系清洗液供給 至清洗裝置100的洗滌槽130内。 (3) 實施形態五至七（第5圖至第7圖）的清洗系 統亦可與實施形態三（第3圖）相同，具備緩衝槽41。 (實施例） 以下，列舉實施例進一步詳細說明本發明，但本發明 並未限定於這些實施例。 (實施例一） 就氟系清洗液而言，係於Vertrel(註冊商標）XF(DU PONT-MITSUI FLUOROCHEMICALS COMPANY，LTD.製 造）混合2—丙醇（以下記為IPA) 200重量ppm作為水 30 · 321091 200946253 溶性污染物，並混合Krutox(註冊商標）i43AC( DuPont，Inc· 製造）5重量ppm作為有機性污染物，以調配成具有模擬 癖污之氟系清洗液。 使用前述實施形態一（參照第1圖）中的精製裝置20 精製具有模擬髒污的前述氟系清洗液，使用水分計（曰本 三菱化學製造’ CA-06型）測量從精製後的氟系清洗液已 去除多少程度的各種污染物與水分，將測量結果顯示於表 一。此外，於離子性污染物去除裝置24使用分子篩 〇 (molecular sieve) 3A (UNION SHOWA K.K·製造），於 精館裝置25使用蒸館塔（歐德沙（oidershaw )型，40段）。 表一 精製前的氟系清洗液 精製後的氟系清洗液 水溶性污染物 (IPA) 166ppm 檢測限度以下 有機性污染物 (Krutox 143 AC) 5ppm 檢測限度以下 水分 224ppm 36ppm 從實施例一的結果確認到藉由本發明中的精製裝置 精製具有模擬髒污的氟系清洗液，能獲得高純度的氟系清 洗液。 (實施例二） 首先，調查使用於本發明的清洗系統之未使用的氟系 清洗液中含有何種的污染物，之後，與實施例一同樣地精 31 321091 200946253 製未使用的氟系清洗液，並與實施例一同樣地測量從精製 後的氟系清洗液已去除何種程度的各種污染物，將測量結 果顯示於表二。 就未使用的氟系清洗液而言，係使用18L鋼筒的前述 Vertrel XF (註冊商標）。 表二 精製前的氟系清洗液 精製後的亂糸清洗液 金屬 銅 0.03ppb 檢測限度以下 辞 0.14ppb 檢測限度以下 離子 F_離子 1.20ppb 檢測限度以下 NCV離子 0.07ppb 檢測限度以下 HCOO—離子 0.03ppb 檢測限度以下 NH/離子 0.08ppb 0.02ppb 從實施例二的結果確認到於未使用的氟系清洗液亦 含有複數種污染物，藉由精製裝置精製該氟系清洗液，可 獲得更局純度的氟糸清洗液。 (產業上的可利用性） 本發明的電子組件的清洗方法與清洗系統雖未限定 電子組件，但特別適合於清洗要求以高純度的氟系清洗液 進行高清淨化之石夕晶圓、陶兗晶圓、切斷前述石夕晶圓所得 之矽晶片、切斷前述陶瓷晶圓所得之陶瓷晶片、玻璃基板、 金屬基板、彩色濾光片基板、印刷基板、以及使用該等之 32 321091 200946253 電子組件等電子組件，且可恆常地長期間使用高度清淨化 的氟系清洗液。 【圖式簡單說明】 第1圖係顯示本發明的清洗系統的實施形態1的概略 構成圖。 第2圖係顯示本發明的清洗系統的實施形態2的概略 構成圖。 第3圖係顯示本發明的清洗系統的實施形態3的概略 ®構成圖。 第4圖係顯示本發明的清洗系統的實施形態4的概略 構成圖。 第5圖係顯示本發明的清洗系統的實施形態5的概略 構成圖。 第6圖係顯示本發明的清洗系統的實施形態6的概略 構成圖。 Q 第7圖係顯示本發明的清洗系統的實施形態7的概略 構成圖。 【主要元件符號說明】 10、 10A、10B、10C、100、100A、100B、100C 清洗裝置 11、 110 主體 11a 蓋體 12、 120 清洗槽 12a、150a 加熱器 13、 130 洗滌槽 33 321091 200946253 13a、130a 14 、 140a 14a、140a 14b ' 140b 14c 、 22 、 140c 17 20 、 200 21、210 21a、210a 23 、 230 24、240 25 ' 160 26 > 260 28 27a、28a 30 31 41 42 120a 150 310 C s 超音波產生機 蒸氣凝結部 凝結管 排水槽部 、220 水分離器 淋浴喷嘴 精製裝置 向流型水接觸管柱 給料斗 吸濕材料管柱 離子性污染物去除管柱 蒸餾塔 過濾器 分歧配管 開閉閥 再生裝置 循環配管 精製用緩衝槽 再生用緩衝槽 加熱器或超音波產生機 蒸氣產生槽 循環配管 含氟有機清洗劑組成物液（氟系清洗液） 蒸氣層 34 321091Assembly; head combination), and cleaning methods such as cassettes are used. In the present invention, as the fluorine-based cleaning liquid, a cleaning liquid suitable for cleaning of an electronic component can also be used. The fluorine-containing organic detergent composition liquid is exemplified by a fluorine compound having a molecular weight of less than 1,000 and having a carbon atom and a fluorine atom in the skeleton, and being liquid at room temperature and having a volatility. The fluorine compound is not particularly limited, but from the viewpoint of preventing global warming, it is preferable to further contain a hydrogen atom in order to shorten the life in the atmosphere. In addition, it can also contain oxygen atoms, sulfur yellow shoulders, 321091 7 200946253 2: the original IT heterogeneous atoms. The carbon skeleton may be any of a straight chain (iln) or a double bond, or may have a double bond or a triple bond. As a fluorine (tetra) lotion having such characteristics, it is a heptafluoroether, with 1 , 3,3 - pentafluorobutanol, 1,1,2,2,3,3,4 1, 仏 仏 ' 其中 其中 其中 其中 其中 其中 其中 其中 = = = = = = = = = = = = = = = = = 气 气 气 气 气 气It is thought that (4) materials (4) other money (four) of the species or two of the f. In the case of organic solvent-swords, for example, alcohols such as 2-propane acid = alcohol, acetone, etc. _, diethyl hydrazine, etc. Such as organic acids, esters such as ethyl acetate, _w hydrocarbons, etc.. A milk B, a gas, a non-halogen, a non-halogen, a halogen, etc. have a 曰 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子—=:) 佳为::Boiling=:r is a mixture with a green mixture. 'Washing the squatting' indicates that the cleaning of the invention is cleaned by this cleaning method ==: Washing method cleaning electronic components The cleaning device is provided with a refining device for removing uncontaminated money and cleaning the contaminants contained in the composition liquid of the organic solvent 321091 200946253; and the cleaning device is purified by the refining device. a cleaning agent composition liquid for cleaning an electronic component; the refining device is provided with at least a rectifying device for removing organic contaminants, and a filtering device for removing solid contaminants; and the foregoing filtering device and the foregoing filtering device The cleaning agent composition liquid is circulated and purified; the cleaning liquid used for cleaning the electronic component in the cleaning device is re-refined by the refining device, and is circulated and supplied to the cleaning device. ® This refining unit can also be equipped with a water cleaning device for removing water-soluble contaminants and a moisture removing device for removing moisture. In the refining device, the order of disposing the rectifying device, the water washing device, the moisture removing device, and the filtering device is arbitrary, but from the viewpoint of effectively removing each contaminant, the refining device is preferably rectified. The order of the apparatus, the water washing apparatus, the moisture removing apparatus, and the passing apparatus is either the order of the water washing apparatus, the water removing apparatus, the rectifying apparatus, and the passing Q filtering apparatus, and the cleaning agent composition liquid is flowed and refined. (Description of the cleaning device) The cleaning device is not particularly limited as long as it is configured to house a fluorine-based cleaning liquid for removing dirt adhering to the electronic component and to clean the electronic component in the cleaning device. In the configuration of the cleaning device, for example, a washing tank is provided, and a fluorine-based cleaning liquid purified by the refining device is supplied, and a cleaning tank is provided to store the fluorine-based cleaning liquid overflowing from the cleaning tank. Heating, the vapor retention portion is a 9 321091 200946253 vapor in which the gas-based cleaning liquid heated and vaporized in the cleaning tank is retained; and the vapor condensation portion is configured to condense and vaporize the vapor in the vapor retention portion to the washing tank The electronic component is immersed in the fluorine-based cleaning liquid in the cleaning tank, and the cleaned electronic component is immersed in the fluorine-based cleaning liquid in the washing tank to be washed, and then the steam retention portion is used as described above. The steam cleans the washed electronic components. Specifically, a known multi-tank cleaning device described in, for example, JP-A-H08-243515 or JP-A-10-192797 can be used. Further, the cleaning device may be configured to include a shower nozzle, and a fluorine-based cleaning liquid purified by the refining device is ejected from the shower nozzle, and the electronic component after the steam cleaning is shower-cleaned. According to this configuration, the cleanliness of the electronic component of the cleaning system of the present invention can be further improved. (Description of the refining device) The refining device according to the present invention is a device for removing dirt components mixed in an unused fluorine-based cleaning liquid in accordance with the type of the dirt, and as described above, at least useful for removing organic contaminants a rectifying device and a filtering device for removing solid contaminants, and a water cleaning device for removing water-soluble contaminants, a moisture removing device for removing moisture, and ions for removing ionic contaminants Sexual contaminant removal device. In the present invention, as the kind of the contaminant, the aforementioned organic pollutants, water-soluble contaminants, ionic contaminants, and solid contaminants can be exemplified. Specific examples of such various contaminants include the following. As the organic pollutant, a fluorine oil (for example, Krutox (note 10 321091 200946253)), a fluoropolymer or the like can be exemplified. The water-soluble contaminant may, for example, be an isopropyl alcohol or an alcohol such as ethanol or a ketone such as cupron. The ionic contaminant may, for example, be a fluoride ion, a nitrate ion, a hydrogen carbonate ion, an ammonium ion or a sodium ion. The solid contaminant may, for example, be an organic polymer compound particle such as a plastic or an elastomer, metal particles, or dust. Hereinafter, the specific configuration of the refining device will be described. In addition, the refining device can also have means for removing contaminants other than the foregoing. <Rectification Apparatus> The rectification apparatus can be configured to utilize a heat exchange effect of a difference between a boiling point of a fluorine-based cleaning liquid and a boiling point of an organic contaminant (hereinafter referred to as "boiling point difference"). Remove organic contaminants contained in unused fluorine-based cleaning solutions. For example, in the case where the difference in boiling point is small, the separation of the fluorine-based cleaning liquid and the organic φ pollutant requires a plurality of heat exchange effects, and a rectifying device having a high reflux function is selected, and the difference in boiling point is large. In the case of the case, a heating device for heating the single distillation apparatus or the fluorine-based cleaning liquid without boiling is selected. Thus, the rectification apparatus appropriately selects the optimum apparatus in accordance with the difference in boiling point between the fluorine-based washing liquid and the organic contaminant or the cleanness required for the electronic component. Further, in the case where the rectification apparatus (e.g., distillation apparatus) is integrated with the cleaning apparatus, the refining apparatus can omit the rectification apparatus. <Water cleaning device> 11 321091 200946253 Since the I-based cleaning liquid is brought into contact with water and the water-soluble contaminant is dissolved in the water, the removal of the water-soluble contaminant contained in the fluorine-based cleaning liquid can be effectively performed. The device is suitable as a water cleaning device. Although the contact method is not specific, it is preferred to the flow contact method in view of simplicity and operability. In the water contact device, for example, a plurality of partitions or filling fillers may be disposed inside the cylinder having the cleaning liquid inflow port and the water discharge port at the upstream end and the cleaning liquid discharge port and the water inflow port at the downstream end. Thereby, the water-contacting device of the fluorine-based cleaning liquid on the inner surface path and the water (four) contact rate is increased. In the water contact device of such a configuration, it is preferable that the upstream end is disposed at the upper portion, and the downstream end is disposed at the lower portion, and the gas-based cleaning liquid flows into the water flow flowing downward from the lower side from above. In addition, since the fluorine-based cleaning liquid is brought into contact with water, the trace amount of water is dissolved in the pure water, and the moisture removal in the fluorine-based cleaning liquid is removed on the downstream side of the money-contacting device. In addition, as described above, when the cleaning liquid is composed of a mixture of an oxygen-based cleaning solution and a cerium-soluble organic granule, the device and the moisture removing device are refining. Water / month / first <Moisture Removal Device> The water removal device may be, for example, an internal filling of the cylinder which has a washing liquid at the upstream end and a cleaning liquid discharge α at the downstream end. The moisture absorbing material formed by the particulate absorbing material is removed. In addition, the water-soluble pollutants are also ionic. The water-soluble pollution of the water-receiving and water-removing devices is also removed. The removal of the ionic pollutants is also included. Further, since the amount of moisture adsorbed by the moisture absorbing material is limited, the water removing device may be provided with a water discharging means for discharging the moisture adsorbed to the moisture absorbing material to the outside. In the water discharge means, the following components can be used: for example, an air inflow port and an air discharge port are formed at the upstream end and the downstream end of the moisture removing device; and a band heater is used. Winding on a hot air supply device for blowing hot air into the air inlet, or a blower and a cylinder for blowing room temperature air into the air inlet, and heating the inside; by circulating the heated air In the cylinder, the hygroscopic material is dried. Further, it is preferable that the moisture removing device is arranged in two or more. As a result, since the moisture in the fluorine-based cleaning liquid can be removed by the other moisture removing device while the moisture absorbing material of one moisture removing device is being dried, the cleaning efficiency of the fluorine-based cleaning liquid by the refining device can be improved. φ Further, a part of the surrounding wall of the cylinder is formed by a transparent window, and a saturated indicating material typified by blue silicone is preliminarily mixed with the moisture absorbing material, whereby the moisture absorbing material can be visually observed by the color of the saturated indicating material. Degree of humidity (degree of dryness). Alternatively, a moisture measuring device may be provided downstream of the moisture removing device, and the moisture measuring device measures the moisture content in the air which is dry, thereby investigating the degree of drying of the moisture absorbing material. In addition, in order to improve the water removal efficiency by the moisture absorbing material, the water separator that separates the fluorine-based cleaning liquid from the water by the difference between the specific gravity of the fluorine-based cleaning liquid and the specific gravity of the water dissolved in the fluorine-based cleaning liquid is also used. Can be set between 17 321091 200946253 water contact device and moisture removal device. <Ionic Contaminant Removal Device> The ionic contaminant removal device may, for example, be filled with a oxidized gel inside a cylinder having a cleaning liquid inlet at the upstream end and a cleaning liquid discharge port at the downstream end. An ionic contaminant removal device constructed of (alumina gel). <Filtering device> The filtering device for removing solid contaminants can be exemplified by a filtering device such as a microfiltration membrane or an ultrafiltration membrane for allowing a fluorine-based cleaning liquid to pass through. In this case, the solid contaminants removed by the filtering means are discharged from the cylinder to the outside by exchange of the filter core. Further, a plurality of the same filter membranes or different filter membranes may be combined for use. The refining device in the cleaning system preferably has an order from upstream to downstream, that is, in the order of a rectifying device, a water washing device, a moisture removing device, and a filtering device, from the viewpoint of effectively removing the various contaminants described above. Alternatively, each device is continuously connected by piping in the order of a water washing device, a water removing device, a rectifying device, and a filtering device. Further, in the case where the refining device has the ionic contaminant removing device, the position of the ionic contaminant removing device is not limited as long as it is between the water washing device and the moisture removing device. The cleaning system is integrated with a refining device and a cleaning device for continuously connecting various contaminant removal devices by piping, thereby continuously removing various contaminants from unused fluorine-based cleaning liquid and purifying high purity. The fluorine-based cleaning solution is directly supplied to the cleaning device without being connected to the external environment. Further, in the refining device, in order to prevent the transfer of the unused gas system from being stagnant, for example, a pump type or an air type transfer means is provided in the middle of the = tube, or the fluorine-based cleaning liquid is transferred by gravity difference. 5 with <Other Configuration> The cleaning system may further include a buffer sample for temporarily storing the cleaning agent composition liquid between the refining device and the cleaning device. When the buffer tank is installed on the downstream side of the cleaning skirt, the used fluorine-based cleaning liquid is transferred while the used gas-based cleaning in the cleaning apparatus is re-refined by the refining device. The purified fluorine-based cleaning liquid is supplied to the cleaning device from the refining device, and the used gas-based cleaning liquid is supplied from the regeneration buffer tank to the refining device while the cleaning device performs the cleaning step. Refined again. Further, when another buffer tank is provided on the upstream side of the cleaning device, the re-refined gas-based cleaning liquid can be continuously fed to the other buffer tank to be stored as a fluorine-based cleaning liquid for the next batch. .清洗 The cleaning system of the present invention is integrated with a refining device and a cleaning device for continuously connecting the respective contaminant removing devices by a circulation pipe, thereby continuously removing various unused fluorine-based cleaning liquids. The high-purity fluorine-based cleaning liquid refined from the contaminants is directly supplied to the cleaning device without coming into contact with the external environment. Further, since the re-refining (regeneration) in the same system path does not require the fluorine-based cleaning liquid which is contaminated after the cleaning to be discharged to the outside, it is possible to reuse the high-purity regenerated fluorine-based cleaning liquid which is not contaminated with the outside. Further, in the present cleaning system, in order to prevent the transfer of the gas-based cleaning liquid 15 321091 200946253, for example, a pump type or an air type transfer means may be provided in the middle of the piping, or the cleaning liquid may be transferred by gravity difference. (Description of Cleaning Method) In the cleaning system of the above configuration, the cleaning method of the present invention for cleaning the electronic component may include a cleaning liquid replenishing step of replenishing the purified fluorine-based cleaning liquid from the refining device to the cleaning device. In addition, the cleaning step may be performed by immersing the electronic component in a fluorine-based cleaning liquid in the cleaning tank, and rinsing the cleaned electronic component in a fluorine-based cleaning liquid in the washing tank to be washed. The steam is subjected to steam cleaning of the washed electronic component, and the steam-cleaned electronic component is shower-washed by the purified fluorine-based cleaning liquid from the shower nozzle. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Further, the present invention is not limited to the embodiments exemplified below. (First Embodiment) Fig. 1 is a schematic configuration view showing a first embodiment of a cleaning system according to the present invention. The cleaning system of the first embodiment is composed of a cleaning device 10 and a refining device 20 connected to the cleaning device 10 by a circulation pipe 31. The cleaning device 10 includes a main body 11 having an open top, a washing tank 12 disposed in the lower portion of the main body 11, a washing tub 13, and a vapor condensation portion 14 disposed along an upper opening edge of the main body 11 in the washing tank 12 A fluorine-based cleaning liquid C is accommodated in the inside of the washing tub 13. Further, in Fig. 1, the two-dot chain line indicates the liquid level of the fluorine-based cleaning liquid C, and the amount of the fluorine-based cleaning liquid C is 16 321091 200946253. The liquid level of the cleaning tank 12 is set to be constantly lower than the washing tank 13 The liquid level. The cleaning tank 12 has a heater 12a on the inner bottom surface, and the fluorine-based cleaning liquid C in the cleaning tank 12 is heated by the heater 12a. In addition, a part of the heated fluorine-based cleaning liquid C in the cleaning tank 12 is vaporized and rises, and a vapor layer S of the fluorine-based cleaning liquid C is formed above the cleaning tank 12 and the washing tank 13. Further, in Fig. 1, the broken line indicates the boundary between the vapor layer S and the atmosphere. The washing tank 13 has an ultrasonic generator 13a on the inner bottom surface, and the ultrasonic cleaning liquid C in the washing tub 13 is ultrasonically applied by the ultrasonic generator 13a. The vapor condensation unit 14 is provided with a condensation tube 14a provided along the inner surface of the upper opening edge of the main body 11, and a cooling circulation unit (not shown) circulates the cold coal in the condensation tube 14a; the drainage groove portion 14b, It is provided in the lower part of the condensing pipe 14a, and the water separator 14c is connected to the drain groove part 14b and the washing tank 13 via piping. A part of the vapor in the vapor layer S is in contact with the condensation tube 14 to lose thermal energy, whereby it is liquefied and collected in the drain groove portion 14b. Since the liquefied fluorine-based cleaning liquid C contains moisture condensed by the water vapor in the air, the fluorine-based cleaning liquid C is introduced into the water separator 14c from the drain tank portion 14b to be separated from the water, and the specific gravity is higher than that of the fluorine-based cleaning liquid. The water which is still small in C is discharged to the outside from the drain port in the upper portion of the water separator 14c, and the fluorine-based cleaning liquid C is introduced into the washing tub 13 through the pipe from the opening in the lower portion of the water separator 14c. The refining device 20 is connected in series from the upstream side by a pipe: a water contact pipe constituting a water washing device for removing water-soluble contaminants 17 321091 200946253 21, a water separator 22 constituting a moisture removing device and moisture absorbing a material column 23, an ionic contaminant removal column 24 constituting an ionic contaminant removal device, a heater built-in distillation column 25 constituting a rectification device for removing organic contaminants, and a solid waste pollution removal device Filter device 26 of the object. The water contact column 21 has a cleaning liquid inlet and a water discharge port at an upstream end of the upper portion, and a cleaning liquid discharge port and a water flow inlet at a downstream end of the lower portion, and the cleaning liquid inlet is connected via a pipe for unused The fluorine-based cleaning liquid C is introduced into an internal hopper 21 a, and the water inlet is connected to a water supply source (not shown) via a pipe. Further, the filter device 26 is connected to the washing tub 13 of the washing device 10 by piping. The cleaning method using the cleaning system includes a purification step of supplying an unused fluorine-based cleaning liquid to the refining device 20 for purification; and a cleaning step of cleaning the electronic component by the fluorine-based cleaning liquid C in the cleaning device 10. In the circulation supply step, the fluorine-based cleaning liquid used for cleaning is transferred from the cleaning device 10 to the refining device 20, and the used fluorine-based cleaning liquid is re-refined and circulated to the cleaning device 10. <Regarding the Purification Step> In the water contact column 21, the fluorine-based cleaning liquid flows in from above, and the water flows in from below. When the fluorine-based cleaning liquid contains a water-soluble contaminant, the water-soluble contaminant is removed while the fluorine-based cleaning liquid is lowered, and then transferred to the water separator 22. Further, water used for the treatment is discharged from the upper portion of the water contact column 21. Since the fluorine-based cleaning liquid transferred to the water separator 22 contains a trace amount of 18 321091 * 200946253 water, the fluorine-based cleaning liquid and the water system are separated into the lower layer and the upper layer in the water separator 22, and the lower layer of the fluorine-based cleaning liquid is transferred to The material column 23 is hygroscopic. Further, the separated water is discharged from the upper portion of the water separator 22. Since the fluorine-based cleaning liquid transferred to the moisture absorbing material column 23 contains a small amount of water, the fluorine-based cleaning liquid is transferred to the ionic pollutant removal column 24 after the moisture is removed by the moisture absorbing material (e.g., zeolite). When the fluorine-based cleaning solution transferred to the ionic contaminant removal column 24 contains ionic contaminants, the ionic contaminant removal column 24 ® removes materials by ionic contaminants (eg, alumina condensation) After the ionic contaminant is removed, the fluorine-based cleaning liquid is transferred to the distillation column 25. In the case where the fluorine-based cleaning liquid transferred to the distillation column 25 contains an organic contaminant, the organic contaminant is removed by a distillation operation in the distillation column 25 using a difference in boiling point between the organic contaminant and the fluorine-based cleaning liquid. Thereafter, the fluorine-based cleaning liquid is transferred to the filtration device 26. When the fluorine-based cleaning liquid transferred to the filtering device 26 contains a solid contaminated φ substance, the solid contaminant is removed by the filtering device 26 having the ultrafiltration membrane 舆 ultrafiltration membrane. In addition, solid contaminants sometimes contain absorbent materials on the upstream side or ionic contaminant removal materials. Thus, the fluorine-based cleaning liquid through the water contact column 21, the water separator 22, the moisture absorbing material column 23, the ionic contaminant removal column 24, the distillation column 25, and the filtration device 26 is not water-soluble, The fluorine-based cleaning liquid C purified by high-purity of the ionic, organic, and solid contaminants is supplied to the empty washing tank 13 of the cleaning apparatus 10, and the purified fluorine-based cleaning liquid C is supplied to the cleaning apparatus. The fluorine-based cleaning liquid C overflowing from the washing tank 13 is supplied to the washing tank 12 at 19 321091 200946253. <Regarding the cleaning step> In the cleaning step, first, the electronic component is immersed in the heated fluorine-based cleaning liquid C in the cleaning tank 12 to remove the dirt (mainly organic contaminants) on the surface of the electronic component. . Next, the electronic component is immersed in the fluorine-based cleaning liquid C in the washing tub 13. Since the fluorine-based cleaning liquid C in the washing tub 13 is kept at a lower temperature than the fluorine-based cleaning liquid C in the washing tank 12, the electronic components are cooled in the washing tub 13. Further, since the fluorine-based cleaning liquid C is ultrasonically applied to the washing tank 13 by the ultrasonic generator 13a, the dirt remaining in the cleaning tank 12 and remaining on the surface of the electronic component is acted upon by ultrasonic waves. Stripped from the electronic components. Thereafter, the electronic component is taken out from the washing tub 13 and introduced into the vapor layer S, and the final cleaning is performed by a fluorine-based cleaning liquid which is condensed and liquefied on the surface of the electronic component, and the electronic component is taken out from the opening above the cleaning device 10. In the washing step, the cleaned fluorine-based cleaning liquid which is condensed and liquefied in the condensing unit 14 is returned to the washing tank 13 after the water separation, and the pollutants brought into the washing tank 13 by the electronic component from the washing tank 12 are overflowed. The flow returns to the washing tank 12. In the cleaning step, since the electronic component can be cleaned by using a fluorine-based cleaning liquid which further increases the purity of the unused fluorine-based cleaning liquid, the cleanliness of the electronic component can be further improved. Further, in the cleaning step, the fluorine-based cleaning liquid C which is dirty in the cleaning tank 12 can be continuously or intermittently introduced into the water contact column 21 of the refining device 20 321091 200946253 20 through the circulation pipe 31, so that the fluorine-based cleaning liquid is The water is contacted through the column 21, the water separator 22, the hygroscopic material column 23, the ionic contaminant removal column 24, the distillation column 25, and the filter 26 to remove various contaminants and clean the fluorine. The liquid is regenerated, and the regenerated fluorine-based cleaning liquid is continuously or intermittently supplied to the washing tub 13 of the washing apparatus 10 through the circulation pipe 31. Therefore, the cleaned electronic component can be cleaned while supplying the clean fluorine-based cleaning liquid containing no contaminant to the washing tub 13 at any time. In addition, after the cleaning process (one batch cleaning process) of a predetermined number of electronic components, the cleaning device 10 can continuously introduce the dirty fluorine-based cleaning liquid from the cleaning device 10 to the purification. The apparatus 20 is regenerated, and the regenerated fluorine-based cleaning liquid is circulated to the cleaning apparatus 10. Further, when the internal fluorine-based cleaning liquid C is reduced by the cleaning operation of the electronic component by the cleaning device 10, the purified fluorine-based cleaning liquid can be replenished to the washing tub 13 after the cleaning and/or cleaning. Further, in the cleaning system, it is also possible to replace the defeated cleaning liquid C which has been regenerated and reused by φ. At this time, the valve provided in the discharge port (not shown) at the bottom of the washing tank 12 and the washing tub 13 is opened, and the fluorine-based cleaning liquid that has been used internally is collected in the recovery container, and the fluorine purified by the refining device 20 is used as needed. The cleaning liquid C cleans the inside of the empty cleaning device 10, and after closing the discharge port, the fluorine-based cleaning liquid C purified by the refining device 20 is introduced into the washing tank 13 and the washing tank 12 as described above. Further, the recovered fluorine-based cleaning liquid is discarded or may be regenerated by a regeneration device, and the regenerated fluorine-based cleaning solution 21 321091 200946253 is directly introduced into the cleaning device 10 and reused. Further, the purity can be further increased by a refining device, and then introduced into a cleaning device and reused. (Second embodiment) Fig. 2 is a schematic configuration diagram of a second embodiment of the cleaning system of the present invention. In the same manner as in the first embodiment, the cleaning system of the second embodiment is constituted by the cleaning device 100 and the refining device 200 connected to the cleaning device 1 by piping. However, the configuration of the cleaning device 1 and the refining device 2 is The implementation is slightly different. 〇 The following mainly describes differences between the second embodiment and the first embodiment. The cleaning device 100 includes a main body 110 having an opening at the top, a cleaning tank 120 disposed in the lower portion of the main body 110, a washing tub 130, a vapor condensing unit 140 disposed along an upper opening edge of the main body 110, and a washing tank. The vapor generation tank 15 disposed adjacent to the 120 and the distillation column 16 disposed above the vapor generation tank 150 are the same as the first embodiment. The cleaning tank 120 has a heater 120a, and the washing tank 130 has an ultrasonic generator i3. a, the vapor condensation unit 140 has a condensation tube 140a, a drain groove portion 140b, and a water separator 140c. Further, instead of the heater 12A, the ultrasonic generator can be placed in the cleaning tank 120. The vapor generation tank 150 is provided outside from the vapor condensation portion 140, and has a heater 150a on the inner bottom surface. The main body 110 has a portion covering the upper portion of the steam generating tank 150, and the portion is equipped with a distillation column 160 at 22 321091 200946253. Further, the distillation column 160 and the vapor generation tank 150 are in communication with each other by a communication hole formed in the main body 110. Further, an exhaust port for discharging the vapor is formed at the upper end of the distillation column 160, and the discharge port is connected to the water contact column 210 of the refining device 200 to be described later via the circulation pipe 310. The cleaning process of the electronic component by the cleaning device 100 is the same as that of the first embodiment. First, the electronic component is immersed in the heated fluorine-based cleaning liquid C in the cleaning tank 120 for cleaning, and then immersed in the washing. In the fluorine-based cleaning liquid C to which the ultrasonic wave is applied, the cleaning is carried out in the groove 130, and the vapor layer S vaporized by the heated fluorine-based cleaning liquid C in the cleaning tank 120 is removed by steam cleaning. To the outside. During this period, the fluorine-based cleaning liquid C overflowing into the cleaning tank 120 is introduced into the steam generation tank 150, and a part of the vapor of the fluorine-based cleaning liquid C heated and vaporized in the vapor generation tank 150 passes through the distillation column. 16 0 and the circulation pipe 310 are introduced into the refining device 200. That is, in the washing step, the fluorine-based cleaning liquid that has been contaminated in the cleaning tank 120 flows into the steam generating tank 150, and the fluorine-based cleaning liquid containing organic contaminants is vaporized in the steam generating tank 160, and the vapor is in the vapor. The vapor of the organic pollutant is cooled, liquefied, and returned to the steam generation tank 160 by the distillation column 160, and only the vapor of the fluorine-based cleaning liquid containing no organic pollutants passes through the distillation column 160, and is cooled and liquefied while passing through the circulation piping 310. The fluorine-based cleaning liquid that does not contain organic pollutants is introduced into the refining device 200. The refining device 200 is configured by continuously connecting in series a pipe: a water contact pipe 210 to which the feed hopper 210a is connected, a water separator 220, a moisture absorption 23 321091 200946253 pipe column 230, an ionic pollutant removal pipe column 240, and Filter 260. As described above, the water contact column 210 is connected to the distillation column 160 of the cleaning device 100 by the circulation pipe 310, and the filter 260 is configured to be connected to the washing tank 130 of the cleaning device 100 by the circulation pipe 310. According to the cleaning system of the second embodiment, the removal of the water-soluble contaminants other than the organic contaminants in the unused fluorine-based cleaning liquid by the refining device 200, the removal of the ionic contaminants, and the solid contamination can be performed. The fluorine-based cleaning liquid purified by the removal of the material is introduced into the washing tank 130 of the cleaning device 100, and the fluorine-based cleaning liquid containing various contaminants is removed by the distillation column 160 and the refining device 200 while cleaning the electronic component by the cleaning device 100. The purified and regenerated fluorine cleaning liquid is circulated and supplied to the cleaning device 100. Further, when the internal fluorine cleaning solution C is reduced by the cleaning process of the electronic component by the cleaning device 100, the purified fluorine-based cleaning liquid can be replenished to the washing tank 130 during and/or after cleaning. (Embodiment 3) Fig. 3 is a schematic block diagram showing a third embodiment of the cleaning system of the present invention. In the cleaning system of the third embodiment, the washing tank 13 of the washing apparatus 10 and the filter 26 of the refining apparatus 20 in the washing system of the first embodiment described in Fig. 1 are provided with a utility for temporarily storing and purifying the purified fluorine. It is a buffer tank 41 for the cleaning liquid. According to the cleaning system of the third embodiment, since the fluorine-based cleaning liquid of the next batch or more can be purified while the electronic component is being cleaned by the cleaning device 10, and the pre-24 321091 200946253 is stored in the buffer tank 41, the cleaning system can be improved. The efficiency of the cleaning process performed. Further, after the first batch of the cleaning process performed by the cleaning device 10 is completed, the fluorine-based cleaning liquid contaminated in the cleaning device 10 can be introduced into the refining device 20 and re-refined, and the buffer tank is used during this period. The second batch of the fluorine-based cleaning liquid purified in the 41 is supplied to the cleaning device 10, and the re-purified fluorine-based cleaning liquid is stored in the buffer tank 41, and the second batch of cleaning treatment is performed by the cleaning device 10, and thereafter Repeat these steps. Further, a part of the purified fluorine-based cleaning liquid stored in the buffer tank 41 can be replenished to the cleaning device 10 for cleaning at any time. Further, the position of the purification buffer tank 41 may be located between the distillation column 25 and the filter 26, between the ionic contaminant removal column 24 and the distillation column 25, the moisture absorbing material column 23 and the ionic contaminant removal tube. Between the columns 24, or between the cleaning device 10 and the water contacting the column 21. At this time, the fluorine-based cleaning liquid during the purification, the regeneration, or the regeneration is temporarily stored in the buffer tank 41. Further, in the third embodiment, the buffer tank may be disposed between the cleaning tank 12 of the cleaning device φ 10 and the refining device 20, or may be disposed on both the upstream side and the downstream side of the cleaning device 10. Further, the configuration of the buffer tank 41 having such a configuration can be applied to the cleaning system of the second embodiment, in addition to the cleaning system of the first embodiment. (Embodiment 4) Fig. 4 is a view showing a schematic configuration of a fourth embodiment of the cleaning system of the present invention. The cleaning system of the fourth embodiment is configured to include the cleaning device 10 and the refining device 20' in the same manner as the embodiment 1 of the above-mentioned Japanese Patent Application No. 25 321091 200946253. The cleaning device 1G is provided with a shower nozzle 17 from the shower nozzle 17 The gas-based cleaning liquid purified by the refining device 20 is ejected, and the e-plants after the steam cleaning are shower-washed. Further, in Fig. 4, the same constituent elements as those of the i-th diagram are denoted by the same reference numerals. Hereinafter, differences between the fourth embodiment and the embodiment will be mainly described. In the fourth embodiment, for example, the shower nozzle 17 is disposed above the air retention portion S in the cleaning device 10 and is adjacent to the upper edge of the main body 11 of the cleaning tank 12, and the branch pipe 28' is provided to connect the branch pipe 28 In addition, the branch pipe 28 of the cold nozzle 17' is branched from the middle of the circulation pipe 31 of the refining device 2 and the circulation pipe 31 of the / month washing device 1 . Further, an opening and closing valve is provided in the middle of the manifold 28, and an opening and closing valve 3 i a is provided at a position on the downstream side of the branching pipe 28 of the circulation pipe 31. According to this configuration, the opening and closing port 27a can be closed in the washing step, and the opening and closing valve 28a' can be opened and discharged from the shower nozzle 17 by the refining device 2, and the steam s of the vapor retention portion can be vaporized. Clean the electronic components of i for shower cleaning. Further, the cleaning liquid for shower cleaning can be dropped into the cleaning tank 12 and reused in the cleaning tank 12. ...so 'even if the vapor s contains vapors of organic contaminants and the organic contaminants remain on the surface of the electronic components after the steam cleaning, the surface of the electronic components can be washed by the purified shower-like fluorine-based cleaning solution. Organic contaminants to further improve the cleanliness of electronic components. Further, the constitution for performing such a bath washing can be applied to the cleaning system of the second embodiment and the third embodiment in addition to the cleaning system of the embodiment - 321091 26 200946253. In particular, it is preferable that the purified fluorine-based cleaning liquid can be supplied to the shower nozzle 17 at any time from the purification buffer tank 41 (see FIG. 3). (Fifth Embodiment) Fig. 5 is a schematic block diagram showing a fifth embodiment of the cleaning system of the present invention. The cleaning system according to the fifth embodiment is the same as the first embodiment except that it is different from the cleaning device 10 in the cleaning system of the first embodiment described in Fig. 1. In Fig. 5, the same components as those in Fig. 1 are attached with the same symbols. Hereinafter, differences between the fifth embodiment and the first embodiment will be mainly described. The cleaning device 10A according to the fifth embodiment includes a main body 11 having an upper opening, a lid 11a that opens and closes the opening φ above the main body 11, and a washing tank 12 and a washing tub 13 in a hierarchical manner. It is disposed in the lower portion of the main body 11 and houses the fluorine-based cleaning liquid C in the inside of the washing tank 12 and the washing tub 13. The amount of the fluorine-based cleaning liquid C is set to be lower than the liquid level of the washing tub 13 from the liquid level of the washing tank 12 constant. Further, an ultrasonic generator 13a is provided on each of the cleaning tank 12 and the inner bottom surface of the washing tub 13, and ultrasonic waves are applied to the cleaning tank 12 and the fluorine-based cleaning liquid C in the washing tank 13 by the ultrasonic generators 13a. When the cleaning of the electronic component is performed by the cleaning device 10A, the lid body 11a is opened. First, the electronic component is immersed in the fluorine-based cleaning liquid c in the cleaning tank 12 at room temperature by 27.321091 200946253 The action of the sound waves peels off the dirt on the surface of the electronic components. Then, the electronic component is immersed in the fluorine-based cleaning liquid C in the washing tank 13 at room temperature, and the dirt remaining on the surface of the electronic component is peeled off by the action of ultrasonic waves, and the electrons are taken out from the upper opening of the cleaning device 10A. Component. As described above, in the fifth embodiment, the steam cleaning performed in the first embodiment is omitted. Further, in addition to the cleaning step of the electronic component, the basic upper cover 11a is closed, and the cleaning device 10A is sealed in such a manner that dust, dust, dirt, or the like does not enter the cleaning tank 12 and the washing tub 13. (Embodiment 6) Fig. 6 is a view showing a schematic configuration of a sixth embodiment of the cleaning system of the present invention. The cleaning system of the sixth embodiment is the same as the fifth embodiment except that it is different from the cleaning device 10A of the cleaning system of the fifth embodiment described in Fig. 5. In Fig. 6, the same components as those in Fig. 5 are denoted by the same reference numerals. Hereinafter, differences between the sixth embodiment and the fifth embodiment will be mainly described. The cleaning device 10B according to the sixth embodiment is a shower nozzle 17 (see Fig. 6) provided in the cleaning device 10A of the fifth embodiment. The shower nozzle 17 is connected to the refining device 20 in the same manner as in the fourth embodiment. When the electronic component is cleaned by the cleaning device 10B, the electronic component is cleaned by the cleaning nozzle 12 and the washing tank 13, and the purified fluorine-based cleaning liquid discharged from the shower nozzle 17 is used. C for shower cleaning. Alternatively, one or both of the washing of the washing tank 12 and the washing of the washing tank 13 28 32109 1 200946253 may be omitted, and the shower washing may be directly performed. In addition, shower cleaning can also be used for high pressure shower cleaning. (Embodiment 7) Fig. 7 is a view showing a schematic configuration of a seventh embodiment of the cleaning system of the present invention. The cleaning system according to the seventh embodiment is the same as the first embodiment except that it is different from the cleaning device 10 in the cleaning system of the first embodiment described in Fig. 1. In the figure of the brother 7 , the same components as those of the brother 1 are attached with the same symbols. Hereinafter, differences between the seventh embodiment and the first embodiment will be mainly described. In the cleaning device 10C of the seventh embodiment, the washing tub 13 of the cleaning device 10 in the first embodiment is omitted. When the electronic component is cleaned by the cleaning device 10C, the electronic component is not immersed in the heated fluorine-based cleaning liquid C in the cleaning tank 12, and is cleaned in the vapor layer S. At this time, when the electronic component is placed in the vapor layer S in a state where the electronic component is cooled, the vapor of the cleaning liquid on the surface of the component condenses and liquefies, thereby rinsing the surface of the component. After that, it is temporarily placed, and since the temperature of the electronic component gradually rises to the boiling point of the cleaning liquid, the cleaning liquid on the surface of the module is vaporized, and the electronic components are dried. Alternatively, the electronic component may be taken out from the vapor layer S before the electronic component is dried, so that the electronic component is naturally dried or dried by an external drying device. (Other Embodiments) (1) In each of the above embodiments, a circulation path for a fluorine-based cleaning liquid in a washing tank for a ring cleaning device of 29.321091 200946253 may be provided, and a filter may be provided in the circulation path. The fluorine-based cleaning liquid in the washing tank is circulated and purified by passing through a filter. According to this configuration, even when the solid contaminant adhering to the electronic component before the cleaning is peeled off in the washing tank and mixed in the fluorine-based cleaning liquid, the solid contaminant can be removed from the fluorine-based cleaning liquid in the washing tank, and Can further improve the cleanliness of electronic components. (2) In the cleaning system of the second embodiment (see Fig. 2), the unused fluorine-based cleaning liquid is introduced from the water contact column 210 of the refining device 200, but the unused fluorine-based cleaning solution may be used. The liquid is introduced into the steam generation tank 150 of the cleaning device 100. According to this configuration, the unused fluorine-based cleaning liquid is heated by the heater 150a in the steam generation tank 150 to become steam. When the vapor contains organic contaminants, the vapor which has removed the organic contaminant passes through the distillation column 160. It is introduced to the refining device 200. Therefore, the purified fluorine-based cleaning liquid having a higher purity from which the organic contaminants have been removed can be supplied to the washing tub 130 of the washing apparatus 100. (3) The cleaning system of the fifth to seventh embodiments (Fig. 5 to Fig. 7) may be provided with the buffer tank 41 in the same manner as the third embodiment (Fig. 3). (Examples) Hereinafter, the present invention will be described in further detail by way of examples, but the present invention is not limited to these examples. (Example 1) In the case of the fluorine-based cleaning liquid, 2-propanol (hereinafter referred to as IPA) was mixed with 200 ppm by weight as water 30 in Vertrel (registered trademark) XF (manufactured by DU PONT-MITSUI FLUORO CHEMICALS COMPANY, LTD.). · 321091 200946253 A soluble contaminant was mixed with Krutox (registered trademark) i43AC (manufactured by DuPont, Inc.) at 5 ppm by weight as an organic contaminant to prepare a fluorine-based cleaning solution with simulated contamination. The fluorine-based cleaning liquid having simulated soiling is purified by the refining device 20 in the first embodiment (see FIG. 1), and the fluorine-based cleaning system is measured using a moisture meter (manufactured by Sakamoto Mitsubishi Chemical Corporation, CA-06 type). How many levels of various pollutants and moisture have been removed from the cleaning solution, and the measurement results are shown in Table 1. Further, a molecular sieve 3A (manufactured by UNION SHOWA K.K.) was used for the ionic contaminant removing device 24, and a steaming tower (odershaw type, 40) was used in the fine museum device 25. The fluorine-based cleaning solution after the purification of the fluorine-based cleaning solution is purified. The water-soluble contaminant (IPA) is 166 ppm. The organic contaminant (Krutox 143 AC) is below the detection limit. 5 ppm The detection limit is 224 ppm below the water 36 ppm. Confirmed from the results of the first example. By purifying a fluorine-based cleaning liquid having simulated soiling by the refining device of the present invention, a high-purity fluorine-based cleaning liquid can be obtained. (Second embodiment) First, the type of contaminant contained in the unused fluorine-based cleaning liquid used in the cleaning system of the present invention is investigated. Then, in the same manner as in the first embodiment, the unused fluorine-based cleaning liquid is used. In the same manner as in the first embodiment, various levels of various contaminants removed from the purified fluorine-based cleaning liquid were measured, and the measurement results are shown in Table 2. For the unused fluorine-based cleaning liquid, the aforementioned Vertrel XF (registered trademark) of an 18-liter steel cylinder is used. Table 2: Fluoride cleaning solution before purification, chaotic cleaning liquid, metal copper 0.03ppb detection limit below 0.14ppb detection limit below ion F_ ion 1.20ppb detection limit below NCV ion 0.07ppb detection limit below HCOO-ion 0.03ppb Below the detection limit, the NH/ion is 0.08 ppb 0.02 ppb. It is confirmed from the results of the second example that the unused fluorine-based cleaning liquid also contains a plurality of kinds of contaminants, and the fluorine-based cleaning liquid is purified by a refining device to obtain a more pure purity. Fluoride cleaning solution. (Industrial Applicability) The electronic component cleaning method and the cleaning system of the present invention are not limited to electronic components, but are particularly suitable for cleaning the stone wafers and ceramics which require high-purity fluorine-based cleaning liquid for high-definition purification. a wafer, a wafer obtained by cutting the wafer, a ceramic wafer obtained by cutting the ceramic wafer, a glass substrate, a metal substrate, a color filter substrate, a printed substrate, and the use of the 32 321091 200946253 electronic An electronic component such as a component, and a highly cleaned fluorine-based cleaning solution can be used for a long period of time. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic block diagram showing a first embodiment of a cleaning system according to the present invention. Fig. 2 is a schematic block diagram showing a second embodiment of the cleaning system of the present invention. Fig. 3 is a schematic view showing a configuration of a cleaning system according to a third embodiment of the present invention. Fig. 4 is a schematic block diagram showing a fourth embodiment of the cleaning system of the present invention. Fig. 5 is a schematic block diagram showing a fifth embodiment of the cleaning system of the present invention. Fig. 6 is a schematic block diagram showing a sixth embodiment of the cleaning system of the present invention. Fig. 7 is a schematic block diagram showing a seventh embodiment of the washing system of the present invention. [Main component symbol description] 10, 10A, 10B, 10C, 100, 100A, 100B, 100C Cleaning device 11, 110 Main body 11a Cover 12, 120 Cleaning tank 12a, 150a Heater 13, 130 Washing tank 33 321091 200946253 13a, 130a 14 , 140a 14a , 140a 14b ' 140b 14c , 22 , 140c 17 20 , 200 21 , 210 21a , 210a 23 , 230 24 , 240 25 ' 160 26 > 260 28 27a, 28a 30 31 41 42 120a 150 310 C s Ultrasonic generator steam condensation condensate pipe drain groove, 220 water separator shower nozzle refining device to flow water contact pipe feed hopper moisture absorption material pipe column ionic pollutant removal pipe column distillation tower filter divergent pipe opening and closing Valve regeneration device Circulating piping purification buffer tank regeneration buffer tank heater or ultrasonic generator steam generation tank circulation piping fluorinated organic cleaning agent composition liquid (fluorine-based cleaning liquid) vapor layer 34 321091

Claims (1)

200946253 七、申請專利範圍： 1. 一種電子組件的清洗方法，係包含有： 精製步驟，係藉由精製裝置精製未使用之含氟有 機清洗劑組成物液； 清洗步驟，係使用從前述精製裝置供給至清洗裝 置内之精製後的清洗劑組成物液來清洗電子組件；以 及 循環供給步驟，係將使用於清洗的清洗液從清洗 ® 裝置輸送至前述精製裝置，將使用完畢的清洗液予以 再精製，並循環供給至清洗裝置； 在前述精製步驟中，至少進行藉由精餾裝置所進 行之有機性污染物的去除、以及藉由過濾裝置所進行 之固體污染物的去除。 2. 如申請專利範圍第1項之電子組件之清洗方法，其中， 前述精製步驟係包含藉由水清洗裝置所進行的水溶性 Q 污染物的去除； 以有機性污染物的去除、水溶性污染物的去除、 固體污染物的去除之順序，或者以水溶性污染物的去 除、有機性污染物的去除、固體污染物的去除之順序 進行前述精製步驟，以精製前述清洗劑組成物液。 3. 如申請專利範圍第1項之電子組件之清洗方法，其中， 前述電子組件係為梦晶圓、陶竟晶圓、切斷前述石夕晶 圓所得之碎晶片、切斷前述陶曼晶圓所得之陶曼晶 片、玻璃基板、金屬基板、彩色濾光片基板、印刷基 35 321091 200946253 板、以及使用該等之電子組件。 4. 如申請專利範圍第1項之電子組件之清洗方法，其中， 復包含有補給步驟，係從精製裝置將精製過的清洗劑 組成物液補給至清洗裝置。 5. 如申請專利範圍第1項之電子組件之清洗方法，其中， 前述清洗裝置係具備有： 洗滌槽，係被供給有由前述精製裝置所精製的清 洗劑組成物液； 清洗槽，係收容並加熱從該洗滌槽所溢出的清洗 劑組成物液； 蒸氣滯留部，係滯留有在該清洗槽内經加熱而氣 化的清洗劑組成物液的蒸氣； 蒸氣凝結部，係使該蒸氣滯留部的蒸氣凝結，並 回流至前述洗蘇槽；以及 淋浴喷嘴，係喷出由精製裝置所精製的清洗劑組 成物液； 前述清洗步驟係為：將電子組件浸潰於前述清洗 槽内的清洗劑組成物液中進行清洗，將清洗後的電子 組件浸潰於前述洗滌槽内的清洗劑組成物液中進行洗 滌，藉由蒸氣滯留部的前述蒸氣將洗滌後的電子組件 予以蒸氣清洗，藉由來自前述淋浴喷嘴的清洗劑組成 物液將蒸氣清洗後的電子組件予以淋浴清洗。 6. 一種電子組件之清洗系統，係藉由申請專利範圍第1 項的清洗方法清洗電子組件，該清洗系統係具備有： 36 321091 200946253 精製裝置，係去除未使用的含氟有機清洗劑組成 物液所含有的污染物而予以精製；以及 清洗裝置，係使用由該精製裝置所精製的前述清 洗劑組成物液來清洗電子組件； 前述精製裝置係至少具備有用以去除有機性污染 物之精餾裝置、以及用以去除固體污染物之過濾裝 置，於前述精餾裝置以及前述過濾裝置流通前述清洗 劑組成物液並予以精製。 ® 7.如申請專利範圍第6項之電子組件之清洗系統，其中， 前述精製裝置復具備有用以去除水溶性污染物之水清 洗裝置、以及用以去除水分之水分去除裝置，並以前 述精餾裝置、前述水清洗裝置、前述水分去除裝置、 以及前述過濾裝置之順序，或者以水清洗裝置、水分 去除裝置、精餾裝置、以及過濾裝置之順序，流通前 述清洗劑組成物液並予以精製。 φ 8.如申請專利範圍第6項之電子組件之清洗系統，其中， 前述精製裝置復具備有用以去除離子性污染物之離子 性污染物去除裝置。 9.如申請專利範圍第6項之電子組件之清洗系統，其中， 前述清洗裝置係具備有： 洗滌槽，係被供給有由前述精製裝置所精製的清 洗劑組成物液； 清洗槽，係收容並加熱從該洗滌槽所溢出的清洗 劑組成物液； 37 321091 200946253 蒸氣滯留部，係滯留有在該清洗槽内經加熱而氣 化的清洗劑組成物液的蒸氣；以及 蒸氣凝結部，係使該蒸氣滯留部的蒸氣凝結，並 回流至前述洗滌槽； 並構成為：將電子組件浸潰於前述清洗槽内的清 洗劑組成物液中進行清洗，將清洗後的電子組件浸潰 於前述洗滌槽内的清洗劑組成物液中進行洗滌，藉由 蒸氣滯留部的前述蒸氣將洗務後的電子組件予以蒸氣 清洗； 前述精製裝置係將從前述清洗槽排出的清洗劑組 成物液予以再精製，並循環供給至前述洗滌槽。 10. 如申請專利範圍第6項之電子組件之清洗系統，其中， 於前述精製裝置與前述清洗裝置之間復具備有用以暫 時地儲留清洗劑組成物液之緩衝槽。 11. 如申請專利範圍第9項之電子組件之清洗系統，其中， 前述清洗裝置復具備有淋浴喷嘴，從前述淋浴喷嘴噴 出由精製裝置所精製的清洗劑組成物液，並將前述蒸 氣清洗後的電子組件予以淋浴清洗。 38 321091200946253 VII. Patent application scope: 1. A method for cleaning an electronic component, comprising: a refining step of refining an unused fluorine-containing organic cleaning agent composition liquid by a refining device; and a cleaning step using the refining device The purified cleaning agent composition liquid supplied to the cleaning device to clean the electronic component; and the circulation supply step of conveying the cleaning liquid used for cleaning from the cleaning device to the refining device, and reusing the used cleaning solution Refining and recycling to the cleaning device; in the refining step, at least the removal of the organic contaminants by the rectification device and the removal of the solid contaminants by the filtration device are performed. 2. The method of cleaning an electronic component according to claim 1, wherein the refining step comprises removing water-soluble Q contaminants by a water cleaning device; removing organic pollutants, water-soluble pollution The removal step of the substance, the order of removal of the solid contaminant, or the removal of the water-soluble contaminant, the removal of the organic contaminant, and the removal of the solid contaminant are performed in the order of the purification step to purify the cleaning agent composition liquid. 3. The method for cleaning an electronic component according to claim 1, wherein the electronic component is a dream wafer, a ceramic wafer, a broken wafer obtained by cutting the Si Xi wafer, and cutting the Taman wafer. A Tauman wafer, a glass substrate, a metal substrate, a color filter substrate, a printing substrate 35 321091 200946253, and an electronic component using the same. 4. The method of cleaning an electronic component according to claim 1, wherein the replenishing step comprises replenishing the purified cleaning agent composition liquid from the refining device to the cleaning device. 5. The cleaning method of the electronic component according to the first aspect of the invention, wherein the cleaning device comprises: a washing tank supplied with a cleaning agent composition liquid purified by the refining device; and a washing tank for accommodating And heating the cleaning agent composition liquid overflowing from the washing tank; the vapor retention portion is a vapor in which the cleaning agent composition liquid heated and vaporized in the cleaning tank is retained; and the vapor condensation portion causes the vapor to remain The steam is condensed and returned to the washing tank; and the shower nozzle is sprayed with the cleaning agent liquid refined by the refining device; the cleaning step is: washing the electronic component into the cleaning tank The composition liquid is cleaned, and the cleaned electronic component is immersed in the cleaning agent composition liquid in the washing tank to be washed, and the washed electronic component is steam-washed by the vapor in the vapor retention portion. The steam-cleaned electronic component is shower-washed by the cleaning agent composition liquid from the shower nozzle. 6. A cleaning system for an electronic component, the electronic component being cleaned by the cleaning method of the first application of the patent scope, the cleaning system comprising: 36 321091 200946253 refining device for removing unused fluorine-containing organic cleaning agent composition And purifying the contaminant contained in the liquid; and cleaning the device by using the cleaning agent composition liquid purified by the refining device to clean the electronic component; the refining device having at least a rectification useful for removing organic contaminants A device and a filtering device for removing solid contaminants, and the cleaning agent composition liquid is circulated in the rectifying device and the filtering device and purified. ® 7. The cleaning system for an electronic component according to claim 6, wherein the refining device has a water cleaning device for removing water-soluble contaminants, and a moisture removing device for removing moisture, The order of the distillation apparatus, the water cleaning apparatus, the moisture removal apparatus, and the filtration apparatus, or the order of the water cleaning apparatus, the moisture removal apparatus, the rectification apparatus, and the filtration apparatus, flows the cleaning agent composition liquid and refines it . φ 8. The cleaning system for an electronic component according to claim 6, wherein the refining device is provided with an ionic contaminant removing device for removing ionic contaminants. 9. The cleaning system for an electronic component according to the sixth aspect of the invention, wherein the cleaning device comprises: a washing tank supplied with a cleaning agent composition liquid purified by the refining device; and a washing tank for accommodating And heating the cleaning agent composition liquid overflowing from the washing tank; 37 321091 200946253 The vapor retention portion is a vapor which retains a cleaning agent composition liquid which is heated and vaporized in the cleaning tank; and a vapor condensation portion The vapor in the vapor retention portion is condensed and returned to the washing tub; and the electronic component is immersed in the cleaning agent composition liquid in the cleaning tank to be cleaned, and the cleaned electronic component is immersed in the foregoing Washing the cleaning agent composition liquid in the washing tank, and steam-cleaning the electronic component after washing by the steam in the vapor retention portion; the refining device is to re-discharge the cleaning agent composition liquid discharged from the cleaning tank Refined and circulated to the aforementioned washing tank. 10. The cleaning system for an electronic component according to claim 6, wherein a buffer tank for temporarily storing the cleaning agent composition liquid is provided between the refining device and the cleaning device. 11. The cleaning system for an electronic component according to claim 9, wherein the cleaning device is provided with a shower nozzle, and a cleaning agent composition liquid purified by the refining device is sprayed from the shower nozzle, and the steam is cleaned. The electronic components are shower cleaned. 38 321091
TW098107270A 2008-03-07 2009-03-06 Method for cleaning electronic parts and cleaning system TW200946253A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008058444 2008-03-07

Publications (1)

Publication Number Publication Date
TW200946253A true TW200946253A (en) 2009-11-16

Family

ID=41056101

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098107270A TW200946253A (en) 2008-03-07 2009-03-06 Method for cleaning electronic parts and cleaning system

Country Status (3)

Country Link
JP (1) JPWO2009110549A1 (en)
TW (1) TW200946253A (en)
WO (1) WO2009110549A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109715303A (en) * 2016-12-07 2019-05-03 株式会社Ihi Cleaning method and cleaning device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011152517A (en) * 2010-01-28 2011-08-11 Du Pont Mitsui Fluorochem Co Ltd Drying method of fluorinated hydrocarbon solvent
KR101297111B1 (en) * 2011-12-20 2013-08-21 비나텍주식회사 Cleaning System For Cell And Method thereof
CN102847480B (en) * 2012-09-19 2014-07-30 北京七星华创电子股份有限公司 Chemical liquid mixing device and method
US10773192B1 (en) * 2019-04-09 2020-09-15 Bitfury Ip B.V. Method and apparatus for recovering dielectric fluids used for immersion cooling
CN115121522B (en) * 2021-03-25 2024-07-26 深圳银星智能集团股份有限公司 Cleaning method, cleaning device and maintenance station
CN115625145A (en) * 2022-10-08 2023-01-20 广东环华氢能科技有限公司 Flexible graphite bipolar plate cleaning process

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4952386A (en) * 1988-05-20 1990-08-28 Athens Corporation Method and apparatus for purifying hydrogen fluoride
JP2002012894A (en) * 2000-06-28 2002-01-15 Asahi Kasei Corp Low flammable cleaning agent, cleaning method and cleaning apparatus
JP2004284903A (en) * 2003-03-24 2004-10-14 Hamada Heavy Industries Ltd Manufacturing method of high purity zinc carbonate
JP4635527B2 (en) * 2004-09-08 2011-02-23 三菱化学エンジニアリング株式会社 Method for recovering hydrofluoric acid
JP4581618B2 (en) * 2004-10-14 2010-11-17 三菱化学エンジニアリング株式会社 Method for recovering hydrofluoric acid
WO2007126120A1 (en) * 2006-04-27 2007-11-08 Jfe Chemical Corporation Method for processing plastic and apparatus therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109715303A (en) * 2016-12-07 2019-05-03 株式会社Ihi Cleaning method and cleaning device
CN109715303B (en) * 2016-12-07 2021-09-24 株式会社Ihi Cleaning method and cleaning device

Also Published As

Publication number Publication date
WO2009110549A1 (en) 2009-09-11
JPWO2009110549A1 (en) 2011-07-14

Similar Documents

Publication Publication Date Title
TW200946253A (en) Method for cleaning electronic parts and cleaning system
TW502332B (en) Substrate processing unit
JP2003297795A (en) Semiconductor wafer cleaning / drying apparatus and cleaning / drying method
TW200946254A (en) Cleaning method and cleaning system for electronic part
JP3842657B2 (en) Wet etching system
JP5572198B2 (en) Substrate processing apparatus and chemical solution recycling method
JPS62183804A (en) Method for replenishing and/or regenerating treatment liquid
KR100681807B1 (en) Ozone treatment method and ozone treatment device
CN111093806A (en) Treatment system for engineered exhaust stream with IPA
JPS62106630A (en) processing equipment
JP4167720B2 (en) Solvent washer
JP2002210424A (en) Apparatus for cleaning filter
JP5129911B2 (en) Moisture removal device
JP4018917B2 (en) Processing method and processing system
JP2008211139A (en) Apparatus and method for treating substrate
JPS59195654A (en) Method and device for washing photomask
JP2001308058A (en) Drier for semiconductor material, and the like
JPH0474420A (en) Apparatus and method for cleaning
KR100753977B1 (en) Plating solution wastewater regeneration device
JPS6316189B2 (en)
JPH0623331A (en) Vapor generation device
JPH08283971A (en) Aqueous cleaning device
JP2012163220A (en) Workpiece draining and drying device
JP2005268331A (en) Vapor dryer
KR100655652B1 (en) Drying apparatus of the board