200948706 六、發明說明： 【發明所屬之技術領域】 本發明係關於將形成有流路用溝槽的樹脂製基板接合 - 而製作成的微晶片。另外，本發明係關於用來製作形成有 ' 流路用溝槽的樹脂製基板之成形用模具。 【先前技術】 Q 利用微細加工技術來在矽或玻璃基板上形成微細的流 路或迴路，在微小空間進行核酸、蛋白質、血液等的液體 試料的化學反應、分離、分析等之微分析晶片、或被稱作 M TAS (Micro Total Analysis Systems)的裝置已實用化》 這種微晶片的優點在於，可減少樣品、試藥的使用量或廢 液的排出量，且能實現不佔空間之可攜式的低成本系統。 微晶片，是將2個構件（其中對至少一構件實施微細 加工）貼合而製造出的。以往，微晶片是使用玻璃基板， 〇 而有各種的微細加工方法被提出。然而，玻璃基板並不適 用於大量生產，其成本非常高，因此期望能開發出低成本 之拋棄型的樹脂製微晶片。 爲了製造樹脂製的微晶片，是將形成有流路用溝槽的 樹脂製基板和用來覆蓋流路用溝槽的樹脂製基板接合。形 成有流路用溝槽的樹脂製基板，例如藉由射出成形而製作 出。以往提出的微晶片，爲了促進微細流路內之液體的迴 旋流，是藉由成形來形成分支成複數流路的流路用溝槽（ 其中包含形成有螺旋狀凹凸的流路用溝槽）（專利文獻1 -5- 200948706 專利文獻1 :日本特開2006-142210號公報 【發明內容】 然而’專利文獻1等揭示的習知的流路用溝槽，大多 分支成複數個流路’而具有互相交叉的複雜圖案。在藉由 射出成形來形成如此般複雜的流路用溝槽圖案的情況，成 形時的樹脂轉印性可能無法遍及流路用溝槽全體。在此情 況，必須測定並評價流路的複數處的轉印性，但若對各流 路進行轉印性的評價，必定相當的費事。另外，根據測定 裝置的測定結果來進行評價的方法，由於檢查需要時間， 要簡便地評價成形時的轉印性益發困難。另外，測定用的 測定裝置也有一定的成本。因此，期望能提供一種方法， 能減少檢查所需的工作量及成本，且能簡便地評價成形時 的轉印性。 本發明是爲了解決上述問題而開發完成者，其目的是 提供一種微晶片，即使是在形成這麼複雜的流路用溝槽圖 案的情況，不須測定各個流路用溝槽即可評價成形時的轉 印性。並提供用來製作形成有流路用溝槽的樹脂製基板之 成形用模具。 本發明的第1形態係關於一種微晶片，是在將樹脂成 形而製作出的2個樹脂製基板當中至少一方的樹脂製基板 的表面形成流路用溝槽，將前述2個樹脂製基板以形成有 前述流路用溝槽的面朝內側的狀態接合而構成微晶片：其 -6- 用溝槽和與前 前述第1流路 同。 態的微晶片中 溝槽交叉的交 〇 態或第2形態 第2流路用溝 第1流路用溝 深度當中較深 形用模具，是 脂製基板之成 基板當中一方 流路用溝槽， 流路用溝槽的 溝槽一方的第 少2個流路用 以具有與前述 同寬度的段差 態的成形用模 200948706 特徵在於：前述流路用溝槽是包含第1流路 述第1流路用溝槽交叉的第2流路用溝槽’ 用溝槽和前述第2流路用溝槽的溝槽深度不 另外，本發明的第2形態，是在第1形 ' ，在前述第1流路用溝槽與前述第2流路用 叉部形成的段差，是用來檢查成形的轉印性 另外，本發明的第3形態，是在第1形 0 的微晶片中，在前述第1流路用溝槽與前述 槽交叉的交叉部的段差高度，是設定成前述 槽的溝槽深度和前述第2流路用溝槽的溝槽 的溝槽深度的〇.3%~5%的範圍。 另外，本發明的第4形態係關於一種成 用來成形出微晶片之形成有流路用溝槽的樹 形用模具，該微晶片，是在至少2個樹脂製 的樹脂製基板表面形成互相交叉的至少2個 φ 將前述2個樹脂製基板以形成有前述複數個 面朝內側的狀態接合而構成；其特徵在於： 具有對應於前述交叉的至少2個流路用 1凸部；在前述第1凸部的上面’在前述至 溝槽互相交叉的交叉部的部位之對應位置， 2個流路用溝槽當中至少一方溝槽的寬度相 來設置第2凸部。 另外，本發明的第5形態，是在第4形 具中，前述第2凸部是用來檢查成形的轉印性。 200948706 另外，本發明的第6形態，是在第4形態或第5形態 的成形用模具中，前述第2凸部的高度設定成前述第丨凸 部及前述第2凸部的全體高度的0.3%〜5%的範圍。 另外’本發明的第7形態，是在第4至6形態中任一 個成形用模具中，是使用電鑄母模而藉由電鑄加工來形成 對應於凹部的前述凸部；前述電鑄母模，是藉由蝕刻加工 來形成前述複數個凹部的各個（前述複數個凹部互相交叉 )，且在前述交叉的交叉部，在前述凹部的底面形成段差 〇 依據本發明’是在流路用溝槽互相交叉的交叉部設置 段差，利用該交叉部的段差部來評價流路用溝槽的轉印性 。此構造，是認知到’複數個流路互相交叉的交叉部分在 進行射出成形時其樹脂轉印性最差而開發完成的。亦即， 利用形成於該交叉部的段差部來評價樹脂轉印性，不須逐 一評價各個流路用溝槽形狀的轉印性，藉由評價少數的交 叉部即可評價樹脂製基板上流路用溝槽的轉印性，因此可 減少工作量’又即使是在使用測定裝置來進行高成本的評 價時，也有助於減低成本。 另外’藉由形成比流路的段差更深的段差部，即使不 是根據測定裝置的測定結果來進行評價，也能利用顯微鏡 等來觀察段差部而簡單地推定出轉印性。在此情況，能更 進一步降低成本。 【實施方式】 200948706 參照第1圖至第3圖來說明本發明的實施形態的微晶 片。第1圖係本發明的實施形態的樹脂製基板的俯視圖。 第2圖係本發明的實施形態的樹脂製基板的截面圖，是第 1圖的II-II截面圖。第3圖係本發明的實施形態的微晶 ' 片的截面圖。 如第1圖所示，樹脂製基板1爲板狀的基板，在樹脂 製基板1的一表面，形成直線狀的第1流路用溝槽2和直 Q 線狀的第2流路用溝槽3。在本實施形態，作爲1例，第 1流路用溝槽2和第2流路用溝槽3是互相正交而形成在 樹脂製基板1的表面。另外，第1流路用溝槽2和第2流 路用溝槽3也能以不互相正交的方式形成在樹脂製基板i 〇 另外，第1流路用溝槽2的深度和第2流路用溝槽3 的深度不同，在第1流路用溝槽2與第2流路用溝槽3互 相交叉的交叉部4的底面形成段差部5。在本實施形態， © 第2流路用溝槽3的深度比第1流路用溝槽2的深度更深 。因此，在交叉部4的底面，遍及第1流路用溝槽2的寬 . 度方向，形成與第1流路用溝槽2的長度方向正交的段差 部5。段差部5具有和第1流路用溝槽2的寬度相同的寬 度。另外，亦可使第1流路用溝槽2的深度比第2流路用 溝槽3的深度更深，而遍及第2流路用溝槽3的寬度方向 形成與第2流路用溝槽3的長度方向正交的段差部。 例如第2圖所示，設第1流路用溝槽2的深度爲深度 dl’設第2流路用溝槽3的深度爲深度d2。在本實施形 -9- 200948706 態，由於第2流路用溝槽3的深度比第1流路用溝槽2的 深度更深，會成立深度d2>深度dl的關係，而深度的差 値（5t就是段差部5的高度。 另外，樹脂製基板1的接合對象之樹脂製基板6是平 板狀的基板。如第3圖所示，以形成有第1流路用溝槽2 和第2流路用溝槽3的面朝內側的狀態，將樹脂製基板1 和樹脂製基板6接合而製造出微晶片8。經由該接合，樹 脂製基板6是發揮作爲第1流路用溝槽2和第2流路用溝 槽3的蓋體（cover )的作用。如此，藉由形成於樹脂製 基板1之第1流路用溝槽2和樹脂製基板6來形成微細流 路，藉由第2流路用溝槽3和樹脂製基板6來形成微細流 路。 另外，在樹脂製基板6，在對應於第1流路用溝槽2 的兩端部的位置、和對應於第2流路用溝槽3的兩端部的 位置，形成貫穿樹脂製基板6的厚度方向之貫穿孔7。藉 由將樹脂製基板1和樹脂製基板6接合，而在微晶片8形 成對應於貫穿孔7的開口部。該貫穿孔7所形成的開口部 ，是連通於微細流路，是用來進行凝膠、試料、緩衝液的 導入、保存或排出的孔。開口部（貫穿孔7)的形狀，可 爲圓形、矩形，也可以是其他各種的形狀。開口部是和設 置於分析裝置的軟管或噴嘴連接，透過該軟管或噴嘴而將 凝膠、試料或緩衝液等導入微細流路，或是將試料等從微 細流路排出。 另外，不是在樹脂製基板6設置貫穿孔7,而是在樹 -10- 200948706 脂製基板1設置貫穿孔亦可。例如，在第1流路用溝槽2 的兩端部形成貫穿樹脂製基板1的厚度方向的貫穿孔，在 第2流路用溝槽3的兩端部形成貫穿樹脂製基板丨的厚度 • 方向的貫穿孔。而且’將樹脂製基板1和樹脂製基板6接 合，藉由形成於樹脂製基板1的貫穿孔，來形成連通於微 細流路的開口部。 樹脂製基板1、6的形狀，只要是易於操作、分析的 φ 形狀即可，不管怎樣的形狀皆可。例如宜爲10mm見方 ~200mm見方的大小’更佳爲l〇mm見方〜l〇〇mm見方。 樹脂製基板1、6的形狀，只要適合分析手法、分析裝置 即可’宜爲正方形、長方形、圓形等的形狀。另外，貫穿 孔7的口徑只要適合分析手法、分析裝置即可，例如宜爲 2mm左右0 第1流路用溝槽2及第2流路用溝槽3的形狀，是考 慮可減少分析試料、試藥的使用量、以及成形模具的製作 ❹ 精度、轉印性、脫模性等，寬度和深度宜爲10// m〜200 範圍內的値’但沒有特別的限定。另外，深寬比（溝 槽的深度/溝槽寬度）宜爲0.1〜3，更佳爲〇.2~2。此外， 第1流路用溝槽2及第2流路用溝槽3的寬度和深度，是 依微晶片的用途而決定。另外，爲了便於說明，第2圖所 示的第1流路用溝槽2及第2流路用溝槽3的截面形狀是 呈矩形’但該形狀僅爲流路用溝槽的1例，也可以呈曲面 狀。 另外，形成有第1流路用溝槽2和第2流路用溝槽3 -11 - 200948706 的樹脂製基板1的板厚，考慮到成形性宜爲0.2mm~5mm ’更佳爲0.5mm〜2mm。作爲用來覆蓋第1流路用溝槽2 和第2流路用溝槽3之蓋體（cover)的樹脂製基板6板 厚，考慮到成形性宜爲0.2mm〜5mm，更佳爲0.5mm〜2mm 。另外，在作爲蓋體（cover )之樹脂製基板6上不形成 流路用溝槽的情況，亦可使用薄膜（薄片狀構件）。在此 情況’薄膜厚度宜爲30/zm~300;zm，更佳爲50//m~150 μ m。 (樹脂製基板的材料） 樹脂製基板1、6是使用樹脂。該樹脂的條件，例如 包括：成形性（轉印性、脫模性）良好、高透明性、對於 紫外線或可見光之自發螢光性低等，並沒有特別的限定。 例如宜使用：聚碳酸酯、聚甲基丙烯酸甲酯、聚苯乙烯、 聚丙烯腈、聚氯乙烯、聚對苯二甲酸乙二酯、尼龍6、尼 龍66、聚酯酸乙烯、聚偏二氯乙烯、聚丙烯、聚異戊二 烯、聚乙烯、聚二甲基矽氧烷、環狀烯烴等。其中較佳爲 聚甲基丙烯酸甲酯、環狀烯烴等。另外，樹脂製基板1和 樹脂製基板6可使用同一種材料，也能使用不同的材料。 (樹脂製基板的接合） 以形成有第1流路用溝槽2和第2流路用溝槽3的面 朝內側的狀態，將樹脂製基板1和樹脂製基板6接合。樹 脂製基板的接合，例如可藉由熱熔接、超音波熔接、雷射 -12- 200948706 熔接等來進行。再者，亦可藉由紫外線、電漿或離子束使 樹脂製基板的表面活性化後，將樹脂製基板接合。 另外，可在樹脂製基板6上也形成流路用溝槽，而使 - 形成有流路用溝槽的樹脂製基板彼此接合。例如，使形成 於樹脂製基板6的流路用溝槽朝內側，且使形成於樹脂製 基板1的流路用溝槽朝內側，而將樹脂製基板1和樹脂製 基板6接合以製作出微晶片。另外，亦可將複數個樹脂製 0 基板重疊並接合。 形成在第1流路用溝槽2和第2流路用溝槽3互相交 叉的交叉部4之段差部5,是用來評價成形時的流路用溝 槽的轉印性。樹脂製基板1，是使用成形用模具而藉由射 出成形法等製作出。在成形用模具，形成有對應於第1流 路用溝槽2的凸部和對應於第2流路用溝槽3的凸部，藉 由將成形用模具的凸部的形狀轉印到樹脂，而製作出具有 第1流路用溝槽2和第2流路用溝槽3的樹脂製基板1。 Φ 再者，在成形用模具的凸部的上面，在對應於第1流路用 溝槽2和第2流路用溝槽3互相交叉的交叉部4的位置， 設置段差部。藉此，將成形用模具的段差轉印於樹脂，而 在第1流路用溝槽2和第2流路用溝槽3互相交叉的交叉 部4的底面形成段差部5。 而且，藉由觀察形成於樹脂製基板1的段差部5的形 狀，可評價第1流路用溝槽2及第2流路用溝槽3的轉印 性。例如，可使用顯微鏡等的觀察裝置，將形成於樹脂製 基板1的段差部5的形狀和形成於成形用模具的段差部的 -13- 200948706 形狀作比較，根據段差部形狀的差異來評價轉印性。成形 品之樹脂製基板1的段差部5的形狀’只要能維持成形用 模具之段差部的形狀，即可判斷：樹脂是充分地充塡於成 形用模具，互相交叉之第1流路用溝槽2及第2流路用溝 槽3全體的轉印良好。另一方面，在樹脂製基板1的段差 部5的形狀無法維持的情況則判斷：樹脂並未充分充塡於 成形用模具，互相交叉之第1流路用溝槽2及第2流路用 溝槽3的轉印不完全。如此般，依據本實施形態的使用樹 脂製基板1的微晶片，即使不測定各個流路用溝槽的形狀 ，藉由測定交叉部的段差，亦即測定轉印性最令人擔心之 交叉部的段差，即可評價互相交叉之流路用溝槽全體的轉 印性。另外，由於具備比流路用溝槽的段差更深的段差的 形狀’即使不根據測定裝置的測定結果進行評價，藉由顯 微鏡等的觀察裝置即可評價流路用溝槽的轉印性。如此， 可降低檢查所需的成本’且能簡便地評價成形的轉印性。 另外’藉由在第1流路用溝槽2和第2流路用溝槽3 互相交叉的交叉部4設置段差部5，在流路用溝槽深的部 分可評價轉印性。藉由在交叉部4設置段差部5，在該交 叉部4’ 一方流路用溝槽的深度比另—方流路用溝槽的深 度更深。在本實施形態，第2流路用溝槽3的深度比第1 流路用溝槽2的深度更深。如此般，在流路用溝槽互相交 叉的交叉部4,藉由段差部5使深度不同的流路用溝槽互 相交叉。因此，藉由觀察該段差部5的形狀，在溝槽深的 部分可評價成形的轉印性’根據該評價，可對樹脂製基板 -14- 200948706 1全體評價流路用溝槽的轉印性。亦即，只要溝槽深度深 的部分之轉印性良好，可推定在溝槽深度淺的部分也具有 良好轉印性。如此般，藉由利用交叉部4的段差部5來進 • 行評價，可減輕評價各個溝槽的轉印狀態的必要性，而簡 易地判定流路用溝槽全體的轉印性是否良好。 另外，在檢查轉印性時，較容易界定該段差部5的位 置。如此，可縮短檢查所需的時間。假使在流路用溝槽的 0 任意場所設置檢查用段差部的情況，在檢查轉印性時，必 須用顯微鏡等的檢查裝置來搜尋段差部的設置場所。在本 實施形態’由於在交叉部4設置段差部5,在流路圖案中 可立即界定出段差部5的場所。在交叉部以外的任意位置 形成段差的情況，很難判定出所發現的段差部是設於成形 用模具的段差部所造成的段差部、或是其他原因所形成的 段差部，因此要以高精度來進行轉印性的評價會有困難。 另外’在藉由顯微鏡等的觀察裝置無法發現段差部的 © 情況’很難判定出：是儘管在成形用模具形成有段差部但 因轉印性差而無法轉印出段差部，或是所觀察的場所本來 就未設置段差部。因此，必須將流路用溝槽的全部場所都 用顯微鏡等的觀察裝置觀察，在全部場所都沒有發現到段 差部的情況’才判斷流路用溝槽的轉印性差。另外，即使 在流路用溝槽發現段差部的情況，如上述般，很難判定是 否是形成於成形用模具的段差部所造成的段差部。 相對於此’依據本實施形態的樹脂製基板1，由於在 交叉部4設置段差部5，很容易界定段差部5，藉由確認 -15- 200948706 該交叉部4之段差部5的形狀，即可評價樹脂製基板1的 轉印性。 另外’若段差部5的高度過高，在段差部5，流過微 晶片內的試料可能會發生亂流，結果，可能會影響使用微 晶片的分析。特別是，由於段差是設置在流路交叉的部分 ，比起其他的段差，須要求更嚴格限制段差高度。因此， 段差部5的高度宜設定成第2流路用溝槽3的深度d2 的0.3%〜5%的範圍。另外，段差部5的高度6t，在轉印 性良好的情況，只要是檢查者能用顯微鏡等來辨識段差部 5形狀的高度即可。例如，段差部5的高度δ t宜爲0.01 // m 〜1 // m。 在本實施形態的樹脂製基板1，是形成1個交叉部4 ，而在該交叉部4設置段差部5，但本發明並不限定於此 例。例如，可在樹脂製基板形成複數個流路用溝槽以構成 複數個交叉部，藉此設置複數個段差部。而且，在評價成 形的轉印性時’可用顯微鏡等的觀察裝置來觀察各交叉部 之段差部的形狀，根據其觀察結果來評價轉印性。另外， 在設置複數個段差部的情況，各段差部的高度都相同或是 分別不同皆可。例如’在本實施形態的樹脂製基板1形成 2個段差部5。這2個段差部5的高度可爲相同高度或是 不同高度。另外’遍及第1流路用溝槽2的寬度方向設置 段差部5，且遍及第2流路用溝槽3的寬度方向進一步設 置段差部5亦可。 另外，在本實施形態的樹脂製基板1，第1流路用溝 -16- 200948706 槽2和第2流路用溝槽3是互相正交，但本發明並不限於 此例。例如’可將流路用溝槽形成γ字狀或T字狀，而 在流路用溝槽分支的分支點、流路用溝槽交叉的交叉部設 • 置段差部。亦即，本發明之「第1流路用溝槽」、「第2 流路用溝槽」’只要都是直線狀的溝槽且具備互相交叉的 交叉部即可’這代表著前述γ字狀的流路用溝槽和T字 狀的流路用溝槽都包含在此範疇。另外，在3個以上的流 〇 路用溝槽交叉的情況，並不侷限於設置1個段差部，也可 以設置2個以上的段差部。另外，在流路用溝槽分支的分 支點設置段差部的情況，也是和本實施形態的樹脂製基板 1同樣的’可利用顯微鏡等的觀察裝置來觀察其段差部， 藉此評價成形的轉印性。 (製造方法） 爲了製作形成有段差部5的樹脂製基板1，是使用形 φ 成有對應於段差部5的段差部之成形用模具。模具的加工 ，是藉由公知的蝕刻加工來進行。在成形用模具形成對應 於第1流路用溝槽2和第2流路用溝槽3的凸部，接著在 凸部的上面形成對應於段差部5之段差部。在本實施形態 ，是在凸部的上面，在對應於第1流路用溝槽2和第2流 路用溝槽3互相交叉的交叉部4的位置，形成對應於段差 部5的段差部。另外，成形用模具可藉由電鑄加工來製作 出。在此情況，是經由蝕刻加工而在電鑄母模上形成對應 於第1流路用溝槽2和第2流路用溝槽3的流路形成用溝 -17- 200948706 槽。接著使用該電鑄母模來製作成形用模具。 在此，作爲1例，是針對藉由電鑄加工來製作成形用 模具，並用該成形用模具來製作樹脂製基板1的情況，參 照第4圖至第6圖來作說明。第4圖係顯示本發明的實施 形態的電鑄母模的俯視圖。第5圖係顯示本發明的實施形 態的電鑄母模的截面圖，是第4圖的V-V截面圖。第6 圖係本發明的實施形態的成形用模具的截面圖。 如第4圖所示，在電鑄母模10的一面，形成直線狀 的第1流路形成用溝槽11和直線狀的第2流路形成用溝 槽12。在本實施形態，作爲1例，第1流路形成用溝槽 11和第2流路形成用溝槽12是以正交狀態形成於電禱母 模10的表面。 另外，第1流路形成用溝槽1 1和第2流路形成用溝 槽12的深度不同，在第1流路形成用溝槽11和第2流路 形成用溝槽12互相交叉的交叉部13的底面形成段差部 14。在本實施形態，第2流路形成用溝槽12的深度比第 1流路形成用溝槽11更深。因此，在交叉部13的底面， 遍及第1流路形成用溝槽1 1的寬度方向形成與第1流路 形成用溝槽11的長度方向正交的段差部14。該段差部14 ，是對應於形成在樹脂製基板1的段差部5。另外，亦可 使第1流路形成用溝槽11的深度比第2流路形成用溝槽 12的深度更深，而遍及第2流路形成用溝槽12的寬度方 向形成與第2流路形成用溝槽12的長度方向正交的段差 部。 -18- 200948706 例如像第5圖所示，在第1流路形成用溝槽n的深 度dl和第2流路形成用溝槽12的深度d2之間成立深度 d2>深度dl的關係，深度的差値成爲段差部的高 • 度。 _ 接著說明電鑄母模10的製造方法。首先，對母模胚 實施鍍Ni-P加工或鍍Cu加工，以在母模胚表面形成金屬 層。然後’對金屬層的上面實施蝕刻加工，以形成第1流 〇 路形成用溝槽1 1和第2流路形成用溝槽i 2。如此製得的 電鑄母模10成爲樹脂製基板1的成形用模具的母體。第 1流路形成用溝槽11對應於樹脂製基板1的第1流路用 溝槽2’第2流路形成用溝槽12對應於樹脂製基板1的 第2流路用溝槽3’段差部14對應於樹脂製基板1的段 差部5。另外’在母模胚上不形成金屬層亦可。例如，母 模胚由銘合金或無氧銅等的材料構成，對該母模胚實施蝕 刻加工來製作電鑄母模1 〇亦。 ® 接著’對電鑄母模10實施電鑄加工而製作成電鑄加 工體’然後從電鑄母模10使電鑄加工體脫模。藉此製作 出具有凸部（對應於電鑄母模10的流路形成用溝槽）之 成形用模具。 第6圖係顯示使用電鑄母模製作出的成形用模具 。在成形用模具20的一面形成：對應於第1流路形成用 溝槽11的直線狀的第1凸部21、對應於第2流路形成用 溝槽12的直線狀的第2凸部22。第1凸部21的高度和 第2凸部22的高度不同’在第1凸部21和第2凸部22 -19- 200948706 交叉的交叉部的上面形成段差部23。在本實施形態’第2 凸部22的高度比第1凸部21的高度更高。第1凸部21 的高度dl和第2凸部22的高度d2之間成立高度（12>高 度dl的關係，高度的差値成爲段差部23的高度。 . 另外，使用成形用模具20而進行樹脂的射出成形’ - 可製作出形成有第1流路用溝槽2、第2流路用溝槽3及 段差部5之樹脂製基板1。藉由第1凸部21來形成深度 dl的第1流路用溝槽2，藉由第2凸部22來形成深度d2 ^ 的第2流路用溝槽3。另外，藉由形成於第1凸部21和 第2凸部22交叉的交叉部之段差部23，來在第1流路用 溝槽2和第2流路用溝槽3交叉的交叉部4形成段差部5 〇[Technical Field] The present invention relates to a microchip produced by joining a resin substrate on which a channel groove is formed. Further, the present invention relates to a molding die for producing a resin substrate on which a groove for a flow path is formed. [Prior Art] Q Micro-analysis wafers for chemical reaction, separation, analysis, etc. of liquid samples such as nucleic acids, proteins, and blood are formed in a microscopic space by forming a fine flow path or a circuit on a crucible or a glass substrate by a microfabrication technique. Or a device called M TAS (Micro Total Analysis Systems) has been put into practical use. The advantage of such a microchip is that it can reduce the amount of sample, reagent usage or waste liquid discharge, and can achieve space-saving. Portable low cost system. The microchip is produced by laminating two members in which at least one member is subjected to microfabrication. Conventionally, microchips have been made using glass substrates, and various microfabrication methods have been proposed. However, since the glass substrate is not suitable for mass production and the cost is very high, it is desired to develop a low-cost disposable resin microchip. In order to produce a resin microchip, a resin substrate on which a flow path groove is formed and a resin substrate for covering a flow path groove are joined. A resin substrate in which a groove for a flow path is formed is produced, for example, by injection molding. In order to promote the swirling flow of the liquid in the fine flow path, the microchip has been formed into a flow path groove (which includes a flow path groove in which spiral irregularities are formed) by forming into a plurality of flow paths by molding. [Patent Document 1 - 5 - 200948706 [Patent Document 1] Japanese Laid-Open Patent Publication No. 2006-142210 [Patent Document] However, the conventional channel groove disclosed in Patent Document 1 and the like is often branched into a plurality of flow paths. In the case of forming such a complicated flow channel groove pattern by injection molding, the resin transfer property during molding may not be spread over the entire flow path groove. In this case, it is necessary to measure In addition, the transferability of the flow path is evaluated, but it is quite troublesome to evaluate the transferability of each flow path. Further, the method of evaluating based on the measurement result of the measurement device requires time for the inspection. It is difficult to easily evaluate the transferability during molding. The measurement device for measurement also has a certain cost. Therefore, it is desirable to provide a method that can reduce the need for inspection. The present invention has been developed in order to solve the above problems, and an object of the present invention is to provide a microchip, even in forming such a complicated channel groove pattern. In the case of the measurement of the transferability at the time of molding, it is not necessary to measure the groove for each flow path, and a mold for molding a resin substrate on which the flow path groove is formed is provided. In the microchip, a channel groove is formed on the surface of at least one of the two resin substrates formed by molding the resin, and the two resin substrates are formed with the channel groove. The surface of the groove is joined to the inner side to form a microchip: the groove of the -6- is the same as the first flow path, and the intersection of the groove or the second form of the second wafer is used in the microchip. The deeper mold for the depth of the trench first channel is one of the channels for forming the substrate of the grease substrate, and the second channel of the channel for the channel is used for The same width as described above The differential molding die 200948706 is characterized in that the flow channel groove is a groove for the second flow path groove for intersecting the first flow path groove in the first flow path and the second flow path The groove according to the second aspect of the present invention is a step formed by the first flow path groove and the second flow path fork portion, and is used for inspection molding. In the third aspect of the present invention, in the microchip of the first form, the height of the step at the intersection of the first channel groove and the groove intersects with the groove is set to the groove. The groove depth and the groove depth of the groove of the second flow path groove are in the range of 3% to 5%. Further, the fourth aspect of the present invention relates to the formation of a microchip for forming. a tree-shaped mold having a flow path groove in which at least two φ intersecting each other on at least two resin-made resin substrates are formed, and the two resin substrates are formed to form the plurality of surfaces Constructed in a state of being joined to the inner side; characterized in that it has at least two corresponding to the aforementioned intersection a convex portion for a flow path; and a position corresponding to a width of at least one of the two flow channel grooves at a position corresponding to a portion of the upper portion of the first convex portion that intersects the groove to each other 2 convex parts. According to a fifth aspect of the invention, in the fourth aspect, the second convex portion is a transfer property for inspecting the molding. According to a sixth aspect of the invention, in the molding die of the fourth aspect or the fifth aspect, the height of the second convex portion is set to 0.3 of the total height of the second convex portion and the second convex portion. %~5% range. In a seventh aspect of the present invention, in the molding die according to any one of the fourth to sixth aspects, the convex portion corresponding to the concave portion is formed by electroforming using an electroforming master; the electroforming mother The mold is formed by etching each of the plurality of recesses (the plurality of recesses intersect each other), and at the intersection of the intersections, a step is formed on the bottom surface of the recess. According to the present invention, the groove is in the flow path. A step is formed at the intersection where the grooves intersect each other, and the transfer property of the channel groove is evaluated by the step portion of the intersection. This configuration is developed by recognizing that the intersection of a plurality of flow paths intersecting each other at the time of injection molding is the worst in resin transferability. In other words, the resin transfer property is evaluated by the step portion formed in the intersection portion, and it is not necessary to evaluate the transferability of each channel groove shape one by one, and the flow path on the resin substrate can be evaluated by evaluating a small number of intersection portions. By using the transfer property of the groove, the amount of work can be reduced, and even when the evaluation device is used for high cost evaluation, it contributes to cost reduction. In addition, the step portion which is formed to be deeper than the step of the flow path can be easily estimated by observing the step portion by a microscope or the like without performing evaluation based on the measurement result of the measuring device. In this case, the cost can be further reduced. [Embodiment] 200948706 A microchip according to an embodiment of the present invention will be described with reference to Figs. 1 to 3 . Fig. 1 is a plan view showing a resin substrate according to an embodiment of the present invention. Fig. 2 is a cross-sectional view showing a resin substrate according to an embodiment of the present invention, which is a cross-sectional view taken along line II-II of Fig. 1 . Fig. 3 is a cross-sectional view showing a microcrystalline 'sheet of an embodiment of the present invention. As shown in Fig. 1, the resin substrate 1 is a plate-shaped substrate, and a linear first channel groove 2 and a straight Q-shaped second channel groove are formed on one surface of the resin substrate 1. Slot 3. In the first embodiment, the first flow path groove 2 and the second flow path groove 3 are formed on the surface of the resin substrate 1 so as to be orthogonal to each other. In addition, the first flow path groove 2 and the second flow path groove 3 can be formed on the resin substrate i 不 not perpendicular to each other, and the depth of the first flow path groove 2 and the second The depth of the flow path groove 3 is different, and the step portion 5 is formed on the bottom surface of the intersection portion 4 where the first flow path groove 2 and the second flow path groove 3 intersect each other. In the present embodiment, the depth of the second flow path groove 3 is deeper than the depth of the first flow path groove 2. Therefore, on the bottom surface of the intersection portion 4, a step portion 5 orthogonal to the longitudinal direction of the first channel groove 2 is formed in the width direction of the first channel groove 2. The step portion 5 has the same width as the width of the first channel groove 2. In addition, the depth of the first flow path groove 2 may be deeper than the depth of the second flow path groove 3, and the second flow path groove may be formed in the width direction of the second flow path groove 3. The step portion of the length direction of 3 is orthogonal. For example, as shown in Fig. 2, the depth of the first flow path groove 2 is the depth dl', and the depth of the second flow path groove 3 is the depth d2. In the embodiment of the present invention, the depth of the second flow path groove 3 is deeper than the depth of the first flow path groove 2, and the relationship of the depth d2 > the depth dl is established, and the depth difference 値 ( 5t is the height of the step portion 5. The resin substrate 6 to be bonded to the resin substrate 1 is a flat substrate. As shown in Fig. 3, the first channel groove 2 and the second stream are formed. The resin substrate 1 and the resin substrate 6 are bonded to each other to form the microchip 8 in a state in which the surface of the groove 3 is facing inward. The resin substrate 6 serves as the first channel groove 2 and The role of the cover of the second flow path groove 3 is such that the first flow path groove 2 and the resin substrate 6 formed on the resin substrate 1 form a fine flow path. The flow path groove 3 and the resin substrate 6 form a fine flow path. The resin substrate 6 corresponds to the second flow in the position corresponding to both end portions of the first flow path groove 2 and the second flow. A through hole 7 penetrating the thickness direction of the resin substrate 6 is formed at a position of both end portions of the road trench 3. By using the resin substrate 1 and The resin substrate 6 is joined, and an opening corresponding to the through hole 7 is formed in the microchip 8. The opening formed by the through hole 7 communicates with the fine flow path and is used for gel, sample, and buffer. a hole that is introduced, stored, or discharged. The shape of the opening (through hole 7) may be circular, rectangular, or other various shapes. The opening is connected to a hose or a nozzle provided in the analysis device, and is passed through the hole. In the hose or the nozzle, a gel, a sample, a buffer, or the like is introduced into the fine flow path, or the sample or the like is discharged from the fine flow path. Further, the through hole 7 is not provided in the resin substrate 6, but in the tree -10- 200948706 The through hole may be provided in the grease substrate 1 . For example, a through hole penetrating the resin substrate 1 in the thickness direction is formed at both end portions of the first channel groove 2, and two of the second channel groove 3 are formed. The end portion is formed with a through hole extending in the thickness direction of the resin substrate 。. Further, the resin substrate 1 and the resin substrate 6 are bonded to each other, and formed in the through hole of the resin substrate 1 to form a fine flow path. Opening portion. Resin substrate 1 The shape of 6 can be any shape as long as it is easy to operate and analyze, and it can be any shape. For example, the size of 10 mm square to 200 mm square is better than l〇mm square ~ l〇〇mm square. The shape of the substrates 1 and 6 may be a square, a rectangle, a circle or the like as long as it is suitable for the analysis method and the analysis device. The diameter of the through hole 7 may be any suitable for the analysis method and the analysis device, for example, 2 mm. In the shape of the first flow path groove 2 and the second flow path groove 3, it is considered that the amount of the analysis sample, the amount of the reagent to be used, and the manufacturing accuracy, transferability, and mold release property of the molding die can be reduced. Etc., the width and depth are preferably 値' in the range of 10//m to 200, but are not particularly limited. Further, the aspect ratio (depth of the groove/groove width) is preferably 0.1 to 3, more preferably 〇.2 to 2. Further, the width and depth of the first flow path groove 2 and the second flow path groove 3 are determined depending on the use of the microchip. In addition, for convenience of explanation, the cross-sectional shape of the first flow path groove 2 and the second flow path groove 3 shown in FIG. 2 is a rectangular shape, but the shape is only one example of the flow path groove. It can also be curved. In addition, the thickness of the resin substrate 1 in which the first flow path groove 2 and the second flow path groove 3 -11 - 200948706 are formed is preferably 0.2 mm to 5 mm', more preferably 0.5 mm. ~2mm. The thickness of the resin substrate 6 for covering the first flow path groove 2 and the second flow path groove 3 is preferably 0.2 mm to 5 mm, more preferably 0.5. Mm~2mm. Further, in the case where the flow path groove is not formed on the resin substrate 6 as a cover, a film (sheet member) may be used. In this case, the film thickness is preferably from 30/zm to 300; zm, more preferably from 50/m to 150 μm. (Material of Resin Substrate) Resin substrates 1 and 6 are made of a resin. The conditions of the resin include, for example, good moldability (transferability and mold release property), high transparency, low spontaneous fluorescence property to ultraviolet light or visible light, and the like, and are not particularly limited. For example, it should be used: polycarbonate, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, polyethylene terephthalate, nylon 6, nylon 66, polyester acid vinyl, polyethylene Vinyl chloride, polypropylene, polyisoprene, polyethylene, polydimethyl siloxane, cyclic olefin, and the like. Among them, polymethyl methacrylate, cyclic olefin, and the like are preferable. Further, the same material may be used for the resin substrate 1 and the resin substrate 6, and different materials may be used. (Joining of the resin substrate) The resin substrate 1 and the resin substrate 6 are bonded to each other in a state in which the surfaces of the first channel groove 2 and the second channel groove 3 are formed inward. The bonding of the resin substrate can be performed, for example, by heat welding, ultrasonic welding, laser welding, laser welding, or the like. Further, the surface of the resin substrate may be activated by ultraviolet rays, plasma or ion beam, and then the resin substrate may be joined. Further, the flow path grooves can be formed also on the resin substrate 6, and the resin substrates on which the flow path grooves are formed can be joined to each other. For example, the flow path groove formed in the resin substrate 6 is directed inward, and the flow path groove formed in the resin substrate 1 is directed inward, and the resin substrate 1 and the resin substrate 6 are joined to each other to produce Microchip. Further, a plurality of resin-made 0 substrates may be stacked and joined. The step portion 5 formed at the intersection portion 4 where the first channel groove 2 and the second channel groove 3 intersect each other is used to evaluate the transferability of the channel groove during molding. The resin substrate 1 is produced by an injection molding method or the like using a molding die. In the molding die, a convex portion corresponding to the first flow path groove 2 and a convex portion corresponding to the second flow path groove 3 are formed, and the shape of the convex portion of the molding die is transferred to the resin. Then, the resin substrate 1 having the first flow path groove 2 and the second flow path groove 3 is produced. Φ Further, a step portion is provided at a position corresponding to the intersection portion 4 where the first channel groove 2 and the second channel groove 3 intersect each other on the upper surface of the convex portion of the molding die. Thereby, the step difference of the molding die is transferred to the resin, and the step portion 5 is formed on the bottom surface of the intersection portion 4 where the first channel groove 2 and the second channel groove 3 intersect each other. By observing the shape of the step portion 5 formed on the resin substrate 1, the transfer properties of the first channel groove 2 and the second channel groove 3 can be evaluated. For example, the shape of the step portion 5 formed on the resin substrate 1 and the shape of the step portion formed in the step portion of the molding die can be compared with the shape of the step portion of the molding die, and the evaluation can be performed based on the difference in the shape of the step portion. Indian. In the shape of the step portion 5 of the resin substrate 1 of the molded article, the shape of the step portion of the molding die can be maintained, and it can be determined that the resin is sufficiently filled in the molding die and the first channel groove intersects each other. The transfer of the entire groove 2 and the second flow path groove 3 is good. On the other hand, when the shape of the step portion 5 of the resin substrate 1 cannot be maintained, it is determined that the resin is not sufficiently filled in the molding die, and the first channel groove 2 and the second channel are intersecting each other. The transfer of the grooves 3 is not complete. In the microchip using the resin substrate 1 of the present embodiment, even if the shape of each channel groove is not measured, the intersection of the intersection portion is measured, that is, the intersection where the transferability is most worried is measured. The step difference can evaluate the transferability of the entire flow path groove that intersects each other. In addition, the shape of the step which is deeper than the step of the flow path groove is not evaluated by the measurement device of the measuring device, and the transfer property of the channel groove can be evaluated by an observation device such as a microscope. Thus, the cost required for the inspection can be reduced, and the transferability of the molding can be easily evaluated. In addition, the step portion 5 is provided at the intersection portion 4 where the first channel groove 2 and the second channel groove 3 intersect each other, and the transferability can be evaluated in the portion where the channel groove is deep. By providing the step portion 5 at the intersection portion 4, the depth of the flow path groove in the intersection portion 4' is deeper than the depth of the other-side flow path groove. In the present embodiment, the depth of the second flow path groove 3 is deeper than the depth of the first flow path groove 2. In the intersection portion 4 where the flow path grooves intersect each other, the flow path grooves having different depths intersect each other by the step portion 5. Therefore, by observing the shape of the step portion 5, the transfer property of the molding can be evaluated in the deep portion of the groove. According to the evaluation, the transfer of the channel groove can be evaluated for the entire resin substrate-14-200948706 1 Sex. That is, as long as the transfer property of the portion having a deep groove depth is good, it is presumed that the portion having a shallow groove depth also has good transferability. By performing the evaluation by the step portion 5 of the intersection portion 4, it is possible to reduce the necessity of evaluating the transfer state of each groove, and it is easy to determine whether or not the transfer property of the entire channel groove is good. Further, when the transferability is checked, it is easier to define the position of the step portion 5. In this way, the time required for inspection can be shortened. In the case where the inspection step portion is provided at any position of the flow path groove 0, when the transfer property is checked, it is necessary to search for the installation place of the step portion by an inspection device such as a microscope. In the present embodiment, since the step portion 5 is provided at the intersection portion 4, the portion of the step portion 5 can be immediately defined in the flow path pattern. When a step is formed at any position other than the intersection portion, it is difficult to determine that the step portion found is a step portion formed in the step portion of the molding die or a step portion formed by other causes, so that high precision is required. It is difficult to evaluate the transferability. In addition, it is difficult to determine that the step portion cannot be found by an observation device such as a microscope. It is difficult to transfer the step portion due to poor transferability even though a step portion is formed in the molding die. The location of the site has not been set up. Therefore, it is necessary to observe all the places of the flow path grooves with an observation device such as a microscope, and it is determined that the step of the step is not found in all places. Further, even in the case where the step portion is found in the flow path groove, as described above, it is difficult to determine whether or not the step portion is formed in the step portion of the molding die. In the resin substrate 1 according to the present embodiment, since the step portion 5 is provided at the intersection portion 4, the step portion 5 can be easily defined, and the shape of the step portion 5 of the intersection portion 4 is confirmed by -15-200948706, that is, The transfer property of the resin substrate 1 can be evaluated. Further, if the height of the step portion 5 is too high, turbulence may occur in the sample flowing through the microchip in the step portion 5, and as a result, analysis using the microchip may be affected. In particular, since the step difference is set at the intersection of the flow paths, it is required to restrict the height of the step more strictly than other sections. Therefore, the height of the step portion 5 is preferably set to be in the range of 0.3% to 5% of the depth d2 of the second channel groove 3. In addition, when the transferability is good, the height 6t of the step portion 5 may be such that the examiner can recognize the height of the step portion 5 by a microscope or the like. For example, the height δ t of the step portion 5 is preferably 0.01 // m to 1 // m. In the resin substrate 1 of the present embodiment, one intersection portion 4 is formed, and the step portion 5 is provided in the intersection portion 4. However, the present invention is not limited to this example. For example, a plurality of flow path grooves may be formed in a resin substrate to form a plurality of intersection portions, thereby providing a plurality of step portions. Further, when the transfer property of the formation is evaluated, the shape of the step portion of each intersection portion can be observed by an observation device such as a microscope, and the transfer property can be evaluated based on the observation result. Further, in the case where a plurality of step portions are provided, the heights of the step portions are the same or different. For example, in the resin substrate 1 of the present embodiment, two step portions 5 are formed. The heights of the two step portions 5 may be the same height or different heights. Further, the step portion 5 may be provided in the width direction of the first channel groove 2, and the step portion 5 may be further provided in the width direction of the second channel groove 3. Further, in the resin substrate 1 of the present embodiment, the first channel groove -16 - 200948706 groove 2 and the second channel groove 3 are orthogonal to each other, but the present invention is not limited to this example. For example, the flow path groove may be formed in a γ-shape or a T-shape, and a step portion may be provided at an intersection where the flow path groove branching branch and the flow path groove intersect. In other words, the "first flow channel groove" and the "second flow channel groove" as long as they are linear grooves and have intersecting intersecting portions can represent the aforementioned γ word. The flow path groove and the T-shaped flow path groove are included in this category. Further, when three or more flow channel grooves are intersected, it is not limited to one step portion, and two or more step portions may be provided. In addition, in the case where the step portion is provided at the branching point of the flow path groove branch, the same as the resin substrate 1 of the present embodiment, the step can be observed by an observation device such as a microscope, and the formed turn can be evaluated. Indian. (Manufacturing Method) In order to produce the resin substrate 1 on which the step portion 5 is formed, a molding die having a step φ corresponding to the step portion 5 is used. The processing of the mold is performed by a known etching process. A convex portion corresponding to the first flow path groove 2 and the second flow path groove 3 is formed in the molding die, and then a step portion corresponding to the step portion 5 is formed on the upper surface of the convex portion. In the present embodiment, the step portion corresponding to the step portion 5 is formed at a position corresponding to the intersection portion 4 where the first channel groove 2 and the second channel groove 3 intersect each other on the upper surface of the convex portion. . Further, the molding die can be produced by electroforming. In this case, the flow path forming groove -17-200948706 groove corresponding to the first flow path groove 2 and the second flow path groove 3 is formed in the electroforming mother mold by etching. Next, this electroforming master mold was used to produce a molding die. Here, as an example, a case where a molding die is produced by electroforming and a resin substrate 1 is produced by the molding die will be described with reference to Figs. 4 to 6 . Fig. 4 is a plan view showing an electroforming master according to an embodiment of the present invention. Fig. 5 is a cross-sectional view showing an electroforming master according to an embodiment of the present invention, which is a V-V cross-sectional view of Fig. 4. Fig. 6 is a cross-sectional view showing a molding die according to an embodiment of the present invention. As shown in Fig. 4, a linear first flow path forming groove 11 and a linear second flow path forming groove 12 are formed on one surface of the electroforming mold 10. In the first embodiment, the first flow path forming groove 11 and the second flow path forming groove 12 are formed on the surface of the electric prayer mother die 10 in an orthogonal state. In addition, the depths of the first channel forming groove 1 1 and the second channel forming groove 12 are different, and the first channel forming groove 11 and the second channel forming groove 12 intersect each other. The bottom surface of the portion 13 forms a step portion 14. In the present embodiment, the depth of the second flow path forming groove 12 is deeper than the first flow path forming groove 11. Therefore, the step portion 14 which is orthogonal to the longitudinal direction of the first channel forming groove 11 is formed in the width direction of the first channel forming groove 11 in the bottom surface of the intersecting portion 13. This step portion 14 corresponds to the step portion 5 formed on the resin substrate 1. In addition, the depth of the first channel forming groove 11 may be deeper than the depth of the second channel forming groove 12, and may be formed in the width direction of the second channel forming groove 12 and the second channel. A step portion in which the longitudinal direction of the trench 12 is orthogonal is formed. -18- 200948706 For example, as shown in Fig. 5, the relationship between the depth d1 of the first flow path forming groove n and the depth d2 of the second flow path forming groove 12 is established, and the depth d1 is established. The difference is the height of the step. Next, a method of manufacturing the electroforming master 10 will be described. First, the mother mold is subjected to Ni-P plating or Cu plating to form a metal layer on the surface of the mother mold. Then, the upper surface of the metal layer is subjected to etching processing to form the first flow path forming groove 1 1 and the second flow path forming groove i 2 . The electroforming master 10 thus obtained is the precursor of the molding die of the resin substrate 1. The first flow path forming groove 11 corresponds to the first flow path groove 2 ′ of the resin substrate 1 . The second flow path forming groove 12 corresponds to the second flow path groove 3 ′ of the resin substrate 1 . The step portion 14 corresponds to the step portion 5 of the resin substrate 1 . In addition, a metal layer may not be formed on the mother mold. For example, the mother mold is made of a material such as an alloy or an oxygen-free copper, and the mother mold is etched to produce an electroformed mold. Then, the electroforming mold 10 is subjected to electroforming to prepare an electroforming workpiece, and then the electroformed body is released from the electroforming master 10. Thus, a molding die having a convex portion (corresponding to the flow path forming groove of the electroforming mold 10) is produced. Fig. 6 shows a molding die produced by using an electroforming master. On the one surface of the molding die 20, a linear first convex portion 21 corresponding to the first flow path forming groove 11 and a linear second convex portion 22 corresponding to the second flow path forming groove 12 are formed. . The height of the first convex portion 21 is different from the height of the second convex portion 22. The step portion 23 is formed on the upper surface of the intersection portion where the first convex portion 21 and the second convex portion 22 -19-200948706 intersect. In the present embodiment, the height of the second convex portion 22 is higher than the height of the first convex portion 21. A height (12> relationship between the height d1 of the first convex portion 21 and the height d2 of the second convex portion 22 is established, and the difference in height is the height of the step portion 23. The molding die 20 is used. Injection molding of resin - The resin substrate 1 on which the first flow path groove 2, the second flow path groove 3, and the step portion 5 are formed can be formed. The first convex portion 21 forms the depth dl. In the first channel groove 2, the second channel groove 3 having a depth d2 ^ is formed by the second protrusion 22, and is formed by the first protrusion 21 and the second protrusion 22 intersecting each other. The step portion 23 of the intersection portion forms the step portion 5 at the intersection portion 4 where the first channel groove 2 and the second channel groove 3 intersect.
另外，在評價樹脂製基板1的轉印性時，是用顯微鏡 等的観察裝置來觀察形成在樹脂製基板1之段差部5形狀 ，並將段差部5形狀和形成於成形用模具20的段差部23 形狀作比較。而根據段差部形狀的差異來評價轉印性。 Q 在此，參照第7圖來說明流路用溝槽的轉印性。第7 圖係將本發明的實施形態的成形用模具的一部分放大的截 面圖。例如是使用：模穴形成用之形成有平坦溝槽的模具 、和本實施形態的成形用模具20，藉由射出成形來製作 樹脂製基板1。以平坦溝槽朝內側的狀態，將成形用模具 20和形成有溝槽的模具對置接觸，以在成形用模具20和 形成有平坦溝槽的模具之間形成模穴。將樹脂充塡於該模 穴’即可製作出轉印有第1凸部21的形狀和第2凸部22 -20- 200948706 的形狀之樹脂製基板1。 例如第7(a)圖所示，在樹脂可充分充塡於成形用 模具20所形成的模穴的情況，形成於成形用模具20之段 - 差部23的形狀可良好地轉印至樹脂製基板1。具體而言 - ，段差部23的角部形狀或壁部形狀可轉印至樹脂製基板 1，而在樹脂製基板1形成具有對應於段差部23形狀的段 差部5。而且，藉由顯微鏡等的觀察裝置來觀察段差部5 φ 的情況，段差部5的邊界線能用較濃的線來辨識。如此， 檢查者可確認是進行良好的轉印。 另一方面，如第7(b)圖所示，在樹脂無法充分充 塡於成形用模具2 0所形成的模穴的情況，形成於成形用 模具2 0之段差部2 3的形狀無法良好地轉印至樹脂製基板 1。具體而言，段差部23的角部形狀或壁部形狀無法良好 地轉印至樹脂製基板1，而使形成於樹脂製基板1的段差 部5的角部或壁部呈曲線狀，無法在樹脂製基板1形成對 〇 應於段差部23形狀的段差部5。而且，藉由顯微鏡等的 觀察裝置來觀察段差部5的情況，段差部5的邊界線僅能 模糊地辨識。如此，檢査者可確認並未進行良好的轉印。 如以上所說明，藉由觀察形成於樹脂製基板1之段差 部5的形狀，可評價成形用模具20之凸部的形狀是否良 好地轉印至樹脂製基板1。如此，不須定量地測定流路用 溝槽的形狀，而能以簡便的方法來評價轉印性。 (變形例） -21 - 200948706 接著，參照第8圖及第9圖來說明上述實施形態的變 形例之微晶片。第8圖係顯示變形例的樹脂製基板的俯視 圖，第9圖係顯示變形例的樹脂製基板的截面圖，是第8 圖的IX-IX截面圖。該變形例，是關於藉由不同深度的2 個流路用溝槽來形成T字狀溝槽之樹脂製基板。 如第8圖所示，樹脂製基板1A是板狀的基板，在樹 脂製基板1A的一表面形成直線狀的第1流路用溝槽2A 和直線狀的第2流路用溝槽3A。在本變形例，作爲1例 0 ，第1流路用溝槽2A和第2流路用溝槽3A是以正交的 狀態形成在樹脂製基板1A的表面。第2流路用溝槽3A， 是形成到第1流路用溝槽2A的中間。如此由第1流路用 溝槽2A和第2流路用溝槽3A來構成T字狀的溝槽。由 於第2流路用溝槽3 A的深度比第1流路用溝槽2A的深 度更深，在第1流路用溝槽2A和第2流路用溝槽3A互 相交叉的交叉部4A的底面形成段差部5A。例如像第9圖 所示，設第1流路用溝槽2A的深度爲dl，設和第2流路 〇 用溝槽3A的深度爲d2。由於第2流路用溝槽3A的深度 比第1流路用溝槽2A的深度更深，可成立d2>dl的關係 ，該深度的差値成爲段差部5A的高度。 而且，以形成有第1流路用溝槽2A和第2流路用溝 槽3A的面朝內側的狀態，將樹脂製基板1A和平板狀的 樹脂製基板接合而製造出微晶片。如此，藉由第1流路用 溝槽2A和第2流路用溝槽3A來形成微細流路。 另外，樹脂製基板1A的尺寸，是和上述實施形態的 -22- 200948706 樹脂製基板1的尺寸相同，第1流路用溝槽2A和第2流 路用溝槽3A的寬度及深度，是和上述實施形態的樹脂製 基板1的流路用溝槽的寬度及深度相同。 和上述實施形態同樣的，樹脂製基板1A是使用成形 ' 用模具而藉由射出成形法等來製作的。在成形用模具’形 成有對應於第1流路用溝槽2A的凸部和對應於第2流路 用溝槽3 A的凸部，藉由將成形用模具的凸部的形狀轉印 φ 至樹脂，而製作出具有第1流路用溝槽2A和第2流路用 溝槽3A之樹脂製基板1A，再者，在成形用模具的凸部的 上面，在對應於第1流路用溝槽2A和第2流路用溝槽3A 互相交叉的交叉部4A的位置設置段差部。藉此，將成形 用模具的段差轉印至樹脂，以在第1流路用溝槽2A和第 2流路用溝槽3A互相交叉的交叉部4A的底面形成段差部 5 A。藉由觀察該段差部5A的形狀，即可評價第1流路用 溝槽2A和第2流路用溝槽3 A的轉印性。 ❹ (實施例） 接著說明具體實施例。 在實施例，是製作上述變形例的樹脂製基板1 A。首 先，製作用來製作樹脂製基板1A的成形用模具。具體而 言，是製作出具有對應於第1流路用溝槽2A和第2流路 用溝槽3A的凸部之成形用模具。接著，使用該成形用模 具而藉由射出成形機並用透明樹脂材料PMMA進行成形 ，而製作出：在30mm見方、厚度1mm的板狀構件的表 -23- 200948706 面上形成有第1流路用溝槽2A和第2流路用溝槽3A之 樹脂製基板。溝槽尺寸如下所示。 第1流路用溝槽2A的深度dl=26.5〔 "m〕 第2流路用溝槽3A的深度d2 = 26.7〔 ym〕 段差部5A的深度（5 t = 0.18〔 // m〕 第1流路用溝槽2A的寬度=40.3〔 /zm〕 (評價） 藉由射出成形機而在2個不同的成形條件下進行透明 樹脂材料PMM A的成形’以製作出2片樹脂製基板1A。 檢查各個樹脂製基板1A的轉印性。用倍率400倍左右的 沉用光學顯微鏡來觀察段差部5A的外觀，可確認樹脂製 基板1A之段差部5A的形狀的差異。在—方的樹脂製基 板1A’段差部5A看起來較粗，在另一方的樹脂製基板 1A，段差部5A看起來較細。 再者，藉由形狀測定裝置來測定上述2個樹脂製基板 1 A的形狀’以確認成形的轉印性。段差部5 A看起來較粗 的樹脂製基板1 A的形狀，和成形用模具的偏差較大，而 確認出其無法進行充分的成形轉印。另一方面，段差部 5A看起來較細的樹脂製基板1A的形狀，和成形用模具的 偏差較小’而確認出其可進行充分的成形轉印。如此確認 出，光學顯微鏡的觀察像和成形轉印性是相關的。 另外，上述實施例所示的樹脂製基板的材料及尺寸僅 是用來確認本發明的效果，但本發明並不限定於此。例如 -24- 200948706 ，在使用上述實施形態所列舉的樹脂的情況，也能藉由設 置段差部來評價成形的轉印性。 【圖式簡單說明】 • 第1圖係本發明的實施形態之樹脂製基板的俯視圖。 第2圖係本發明的實施形態的樹脂製基板的截面圖， 是第1圖的II-II截面圖。 φ 第3圖係本發明的實施形態的微晶片的截面圖。 第4圖係顯示本發明的實施形態的電鑄母模的俯視圖 〇 第5圖係顯示本發明的實施形態的電鑄母模的截面圖 ，是第4圖的V-V截面圖。 第6圖係本發明的實施形態的成形用模具的截面圖。 第7 ( a ) ( b )圖係將本發明的實施形態的成形用模 具的一部分放大的截面圖。 〇 第8圖係顯示變形例的樹脂製基板的俯視圖。 第9圖係顯示變形例的樹脂製基板的截面圖，是第8 圖的IX -1X截面圖。 【主要元件符號說明】 1、 1A、6:樹脂製基板 2、 2A :第1流路用溝槽 3、 3A:第2流路用溝槽 4、 4A、1 3 :交叉部 -25- 200948706 5、5A、14、23 :段差部 7 :貫穿孔 8 :微晶片 10 :電鑄母模 1 1 :第1流路形成用溝槽 1 2 :第2流路形成用溝槽 20 :成形用模具 21 :第1凸部 22 :第2凸部In addition, when the transfer property of the resin substrate 1 is evaluated, the shape of the step portion 5 formed on the resin substrate 1 is observed by a sighting device such as a microscope, and the shape of the step portion 5 and the step formed in the molding die 20 are formed. Part 23 shape for comparison. The transferability was evaluated based on the difference in the shape of the step portion. Q Here, the transfer property of the flow path groove will be described with reference to Fig. 7 . Fig. 7 is an enlarged cross-sectional view showing a part of a molding die according to an embodiment of the present invention. For example, a mold having a flat groove formed by cavity formation and a molding die 20 of the present embodiment are used, and the resin substrate 1 is produced by injection molding. The molding die 20 and the mold in which the grooves are formed are opposed to each other with the flat grooves facing inward to form a cavity between the molding die 20 and the die in which the flat grooves are formed. The resin substrate 1 on which the shape of the first convex portion 21 and the shape of the second convex portion 22-20-200948706 are transferred can be produced by filling the resin into the cavity. For example, as shown in Fig. 7(a), when the resin is sufficiently filled in the cavity formed by the molding die 20, the shape of the segment-difference portion 23 formed in the molding die 20 can be favorably transferred to the resin. Forming the substrate 1. Specifically, the corner shape or the wall shape of the step portion 23 can be transferred to the resin substrate 1, and the step portion 5 having the shape corresponding to the step portion 23 can be formed on the resin substrate 1. Further, when the step portion 5 φ is observed by an observation device such as a microscope, the boundary line of the step portion 5 can be recognized by a thick line. In this way, the examiner can confirm that the transfer is good. On the other hand, as shown in Fig. 7(b), when the resin is not sufficiently filled in the cavity formed by the molding die 20, the shape of the step portion 23 formed in the molding die 20 is not good. Transfer to the resin substrate 1 . Specifically, the corner shape or the wall shape of the step portion 23 is not transferred to the resin substrate 1 well, and the corner portion or the wall portion of the step portion 5 formed on the resin substrate 1 is curved, and cannot be formed. The resin substrate 1 is formed with a step portion 5 that faces the shape of the step portion 23. Further, when the step portion 5 is observed by an observation device such as a microscope, the boundary line of the step portion 5 can be only ambiguously recognized. In this way, the examiner can confirm that good transfer has not been performed. As described above, by observing the shape of the step portion 5 formed on the resin substrate 1, it is possible to evaluate whether or not the shape of the convex portion of the molding die 20 is favorably transferred to the resin substrate 1. Thus, the transferability can be evaluated in a simple manner without quantitatively measuring the shape of the flow path groove. (Modification) - 21 - 200948706 Next, a microchip of a modification of the above embodiment will be described with reference to Figs. 8 and 9. Fig. 8 is a plan view showing a resin substrate according to a modification, and Fig. 9 is a cross-sectional view showing a resin substrate according to a modification, and is a cross-sectional view taken along line IX-IX of Fig. 8. This modification is a resin substrate in which T-shaped grooves are formed by grooves of two flow paths at different depths. As shown in Fig. 8, the resin substrate 1A is a plate-shaped substrate, and a linear first channel groove 2A and a linear second channel groove 3A are formed on one surface of the resin substrate 1A. In the present modification, the first flow path groove 2A and the second flow path groove 3A are formed on the surface of the resin substrate 1A in an orthogonal state as one example. The second flow path groove 3A is formed in the middle of the first flow path groove 2A. In this way, the first flow path groove 2A and the second flow path groove 3A constitute a T-shaped groove. The depth of the second flow path groove 3 A is deeper than the depth of the first flow path groove 2A, and the intersection portion 4A where the first flow path groove 2A and the second flow path groove 3A intersect each other The bottom surface forms a step portion 5A. For example, as shown in Fig. 9, the depth of the first flow path groove 2A is dl, and the depth of the second flow path groove 3A is d2. Since the depth of the second flow path groove 3A is deeper than the depth of the first flow path groove 2A, the relationship d2 > dl can be established, and the difference 深度 is the height of the step portion 5A. In addition, the resin substrate 1A and the flat resin substrate are joined to each other to form a microchip in a state in which the surfaces of the first channel groove 2A and the second channel groove 3A are formed inward. In this way, the fine flow path is formed by the first flow path groove 2A and the second flow path groove 3A. In addition, the size of the resin substrate 1A is the same as the size of the resin substrate 1 of the above-described embodiment -22-200948706, and the width and depth of the first channel groove 2A and the second channel groove 3A are The width and depth of the flow channel groove of the resin substrate 1 of the above embodiment are the same. In the same manner as in the above-described embodiment, the resin substrate 1A is produced by injection molding or the like using a molding die. The convex portion corresponding to the first flow path groove 2A and the convex portion corresponding to the second flow path groove 3 A are formed in the molding die ', and the shape of the convex portion of the molding die is transferred by φ The resin substrate 1A having the first flow path groove 2A and the second flow path groove 3A is formed in the resin, and the upper surface of the convex portion of the molding die corresponds to the first flow path. A step portion is provided at a position of the intersection portion 4A where the groove 2A and the second channel groove 3A intersect each other. By this, the step of the mold is transferred to the resin, and the step portion 5A is formed on the bottom surface of the intersection portion 4A where the first channel groove 2A and the second channel groove 3A intersect each other. By observing the shape of the step portion 5A, the transfer properties of the first channel groove 2A and the second channel groove 3A can be evaluated. ❹ (Embodiment) Next, a specific embodiment will be described. In the embodiment, the resin substrate 1 A of the above modification is produced. First, a molding die for producing a resin substrate 1A was produced. Specifically, a molding die having a convex portion corresponding to the first flow path groove 2A and the second flow path groove 3A is produced. Then, the molding die was formed by the injection molding machine and molded with a transparent resin material PMMA, and the first flow path was formed on the surface of Table-2009-200948706 of a plate-shaped member having a thickness of 30 mm and a thickness of 1 mm. The resin substrate of the groove 2A and the second flow path groove 3A. The groove size is as follows. The depth dl of the first flow path groove 2A is 26.5 [ "m] The depth d2 of the second flow path groove 3A is 26.7 [ ym] The depth of the step portion 5A (5 t = 0.18 [ // m] 1 Width of the channel groove 2A = 40.3 [ /zm] (Evaluation) The molding of the transparent resin material PMM A was performed under two different molding conditions by the injection molding machine to fabricate two resin substrates 1A. The transferability of each resin substrate 1A was examined. The appearance of the step portion 5A was observed with a sinking optical microscope having a magnification of about 400 times, and the difference in the shape of the step portion 5A of the resin substrate 1A was confirmed. In the resin substrate 1A, the step portion 5A is thinner. The shape of the two resin substrates 1 A is measured by a shape measuring device. In order to confirm the transferability of the molding, the shape of the resin substrate 1 A which is a thick portion of the step portion 5 A and the molding die are large, and it is confirmed that the molding transfer cannot be performed sufficiently. The shape of the resin substrate 1A in which the step portion 5A looks thin, and the molding die It was confirmed that the deviation was small, and it was confirmed that the molding transfer was sufficiently performed. It was confirmed that the observation image of the optical microscope was related to the mold transfer property. Further, the material of the resin substrate shown in the above embodiment and The size is only used to confirm the effect of the present invention, but the present invention is not limited thereto. For example, in the case of using the resin exemplified in the above embodiment, the step of the step can be evaluated by providing the step portion. [Brief Description of the Drawings] Fig. 1 is a plan view of a resin substrate according to an embodiment of the present invention. Fig. 2 is a cross-sectional view of a resin substrate according to an embodiment of the present invention, which is II- of Fig. 1 Fig. 3 is a cross-sectional view of a microchip according to an embodiment of the present invention. Fig. 4 is a plan view showing an electroforming master according to an embodiment of the present invention. Fig. 5 is a view showing an embodiment of the present invention. The cross-sectional view of the electroforming master is a VV cross-sectional view of Fig. 4. Fig. 6 is a cross-sectional view of the molding die according to the embodiment of the present invention. The seventh embodiment (a) (b) shows an embodiment of the present invention. Forming mold Fig. 8 is a plan view showing a resin substrate according to a modification. Fig. 9 is a cross-sectional view showing a resin substrate according to a modification, and is a cross-sectional view taken along line IX - 1X of Fig. 8. DESCRIPTION OF REFERENCE NUMERALS 1 , 1A, 6: Resin substrate 2, 2A: First channel groove 3, 3A: Second channel groove 4, 4A, 13: Intersection - 25 - 200948706 5, 5A , 14 , 23 : step portion 7 : through hole 8 : microchip 10 : electroforming master mold 1 1 : first channel forming groove 1 2 : second channel forming groove 20 : molding die 21 : First convex portion 22: second convex portion