TW201002126A - Encapsulation assembly for electronic devices - Google Patents

Encapsulation assembly for electronic devices Download PDF

Info

Publication number
TW201002126A
TW201002126A TW097149869A TW97149869A TW201002126A TW 201002126 A TW201002126 A TW 201002126A TW 097149869 A TW097149869 A TW 097149869A TW 97149869 A TW97149869 A TW 97149869A TW 201002126 A TW201002126 A TW 201002126A
Authority
TW
Taiwan
Prior art keywords
electronic device
barrier
substrate
glass
package
Prior art date
Application number
TW097149869A
Other languages
English (en)
Chinese (zh)
Inventor
Matthew Dewey Hubert
James Daniel Tremel
Kyle D Frischknecht
Nugent Truong
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW201002126A publication Critical patent/TW201002126A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
TW097149869A 2007-12-21 2008-12-19 Encapsulation assembly for electronic devices TW201002126A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1580207P 2007-12-21 2007-12-21

Publications (1)

Publication Number Publication Date
TW201002126A true TW201002126A (en) 2010-01-01

Family

ID=40824689

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097149869A TW201002126A (en) 2007-12-21 2008-12-19 Encapsulation assembly for electronic devices

Country Status (6)

Country Link
US (1) US20100270919A1 (2)
EP (1) EP2225767A4 (2)
JP (1) JP2011508437A (2)
KR (1) KR20100108392A (2)
TW (1) TW201002126A (2)
WO (1) WO2009086228A1 (2)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI862281B (zh) * 2023-11-16 2024-11-11 世界先進積體電路股份有限公司 微機電封裝及其製造方法

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US8568184B2 (en) * 2009-07-15 2013-10-29 Apple Inc. Display modules
KR101074805B1 (ko) 2009-12-04 2011-10-19 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치 및 그 제조 방법
KR101074807B1 (ko) * 2009-12-10 2011-10-19 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치
JP5611811B2 (ja) * 2009-12-31 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． バリア・フィルム複合体及びこれを含む表示装置
JP5290268B2 (ja) 2009-12-31 2013-09-18 三星ディスプレイ株式會社 バリア・フィルム複合体、これを含む表示装置、バリア・フィルム複合体の製造方法、及びこれを含む表示装置の製造方法
JP5611812B2 (ja) 2009-12-31 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． バリア・フィルム複合体、これを含む表示装置及び表示装置の製造方法
US20110195540A1 (en) * 2010-02-05 2011-08-11 Hitachi Chemical Company, Ltd. Composition for forming p-type diffusion layer, method for forming p-type diffusion layer, and method for producing photovoltaic cell
US20110195541A1 (en) * 2010-02-05 2011-08-11 Hitachi Chemical Company, Ltd. Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell
WO2011130632A1 (en) * 2010-04-15 2011-10-20 Ferro Corporation Low-melting lead-free bismuth sealing glasses
KR20190039347A (ko) * 2010-06-03 2019-04-10 알닐람 파마슈티칼스 인코포레이티드 활성제의 전달을 위한 생분해성 지질
JP5724684B2 (ja) * 2011-07-01 2015-05-27 日本電気硝子株式会社 発光デバイス用セル及び発光デバイス
JP5724685B2 (ja) * 2011-07-01 2015-05-27 日本電気硝子株式会社 発光デバイス用セルの製造方法及び発光デバイスの製造方法
RU2638070C2 (ru) * 2011-09-13 2017-12-11 Ферро Корпорейшн Индукционная пайка неорганических подложек
US20130098675A1 (en) * 2011-10-21 2013-04-25 Qualcomm Mems Technologies, Inc. Method and apparatus for application of anti-stiction coating
US20140261975A1 (en) * 2011-11-02 2014-09-18 Ferro Corporation Microwave Sealing Of Inorganic Substrates Using Low Melting Glass Systems
WO2013086354A1 (en) 2011-12-07 2013-06-13 Alnylam Pharmaceuticals, Inc. Biodegradable lipids for the delivery of active agents
US9685628B2 (en) 2013-08-16 2017-06-20 Samsung Electronics Co., Ltd. Methods for making optical components, optical components, and products including same
EP3176225B1 (en) * 2014-07-29 2020-02-19 Boe Technology Group Co. Ltd. Functional material, preparation method therefor, organic light-emitting diode display panel
CN104157798A (zh) * 2014-08-21 2014-11-19 深圳市华星光电技术有限公司 Oled的封装方法及结构
CN104810484B (zh) * 2015-05-07 2017-01-04 合肥鑫晟光电科技有限公司 封装胶、封装方法、显示面板及显示装置
US10629468B2 (en) 2016-02-11 2020-04-21 Skyworks Solutions, Inc. Device packaging using a recyclable carrier substrate
US20170243739A1 (en) * 2016-02-24 2017-08-24 Skyworks Solutions, Inc. 3d micromold and pattern transfer
US10453763B2 (en) 2016-08-10 2019-10-22 Skyworks Solutions, Inc. Packaging structures with improved adhesion and strength
FR3068706A1 (fr) * 2017-07-04 2019-01-11 Arkema France Materiau absorbant pour la protection des dispositifs electroniques
US20240167318A1 (en) * 2022-11-23 2024-05-23 LuxWall, Inc. Vacuum insulated panel with optimized compressive and/or tensile stress in glass

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JPH11195487A (ja) * 1997-12-27 1999-07-21 Tdk Corp 有機ｅｌ素子
JP2000003783A (ja) * 1998-06-12 2000-01-07 Tdk Corp 有機ｅｌ表示装置
US6798133B1 (en) * 1999-09-09 2004-09-28 Siemens Aktiengesellschaft Glass cover and process for producing a glass cover
WO2002039513A1 (en) * 2000-11-08 2002-05-16 Koninklijke Philips Electronics N.V. Electro-optical device
US20060087230A1 (en) * 2004-10-22 2006-04-27 Eastman Kodak Company Desiccant film in top-emitting OLED
JP4605499B2 (ja) * 2004-10-28 2011-01-05 富士電機ホールディングス株式会社 有機ｅｌディスプレイの封止構造
JP2007005060A (ja) * 2005-06-22 2007-01-11 Fuji Electric Holdings Co Ltd 有機ｅｌディスプレイの製造方法
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US8278401B2 (en) * 2006-03-29 2012-10-02 Henkel Ag & Co. Kgaa Radiation or thermally curable barrier sealants
TWI421607B (zh) * 2006-08-24 2014-01-01 Creator Technology Bv 可撓性裝置上的滲透阻障
KR100858811B1 (ko) * 2006-11-10 2008-09-17 삼성에스디아이 주식회사 전자 방출 표시 소자의 제조 방법
US8115326B2 (en) * 2006-11-30 2012-02-14 Corning Incorporated Flexible substrates having a thin-film barrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI862281B (zh) * 2023-11-16 2024-11-11 世界先進積體電路股份有限公司 微機電封裝及其製造方法

Also Published As

Publication number Publication date
WO2009086228A1 (en) 2009-07-09
EP2225767A1 (en) 2010-09-08
EP2225767A4 (en) 2011-09-28
JP2011508437A (ja) 2011-03-10
US20100270919A1 (en) 2010-10-28
KR20100108392A (ko) 2010-10-06

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